CN102091875B - 用于在未完工产品上形成表面的激光加工设备及方法 - Google Patents

用于在未完工产品上形成表面的激光加工设备及方法 Download PDF

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Publication number
CN102091875B
CN102091875B CN201010580202.XA CN201010580202A CN102091875B CN 102091875 B CN102091875 B CN 102091875B CN 201010580202 A CN201010580202 A CN 201010580202A CN 102091875 B CN102091875 B CN 102091875B
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laser
complete
pulse
laser beam
pulse area
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English (en)
Chinese (zh)
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CN102091875A (zh
Inventor
G·布伦纳
U·孔齐克
R·弗里德里希
H·穆沙尔特
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Walter Maschinenbau GmbH
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Ewag AG
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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/0823Devices involving rotation of the workpiece
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/083Devices involving movement of the workpiece in at least one axial direction
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/0869Devices involving movement of the laser head in at least one axial direction
    • B23K26/0876Devices involving movement of the laser head in at least one axial direction in at least two axial directions

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
CN201010580202.XA 2009-10-22 2010-10-21 用于在未完工产品上形成表面的激光加工设备及方法 Active CN102091875B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE200910044316 DE102009044316B4 (de) 2009-10-22 2009-10-22 Verfahren zur Herstellung einer Fläche und/oder einer Kante an einem Rohling sowie Laserbearbeitungsvorrichtung zur Durchführung des Verfahrens
DE102009044316.9 2009-10-22

Publications (2)

Publication Number Publication Date
CN102091875A CN102091875A (zh) 2011-06-15
CN102091875B true CN102091875B (zh) 2016-03-09

Family

ID=43502607

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201010580202.XA Active CN102091875B (zh) 2009-10-22 2010-10-21 用于在未完工产品上形成表面的激光加工设备及方法

Country Status (7)

Country Link
US (1) US8969758B2 (ja)
EP (1) EP2314412B2 (ja)
JP (1) JP6137767B2 (ja)
CN (1) CN102091875B (ja)
DE (1) DE102009044316B4 (ja)
ES (1) ES2709696T5 (ja)
SI (1) SI2314412T2 (ja)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9463531B2 (en) * 2009-10-23 2016-10-11 Kennametal Inc. Three-dimensional surface shaping of rotary cutting tool edges with lasers
DE102010011508B4 (de) * 2010-03-15 2015-12-10 Ewag Ag Verfahren zur Herstellung zumindest einer Spannut und zumindest einer Schneidkante und Laserbearbeitungsvorrichtung
DE102011078825B4 (de) 2011-07-07 2018-07-19 Sauer Gmbh Lasertec Verfahren und Laserbearbeitungsmaschine zur Bearbeitung eines Werkstücks
KR101341001B1 (ko) * 2011-11-17 2013-12-13 주식회사 아이엠티 레이저를 이용한 대면적 마스크 세정 장치 및 이를 포함하는 대면적 마스크 세정 시스템
DE102012111771B4 (de) * 2012-12-04 2020-12-03 Ewag Ag Verfahren zur Bearbeitung eines Werkstücks unter Verwendung einer Laserbearbeitungsvorrichtung zur Herstellung eines Schneidwerkzeugs
JP5764181B2 (ja) 2013-10-31 2015-08-12 ユニオンツール株式会社 硬質皮膜被覆切削工具
DE102014109613A1 (de) * 2014-07-09 2014-09-04 Ewag Ag Verfahren zur Herstellung einer Werkstückfläche an einem stabförmigen Werkstück
CN104625416B (zh) * 2014-12-29 2016-06-22 北京理工大学 基于方孔辅助电子动态调控晶硅表面周期性微纳结构方法
SG10201804397UA (en) 2015-06-22 2018-06-28 Electro Scientific Industries Inc Multi-axis machine tool and methods of controlling the same
DE102016225602B3 (de) * 2016-12-20 2018-05-09 Sauer Gmbh Verfahren zur Bearbeitung einer Schneidplatte sowie entsprechende Vorrichtung zur Bearbeitung einer Schneidplatte
PL3398709T3 (pl) * 2017-05-03 2021-06-28 Agathon AG, Maschinenfabrik Układ do obróbki laserowej z koncepcją termiczną
DE102018001570A1 (de) * 2018-02-28 2019-08-29 Vollmer Werke Maschinenfabrik Gmbh Vorrichtung und Verfahren zum Bearbeiten eines Werkstücks mittels eines Laserstrahls
DE102018125436A1 (de) * 2018-10-15 2020-04-16 Ewag Ag Verfahren zur materialabtragenden Laserbearbeitung eines Werkstücks
DE102018221365A1 (de) * 2018-12-10 2020-06-10 Trumpf Laser Gmbh Verfahren zum Abtragen von Material von einem Werkstück und Laserbearbeitungsanlage
US11559856B2 (en) * 2019-10-28 2023-01-24 Robert Bosch Gmbh Laser cutter adapted to cut rotating workpieces
CN111331259B (zh) * 2020-02-26 2021-11-12 上海交通大学 利用激光加工高精度单晶金刚石圆弧刀具的方法及装置
KR20220164057A (ko) 2020-04-10 2022-12-12 로렉스 에스아 레이저 선삭 시스템, 이러한 시스템을 이용하는 레이저 선삭 방법, 및 이러한 방법에 의해 획득된 부품
KR20220164058A (ko) 2020-04-10 2022-12-12 알파노브 레이저 선삭 시스템, 레이저 선삭 방법, 및 이러한 시스템에 의해 획득된 부품
CN112676704A (zh) * 2020-12-30 2021-04-20 苏州高意激光科技有限公司 一种具有多切割头的多工位旋转的激光研磨装置
CN112710572A (zh) * 2021-01-19 2021-04-27 广东百达检测技术服务有限公司 一种建筑材料硬度检测***及方法
WO2022188969A1 (en) * 2021-03-10 2022-09-15 Applied Materials Italia S.R.L. Apparatus and method for laser machining of a substrate
WO2022199725A1 (en) * 2021-10-12 2022-09-29 Hofmeister S.R.O. Method of surface layer removal from the surface of geometrically complex edges of cutting tools using laser stripping method
EP4265369A1 (de) * 2022-04-21 2023-10-25 Rollomatic S.A. Verfahren zur laserbasierten bearbeitung eines werkstücks
EP4265365A1 (de) * 2022-04-21 2023-10-25 Rollomatic S.A. Verfahren zur laserbasierten bearbeitung eines werkstücks und laserbearbeitungsvorrichtung zur durchführung des verfahrens

