CN107672252A - A kind of ceramic package - Google Patents
A kind of ceramic package Download PDFInfo
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- CN107672252A CN107672252A CN201710685310.5A CN201710685310A CN107672252A CN 107672252 A CN107672252 A CN 107672252A CN 201710685310 A CN201710685310 A CN 201710685310A CN 107672252 A CN107672252 A CN 107672252A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B18/00—Layered products essentially comprising ceramics, e.g. refractory products
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
- B32B3/266—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/002—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising natural stone or artificial stone
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
- B32B9/007—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile comprising carbon, e.g. graphite, composite carbon
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
- C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
- C04B41/51—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
- C04B41/5194—Metallisation of multilayered ceramics, e.g. for the fabrication of multilayer ceramic capacitors
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
- C04B41/81—Coating or impregnation
- C04B41/85—Coating or impregnation with inorganic materials
- C04B41/88—Metals
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/106—Carbon fibres, e.g. graphite fibres
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/212—Electromagnetic interference shielding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
Abstract
The invention discloses a kind of ceramic package, including housing, the housing is formed with five layers of alumina ceramic layer, in first layer, the second layer, the upper surface of third layer and the 4th layer of alumina ceramic layer increases by one layer of basalt fiber, in the second layer, third layer, increase by one layer of carbon fiber layer on the lower surface of 4th layer and layer 5 alumina ceramic layer, the lines for playing wiring using Metal slurry printing and the figure for playing irradiation shielding action are equipped between basalt fiber and alumina ceramic layer, every layer of alumina layer is equipped with the through hole through the alumina layer, Metal slurry is filled with through hole, the through hole is shoulder hole, the through hole of alumina ceramic layer progressively becomes big from first layer alumina ceramic layer to layer 5 alumina ceramic layer.The present invention can be applied to aerospace field, and total quality is light, small volume, the irradiation shield effectiveness to space ionization total-dose are good.
Description
Technical field
The present invention relates to DIP encapsulation technologies field, more particularly to a kind of ceramic package.
Background technology
DIP is encapsulated, and is also dual-inline package technology, it is double enter line encapsulation;Refer to the collection using the encapsulation of dual-in-line form
Into circuit chip, most middle small scale integrated circuits use this packing forms.The CP Μ chips of DIP encapsulation have two rows
Pin is, it is necessary to be inserted on the chip carrier socket with DIP structures.It is of course also possible to identical welding hole number and geometry have been directly inserted in it
Welded on the circuit board of arrangement.DIP encapsulating structure forms have:Multi-layer ceramics dual inline type DIP, single-layer ceramic biserial are straight
The formula of inserting DIP, lead frame posture DIP(The formula of sealing-in containing glass ceramics, plastic encapsulation structural formula, ceramic low-melting-point glass packaged type)Deng.
With the development of DIP encapsulation technologies, dual-in-line ceramic package technology is also constantly brought forth new ideas.For example, patent
CN2834017Y discloses a kind of dual-in-line shell applied to SAW device, including metab (1) and pipe cap
(2) two row electrodes, are provided with for the cavity (3) placed for chip, base (1) bottom surface between the two, wherein a row electrode includes one
Group input and output electrode (4), input and output electrode (4) reaches the front of base (1) and insulated with base (1), in two row electrodes
Remaining electrode be grounding electrode (5), grounding electrode (5) is connected with base (1).It is defeated by increasing grounding electrode reduction input
Go out electrode, therefore earthing effect significantly improves, more conducively Shell, in the case where not changing housing exterior size, have
Area increase is imitated, the choice of chip is bigger.It is black that patent CN203503638M discloses a kind of dual inline type photo-coupler
Ceramic package shell, structure include housing, and two row pins are provided with the outside of housing, and the bottom of enclosure interior is provided with printing
Layer, bottom chip is provided with above printing layer, is provided with teleoseal frame above bottom chip, teleoseal frame passes through iron nickel
Cobalt alloy lead is connected with printing layer, and teleoseal cover plate, teleoseal cover plate are provided with above teleoseal frame
Top be provided with middle synusia, yellow gold frame is provided with above middle synusia, teleoseal frame passes through yellow gold lead
It is connected with yellow gold frame, is provided with synusia above yellow gold frame, be provided with sintering cover plate above upper synusia, in housing
Sintering external member is provided with, sintering external member is connected with sintering cover plate, and housing is connected by bonded assemblies with sintering external member.It passes through more
The electric connection structure optimized packaging structure of layer, reduces fault rate, and practicality is high.But above-mentioned ceramic package still is limited to list
The structure of individual cavity, it is difficult to further lift its electrical density and its effective area.
