CN102091875B - 用于在未完工产品上形成表面的激光加工设备及方法 - Google Patents
用于在未完工产品上形成表面的激光加工设备及方法 Download PDFInfo
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- CN102091875B CN102091875B CN201010580202.XA CN201010580202A CN102091875B CN 102091875 B CN102091875 B CN 102091875B CN 201010580202 A CN201010580202 A CN 201010580202A CN 102091875 B CN102091875 B CN 102091875B
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- 238000000034 method Methods 0.000 title claims abstract description 65
- 230000008569 process Effects 0.000 title claims abstract description 49
- 238000005520 cutting process Methods 0.000 claims abstract description 43
- 238000002679 ablation Methods 0.000 claims abstract description 30
- 239000000463 material Substances 0.000 claims description 62
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 230000008018 melting Effects 0.000 claims description 10
- 238000002844 melting Methods 0.000 claims description 10
- 239000000155 melt Substances 0.000 claims description 3
- 230000001105 regulatory effect Effects 0.000 claims description 3
- 230000010287 polarization Effects 0.000 description 12
- 230000008859 change Effects 0.000 description 11
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- 230000035939 shock Effects 0.000 description 8
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- 229910003460 diamond Inorganic materials 0.000 description 4
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- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 230000001276 controlling effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 238000000608 laser ablation Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
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- 238000001208 nuclear magnetic resonance pulse sequence Methods 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 241000931526 Acer campestre Species 0.000 description 1
- 239000008186 active pharmaceutical agent Substances 0.000 description 1
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- 229910045601 alloy Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
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- 230000007547 defect Effects 0.000 description 1
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- 238000007373 indentation Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0823—Devices involving rotation of the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
- B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE200910044316 DE102009044316B4 (de) | 2009-10-22 | 2009-10-22 | Verfahren zur Herstellung einer Fläche und/oder einer Kante an einem Rohling sowie Laserbearbeitungsvorrichtung zur Durchführung des Verfahrens |
DE102009044316.9 | 2009-10-22 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102091875A CN102091875A (zh) | 2011-06-15 |
CN102091875B true CN102091875B (zh) | 2016-03-09 |
Family
ID=43502607
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201010580202.XA Active CN102091875B (zh) | 2009-10-22 | 2010-10-21 | 用于在未完工产品上形成表面的激光加工设备及方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US8969758B2 (ja) |
EP (1) | EP2314412B2 (ja) |
JP (1) | JP6137767B2 (ja) |
CN (1) | CN102091875B (ja) |
DE (1) | DE102009044316B4 (ja) |
ES (1) | ES2709696T5 (ja) |
SI (1) | SI2314412T2 (ja) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9463531B2 (en) * | 2009-10-23 | 2016-10-11 | Kennametal Inc. | Three-dimensional surface shaping of rotary cutting tool edges with lasers |
DE102010011508B4 (de) * | 2010-03-15 | 2015-12-10 | Ewag Ag | Verfahren zur Herstellung zumindest einer Spannut und zumindest einer Schneidkante und Laserbearbeitungsvorrichtung |
DE102011078825B4 (de) | 2011-07-07 | 2018-07-19 | Sauer Gmbh Lasertec | Verfahren und Laserbearbeitungsmaschine zur Bearbeitung eines Werkstücks |
KR101341001B1 (ko) * | 2011-11-17 | 2013-12-13 | 주식회사 아이엠티 | 레이저를 이용한 대면적 마스크 세정 장치 및 이를 포함하는 대면적 마스크 세정 시스템 |
DE102012111771B4 (de) * | 2012-12-04 | 2020-12-03 | Ewag Ag | Verfahren zur Bearbeitung eines Werkstücks unter Verwendung einer Laserbearbeitungsvorrichtung zur Herstellung eines Schneidwerkzeugs |