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1048996A (zh) * 1989-07-14 1991-02-06 马霍股份公司 用激光束在工件中制造空腔的方法和装置
CN1213997A (zh) * 1996-05-17 1999-04-14 电科学工业公司 采用可变功率密度的紫外激光脉冲在多层靶上形成盲通道的方法
DE19860585A1 (de) * 1998-12-29 2000-07-20 Laserpluss Ag Verfahren zur Bearbeitung von Werkstücken aus diamanthaltigen Werkstoffen sowie Vorrichtung zur Durchführung des Verfahrens
CN1452036A (zh) * 2002-04-16 2003-10-29 山崎马扎克株式会社 三维线状加工装置
WO2006038017A2 (en) * 2004-10-07 2006-04-13 Powerlase Limited An apparatus and a method for processing hard material using a laser having an irradiance in the range 10 '6 to 10 '9 w/cm'2 and a repetition rate in the range 10 to 50 khz

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2241850C3 (de) 1972-08-25 1978-06-29 European Rotogravure Association, 8000 Muenchen Verfahren zur Herstellung von Druckformen mittels eines Energiestrahles
DE8906578U1 (de) 1989-05-29 1990-09-27 Siemens AG, 1000 Berlin und 8000 München Laserbearbeitungsvorrichtung
DE3923356C1 (ja) * 1989-07-14 1991-02-07 Maho Ag
JPH10278279A (ja) * 1997-02-10 1998-10-20 Toshiba Corp プリントヘッドの製造方法
DE19745280A1 (de) 1997-10-15 1999-04-22 Daimler Chrysler Ag Verfahren zur Fein- und Mikrobearbeitung von Werkstücken mittels Laserstrahlen und Vorrichtung zur Durchführung des Verfahrens
US6664498B2 (en) * 2001-12-04 2003-12-16 General Atomics Method and apparatus for increasing the material removal rate in laser machining
TW564196B (en) 2002-01-11 2003-12-01 Electro Scient Ind Inc Simulated laser spot enlargement
DE10321123A1 (de) 2003-05-09 2004-11-25 Lpkf Laser & Electronics Ag Vorrichtung und Arbeitsverfahren zur Laserbearbeitung
US7351241B2 (en) 2003-06-02 2008-04-01 Carl Zeiss Meditec Ag Method and apparatus for precision working of material
DE10352402B4 (de) * 2003-11-10 2015-12-17 Lasertec Gmbh Laserbearbeitungsmaschine und Laserbearbeitungsverfahren
US7259354B2 (en) 2004-08-04 2007-08-21 Electro Scientific Industries, Inc. Methods for processing holes by moving precisely timed laser pulses in circular and spiral trajectories
DE102004040068B4 (de) * 2004-08-18 2018-01-04 Via Mechanics, Ltd. Verfahren zum Laserbohren eines mehrschichtig aufgebauten Werkstücks
ATE365092T1 (de) 2005-03-04 2007-07-15 Bettonville Integrated Solutio Laserschneidgerät
JP2007136692A (ja) * 2005-11-15 2007-06-07 Tatsumi Yoda 装飾品レーザ加工方法
DE102006005401A1 (de) * 2006-02-03 2007-08-09 Gesau-Werkzeuge Fabrikations- Und Service Gmbh Verfahren zur Herstellung eines Schaftfräsers