Publication No. CN203967061U is authorized, authorized announcement date is the Chinese utility model patent on November 26th, 2014
A kind of dual-in-line ceramic package is disclosed, including housing and the two row pins for being arranged at hull outside, enclosure interior offer
Four cavitys, the bottom in each cavity are provided with metal layer, and metallization layer is provided with base, lid is provided with above base
Plate, the base are connected by base sealing ring with cover plate.Original four products are integrated on a product by it, number of pins
Amount also increases to 16 from four, reality product it is integrated, improve the electrical density of dual-in-line ceramic package, in user
Only need once to cover during capping, improve the reliability of product.But the utility model is also deposited during the use of reality
In following defect:
Above-mentioned ceramic package is only used for common circuit package, for applying in the circuit package of Aero-Space, space spoke
Ionising radiation total dose effect, single particle effect equivalent damage can be produced to spaceborne microelectronic component by penetrating.Especially for cmos device,
Its total dose effect accumulates essentially from the positive charge of gate oxide and field oxide and at interface caused by Si/SiO2 interfaces
Trapped charge, form interfacial state.Cause the threshold voltage of cmos device to drift about and static leakage current increase, cause device electrical parameter
Degenerate, or even make astrionic system disabler, influence the satisfactory completion of satellite mission.As microelectronic component is being defended
Extensive use in star, and the long-life service requirement of satellite, the threat of the damage of total dose effect to satellite transit are more next
It is bigger.
Experiment proves that encapsulation reinforcement technique is more difficult for shielding neutron and gamma rays, but is radiated for shielding space
The high energy electron and proton relative efficiency of environment, especially for the electronics and proton that VanAllen radiation zones come, shield effectiveness
Substantially.It is reported that the standby 32Pin flat packages shell of Austin company systems carries out Flouride-resistani acid phesphatase encapsulation, research knot using shielding cover board
Fruit shows, is contrasted with the shell of no shield effectiveness, and 6.5 times can be improved for the shield effectiveness of electronics.But the shield side
The radiation that method can only be directed to perpendicular to cover plate direction has effect, is had differences with the space environment of reality.French 3DPLUS companies
A kind of microelectronics Packaging for the Flouride-resistani acid phesphatase newly developed is announced, referred to as Walo-pack encapsulation, is to increase by one layer outside package casing
The overcoat of heavy metals tungsten and aluminium is protected to device, and the index of its ionizing radiation-resistant accumulated dose can reach 200krad(Si);
The screen layer that the upper and lower surface also mentioned in United States Patent (USP) simultaneously in device aggravates metal is protected, but the cause of both approaches
Life shortcoming is just the increase in the volume and weight of device.
The content of the invention
In order to overcome drawbacks described above, the invention provides a kind of ceramic package, passes through the collection after the encapsulation of the ceramic package
Can be applied to aerospace field into circuit, and total quality is light, small volume, the irradiation shielding to space ionization total-dose
Effect is good.
In order to solve the above-mentioned technical problem, the technical solution adopted by the present invention is:
A kind of ceramic package, including housing, the housing are formed with five layers of alumina ceramic layer, and from inside to outside respectively
One layer of alumina ceramic layer, second layer alumina ceramic layer, third layer alumina ceramic layer, the 4th layer of alumina ceramic layer and
Five layers of alumina ceramic layer, it is characterised in that:In first layer alumina ceramic layer, second layer alumina ceramic layer, third layer oxygen
Changing the upper surface of aluminium ceramic layer and the 4th layer of alumina ceramic layer increases by one layer of basalt fiber, is made pottery in second layer aluminum oxide
Enamel coating, third layer alumina ceramic layer, the 4th layer of alumina ceramic layer and layer 5 alumina ceramic layer lower surface on increase
One layer of carbon fiber layer, it is equipped between basalt fiber and alumina ceramic layer and wiring is played using Metal slurry printing
The lines of effect and the figure for playing irradiation shielding action, every layer of alumina layer are equipped with the through hole through the alumina layer, through hole
In be filled with Metal slurry, the through hole is shoulder hole, the through hole of alumina ceramic layer from first layer alumina ceramic layer to
Layer 5 alumina ceramic layer progressively becomes big.
