CN102244012A - 半导体器件及其制造方法 - Google Patents
半导体器件及其制造方法 Download PDFInfo
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- CN102244012A CN102244012A CN2011101236198A CN201110123619A CN102244012A CN 102244012 A CN102244012 A CN 102244012A CN 2011101236198 A CN2011101236198 A CN 2011101236198A CN 201110123619 A CN201110123619 A CN 201110123619A CN 102244012 A CN102244012 A CN 102244012A
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Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Wire Bonding (AREA)
Abstract
Description
Claims (25)
Applications Claiming Priority (2)
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US12/779,781 US8241964B2 (en) | 2010-05-13 | 2010-05-13 | Semiconductor device and method of embedding bumps formed on semiconductor die into penetrable adhesive layer to reduce die shifting during encapsulation |
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TWI550739B (zh) | 2016-09-21 |
US20120261818A1 (en) | 2012-10-18 |
US9257411B2 (en) | 2016-02-09 |
SG187451A1 (en) | 2013-02-28 |
US8241964B2 (en) | 2012-08-14 |
CN102244012B (zh) | 2016-03-30 |
US8866294B2 (en) | 2014-10-21 |
US20110278717A1 (en) | 2011-11-17 |
TW201203412A (en) | 2012-01-16 |
US20140231989A1 (en) | 2014-08-21 |
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