CN102497739A - New process for manufacturing printed circuit board - Google Patents
New process for manufacturing printed circuit board Download PDFInfo
- Publication number
- CN102497739A CN102497739A CN2011104021520A CN201110402152A CN102497739A CN 102497739 A CN102497739 A CN 102497739A CN 2011104021520 A CN2011104021520 A CN 2011104021520A CN 201110402152 A CN201110402152 A CN 201110402152A CN 102497739 A CN102497739 A CN 102497739A
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- printing
- new process
- circuit board
- printed circuit
- primer
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- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The invention discloses a new process for manufacturing a printed circuit board. The new process comprises the following steps: 1, insulating layer processing: printing an insulated heat-conducting material on a metal substrate in a way of screen printing, and after semi-solidifying the printed insulated heat-conducting material on the metal substrate in a oven, pressing in a hot press, thereby realizing the function of an insulating layer; 2, conductive powder printing and line bonding: printing a line primer on the insulating layer in a way of screen printing, then, printing composite conductive powder on the primer, solidifying the oven, and pressing in the hot press, thereby realizing the functions of a line; and 3, carrying out finished product inspection, then carrying out testing on the obtained finished products. In such a way, a copper-clad manufacturing process of base material is avoided, thereby saving a lot of copper foil boards; meanwhile, the process flow is short, and the manufacturing process is environmental-friendly.
Description
Technical field
The present invention relates to art of printed circuit boards, particularly relate to a kind of New Process in Making of printed circuit board (PCB).
Background technology
Traditional P CB production technology exists waste water, waste liquid and exhaust gas discharging problem, and these PCB preparation technologies' derivative causes quite serious or even nonvolatil destruction to the environment and the ecological balance.The PCB of traditional handicraft makes, and need on substrate, be compounded with certain thickness Copper Foil, and utilizes acid and alkali corrosion to realize the circuit preparation, and most of Copper Foil does not utilize, and utilance even be lower than 5% is wasted the copper resource greatly, for country and enterprise bring massive losses.And the demand of printed circuit board (PCB) constantly enlarges along with the progress of society, and the environment-friendly type of various waste and old printed circuit boards reclaims has become the research focus, and circuit board greenization production technology also becomes the research focus of industry.People expect low appearance of polluting low-loss environmental protection technology.For this reason, my company is technological according to the bonding addition, utilizes the technology of printing insulating material to substitute the production of traditional metal board substrate and the sintering process of ceramic wiring board, has created a kind of New Process in Making of printed circuit board (PCB).
Summary of the invention
The technical problem that the present invention mainly solves provides a kind of New Process in Making of printed circuit board (PCB), and that can exempt base material covers flexible technology, practices thrift a large amount of copper foil plates.
For solving the problems of the technologies described above, the technical scheme that the present invention adopts is: a kind of New Process in Making of printed circuit board (PCB) is provided, comprises the steps: that (1), insulating barrier handle: with the insulating heat-conduction material silk screen printing on metal substrate; Put into the hot press pressing after putting into the baking oven semi-solid preparation; Realize the insulating barrier function, (2), printing conductive powder and bonding circuit: the silk screen printing of circuit primer on insulating barrier, is printed on composite conductive powder above the primer again; Put into baking oven; Put into the press pressing afterwards, realize line function, test after (3), the product inspection.
The invention has the beneficial effects as follows: technological process weak point of the present invention, manufacturing process environmental protection, energy-conservation joint consumption, that has exempted all base materials covers flexible technology, can practice thrift a large amount of copper foil plates.
Description of drawings
Fig. 1 is the board structure of circuit sketch map that new technology of the present invention is made;
The mark of each parts is following in the accompanying drawing: 1---circuit, 2---insulating barrier, 3---metal substrate.
Embodiment
Below in conjunction with accompanying drawing preferred embodiment of the present invention is set forth in detail, thereby protection scope of the present invention is made more explicit defining so that advantage of the present invention and characteristic can be easier to it will be appreciated by those skilled in the art that.
Embodiment 1: the New Process in Making of a kind of printed circuit board (PCB) provided by the invention for the operation of metal substrate, comprises the steps: 1, insulating barrier handles: with the insulating heat-conduction material silk screen printing on metal substrate; Put into the hot press pressing after putting into the baking oven semi-solid preparation; Realize the insulating barrier function, 2, printing conductive powder and bonding circuit: the silk screen printing of circuit primer on insulating barrier, is printed on composite conductive powder above the primer again; Put into baking oven; Put into the press pressing afterwards, realize line function, 3, test after the product inspection.
Embodiment 2: for the operation of non-metal base plate: then omitted the insulating barrier processed steps, directly with the silk screen printing of circuit primer on insulating barrier, again composite conductive powder is printed on above the primer, put into the press pressing after putting into baking oven, realize line function.Carry out product inspection and test then.
The above is merely embodiments of the invention; Be not so limit claim of the present invention; Every equivalent structure or equivalent flow process conversion that utilizes specification of the present invention and accompanying drawing content to be done; Or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present invention.
Claims (1)
1. the New Process in Making of a printed circuit board (PCB) is characterized in that, comprises the steps: that (1), insulating barrier handle: with the insulating heat-conduction material silk screen printing on metal substrate; Put into the hot press pressing after putting into the baking oven semi-solid preparation; Realize the insulating barrier function, (2), printing conductive powder and bonding circuit: the silk screen printing of circuit primer on insulating barrier, is printed on composite conductive powder above the primer again; Put into baking oven; Put into the press pressing afterwards, realize line function, test after (3), the product inspection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011104021520A CN102497739A (en) | 2011-12-07 | 2011-12-07 | New process for manufacturing printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011104021520A CN102497739A (en) | 2011-12-07 | 2011-12-07 | New process for manufacturing printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102497739A true CN102497739A (en) | 2012-06-13 |
Family
ID=46189514
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011104021520A Pending CN102497739A (en) | 2011-12-07 | 2011-12-07 | New process for manufacturing printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102497739A (en) |
-
2011
- 2011-12-07 CN CN2011104021520A patent/CN102497739A/en active Pending
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120613 |