CN102119588A - Method for manufacturing module with built-in component, and module with built-in component - Google Patents

Method for manufacturing module with built-in component, and module with built-in component Download PDF

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Publication number
CN102119588A
CN102119588A CN2009801316352A CN200980131635A CN102119588A CN 102119588 A CN102119588 A CN 102119588A CN 2009801316352 A CN2009801316352 A CN 2009801316352A CN 200980131635 A CN200980131635 A CN 200980131635A CN 102119588 A CN102119588 A CN 102119588A
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Prior art keywords
resin bed
components
circuit elements
module
elements device
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CN2009801316352A
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CN102119588B (en
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野村雅人
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Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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    • H—ELECTRICITY
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L24/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L24/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
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    • H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
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    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
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    • H05K3/28—Applying non-metallic protective coatings
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    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
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    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
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    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
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Abstract

Provided are a method for manufacturing a module with a built-in component, which can be easily manufactured without using a tape and adhesive, and the module with the built-in component. A core substrate (1) having an opening section (2) is laminated on a first resin layer (10) in an uncured state, and a first circuit component (3) is adhered on a part from which a first resin layer in the opening section is exposed. Then, a second resin layer (20) in an uncured state is laminated on the core substrate (1), a second resin layer is applied in a gap between an inner wall of the opening section (2) and a first circuit component (3), then, the first resin layer (10) and the second resin layer (20) are cured.

Description

The manufacture method of components and parts built-in module and components and parts built-in module
Technical field
The present invention relates to a kind of manufacture method and components and parts built-in module of components and parts built-in module.Components and parts built-in module among so-called the present invention, be meant central layer placed in the middle of and its positive and negative have resin bed and between the two layers of resin layer the built-in module of at least one circuit elements device.Also can in each resin bed, be embedded with components and parts.In addition, also can be on the resin bed of positive and negative further stacked resin bed.
Background technology
In recent years, along with the miniaturization of electronic equipment, require to be used to install the circuit substrate realization miniaturization of circuit elements devices such as chip capacitor.In view of the above, make module, thereby cut down circuit elements device mounting area, try hard to realize the miniaturization of circuit substrate by burying the circuit elements device underground in circuit substrate inside.Wherein, the substrate having built-in components that is embedded with the circuit elements device in the inside of resin bed has following advantage: in light weight, and, owing to need not as ceramic substrate, to carry out high-temperature firing, therefore, few to the restriction of built-in circuit elements device.
In patent documentation 1, disclosed the manufacture method of following components and parts built-in module: on central layer, form through hole, at the bottom surface of this central layer Continuous pressing device for stereo-pattern, and, adhere to the circuit elements device on the adhesive tape that exposes in the bottom surface of through hole, utilize adhesive securement circuit elements device around and the gap between the inner surface of through hole, afterwards, with tape stripping, at the stacked resin bed in the two sides of central layer.
In the method, need adhesive tape for temporary fixed circuit elements device, but since after use that this adhesive tape is discarded, therefore, there is the problem that causes manufacturing cost to rise.In addition, need be in the gap between the through hole of circuit elements device and central layer coating adhesive, but in narrow space the action need time and the precision of coating adhesive.In addition, because bonding agent generally is a kinds of materials with the resin bed that is laminated in the two sides of central layer, therefore, and the thermal coefficient of expansion difference, along with variations in temperature, substrate might produce warpage.Though in order to suppress warpage, coating adhesive in the part in the preferred only gap between circuit elements device and through hole, but in this case, because the constant intensity step-down of circuit elements device, therefore, with adhesive tape when central layer is peeled off, the circuit elements device might come off from through hole because of the bonding force of adhesive tape.
Patent documentation 1: the Japan Patent spy opens the 2008-131039 communique
Summary of the invention
The object of the present invention is to provide a kind of manufacture method and components and parts built-in module that can solve the components and parts built-in module of problem as described above.
In order to achieve the above object, the manufacture method of components and parts built-in module involved in the present invention is characterised in that, comprising: the core layer that operation A, this operation A will have the peristome that runs through the positive and negative direction is stacked on first resin bed of its uncured state; Process B, this process B make the first circuit elements device be attached to the exposed portions serve of described first resin bed of its uncured state of exposing in described peristome; Operation C, this operation C is layered in second resin bed of its uncured state on the described central layer, and fills second resin bed in the inwall of described peristome and the gap between the described first circuit elements device; Step D, this step D are solidified described first resin bed; And operation E, this operation E solidifies described second resin bed.