Between the alumina ceramic layer, between alumina ceramic layer and carbon fiber layer, alumina ceramic layer and basalt
It is bonded between fibrous layer with bonding agent.
The bonding agent includes polyvinyl butyral resin and ethanol, and its percentage by weight is:Polyvinyl butyral resin 30%~
50%, ethanol 50%~70%.
The Metal slurry include percentage by weight be 82%~88% solid phase and 12%~18% liquid phase, solid phase be by
The composition counted below with parts by weight forms:
28~32 parts of tungsten copper powder
1~3 part of glass dust
2~5 parts of alumina powder
4~6 parts of aluminium hydrate powder,
The liquid phase is made up of the composition of following parts by weight meter:
12~18 parts of methanol
5~16 parts of terpinol
3~8 parts of ethyl cellulose.
The percentage by weight of tungsten is 85%~96% in the tungsten copper powder, and the percentage by weight of copper is 4%~15%.
The basalt fiber is formed with basalt fibre longitudinal arrangement, and the carbon fiber layer is horizontal with carbon fiber
Arrangement forms, and when alumina ceramic layer bonds together, basalt fiber and carbon fiber layer are superimposed together, and formation is netted,
Mesh size is 3~5mm.
Compared with prior art, the present invention has advantages below:
1st, the present invention includes housing, and the housing is formed with five layers of alumina ceramic layer, from inside to outside respectively first layer
Alumina ceramic layer, second layer alumina ceramic layer, third layer alumina ceramic layer, the 4th layer of alumina ceramic layer and layer 5
Alumina ceramic layer, it is characterised in that:In first layer alumina ceramic layer, second layer alumina ceramic layer, third layer aluminum oxide
The upper surface of ceramic layer and the 4th layer of alumina ceramic layer increases by one layer of basalt fiber, in second layer aluminium oxide ceramics
Layer, third layer alumina ceramic layer, the 4th layer of alumina ceramic layer and layer 5 alumina ceramic layer lower surface on increase by one
Layer carbon fiber layer, it is equipped between basalt fiber and alumina ceramic layer and is made using the wiring that rises of Metal slurry printing
Lines and the figure for playing irradiation shielding action, every layer of alumina layer are equipped with the through hole through the alumina layer, in through hole
Filled with Metal slurry, the through hole is shoulder hole, and the through hole of alumina ceramic layer is from first layer alumina ceramic layer to
Five layers of alumina ceramic layer progressively become big.The present invention is equipped with using metal between basalt fiber and alumina ceramic layer
The lines for playing wiring of slurrying material printing and the figure of an irradiation shielding action rise plus increased basalt fiber
The effect for strengthening irradiation shielding is arrived so that the structure with irradiation shielding action is dissolved into ceramic layer, is effectively reduced
Due to the increased volume and weight of the structure of irradiation screen layer and ceramic package disconnection, pass through basalt fibre and Metal slurry
Irradiation shielding layer by layer, serves the effect for preventing space radiation, the guarantor to become reconciled is served to the integrated circuit of encapsulation to greatest extent
Shield acts on, while present invention also adds carbon fiber, the collective effect of carbon fiber and basalt fibre, not only increases ceramics
Intensity, while the effect for reducing space radiation is also acted, and the use of carbon fiber and basalt fibre reduces aluminum oxide pottery
Enamel coating, the purpose for reducing weight and volume is reached.The hole of the present invention is shoulder hole, and the through hole of alumina ceramic layer is from first layer
Alumina ceramic layer progressively becomes big to layer 5 alumina ceramic layer, after metal paste filling through hole, is formed stair-stepping
Metal paste, more arrives outer bigger, plays a part of anti-space radiation, more to interior smaller, on the premise of reaching and reducing radiation, and section
About metal paste, while the slurry of this structure can increase the bond degree of each alumina ceramic layer, be not forced dislocation or
Person peels off and dropped, and improves the quality of ceramic package.