JP2007216327A (ja) * 2006-02-15 2007-08-30 Aisin Seiki Co Ltd チップブレーカの形成方法
DE102006017629A1 (de) 2006-02-22 2007-08-30 Lpkf Laser & Electronics Ag Verfahren und Vorrichtung zur Laserbearbeitung
JP2007294743A (ja) * 2006-04-26 2007-11-08 Hitachi Cable Ltd 光モジュール及びその製造方法
GB2444037A (en) * 2006-11-27 2008-05-28 Xsil Technology Ltd Laser Machining
DE102007014933A1 (de) * 2007-03-22 2008-09-25 Laser- Und Medizin-Technologie Gmbh, Berlin Verfahren und Vorrichtung zur schnellen Ablenkung eines Lichtstrahles auf eine einstellbare Längsbahn
DE112008000681A5 (de) 2007-03-13 2010-04-15 Laser- Und Medizin-Technologie Gmbh, Berlin Vorrichtung und Verfahren zum Führen eines Lichtstrahls
DE102007012816B4 (de) * 2007-03-16 2009-12-03 Sauer Gmbh Lasertec Verfahren und Vorrichtung zur Werkstückbearbeitung
DE102007012815B4 (de) * 2007-03-16 2024-06-06 Dmg Mori Ultrasonic Lasertec Gmbh Verfahren und Vorrichtung zur Bildung eines Gesenks
DE102008000306B4 (de) * 2008-02-15 2010-08-19 3D-Micromac Ag Verfahren und Vorrichtung zum Laserschneiden

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1048996A (zh) * 1989-07-14 1991-02-06 马霍股份公司 用激光束在工件中制造空腔的方法和装置
CN1213997A (zh) * 1996-05-17 1999-04-14 电科学工业公司 采用可变功率密度的紫外激光脉冲在多层靶上形成盲通道的方法
DE19860585A1 (de) * 1998-12-29 2000-07-20 Laserpluss Ag Verfahren zur Bearbeitung von Werkstücken aus diamanthaltigen Werkstoffen sowie Vorrichtung zur Durchführung des Verfahrens
CN1452036A (zh) * 2002-04-16 2003-10-29 山崎马扎克株式会社 三维线状加工装置
WO2006038017A2 (en) * 2004-10-07 2006-04-13 Powerlase Limited An apparatus and a method for processing hard material using a laser having an irradiance in the range 10 '6 to 10 '9 w/cm'2 and a repetition rate in the range 10 to 50 khz

Also Published As

Publication number Publication date
US20110095005A1 (en) 2011-04-28
EP2314412A3 (de) 2015-05-13
US8969758B2 (en) 2015-03-03
JP6137767B2 (ja) 2017-05-31
JP2011098390A (ja) 2011-05-19
EP2314412A2 (de) 2011-04-27
ES2709696T5 (es) 2023-01-09
SI2314412T2 (sl) 2022-11-30
CN102091875A (zh) 2011-06-15
DE102009044316A1 (de) 2011-05-05
ES2709696T3 (es) 2019-04-17
DE102009044316B4 (de) 2015-04-30
EP2314412B1 (de) 2018-12-19
EP2314412B2 (de) 2022-09-07
SI2314412T1 (sl) 2019-03-29

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Effective date of registration: 20221013

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Patentee after: FRITZ STUDER AG

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