In addition, components and parts built-in module involved in the present invention is characterised in that, comprising: first resin bed; Central layer, this core layer are stacked on described first resin bed, and have the peristome that runs through the positive and negative direction; The first circuit elements device, this first circuit elements device is accommodated in the peristome of described central layer, and the bottom surface is attached on described first resin bed; Second resin bed, this second resin bed is layered on the described central layer, and is filled in the peristome and the gap between the described first circuit elements device of described central layer; And electrode, this electrode is formed at described first resin bed, and, be electrically connected with the described first circuit elements device.
In the present invention, the core layer that will have peristome is stacked on the first uncured resin bed, and makes the first circuit elements device be attached to the part that first resin bed in the peristome exposes.So-called uncured, be meant semi-cured state (for example B stage) or than its more soft state.Because the first uncured resin bed has cementability, therefore, the central layer and the first circuit elements device can remain on first resin bed temporarily.That is, can not use adhesive tape, and keep the first circuit elements device temporarily.Under the state of the interim maintenance first circuit elements device, if with second uncured resin laminated being connected on the central layer, then second resin bed flows, and is filled in the inwall and the gap between the first circuit elements device of peristome.That is, the central layer and the first circuit elements device are embedded between first resin bed and second resin bed, form integrated.Afterwards, if first resin bed and second resin bed are solidified, then finish the components and parts built-in module.Like this, owing to can not use adhesive tape and bonding agent, and keep the first circuit elements device temporarily, and can will be used to keep first resin bed of the first circuit elements device to be used as layer laminate same as before, thereby, can realize that manufacturing process simplifies, manufacture method with low cost.In addition, the problem that also the circuit elements device does not come off with tape stripping the time.Though owing to form peristome at central layer, thereby the mechanical strength of module might reduce, and by utilizing the surface of resin (second resin bed) sealed open portion and central layer, can improve mechanical strength.
As the method that the first circuit elements device is electrically connected with first resin bed, also can be in first resin bed before adhering to the first circuit elements device, formation by the interlayer bonding conductor that runs through first resin bed with the hole be filled into the electrode that the interlayer bonding conductor constitutes with the uncured conducting paste in the hole, in process B, the first circuit elements device is attached to first resin bed in the mode that contacts with electrode, in step D, when first resin bed is solidified, conducting paste is solidified, the first circuit elements device and electrode are electrically connected.In this case, not after first resin bed solidifies, the first circuit elements device to be installed, but in the first uncured resin bed, form uncured electrode by conducting paste, disposing the first circuit elements device is in and the contacted state of electrode, first resin bed and electrode are cured simultaneously, thereby uncured conducting paste has conductivity, and the first circuit elements device and electrode are electrically connected.In this case, can omit the fitting operation that the first circuit elements device and first resin bed are carried out especially.
As the additive method that the first circuit elements device is electrically connected with first resin bed, also can use the hole with bonding conductor between the mode cambium layer that arrives the first circuit elements device in first resin bed after curing, and between this interlayer bonding conductor is with cambium layer in hole bonding conductor, thereby form the electrode that is electrically connected with the first circuit elements device.That is, make after first resin bed solidifies, forming the interlayer bonding conductor that runs through first resin bed with hole (via hole), and in this hole bonding conductor (path) between cambium layer, thereby can form electrode.In this case, because can be by being formed at the interlayer bonding conductor with the plated film of the inner surface in hole or be filled into the interlayer bonding conductor and come bonding conductor between cambium layer with the conducting paste in the hole, therefore, can realize the low resistanceization of interlayer bonding conductor, improve connection reliability.
Can implement the curing of first resin bed and the curing of second resin bed simultaneously, also can before stacked second resin bed, implement the curing of first resin bed.Under the situation that first resin bed and second resin bed are cured simultaneously, can reduce the heat treatment number of times, and the curing of the curing of first resin bed and second resin bed becomes simultaneously to be carried out, and can suppress the generation of the warpage of the components and parts built-in module that causes because of cure shrinkage.In addition, owing to can reduce the thermal process number of times that the circuit elements device is carried out, therefore, can reduce the circuit elements components from being damaged.