3rd, Metal slurry of the present invention includes the solid phase and 12%~18% liquid phase that percentage by weight is 82%~88%, solid phase
It is made up of the composition counted below with parts by weight:28~32 parts of tungsten copper powder, 1~3 part of glass dust, 2~5 parts of alumina powder,
4~6 parts of aluminium hydrate powder, the liquid phase are made up of the composition of following parts by weight meter:12~18 parts of methanol, terpinol 5
~16 parts, 3~8 parts of ethyl cellulose.Metal slurry the matching somebody with somebody by tungsten copper, alumina powder and aluminium hydrate powder of the present invention
Than so that intensity is higher after slurry solidification, while the mixture formed can greatly improve to the obstruction rate of space radiation, most
Big degree protects integrated circuit.
4th, basalt fiber of the present invention is formed with basalt fibre longitudinal arrangement, and the carbon fiber layer is to use carbon
Laterally arrangement forms fiber, and when alumina ceramic layer bonds together, basalt fiber and carbon fiber layer are superimposed together, shape
Reticulate, mesh size is 3~5mm.By the combination of basalt fiber and carbon fiber layer, foring one prevents space spoke
The net penetrated, space radiation are difficult through protection dynamics greatly improves.
Embodiment
Invention shape is further described with reference to embodiment, described embodiment is only a present invention part
Embodiment, it is not whole embodiments.Based on embodiments of the invention, one of ordinary skill in the art is not making wound
Other embodiments used obtained under the premise of the property made work, belong to protection scope of the present invention.
Embodiment 1
The present embodiment includes housing, and the housing is formed with five layers of alumina ceramic layer, from inside to outside respectively first layer
Alumina ceramic layer, second layer alumina ceramic layer, third layer alumina ceramic layer, the 4th layer of alumina ceramic layer and layer 5
Alumina ceramic layer, it is characterised in that:In first layer alumina ceramic layer, second layer alumina ceramic layer, third layer aluminum oxide
The upper surface of ceramic layer and the 4th layer of alumina ceramic layer increases by one layer of basalt fiber, in second layer aluminium oxide ceramics
Layer, third layer alumina ceramic layer, the 4th layer of alumina ceramic layer and layer 5 alumina ceramic layer lower surface on increase by one
Layer carbon fiber layer, it is equipped between basalt fiber and alumina ceramic layer and is made using the wiring that rises of Metal slurry printing
Lines and the figure for playing irradiation shielding action, every layer of alumina layer are equipped with the through hole through the alumina layer, in through hole
Filled with Metal slurry, the through hole is shoulder hole, and the through hole of alumina ceramic layer is from first layer alumina ceramic layer to
Five layers of alumina ceramic layer progressively become big.The present embodiment is equipped between basalt fiber and alumina ceramic layer using gold
The lines for playing wiring of category slurrying material printing and the figure of an irradiation shielding action are plus increased basalt fiber
Serve the effect for strengthening irradiation shielding so that the structure with irradiation shielding action is dissolved into ceramic layer, is effectively reduced
Because the structure of irradiation screen layer and ceramic package disconnects increased volume and weight, pass through basalt fibre and metallization paste
The irradiation shielding of bed of material layer, serves the effect for preventing space radiation, serves what is become reconciled to the integrated circuit of encapsulation to greatest extent
Protective effect, while the present embodiment also add the collective effect of carbon fiber, carbon fiber and basalt fibre, not only increase pottery
The intensity of porcelain, while the effect for reducing space radiation is also acted, and the use of carbon fiber and basalt fibre reduces oxidation
Aluminium ceramic layer, the purpose for reducing weight and volume is reached.The hole of the present embodiment is shoulder hole, the through hole of alumina ceramic layer from
First layer alumina ceramic layer progressively becomes big to layer 5 alumina ceramic layer, after metal paste filling through hole, is formed rank
The metal paste of scalariform, more arrives outer bigger, plays a part of anti-space radiation, more to interior smaller, before reaching and reducing radiation
Put, saved metal paste, while the slurry of this structure can increase the bond degree of each alumina ceramic layer, be not forced
Dislocation or stripping are dropped, and improve the quality of ceramic package.