JP5764181B2 (ja) | 2013-10-31 | 2015-08-12 | ユニオンツール株式会社 | 硬質皮膜被覆切削工具 |
DE102014109613A1 (de) * | 2014-07-09 | 2014-09-04 | Ewag Ag | Verfahren zur Herstellung einer Werkstückfläche an einem stabförmigen Werkstück |
CN104625416B (zh) * | 2014-12-29 | 2016-06-22 | 北京理工大学 | 基于方孔辅助电子动态调控晶硅表面周期性微纳结构方法 |
SG10201804397UA (en) | 2015-06-22 | 2018-06-28 | Electro Scientific Industries Inc | Multi-axis machine tool and methods of controlling the same |
DE102016225602B3 (de) * | 2016-12-20 | 2018-05-09 | Sauer Gmbh | Verfahren zur Bearbeitung einer Schneidplatte sowie entsprechende Vorrichtung zur Bearbeitung einer Schneidplatte |
PL3398709T3 (pl) * | 2017-05-03 | 2021-06-28 | Agathon AG, Maschinenfabrik | Układ do obróbki laserowej z koncepcją termiczną |
DE102018001570A1 (de) * | 2018-02-28 | 2019-08-29 | Vollmer Werke Maschinenfabrik Gmbh | Vorrichtung und Verfahren zum Bearbeiten eines Werkstücks mittels eines Laserstrahls |
DE102018125436A1 (de) * | 2018-10-15 | 2020-04-16 | Ewag Ag | Verfahren zur materialabtragenden Laserbearbeitung eines Werkstücks |
DE102018221365A1 (de) * | 2018-12-10 | 2020-06-10 | Trumpf Laser Gmbh | Verfahren zum Abtragen von Material von einem Werkstück und Laserbearbeitungsanlage |
US11559856B2 (en) * | 2019-10-28 | 2023-01-24 | Robert Bosch Gmbh | Laser cutter adapted to cut rotating workpieces |
CN111331259B (zh) * | 2020-02-26 | 2021-11-12 | 上海交通大学 | 利用激光加工高精度单晶金刚石圆弧刀具的方法及装置 |
KR20220164057A (ko) | 2020-04-10 | 2022-12-12 | 로렉스 에스아 | 레이저 선삭 시스템, 이러한 시스템을 이용하는 레이저 선삭 방법, 및 이러한 방법에 의해 획득된 부품 |
KR20220164058A (ko) | 2020-04-10 | 2022-12-12 | 알파노브 | 레이저 선삭 시스템, 레이저 선삭 방법, 및 이러한 시스템에 의해 획득된 부품 |
CN112676704A (zh) * | 2020-12-30 | 2021-04-20 | 苏州高意激光科技有限公司 | 一种具有多切割头的多工位旋转的激光研磨装置 |
CN112710572A (zh) * | 2021-01-19 | 2021-04-27 | 广东百达检测技术服务有限公司 | 一种建筑材料硬度检测***及方法 |
WO2022188969A1 (en) * | 2021-03-10 | 2022-09-15 | Applied Materials Italia S.R.L. | Apparatus and method for laser machining of a substrate |
WO2022199725A1 (en) * | 2021-10-12 | 2022-09-29 | Hofmeister S.R.O. | Method of surface layer removal from the surface of geometrically complex edges of cutting tools using laser stripping method |
EP4265369A1 (de) * | 2022-04-21 | 2023-10-25 | Rollomatic S.A. | Verfahren zur laserbasierten bearbeitung eines werkstücks |
EP4265365A1 (de) * | 2022-04-21 | 2023-10-25 | Rollomatic S.A. | Verfahren zur laserbasierten bearbeitung eines werkstücks und laserbearbeitungsvorrichtung zur durchführung des verfahrens |
Citations (5)
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CN1048996A (zh) * | 1989-07-14 | 1991-02-06 | 马霍股份公司 | 用激光束在工件中制造空腔的方法和装置 |
CN1213997A (zh) * | 1996-05-17 | 1999-04-14 | 电科学工业公司 | 采用可变功率密度的紫外激光脉冲在多层靶上形成盲通道的方法 |
DE19860585A1 (de) * | 1998-12-29 | 2000-07-20 | Laserpluss Ag | Verfahren zur Bearbeitung von Werkstücken aus diamanthaltigen Werkstoffen sowie Vorrichtung zur Durchführung des Verfahrens |
CN1452036A (zh) * | 2002-04-16 | 2003-10-29 | 山崎马扎克株式会社 | 三维线状加工装置 |
WO2006038017A2 (en) * | 2004-10-07 | 2006-04-13 | Powerlase Limited | An apparatus and a method for processing hard material using a laser having an irradiance in the range 10 '6 to 10 '9 w/cm'2 and a repetition rate in the range 10 to 50 khz |
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DE2241850C3 (de) | 1972-08-25 | 1978-06-29 | European Rotogravure Association, 8000 Muenchen | Verfahren zur Herstellung von Druckformen mittels eines Energiestrahles |
DE8906578U1 (de) | 1989-05-29 | 1990-09-27 | Siemens AG, 1000 Berlin und 8000 München | Laserbearbeitungsvorrichtung |
DE3923356C1 (ja) * | 1989-07-14 | 1991-02-07 | Maho Ag | |
JPH10278279A (ja) * | 1997-02-10 | 1998-10-20 | Toshiba Corp | プリントヘッドの製造方法 |
DE19745280A1 (de) | 1997-10-15 | 1999-04-22 | Daimler Chrysler Ag | Verfahren zur Fein- und Mikrobearbeitung von Werkstücken mittels Laserstrahlen und Vorrichtung zur Durchführung des Verfahrens |
US6664498B2 (en) * | 2001-12-04 | 2003-12-16 | General Atomics | Method and apparatus for increasing the material removal rate in laser machining |