The preferred first circuit elements device is the components and parts higher than the thickness of central layer.Though the lower components and parts of the height of sheet components and parts and so on are also arranged in the circuit elements device, the higher components and parts of height of SAW element and so on are also arranged.By the first higher like this circuit elements device is accommodated in the peristome of central layer, only some gives prominence to the first circuit elements device at the upper surface of central layer, can realize whole slim components and parts built-in module.
Preferably before operation C, comprise the second circuit components and parts lower than the first circuit elements device are installed in operation on the central layer, in operation C, the second circuit components and parts are embedded in second resin bed.In order to improve the packing density of components and parts built-in module, the circuit elements device is installed also on central layer preferably.By the second circuit components and parts lower than the first circuit elements device are installed on the central layer, the upper surface of the upper surface of the first circuit elements device and second circuit components and parts flattens all, can realize the components and parts built-in module of whole slim and high packing density.
Also can form face inner wire (pattern wiring) at the back side of first resin bed.In this case,, after making the curing of first resin bed, Copper Foil is formed pattern, then can form the face inner wire easily as if the back side that Copper Foil is crimped on the first uncured resin bed.Similarly, also can form face inner wire (pattern wiring) at the back side of second resin bed.In this case,, after making the curing of second resin bed, Copper Foil is formed pattern, then can form the face inner wire easily as if the back side that Copper Foil is crimped on the second uncured resin bed.In addition, the formation method of face inner wire is not limited to use the method for Copper Foil, also can use the method for plating method or printing conductive thickener etc.
Preferred first resin bed is formed by identical material with second resin bed.If identical material then because its thermal coefficient of expansion is also equal, therefore, can suppress module warpage, distortion that variations in temperature is brought.As resin bed, for example can constitute by the mixture of heat-curing resins such as epoxy resin, heat-curing resin and inorganic filler, the resin combination that makes glass fiber impregnated heat-curing resin etc.
As the central layer among the present invention, can use the printed wiring board of resin substrate, glass epoxy substrate and so on, also can use the ceramic substrate of LTCC (low-temperature sintering ceramic substrate) and so on.
As mentioned above, according to the present invention, because will have the core layer of peristome is stacked on the first uncured resin bed, the first circuit elements device is attached to the part that first resin bed in the peristome exposes, and second resin bed of its uncured state is layered on the central layer, in the inwall of peristome and the gap between the first circuit elements device, fill second resin bed, first resin bed and second resin bed are solidified, therefore, even the first circuit elements device is the components and parts higher than central layer, also can realize the components and parts built-in module that integral thickness is thin.In addition, because first resin bed has temporary fixed central layer and the first circuit elements device and as the function of layer laminate, therefore, can simplify manufacturing process, reduce manufacturing cost.
Description of drawings
Fig. 1 is the cutaway view of the execution mode 1 of components and parts built-in module involved in the present invention.
Fig. 2 is the process chart of an example of the manufacture method of components and parts built-in module shown in Figure 1.
Fig. 3 is the process chart of other examples of the manufacture method of components and parts built-in module shown in Figure 1.
Fig. 4 is the cutaway view of the execution mode 2 of components and parts built-in module involved in the present invention.
Fig. 5 is the cutaway view of the execution mode 3 of components and parts built-in module involved in the present invention.
Fig. 6 is the process chart of an example of the manufacture method of components and parts built-in module shown in Figure 5.
Embodiment
[execution mode 1]
With reference to Fig. 1, the execution mode 1 of components and parts built-in module involved in the present invention is described.
In Fig. 1, the components and parts built-in module A of present embodiment is made of central layer 1, first resin bed 10 of downside that is laminated in central layer 1 and second resin bed 20 that is laminated in the upside of central layer 1.Central layer 1 can also be the such ceramic substrate of LTCC except printed wiring boards such as resin substrate.Here, though central layer 1 shows the example of multilager base plate, also can be single layer substrate.First resin bed 10 is resin beds thinner than central layer 1, can use heat-curing resin, the material that contains inorganic filler and heat-curing resin and prepregs such as epoxy resin.Wish that second resin bed 20 is the resin beds with first resin bed, 10 identical materials, but also can be other materials.