Between the alumina ceramic layer, between alumina ceramic layer and carbon fiber layer, alumina ceramic layer and basalt
It is bonded between fibrous layer with bonding agent.
The bonding agent includes polyvinyl butyral resin and ethanol, and its percentage by weight is:Polyvinyl butyral resin 30%,
Ethanol 70%.
The Metal slurry includes the solid phase and 12% liquid phase that percentage by weight is 88%, and solid phase is by below with weight
The composition composition of number meter:
28 parts of tungsten copper powder
3 parts of glass dust
2 parts of alumina powder
6 parts of aluminium hydrate powder,
The liquid phase is made up of the composition of following parts by weight meter:
12 parts of methanol
16 parts of terpinol
3 parts of ethyl cellulose.
The percentage by weight of tungsten is 85% in the tungsten copper powder, and the percentage by weight of copper is 15%.
The basalt fiber is formed with basalt fibre longitudinal arrangement, and the carbon fiber layer is horizontal with carbon fiber
Arrangement forms, and when alumina ceramic layer bonds together, basalt fiber and carbon fiber layer are superimposed together, and formation is netted,
Mesh size is 3mm.
Embodiment 2
The present embodiment includes housing, and the housing is formed with five layers of alumina ceramic layer, from inside to outside respectively first layer
Alumina ceramic layer, second layer alumina ceramic layer, third layer alumina ceramic layer, the 4th layer of alumina ceramic layer and layer 5
Alumina ceramic layer, it is characterised in that:In first layer alumina ceramic layer, second layer alumina ceramic layer, third layer aluminum oxide
The upper surface of ceramic layer and the 4th layer of alumina ceramic layer increases by one layer of basalt fiber, in second layer aluminium oxide ceramics
Layer, third layer alumina ceramic layer, the 4th layer of alumina ceramic layer and layer 5 alumina ceramic layer lower surface on increase by one
Layer carbon fiber layer, it is equipped between basalt fiber and alumina ceramic layer and is made using the wiring that rises of Metal slurry printing
Lines and the figure for playing irradiation shielding action, every layer of alumina layer are equipped with the through hole through the alumina layer, in through hole
Filled with Metal slurry, the through hole is shoulder hole, and the through hole of alumina ceramic layer is from first layer alumina ceramic layer to
Five layers of alumina ceramic layer progressively become big.The present embodiment is equipped between basalt fiber and alumina ceramic layer using gold
The lines for playing wiring of category slurrying material printing and the figure of an irradiation shielding action are plus increased basalt fiber
Serve the effect for strengthening irradiation shielding so that the structure with irradiation shielding action is dissolved into ceramic layer, is effectively reduced
Because the structure of irradiation screen layer and ceramic package disconnects increased volume and weight, pass through basalt fibre and metallization paste
The irradiation shielding of bed of material layer, serves the effect for preventing space radiation, serves what is become reconciled to the integrated circuit of encapsulation to greatest extent
Protective effect, while the present embodiment also add the collective effect of carbon fiber, carbon fiber and basalt fibre, not only increase pottery
The intensity of porcelain, while the effect for reducing space radiation is also acted, and the use of carbon fiber and basalt fibre reduces oxidation
Aluminium ceramic layer, the purpose for reducing weight and volume is reached.The hole of the present embodiment is shoulder hole, the through hole of alumina ceramic layer from
First layer alumina ceramic layer progressively becomes big to layer 5 alumina ceramic layer, after metal paste filling through hole, is formed rank
The metal paste of scalariform, more arrives outer bigger, plays a part of anti-space radiation, more to interior smaller, before reaching and reducing radiation
Put, saved metal paste, while the slurry of this structure can increase the bond degree of each alumina ceramic layer, be not forced
Dislocation or stripping are dropped, and improve the quality of ceramic package.