TW564196B (en) | 2002-01-11 | 2003-12-01 | Electro Scient Ind Inc | Simulated laser spot enlargement |
DE10321123A1 (de) | 2003-05-09 | 2004-11-25 | Lpkf Laser & Electronics Ag | Vorrichtung und Arbeitsverfahren zur Laserbearbeitung |
US7351241B2 (en) | 2003-06-02 | 2008-04-01 | Carl Zeiss Meditec Ag | Method and apparatus for precision working of material |
DE10352402B4 (de) * | 2003-11-10 | 2015-12-17 | Lasertec Gmbh | Laserbearbeitungsmaschine und Laserbearbeitungsverfahren |
US7259354B2 (en) | 2004-08-04 | 2007-08-21 | Electro Scientific Industries, Inc. | Methods for processing holes by moving precisely timed laser pulses in circular and spiral trajectories |
DE102004040068B4 (de) * | 2004-08-18 | 2018-01-04 | Via Mechanics, Ltd. | Verfahren zum Laserbohren eines mehrschichtig aufgebauten Werkstücks |
ATE365092T1 (de) | 2005-03-04 | 2007-07-15 | Bettonville Integrated Solutio | Laserschneidgerät |
JP2007136692A (ja) * | 2005-11-15 | 2007-06-07 | Tatsumi Yoda | 装飾品レーザ加工方法 |
DE102006005401A1 (de) * | 2006-02-03 | 2007-08-09 | Gesau-Werkzeuge Fabrikations- Und Service Gmbh | Verfahren zur Herstellung eines Schaftfräsers |
JP2007216327A (ja) * | 2006-02-15 | 2007-08-30 | Aisin Seiki Co Ltd | チップブレーカの形成方法 |
DE102006017629A1 (de) | 2006-02-22 | 2007-08-30 | Lpkf Laser & Electronics Ag | Verfahren und Vorrichtung zur Laserbearbeitung |
JP2007294743A (ja) * | 2006-04-26 | 2007-11-08 | Hitachi Cable Ltd | 光モジュール及びその製造方法 |
GB2444037A (en) * | 2006-11-27 | 2008-05-28 | Xsil Technology Ltd | Laser Machining |
DE102007014933A1 (de) * | 2007-03-22 | 2008-09-25 | Laser- Und Medizin-Technologie Gmbh, Berlin | Verfahren und Vorrichtung zur schnellen Ablenkung eines Lichtstrahles auf eine einstellbare Längsbahn |
DE112008000681A5 (de) | 2007-03-13 | 2010-04-15 | Laser- Und Medizin-Technologie Gmbh, Berlin | Vorrichtung und Verfahren zum Führen eines Lichtstrahls |
DE102007012816B4 (de) * | 2007-03-16 | 2009-12-03 | Sauer Gmbh Lasertec | Verfahren und Vorrichtung zur Werkstückbearbeitung |
DE102007012815B4 (de) * | 2007-03-16 | 2024-06-06 | Dmg Mori Ultrasonic Lasertec Gmbh | Verfahren und Vorrichtung zur Bildung eines Gesenks |
DE102008000306B4 (de) * | 2008-02-15 | 2010-08-19 | 3D-Micromac Ag | Verfahren und Vorrichtung zum Laserschneiden |
-
2009
- 2009-10-22 DE DE200910044316 patent/DE102009044316B4/de not_active Revoked
-
2010
- 2010-10-20 US US12/925,398 patent/US8969758B2/en active Active
- 2010-10-21 JP JP2010236133A patent/JP6137767B2/ja active Active
- 2010-10-21 CN CN201010580202.XA patent/CN102091875B/zh active Active
- 2010-10-22 ES ES10188598T patent/ES2709696T5/es active Active
- 2010-10-22 EP EP10188598.6A patent/EP2314412B2/de active Active
- 2010-10-22 SI SI201031833T patent/SI2314412T2/sl unknown
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1048996A (zh) * | 1989-07-14 | 1991-02-06 | 马霍股份公司 | 用激光束在工件中制造空腔的方法和装置 |
CN1213997A (zh) * | 1996-05-17 | 1999-04-14 | 电科学工业公司 | 采用可变功率密度的紫外激光脉冲在多层靶上形成盲通道的方法 |
DE19860585A1 (de) * | 1998-12-29 | 2000-07-20 | Laserpluss Ag | Verfahren zur Bearbeitung von Werkstücken aus diamanthaltigen Werkstoffen sowie Vorrichtung zur Durchführung des Verfahrens |
CN1452036A (zh) * | 2002-04-16 | 2003-10-29 | 山崎马扎克株式会社 | 三维线状加工装置 |
WO2006038017A2 (en) * | 2004-10-07 | 2006-04-13 | Powerlase Limited | An apparatus and a method for processing hard material using a laser having an irradiance in the range 10 '6 to 10 '9 w/cm'2 and a repetition rate in the range 10 to 50 khz |
Also Published As
Publication number | Publication date |
---|---|
US20110095005A1 (en) | 2011-04-28 |
EP2314412A3 (de) | 2015-05-13 |
US8969758B2 (en) | 2015-03-03 |
JP6137767B2 (ja) | 2017-05-31 |
JP2011098390A (ja) | 2011-05-19 |
EP2314412A2 (de) | 2011-04-27 |
ES2709696T5 (es) | 2023-01-09 |
SI2314412T2 (sl) | 2022-11-30 |
CN102091875A (zh) | 2011-06-15 |
DE102009044316A1 (de) | 2011-05-05 |
ES2709696T3 (es) | 2019-04-17 |
DE102009044316B4 (de) | 2015-04-30 |
EP2314412B1 (de) | 2018-12-19 |
EP2314412B2 (de) | 2022-09-07 |
SI2314412T1 (sl) | 2019-03-29 |
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