On central layer 1, be formed with the peristome 2 that connects positive and negative, utilize the bottom surface of resin bed 10 closed peristomes 2.Taken in the first circuit elements device 3 in peristome 2, the terminal electrode 3a of this circuit elements device 3 is electrically connected with the electrode that is formed at resin bed 10 (interlayer bonding conductor) 11a.The first circuit elements device 3 is that for example the SAW element is such, the thickness of aspect ratio central layer 1 is wanted high higher components and parts.Utilization be formed at second resin bed 20 on the central layer 1 cover the first circuit elements device 3 upper surface and around.That is, also fill second resin bed 20 in the gap between around the inwall of peristome 2 and the first circuit elements device 3.Pattern in that the upper surface and the lower surface of central layer 1 is formed with face inner wire 4,5 is equipped with second circuit components and parts 6 on the face inner wire 4 of upper surface.Second circuit components and parts 6 for example be chip capacitor or integrated circuit component and so on, the aspect ratio first circuit elements device 3 will be low low components and parts, utilize second resin bed 20 that is formed on the central layer 1 with its covering.
The face inner wire 5 of the lower surface of central layer 1 is electrically connected with the interlayer bonding conductor 11b that is formed at resin bed 10.Interlayer bonding conductor 11a, the 11b of resin bed 10 is electrically connected with the face inner wire 12a, the 12b that form pattern at the lower surface of resin bed 10 respectively.
Like this, because the first higher circuit elements device 3 is disposed at peristome 2, second circuit components and parts 6 that will be lower are installed on the central layer 1, therefore, the upper surface of the upper surface of the first circuit elements device 3 and second circuit components and parts 6 flattens all, can realize the components and parts built-in module A of whole slim and high packing density.In addition, though have the mechanical strength step-down of the central layer 1 of peristome 2,, therefore, can improve mechanical strength owing to utilize the surface of same resin (second resin bed) 20 sealed open portions 2 and central layer 1.
-the first manufacture method-
Here, with reference to Fig. 2, an example of the manufacture method of described components and parts built-in module A is described.In addition,, in the manufacturing process of reality, make the components and parts built-in module of mother substrate state, cut into the submounts state afterwards though the manufacture method to single components and parts built-in module A describes among Fig. 2.
(a) of Fig. 2 is first operation, and the state of the central layer 1 and first resin bed 10 has been prepared in expression.Central layer 1 is a hard substrate, is formed with peristome 2 and face inner wire 4,5.Though on the face inner wire 4 of upper surface, second circuit components and parts 6 are installed in advance, also can after central layer 1 and first resin bed 10 is bonding, second circuit components and parts 6 be installed.On the other hand, first resin bed 10 is uncured resin sheets, can utilize the uncured sheet material that for example contains inorganic filler and heat-curing resin, not contain inorganic filler and the uncured sheet material that formed by heat-curing resin and prepreg etc.In first resin bed 10, with the face inner wire 5 corresponding positions of the terminal electrode 3a and the central layer 1 of the first circuit elements device 3, be formed with interlayer bonding conductor 11a, 11b respectively.This interlayer bonding conductor 11a, 11b are filled into the interlayer bonding conductor that runs through first resin bed 10 with the parts in the hole with uncured conductor thickener.And Copper Foil 12 utilizes the bonding force of first resin bed 10 to stick on the whole surface of lower surface of first resin bed 10.
(b) of Fig. 2 is second operation, central layer 1 be crimped on first resin bed 10, and, the first circuit elements device 3 is crimped on the part that first resin bed 10 in the peristome 2 exposes.At this moment, the face inner wire 5 of central layer 1 is corresponding with interlayer bonding conductor 11b, and the terminal electrode 3a of the first circuit elements device 3 is corresponding with interlayer bonding conductor 11a, carries out crimping by this way.Because the first uncured resin bed 10 has cementability, therefore, the central layer 1 and the first circuit elements device 3 are temporarily fixed on first resin bed 10.At this moment, because it is also uncured to constitute the conducting paste of interlayer bonding conductor 11a, therefore, the terminal electrode 3 of the first circuit elements device 3 is electrically connected with interlayer bonding conductor 11a.