Between the alumina ceramic layer, between alumina ceramic layer and carbon fiber layer, alumina ceramic layer and basalt
It is bonded between fibrous layer with bonding agent.
The bonding agent includes polyvinyl butyral resin and ethanol, and its percentage by weight is:Polyvinyl butyral resin 50%,
Ethanol 50%.
The Metal slurry includes the solid phase and 18% liquid phase that percentage by weight is 82%, and solid phase is by below with weight
The composition composition of number meter:
32 parts of tungsten copper powder
2 parts of glass dust
5 parts of alumina powder
4 parts of aluminium hydrate powder,
The liquid phase is made up of the composition of following parts by weight meter:
16 parts of methanol
12 parts of terpinol
6 parts of ethyl cellulose.
The percentage by weight of tungsten is 96% in the tungsten copper powder, and the percentage by weight of copper is 4%.
The basalt fiber is formed with basalt fibre longitudinal arrangement, and the carbon fiber layer is horizontal with carbon fiber
Arrangement forms, and when alumina ceramic layer bonds together, basalt fiber and carbon fiber layer are superimposed together, and formation is netted,
Mesh size is 5mm.
Embodiment 3
The present embodiment includes housing, and the housing is formed with five layers of alumina ceramic layer, from inside to outside respectively first layer
Alumina ceramic layer, second layer alumina ceramic layer, third layer alumina ceramic layer, the 4th layer of alumina ceramic layer and layer 5
Alumina ceramic layer, it is characterised in that:In first layer alumina ceramic layer, second layer alumina ceramic layer, third layer aluminum oxide
The upper surface of ceramic layer and the 4th layer of alumina ceramic layer increases by one layer of basalt fiber, in second layer aluminium oxide ceramics
Layer, third layer alumina ceramic layer, the 4th layer of alumina ceramic layer and layer 5 alumina ceramic layer lower surface on increase by one
Layer carbon fiber layer, it is equipped between basalt fiber and alumina ceramic layer and is made using the wiring that rises of Metal slurry printing
Lines and the figure for playing irradiation shielding action, every layer of alumina layer are equipped with the through hole through the alumina layer, in through hole
Filled with Metal slurry, the through hole is shoulder hole, and the through hole of alumina ceramic layer is from first layer alumina ceramic layer to
Five layers of alumina ceramic layer progressively become big.The present embodiment is equipped between basalt fiber and alumina ceramic layer using gold
The lines for playing wiring of category slurrying material printing and the figure of an irradiation shielding action are plus increased basalt fiber
Serve the effect for strengthening irradiation shielding so that the structure with irradiation shielding action is dissolved into ceramic layer, is effectively reduced
Because the structure of irradiation screen layer and ceramic package disconnects increased volume and weight, pass through basalt fibre and metallization paste
The irradiation shielding of bed of material layer, serves the effect for preventing space radiation, serves what is become reconciled to the integrated circuit of encapsulation to greatest extent
Protective effect, while the present embodiment also add the collective effect of carbon fiber, carbon fiber and basalt fibre, not only increase pottery
The intensity of porcelain, while the effect for reducing space radiation is also acted, and the use of carbon fiber and basalt fibre reduces oxidation
Aluminium ceramic layer, the purpose for reducing weight and volume is reached.The hole of the present embodiment is shoulder hole, the through hole of alumina ceramic layer from
First layer alumina ceramic layer progressively becomes big to layer 5 alumina ceramic layer, after metal paste filling through hole, is formed rank
The metal paste of scalariform, more arrives outer bigger, plays a part of anti-space radiation, more to interior smaller, before reaching and reducing radiation
Put, saved metal paste, while the slurry of this structure can increase the bond degree of each alumina ceramic layer, be not forced
Dislocation or stripping are dropped, and improve the quality of ceramic package.
Between the alumina ceramic layer, between alumina ceramic layer and carbon fiber layer, alumina ceramic layer and basalt
It is bonded between fibrous layer with bonding agent.
The bonding agent includes polyvinyl butyral resin and ethanol, and its percentage by weight is:Polyvinyl butyral resin 40%,
Ethanol 60%.
