CN102036508A - