CN102244981B - Novel printed circuit board (PCB) manufacturing technology - Google Patents
Novel printed circuit board (PCB) manufacturing technology Download PDFInfo
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- CN102244981B CN102244981B CN 201010245358 CN201010245358A CN102244981B CN 102244981 B CN102244981 B CN 102244981B CN 201010245358 CN201010245358 CN 201010245358 CN 201010245358 A CN201010245358 A CN 201010245358A CN 102244981 B CN102244981 B CN 102244981B
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Abstract
The invention discloses a printed circuit board (PCB) manufacturing technology which aims to thoroughly solve the problem that pollution is generated when circuit boards are manufactured at present and completely omit the production of circuit board base materials. The PCB manufacturing technological process comprises substrate blanking, drilling, insulation treatment, circuit bonding, solder-proof ink silk-screening, finished product detection, electrical testing and packaging. Compared with the traditional technology, the technology disclosed by the invention has the advantages of 1) short technological process: the technological process is 1/2 of the traditional technological process, thus facilitating management so as to greatly improve the production efficiency; 2) environment-friendly manufacturing technology: electrochemical treatment technology, acid-alkaline etching technology and alkaline solder mask imaging technology in the traditional technology are omitted, thereby realizing green manufacturing technology; 3) energy conservation, consumption reduction and reduced investment of equipment: the process is short and facilitates management, equipment cost and management cost are greatly reduced, for example, the high temperature sintering equipment for a ceramic circuit board is not required, and one million tons of copper coil materials can be saved every year; and 4) avoidance of the copper cladding manufacturing technology for all substrates.
Description
Technical field
" a kind of manufacture method of PCB circuit board " produced pollution problem when thoroughly having solved present board production, it is the interleaving techniques that contains new material, new method, it is a revolutionary method reform, huge social benefit and abundant economic benefit will be brought, the electronics industry development can be effectively promoted.
Background technology
Method from present board production, there is the discharging of waste water, waste liquid and waste gas, and the leftover pieces in production process, waste material and underproof product, environment and the ecological balance are caused quite serious destruction, or even permanent harm, the circuit board fabrication of various base materials need to have certain thickness Copper Foil, and utilize acid and alkali corrosion to become circuit on the plate base.Most of Copper Foil does not utilize, and utilance is extremely low, even lower than 5%, wastes greatly the copper resource.
" a kind of manufacture method of PCB circuit board " do not had the discharging of waste water, waste liquid and waste gas fully.Having substituted the production of metallic circuit plate substrate and the sintering method of ceramic circuit-board with the printing insulating material, replaced the Copper Foil etch with electric conducting material, is a kind of bonding addition technology.Fundamentally reached the target that the circuit board greenization is produced.
" a kind of manufacture method of PCB circuit board " fully phased out the production of board substrate.
Summary of the invention
The manufacture method of traditional PCB circuit board:
Substrate blanking → boring → heavy copper → full plate copper facing → figure transfer of ink or dry film → graphic plating → etching → half inspection → silk-screen welding resistance printing ink and legend ink or paste dry film solder mask → hot air leveling or spray tin → profile → become inspection → electrical testing → packing
A kind of manufacture method of PCB circuit board:
Substrate blanking → boring → insulation processing → bonding circuit → silk-screen welding resistance printing ink → one-tenth inspection → electrical testing → packing
" a kind of manufacture method of PCB circuit board " adopts addition method; Comprise the methods (non-etching) such as conductive layer injection, electroless copper, chemical plating stannum, trace bonding.
Technical scheme of the present invention is: a kind of manufacture method of PCB circuit board, it comprises the steps:
Step 1 is selected the substrate blanking;
Step 2, substrate are metal substrate, and silk screen printing insulating heat-conduction material on metal substrate at first forms insulating barrier, and the metal substrate that will be printed with insulating barrier puts into the baking oven semi-solid preparation, and 120 ℃-140 ℃ of temperature are in 15 minutes time; Then put into the hot press pressing 15 minutes, temperature is 145 ℃;
Step 3, bonding circuit: silk screen printing circuit primer on the insulating barrier of step 2; Print composite conductive powder on described circuit primer, and put into baking oven 5 minutes, 140 ℃ of temperature; Then put into the hot press pressing 15 minutes, temperature is 145 ℃.
Further, when described substrate adopted non-metal base plate, it comprised the steps:
Step 1 is selected the substrate blanking;
Step 2, the bonding circuit: silk screen printing circuit primer on non-metal base plate, print composite conductive powder on the circuit primer, put into baking oven 5 minutes, temperature is 140 ℃; Then put into the hot press pressing 15 minutes, temperature is 145 ℃.
Further, described metal substrate can be copper, aluminium or iron-based material.
Further, described non-metal base plate can be ceramic wafer, epoxy resin board, phenolic board or soft base plate.
Description of drawings:
Fig. 1 is present PCB circuit board making flow chart;
Fig. 2 is a kind of manufacture method flow chart of PCB circuit board;
Fig. 3 is a kind of board structure of circuit schematic diagram of manufacture method of PCB circuit board.
Embodiment:
The operation of metal substrate:
One, insulating barrier is processed
1, with the insulating heat-conduction material silk screen printing on metal substrate, put into the baking oven semi-solid preparation, 120 ℃-140 ℃ of temperature, the time is no more than 15 minutes.