(c) of Fig. 2 is the 3rd operation, the stacked second uncured resin bed 20 on central layer 1.Because second resin bed 20 is uncured, therefore, second resin bed 20 flows, seamlessly be filled into second circuit components and parts 6 around, and, also be filled in the inwall and the gap between the first circuit elements device 3 of peristome 2.By when carrying out stacked crimping, heating, first resin bed 10 and second resin bed 20 are solidified together.Consequently, central layer 1 is placed the centre, make first resin bed 10 and second resin bed 20 form integrated.At this moment, because interlayer bonding conductor 11a, 11b also solidify simultaneously, produce conductivity, therefore, interlayer bonding conductor 11a is electrically connected with the terminal electrode 3a of the first circuit elements device 3, and interlayer bonding conductor 11b is electrically connected with the face inner wire 5 of central layer 1.
(d) of Fig. 2 is the 4th operation, carries out pattern by the Copper Foil 12 to first resin bed 10 that solidifies and forms, and forms face inner wire 12a, 12b, finishes components and parts built-in module A.The pattern of Copper Foil 12 forms and can form by known methods such as etchings.In addition, face inner wire 12a, 12b also can wait by the print process of plating method, conducting paste to form except by Copper Foil 12 being sticked on the first uncured resin bed 10, carrying out etching method form after first resin bed 10 solidifies.
Though in manufacture method shown in Figure 2, first resin bed 10 and second resin bed 20 are solidified simultaneously, also can first resin bed 10 be solidified in the stage that operation (b) finishes.But, be under same material and the situation about being cured simultaneously at first resin bed 10 and second resin bed 20, because the cure shrinkage of two layers of resin layer becomes identical situation, therefore, have the advantage that can suppress to produce warpage.
-the second manufacture method-
Fig. 3 represents other examples of the manufacture method of described components and parts built-in module A.(a) of Fig. 3 is first operation, and the state of the central layer 1 and uncured first resin bed 10 has been prepared in expression.Though central layer 1 is identical with Fig. 2, first resin bed 10 is the resin sheets that do not have the thin layer of bonding conductor between cambium layer.First resin bed 10 is not pasted Copper Foil yet.
(b) of Fig. 3 is second operation, central layer 1 be crimped on first resin bed 10, and, the first circuit elements device 3 is crimped on the part that first resin bed 10 in the peristome 2 exposes.Because therefore bonding conductor between cambium layer not as yet in first resin bed 10, need not central layer 1 and the first circuit elements device 3 and first resin bed, 10 aligned positions, bonding operation becomes simple.
(c) of Fig. 3 is the 3rd operation, the stacked second uncured resin bed 20 on central layer 1.Because second resin bed 20 is uncured, therefore, second resin bed 20 flows, seamlessly be filled into second circuit components and parts 6 around, and, also be filled in the inwall and the gap between the first circuit elements device 3 of peristome 2.By when carrying out stacked crimping, heating, first resin bed 10 and second resin bed 20 are solidified together.
(d) of Fig. 3 is the 4th operation, with the position of corresponding first resin bed 10 of terminal electrode 3a of the face inner wire 5 of central layer 1 and the first circuit elements device 3, by bonding conductor hole 11a between the laser processing cambium layer 1, 11b 1By the hole 11a of bonding conductor between cambium layer 1, 11b 1, expose face inner wire 5 and terminal electrode 3a.
(e) of Fig. 3 is the 5th operation, at interlayer bonding conductor hole (via hole) 11a 1, 11b 1Middle filled conductive thickener makes its curing, and bonding conductor 11a, 11b between cambium layer afterwards, form and interlayer bonding conductor 11a, the face inner wire 12a of 11b conducting, the pattern of 12b on the surface of first resin bed 10. Interlayer bonding conductor 11a, 11b are not limited to fill and the curing conductive thickener, can also be by plating method at interlayer bonding conductor hole 11a 1, 11b 1Inner surface form conducting film, afterwards, at interlayer bonding conductor hole 11a 1, 11b 1In bury resin underground.As the formation method of face inner wire 12a, 12b, can select any means such as plating method, printing conductive thickener.
