CN102244981A - Novel printed circuit board (PCB) manufacturing technology - Google Patents
Novel printed circuit board (PCB) manufacturing technology Download PDFInfo
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- CN102244981A CN102244981A CN2010102453582A CN201010245358A CN102244981A CN 102244981 A CN102244981 A CN 102244981A CN 2010102453582 A CN2010102453582 A CN 2010102453582A CN 201010245358 A CN201010245358 A CN 201010245358A CN 102244981 A CN102244981 A CN 102244981A
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Abstract
The invention discloses a novel printed circuit board (PCB) manufacturing technology which aims to thoroughly solve the problem that pollution is generated when circuit boards are manufactured at present and completely omit the production of circuit board base materials. The novel PCB manufacturing technological process comprises substrate blanking, drilling, insulation treatment, circuit bonding, solder-proof ink silk-screening, finished product detection, electrical testing and packaging. Compared with the traditional technology, the technology disclosed by the invention has the advantages of 1) short technological process: the technological process is 1/2 of the traditional technological process, thus facilitating management so as to greatly improve the production efficiency; 2) environment-friendly manufacturing technology: electrochemical treatment technology, acid-alkaline etching technology and alkaline solder mask imaging technology in the traditional technology are omitted, thereby realizing green manufacturing technology; 3) energy conservation, consumption reduction and reduced investment of equipment: the process is short and facilitates management, equipment cost and management cost are greatly reduced, for example, the high temperature sintering equipment for a ceramic circuit board is not required, and one million tons of copper coil materials can be saved every year; and 4) avoidance of the copper cladding manufacturing technology for all substrates.
Description
Technical field
Produced pollution problem when " a kind of PCB circuit board making new technology " thoroughly solved present board production, it is the interleaving techniques that contains new material, new technology, it is a revolutionary technological innovation, huge social benefit and abundant economic benefit will be brought, the electronics industry development can be effectively promoted.
Background technology
From the technology of present board production, there are waste water, waste liquid and exhaust gas discharging, and the leftover pieces in the production process, waste material and underproof product, the environment and the ecological balance are caused quite serious destruction, or even permanent harm.The circuit board manufacturing of various base materials need have certain thickness Copper Foil, and utilize acid and alkali corrosion to become circuit on the plate base.Most of Copper Foil does not utilize, and utilance is extremely low, even is lower than 5%.Waste the copper resource greatly.
" a kind of PCB circuit board making new technology " do not had waste water, waste liquid and exhaust gas discharging fully.Having substituted the production of metallic circuit plate substrate and the sintering process of ceramic wiring board with the printing insulating material, with electric conducting material Alloy instead of Copper etching method, is a kind of bonding addition technology.Fundamentally reached the target that the circuit board greenization is produced.
" a kind of PCB circuit board making new technology " fully phased out the production of board substrate.
Summary of the invention:
Traditional PCB process for manufacturing circuit board:
Substrate blanking → boring → heavy copper → full plate copper facing → figure transfer printing ink or dry film → graphic plating → etching → half inspection → silk-screen welding resistance printing ink and legend ink or paste dry film solder mask → hot air leveling or spray tin → profile → become inspection → electrical testing → packing
A kind of PCB circuit board making new technological flow:
Substrate blanking → boring → insulation processing → bonding circuit → silk-screen welding resistance printing ink → one-tenth inspection → electrical testing → packing
" a kind of PCB circuit board making new technology " adopts the addition method.Comprise technologies (non-etching) such as conductive layer injection, electroless copper, chemical plating stannum, trace bonding.
Circuit forms embodiment:
The operation of metal substrate:
One, insulating barrier is handled
1, with the insulating heat-conduction material silk screen printing on metal substrate, put into the baking oven semi-solid preparation, 120 ℃-140 ℃ of temperature, the time is no more than 15 minutes.
2, put into 145 ℃ of 15 minutes temperature of hot press pressing.
Two, bonding circuit
1, with the silk screen printing of circuit primer on insulating barrier, again composite conductive powder is printed on above the primer 140 ℃ of put into baking oven 5 minutes, temperature.
2, put into press 15 minutes, temperature are 145 ℃.
Aluminium base, copper base, iron substrate are fit to this maneuver.
The non-metal base operation:
One, bonding circuit
1, with the silk screen printing of circuit primer on substrate, again composite conductive powder is printed on above the primer 140 ℃ of put into baking oven 5 minutes, temperature.
2, put into press 15 minutes, temperature are 145 ℃.
Non-metal board bases such as ceramic wafer, epoxy resin board, phenolic board, soft base plate, paper substrate plate are fit to this maneuver.Multi-layer sheet is taked same manufacture craft.