2, put into 145 ℃ of 15 minutes temperature of hot press pressing.
Two, bonding circuit
1, with the silk screen printing of circuit primer on insulating barrier, then composite conductive powder is printed on above primer 140 ℃ of put into baking oven 5 minutes, temperature.
2, put into press 15 minutes, temperature are 145 ℃.
Aluminium base, copper base, iron substrate are fit to this maneuver.
The non-metal base operation:
One, bonding circuit
1, with the silk screen printing of circuit primer on substrate, then composite conductive powder is printed on above primer 140 ℃ of put into baking oven 5 minutes, temperature.
2, put into press 15 minutes, temperature are 145 ℃.
The non-metal board bases such as ceramic wafer, epoxy resin board, phenolic board, soft base plate, paper base plate are fit to this maneuver.Multi-layer sheet is taked same sample making process.
Compare with conventional method, the method possesses following characteristics:
1) technological process is short: be equivalent to 1/2 of conventional method and be convenient to management, thereby greatly improved production efficiency.
2) manufacturing process environmental protection: removed the electrochemical treatments in the traditional handicraft, Acidity of Aikalinity engraving method, alkaline solder mask imaging process, thereby realized the manufacture method greenization.
3) energy-saving depletion equipment: flow process is short, be good at management, reduces larger equipment cost and management cost, removed high-temperature sintering apparatus from as ceramic circuit board.Can save annual 1000000 tons of copper foil plate.
That 4) has exempted all base materials covers copper production technique.
Claims (4)
1. the manufacture method of a PCB circuit board, it is characterized in that: it comprises the steps:
Step 1 is selected the substrate blanking;
Step 2, substrate are metal substrate, and silk screen printing insulating heat-conduction material on metal substrate at first forms insulating barrier, and the metal substrate that will be printed with insulating barrier puts into the baking oven semi-solid preparation, and 120 ℃-140 ℃ of temperature are in 15 minutes time; Then put into the hot press pressing 15 minutes, temperature is 145 ℃;
Step 3, bonding circuit: silk screen printing circuit primer on the insulating barrier of step 2; Print composite conductive powder on described circuit primer, and put into baking oven 5 minutes, 140 ℃ of temperature; Then put into the hot press pressing 15 minutes, temperature is 145 ℃.
2. the manufacture method of a kind of PCB circuit board according to claim 1 is characterized in that: when described substrate adopted non-metal base plate, it comprised the steps:
Step 1 is selected the substrate blanking;
Step 2, the bonding circuit: silk screen printing circuit primer on non-metal base plate, print composite conductive powder on the circuit primer, put into baking oven 5 minutes, temperature is 140 ℃; Then put into the hot press pressing 15 minutes, temperature is 145 ℃.
3. the manufacture method of a kind of PCB circuit board according to claim 1, it is characterized in that: described metal substrate can be copper, aluminium or iron-based material.
4. the manufacture method of a kind of PCB circuit board according to claim 2, it is characterized in that: described non-metal base plate can be ceramic wafer, epoxy resin board, phenolic board or soft base plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010245358 CN102244981B (en) | 2010-08-05 | 2010-08-05 | Novel printed circuit board (PCB) manufacturing technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010245358 CN102244981B (en) | 2010-08-05 | 2010-08-05 | Novel printed circuit board (PCB) manufacturing technology |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102244981A CN102244981A (en) | 2011-11-16 |
| CN102244981B true CN102244981B (en) | 2013-11-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010245358 Expired - Fee Related CN102244981B (en) | 2010-08-05 | 2010-08-05 | Novel printed circuit board (PCB) manufacturing technology |
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| CN (1) | CN102244981B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104244596A (en) * | 2014-09-09 | 2014-12-24 | 浙江经立五金机械有限公司 | PCB manufacturing process |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102892253B (en) * | 2012-09-27 | 2015-12-02 | 大连太平洋电子有限公司 | A kind of conduction, insulation ink circuit board processing method |
| CN103123903B (en) * | 2012-10-25 | 2015-08-26 | 南通康比电子有限公司 | A kind of rectifier bridge stack DIP brush coating technique |
| CN104425696A (en) * | 2013-08-23 | 2015-03-18 | 郭剑 | LED substrate and manufacturing method thereof |
| CN103951999A (en) * | 2014-04-30 | 2014-07-30 | 天津普林电路股份有限公司 | Healant for damage of break point hole position of circuit board and application method thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101737750A (en) * | 2008-11-12 | 2010-06-16 | 臣相科技实业股份有限公司 | Composite heat sink of electrical circuit |
-
2010
- 2010-08-05 CN CN 201010245358 patent/CN102244981B/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101737750A (en) * | 2008-11-12 | 2010-06-16 | 臣相科技实业股份有限公司 | Composite heat sink of electrical circuit |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104244596A (en) * | 2014-09-09 | 2014-12-24 | 浙江经立五金机械有限公司 | PCB manufacturing process |
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| Publication number | Publication date |
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| CN102244981A (en) | 2011-11-16 |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20111116 Assignee: Liyuan perichaetine Limited by Share Ltd Assignor: Beijing Tianyi Runda Technology Development Co.,Ltd. Contract record no.: 2014440020221 Denomination of invention: Novel printed circuit board (PCB) manufacturing technology Granted publication date: 20131106 License type: Exclusive License Record date: 20140616 |
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| LICC | Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131106 Termination date: 20190805 |