For the situation of manufacture method shown in Figure 3, because after first resin bed 10 solidifies, bonding conductor hole 11a between cambium layer 1, 11b 1, and by bonding conductor 11a, 11b between conducting paste or plating cambium layer, therefore, the face inner wire 5 of central layer 1 and the terminal electrode 3a of the first circuit elements device 3 can be electrically connected reliably with interlayer bonding conductor 11a, 11b.Though in manufacture method shown in Figure 3, first resin bed 10 and second resin bed 20 are solidified simultaneously, also can before stacked second resin bed 20, first resin bed 10 be solidified.In this case, also can be before stacked second resin bed 20, bonding conductor 11a, 11b between cambium layer.
[execution mode 2]
The execution mode 2 of Fig. 4 representation element device built-in module.In the components and parts built-in module B of this execution mode,, further made up resin bed 30 stacked at the lower surface of first resin bed 10 of the components and parts built-in module A of execution mode 1.This resin bed 30 is thin resin layers same with first resin bed 10, is formed with by a plurality of interlayer bonding conductors 31 and the face inner wire 12a of first resin bed 10, the face inner wire 32 that 12b is connected at its lower surface.In addition, can certainly be at the further stacked resin bed of the lower surface of resin bed 30.
[execution mode 3]
The execution mode 3 of Fig. 5 representation element device built-in module.In order to improve packing density, the components and parts built-in module C of this execution mode passes through to install tertiary circuit components and parts 40 on face inner wire 12a, the 12b at the back side of first resin bed 10, and, stacked the 3rd resin bed 50 at the back side of first resin bed 10, thus tertiary circuit components and parts 40 are embedded in the 3rd resin bed 50.Tertiary circuit components and parts 40 can be the components and parts lower than the first circuit elements device 3.The 3rd resin bed 50 can adopt and first, second resin bed 10,20 identical materials.In second resin bed 20, be formed with a plurality of interlayer bonding conductors 21 that are connected with the face inner wire pattern 4 of central layer 1, on the surface of second resin bed 20, be formed with the face inner wire pattern 22a that is connected with interlayer bonding conductor 21.
Fig. 6 is an example of the manufacturing process of representation element device built-in module C.At first, because Fig. 6 (a)～(d) is basic identical with Fig. 2 (a)～(d), therefore omit its repeat specification.But in the stage of Fig. 6 (c), at the surface configuration Copper Foil 22 of second resin bed 20, Copper Foil 22 is fixed in the surface of second resin bed 20 when crimping/curing.In addition, in (d) of Fig. 6, after second resin bed 20 solidifies, Copper Foil 22 carries out pattern formation and becomes face inner wire pattern 22a, and, interlayer bonding conductor to the face inner wire 4 of the upper surface that arrives central layer 1 carries out laser processing with hole (via hole), this interlayer bonding conductor with the hole in filled conductive thickener and make its curing, thereby bonding conductor 21 between cambium layer.In addition, the shape of the part of second circuit components and parts 6 is different with Fig. 2.
In (e) of Fig. 6, the module that will obtain by (d) of Fig. 6 upset is installed tertiary circuit components and parts 40 on face inner wire 12a, the 12b at the back side of first resin bed 10.In (f) of Fig. 6, by with uncured the 3rd resin bed 50 thermo-compressed on first resin bed 10, utilize the 3rd resin bed 50 cover tertiary circuit components and parts 40 around, and, the 3rd resin bed 50 is solidified, thereby finishes components and parts built-in module C.
Though in Fig. 6, as first resin bed 10, used the resin sheet that is pre-formed interlayer bonding conductor 11a, 11b and pastes Copper Foil 12 on the whole surface of lower surface, but shown in also can image pattern 3 like that, use does not have the resin sheet of interlayer bonding conductor and Copper Foil, and solidifies bonding conductor between the cambium layer of back at it.
Though in the above-described embodiments,, the example of having used the components and parts higher than central layer 1 is shown, also can is and contour components and parts of central layer 1 or the components and parts lower than central layer 1 as the first circuit elements device 3.In addition, the cured of first resin bed 10 and second resin bed 20 not necessarily needs to carry out simultaneously.That is, also can after central layer 1 and the first circuit elements device 3 are temporarily fixed on first resin bed 10 first resin bed 10 be solidified, stacked afterwards second resin bed 20 also makes its curing.But, carry out the curing of first resin bed 10 and second resin bed 20 simultaneously, be favourable reducing on the module warpage this point that cure shrinkage brings.