Compare with traditional handicraft, this technology possesses following characteristics:
1) technological process is short: be equivalent to 1/2 of traditional handicraft and be convenient to management, thereby improved production efficiency greatly.
2) manufacturing process environmental protection: removed the electrochemical treatments in the traditional handicraft, Acidity of Aikalinity etch process, alkaline solder mask imaging process, thereby realized the manufacturing process greenization.
3) energy-conservation joint depletion equipment: flow process is lacked, is good at management, reduces bigger equipment cost and management cost, has removed high-temperature sintering apparatus from as ceramic circuit board.Can save annual 1000000 tons of copper foil plate.
That [0028] 4) has exempted all base materials covers copper production technology.
Description of drawings:
Fig. 1 is present PCB circuit board making flow chart;
Fig. 2 is a kind of PCB circuit board making new technological flow figure;
Fig. 3 is a kind of board structure of circuit schematic diagram of PCB circuit board making new technology.
Claims (5)
- A kind of PCB circuit board making new technology1. will insulate, Heat Conduction Material is coated on the metal substrate and (comprises aluminium, copper, iron-based material).
- 2. steel mesh, the printed wire primer of slipping through the net.(comprising all materials such as ceramic wafer, epoxy resin board, phenolic board, soft base plate, paper substrate plate).
- With composite conductive powder printing, hot pressing on the circuit primer.
- 4. multi-layer sheet is taked same manufacture craft.
- 5. " a kind of PCB circuit board making new technology " adopts the addition method.Comprise that technologies (non-etching) such as conductive layer injection, electroless copper, chemical plating stannum, trace bonding are all at the row of protection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010245358 CN102244981B (en) | 2010-08-05 | 2010-08-05 | Novel printed circuit board (PCB) manufacturing technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010245358 CN102244981B (en) | 2010-08-05 | 2010-08-05 | Novel printed circuit board (PCB) manufacturing technology |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102244981A true CN102244981A (en) | 2011-11-16 |
| CN102244981B CN102244981B (en) | 2013-11-06 |
Family
ID=44962706
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010245358 Expired - Fee Related CN102244981B (en) | 2010-08-05 | 2010-08-05 | Novel printed circuit board (PCB) manufacturing technology |
Country Status (1)
| Country | Link |
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| CN (1) | CN102244981B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102892253A (en) * | 2012-09-27 | 2013-01-23 | 大连太平洋电子有限公司 | Conductive and insulation ink circuit board and processing method thereof |
| CN103123903A (en) * | 2012-10-25 | 2013-05-29 | 南通康比电子有限公司 | Bridge rectifier DIP (Double In-line Package) brush coating process |
| CN103951999A (en) * | 2014-04-30 | 2014-07-30 | 天津普林电路股份有限公司 | Healant for damage of break point hole position of circuit board and application method thereof |
| CN104425696A (en) * | 2013-08-23 | 2015-03-18 | 郭剑 | LED substrate and manufacturing method thereof |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104244596A (en) * | 2014-09-09 | 2014-12-24 | 浙江经立五金机械有限公司 | PCB manufacturing process |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101737750A (en) * | 2008-11-12 | 2010-06-16 | 臣相科技实业股份有限公司 | Composite heat sink of electrical circuit |
-
2010
- 2010-08-05 CN CN 201010245358 patent/CN102244981B/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101737750A (en) * | 2008-11-12 | 2010-06-16 | 臣相科技实业股份有限公司 | Composite heat sink of electrical circuit |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102892253A (en) * | 2012-09-27 | 2013-01-23 | 大连太平洋电子有限公司 | Conductive and insulation ink circuit board and processing method thereof |
| CN102892253B (en) * | 2012-09-27 | 2015-12-02 | 大连太平洋电子有限公司 | A kind of conduction, insulation ink circuit board processing method |
| CN103123903A (en) * | 2012-10-25 | 2013-05-29 | 南通康比电子有限公司 | Bridge rectifier DIP (Double In-line Package) brush coating process |
| CN104425696A (en) * | 2013-08-23 | 2015-03-18 | 郭剑 | LED substrate and manufacturing method thereof |
| CN103951999A (en) * | 2014-04-30 | 2014-07-30 | 天津普林电路股份有限公司 | Healant for damage of break point hole position of circuit board and application method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102244981B (en) | 2013-11-06 |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20111116 Assignee: Liyuan perichaetine Limited by Share Ltd Assignor: Beijing Tianyi Runda Technology Development Co.,Ltd. Contract record no.: 2014440020221 Denomination of invention: Novel printed circuit board (PCB) manufacturing technology Granted publication date: 20131106 License type: Exclusive License Record date: 20140616 |
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| LICC | Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131106 Termination date: 20190805 |