CN102054827B - 发光二极管晶元封装体及其封装方法 - Google Patents
发光二极管晶元封装体及其封装方法 Download PDFInfo
- Publication number
- CN102054827B CN102054827B CN 200910209047 CN200910209047A CN102054827B CN 102054827 B CN102054827 B CN 102054827B CN 200910209047 CN200910209047 CN 200910209047 CN 200910209047 A CN200910209047 A CN 200910209047A CN 102054827 B CN102054827 B CN 102054827B
- Authority
- CN
- China
- Prior art keywords
- led wafer
- led
- conductor
- electrode
- conductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims abstract description 20
- 238000005538 encapsulation Methods 0.000 title abstract 5
- 239000004020 conductor Substances 0.000 claims abstract description 87
- 239000000463 material Substances 0.000 claims abstract description 19
- 239000004065 semiconductor Substances 0.000 claims abstract description 16
- 239000011159 matrix material Substances 0.000 claims abstract description 5
- 238000009434 installation Methods 0.000 claims abstract 5
- 235000012431 wafers Nutrition 0.000 claims description 98
- 239000010410 layer Substances 0.000 claims description 44
- 230000004888 barrier function Effects 0.000 claims description 25
- 238000012856 packing Methods 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 14
- 238000005520 cutting process Methods 0.000 claims description 13
- 239000011241 protective layer Substances 0.000 claims description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 4
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 4
- 239000004411 aluminium Substances 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052799 carbon Inorganic materials 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 239000000843 powder Substances 0.000 claims description 4
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- 229910052725 zinc Inorganic materials 0.000 claims description 4
- 239000011701 zinc Substances 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 2
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 230000005611 electricity Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
Landscapes
- Led Device Packages (AREA)
Abstract
Description
Claims (14)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200910209047 CN102054827B (zh) | 2009-10-30 | 2009-10-30 | 发光二极管晶元封装体及其封装方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200910209047 CN102054827B (zh) | 2009-10-30 | 2009-10-30 | 发光二极管晶元封装体及其封装方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102054827A CN102054827A (zh) | 2011-05-11 |
CN102054827B true CN102054827B (zh) | 2013-01-23 |
Family
ID=43958995
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 200910209047 Expired - Fee Related CN102054827B (zh) | 2009-10-30 | 2009-10-30 | 发光二极管晶元封装体及其封装方法 |
Country Status (1)
Country | Link |
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CN (1) | CN102054827B (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9000461B2 (en) * | 2003-07-04 | 2015-04-07 | Epistar Corporation | Optoelectronic element and manufacturing method thereof |
CN103840054A (zh) * | 2012-11-20 | 2014-06-04 | 展晶科技(深圳)有限公司 | 发光二极管芯片 |
TWI616004B (zh) * | 2013-11-27 | 2018-02-21 | 晶元光電股份有限公司 | 半導體發光元件 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1399352A (zh) * | 2001-07-23 | 2003-02-26 | 连勇科技股份有限公司 | 可表面粘着并具有覆晶封装结构的发光半导体装置 |
CN1545730A (zh) * | 2002-03-08 | 2004-11-10 | 罗姆股份有限公司 | 使用半导体芯片的半导体装置 |
-
2009
- 2009-10-30 CN CN 200910209047 patent/CN102054827B/zh not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1399352A (zh) * | 2001-07-23 | 2003-02-26 | 连勇科技股份有限公司 | 可表面粘着并具有覆晶封装结构的发光半导体装置 |
CN1545730A (zh) * | 2002-03-08 | 2004-11-10 | 罗姆股份有限公司 | 使用半导体芯片的半导体装置 |
Also Published As
Publication number | Publication date |
---|---|
CN102054827A (zh) | 2011-05-11 |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Free format text: FORMER OWNER: WANG CONGQI Effective date: 20130204 Owner name: CHANGCHUNTENG HOLDING CO., LTD. Free format text: FORMER OWNER: SHEN YUNONG Effective date: 20130204 |
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C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20130204 Address after: Virgin Islands (British) Patentee after: CHANGCHUNTENG HOLDING Co.,Ltd. Address before: Taipei City, Taiwan, China Patentee before: Shen Yunong Patentee before: Wang Congqi |
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CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130123 Termination date: 20191030 |