CN102047399A - 电子部件制造用的切片装置及切片方法 - Google Patents

电子部件制造用的切片装置及切片方法 Download PDF

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Publication number
CN102047399A
CN102047399A CN2009801206225A CN200980120622A CN102047399A CN 102047399 A CN102047399 A CN 102047399A CN 2009801206225 A CN2009801206225 A CN 2009801206225A CN 200980120622 A CN200980120622 A CN 200980120622A CN 102047399 A CN102047399 A CN 102047399A
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CN
China
Prior art keywords
section portion
hermetic sealing
sealing substrate
electronic unit
section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2009801206225A
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English (en)
Chinese (zh)
Inventor
东秀和
森泽匡史
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Towa Corp
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Publication of CN102047399A publication Critical patent/CN102047399A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/561—Batch processing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Dicing (AREA)
CN2009801206225A 2008-06-13 2009-06-09 电子部件制造用的切片装置及切片方法 Pending CN102047399A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008-155555 2008-06-13
JP2008155555A JP5511154B2 (ja) 2008-06-13 2008-06-13 電子部品製造用の個片化装置及び個片化方法
PCT/JP2009/002585 WO2009150821A1 (ja) 2008-06-13 2009-06-09 電子部品製造用の個片化装置及び個片化方法

Publications (1)

Publication Number Publication Date
CN102047399A true CN102047399A (zh) 2011-05-04

Family

ID=41416534

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009801206225A Pending CN102047399A (zh) 2008-06-13 2009-06-09 电子部件制造用的切片装置及切片方法

Country Status (5)

Country Link
JP (1) JP5511154B2 (ja)
KR (1) KR101930496B1 (ja)
CN (1) CN102047399A (ja)
TW (1) TWI524402B (ja)
WO (1) WO2009150821A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104952767A (zh) * 2014-03-27 2015-09-30 东和株式会社 检查用夹具、切断装置以及切断方法
CN105280526A (zh) * 2014-07-18 2016-01-27 东和株式会社 切断装置以及切断方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5756803B2 (ja) 2010-07-23 2015-07-29 シャープ株式会社 発光装置及びその製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003092305A (ja) * 2001-09-17 2003-03-28 Towa Corp 電子部品の樹脂封止成形装置
JP2003152005A (ja) * 2001-11-19 2003-05-23 Towa Corp 半導体素子の樹脂封止成形装置
JP2003209130A (ja) * 2002-01-17 2003-07-25 Towa Corp 電子部品の樹脂成形方法及び装置
JP2004207424A (ja) * 2002-12-25 2004-07-22 Towa Corp 基板の切断方法及び装置
JP4426799B2 (ja) * 2003-09-04 2010-03-03 Ｔｏｗａ株式会社 基板の切断方法及び装置
JP2005190077A (ja) * 2003-12-25 2005-07-14 Towa Corp 処理装置及び処理装置用プログラム供給方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104952767A (zh) * 2014-03-27 2015-09-30 东和株式会社 检查用夹具、切断装置以及切断方法
CN104952767B (zh) * 2014-03-27 2018-05-22 东和株式会社 检查用夹具、切断装置以及切断方法
CN105280526A (zh) * 2014-07-18 2016-01-27 东和株式会社 切断装置以及切断方法
CN105280526B (zh) * 2014-07-18 2018-04-10 东和株式会社 切断装置以及切断方法

Also Published As

Publication number Publication date
TWI524402B (zh) 2016-03-01
WO2009150821A1 (ja) 2009-12-17
JP5511154B2 (ja) 2014-06-04
KR101930496B1 (ko) 2018-12-19
KR20110028349A (ko) 2011-03-17
JP2009302323A (ja) 2009-12-24
TW201007831A (en) 2010-02-16

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Application publication date: 20110504