The Metal slurry includes the solid phase and 16% liquid phase that percentage by weight is 84%, and solid phase is by below with weight
The composition composition of number meter:
30 parts of tungsten copper powder
2 parts of glass dust
4 parts of alumina powder
5 parts of aluminium hydrate powder,
The liquid phase is made up of the composition of following parts by weight meter:
16 parts of methanol
12 parts of terpinol
8 parts of ethyl cellulose.
The percentage by weight of tungsten is 90% in the tungsten copper powder, and the percentage by weight of copper is 10%.
The basalt fiber is formed with basalt fibre longitudinal arrangement, and the carbon fiber layer is horizontal with carbon fiber
Arrangement forms, and when alumina ceramic layer bonds together, basalt fiber and carbon fiber layer are superimposed together, and formation is netted,
Mesh size is 4mm.
Embodiment 4
The present embodiment includes housing, and the housing is formed with five layers of alumina ceramic layer, from inside to outside respectively first layer
Alumina ceramic layer, second layer alumina ceramic layer, third layer alumina ceramic layer, the 4th layer of alumina ceramic layer and layer 5
Alumina ceramic layer, it is characterised in that:In first layer alumina ceramic layer, second layer alumina ceramic layer, third layer aluminum oxide
The upper surface of ceramic layer and the 4th layer of alumina ceramic layer increases by one layer of basalt fiber, in second layer aluminium oxide ceramics
Layer, third layer alumina ceramic layer, the 4th layer of alumina ceramic layer and layer 5 alumina ceramic layer lower surface on increase by one
Layer carbon fiber layer, it is equipped between basalt fiber and alumina ceramic layer and is made using the wiring that rises of Metal slurry printing
Lines and the figure for playing irradiation shielding action, every layer of alumina layer are equipped with the through hole through the alumina layer, in through hole
Filled with Metal slurry, the through hole is shoulder hole, and the through hole of alumina ceramic layer is from first layer alumina ceramic layer to
Five layers of alumina ceramic layer progressively become big.The present embodiment is equipped between basalt fiber and alumina ceramic layer using gold
The lines for playing wiring of category slurrying material printing and the figure of an irradiation shielding action are plus increased basalt fiber
Serve the effect for strengthening irradiation shielding so that the structure with irradiation shielding action is dissolved into ceramic layer, is effectively reduced
Because the structure of irradiation screen layer and ceramic package disconnects increased volume and weight, pass through basalt fibre and metallization paste
The irradiation shielding of bed of material layer, serves the effect for preventing space radiation, serves what is become reconciled to the integrated circuit of encapsulation to greatest extent
Protective effect, while the present embodiment also add the collective effect of carbon fiber, carbon fiber and basalt fibre, not only increase pottery
The intensity of porcelain, while the effect for reducing space radiation is also acted, and the use of carbon fiber and basalt fibre reduces oxidation
Aluminium ceramic layer, the purpose for reducing weight and volume is reached.The hole of the present embodiment is shoulder hole, the through hole of alumina ceramic layer from
First layer alumina ceramic layer progressively becomes big to layer 5 alumina ceramic layer, after metal paste filling through hole, is formed rank
The metal paste of scalariform, more arrives outer bigger, plays a part of anti-space radiation, more to interior smaller, before reaching and reducing radiation
Put, saved metal paste, while the slurry of this structure can increase the bond degree of each alumina ceramic layer, be not forced
Dislocation or stripping are dropped, and improve the quality of ceramic package.
Between the alumina ceramic layer, between alumina ceramic layer and carbon fiber layer, alumina ceramic layer and basalt
It is bonded between fibrous layer with bonding agent.
The bonding agent includes polyvinyl butyral resin and ethanol, and its percentage by weight is:Polyvinyl butyral resin 33%,
Ethanol 67%.
The Metal slurry include percentage by weight be 82%~88% solid phase and 12%~18% liquid phase, solid phase be by
The composition counted below with parts by weight forms:
29 parts of tungsten copper powder
2 parts of glass dust
3 parts of alumina powder
4 parts of aluminium hydrate powder,
The liquid phase is made up of the composition of following parts by weight meter:
16 parts of methanol
16 parts of terpinol
7 parts of ethyl cellulose.