Label declaration
A～C parts installation module
1 central layer
2 peristomes
3 first circuit elements devices
The 3a terminal electrode
4,5 inner wires
6 second circuit components and parts
10 first resin beds
11a, 11b electrode (interlayer bonding conductor)
12a, 12b face inner wire
20 second resin beds
21 interlayer bonding conductors
30 stacked resin beds
40 tertiary circuit components and parts
50 the 3rd resin beds

Claims (12)

1. the manufacture method of a components and parts built-in module is characterized in that, comprising:
The core layer that operation A, this operation A will have the peristome that runs through the positive and negative direction is stacked on first resin bed of its uncured state;
Process B, this process B make the first circuit elements device be attached to the exposed portions serve of described first resin bed of its uncured state of exposing in described peristome;
Operation C, this operation C is layered in second resin bed of its uncured state on the described central layer, and fills second resin bed in the inwall of described peristome and the gap between the described first circuit elements device;
Step D, this step D are solidified described first resin bed; And
Operation E, this operation E solidify described second resin bed.
2. the manufacture method of components and parts built-in module as claimed in claim 1 is characterized in that,
Form electrode in described first resin bed before described process B, this electrode by the interlayer bonding conductor that runs through this first resin bed with the hole be filled into this interlayer bonding conductor and constitute with the uncured conducting paste in the hole,
In described process B, the described first circuit elements device is attached to described first resin bed in the mode that contacts with described electrode,
In described step D, when described first resin bed is solidified, described conducting paste is solidified, described first circuit elements device and described electrode are electrically connected.
3. the manufacture method of components and parts built-in module as claimed in claim 1 is characterized in that,
After described step D, in described first resin bed, use the hole with bonding conductor between the mode cambium layer that arrives the described first circuit elements device, and between this interlayer bonding conductor is with cambium layer in hole bonding conductor, the electrode that is electrically connected with the described first circuit elements device by such formation.
4. as the manufacture method of each described components and parts built-in module of claim 1 to 3, it is characterized in that,
Implement described step D and operation E simultaneously.
5. as the manufacture method of each described components and parts built-in module of claim 1 to 4, it is characterized in that,
The described first circuit elements device is the components and parts higher than the thickness of described central layer.
6. as the manufacture method of each described components and parts built-in module of claim 1 to 5, it is characterized in that,
Be included in before the described operation C, will be installed in operation on the described central layer than the low second circuit components and parts of the described first circuit elements device,
In described operation C, described second circuit components and parts are embedded in described second resin bed.
7. as the manufacture method of each described components and parts built-in module of claim 1 to 6, it is characterized in that,
Described first resin bed is formed by identical material with described second resin bed.
8. a components and parts built-in module is characterized in that, comprising:
First resin bed;
Central layer, this core layer are stacked on described first resin bed, and have the peristome that runs through the positive and negative direction;
The first circuit elements device, this first circuit elements device is accommodated in the peristome of described central layer, and the bottom surface is attached on described first resin bed;
Second resin bed, this second resin bed is layered on the described central layer, and is filled in the peristome and the gap between the described first circuit elements device of described central layer; And
Electrode, this electrode are formed at described first resin bed, and are electrically connected with the described first circuit elements device.
9. components and parts built-in module as claimed in claim 8 is characterized in that,
Described electrode is the interlayer bonding conductor that is formed at described first resin bed in the mode that arrives the described first circuit elements device.
10. components and parts built-in module as claimed in claim 8 or 9 is characterized in that,
The described first circuit elements device is the components and parts higher than the thickness of described central layer.
11. each the described components and parts built-in module as claim 8 to 10 is characterized in that,
Comprise that also these second circuit components and parts are installed on the described central layer, and are embedded in described second resin bed than the low second circuit components and parts of the described first circuit elements device.
12. each the described components and parts built-in module as claim 8 to 11 is characterized in that,
Described first resin bed is formed by identical material with described second resin bed.
CN200980131635.2A 2008-08-12 2009-06-09 Method for manufacturing module with built-in component, and module with built-in component Expired - Fee Related CN102119588B (en)

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