The percentage by weight of tungsten is 88% in the tungsten copper powder, and the percentage by weight of copper is 12%.
The basalt fiber is formed with basalt fibre longitudinal arrangement, and the carbon fiber layer is horizontal with carbon fiber
Arrangement forms, and when alumina ceramic layer bonds together, basalt fiber and carbon fiber layer are superimposed together, and formation is netted,
Mesh size is 5mm.
Claims (6)
1. a kind of ceramic package, including housing, the housing is formed with five layers of alumina ceramic layer, is respectively from inside to outside
First layer alumina ceramic layer, second layer alumina ceramic layer, third layer alumina ceramic layer, the 4th layer of alumina ceramic layer and
Layer 5 alumina ceramic layer, it is characterised in that:In first layer alumina ceramic layer, second layer alumina ceramic layer, third layer
The upper surface of alumina ceramic layer and the 4th layer of alumina ceramic layer increases by one layer of basalt fiber, in second layer aluminum oxide
Ceramic layer, third layer alumina ceramic layer, the 4th layer of alumina ceramic layer and layer 5 alumina ceramic layer lower surface on increase
Add one layer of carbon fiber layer, be equipped between basalt fiber and alumina ceramic layer and cloth is played using Metal slurry printing
The lines of line effect and the figure for playing irradiation shielding action, every layer of alumina layer are equipped with the through hole through the alumina layer, led to
It is filled with Metal slurry in hole, the through hole is shoulder hole, and the through hole of alumina ceramic layer is from first layer alumina ceramic layer
Progressively become big to layer 5 alumina ceramic layer.
A kind of 2. ceramic package according to claim 1, it is characterised in that:Between the alumina ceramic layer, aluminum oxide
Between ceramic layer and carbon fiber layer, it is be bonded with bonding agent between alumina ceramic layer and basalt fiber.
A kind of 3. ceramic package according to claim 2, it is characterised in that:The bonding agent includes polyvinyl butyral resin
And ethanol, its percentage by weight are:Polyvinyl butyral resin 30%~50%, ethanol 50%~70%.
A kind of 4. ceramic package according to claim 1, it is characterised in that:The Metal slurry includes percentage by weight
Solid phase and 12%~18% liquid phase for 82%~88%, solid phase are made up of the composition counted below with parts by weight:
28~32 parts of tungsten copper powder
1~3 part of glass dust
2~5 parts of alumina powder
4~6 parts of aluminium hydrate powder,
The liquid phase is made up of the composition of following parts by weight meter:
12~18 parts of methanol
5~16 parts of terpinol
3~8 parts of ethyl cellulose.
A kind of 5. ceramic package according to claim 4, it is characterised in that:The percentage by weight of tungsten is in the tungsten copper powder
85%~96%, the percentage by weight of copper is 4%~15%.
A kind of 6. ceramic package according to claim 1, it is characterised in that:The basalt fiber is fine with basalt
Dimension longitudinal arrangement forms, and the carbon fiber layer is that laterally arrangement forms with carbon fiber, profound when alumina ceramic layer bonds together
Military rock fibrous layer and carbon fiber layer are superimposed together, and formation is netted, and mesh size is 3~5mm.
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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CN102361023A (en) * | 2011-10-20 | 2012-02-22 | 中国电子科技集团公司第十三研究所 | Ceramic shell capable of enhancing radiation shielding and preparation method thereof |
CN103158852A (en) * | 2013-03-01 | 2013-06-19 | 溧阳市科技开发中心 | Fuselage with sandwich structure |
CN204586032U (en) * | 2015-04-02 | 2015-08-26 | 昆山市艾娃光电科技有限公司 | Coating structure on electronic equipment casing |
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2017
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102361023A (en) * | 2011-10-20 | 2012-02-22 | 中国电子科技集团公司第十三研究所 | Ceramic shell capable of enhancing radiation shielding and preparation method thereof |
CN103158852A (en) * | 2013-03-01 | 2013-06-19 | 溧阳市科技开发中心 | Fuselage with sandwich structure |
CN204586032U (en) * | 2015-04-02 | 2015-08-26 | 昆山市艾娃光电科技有限公司 | Coating structure on electronic equipment casing |
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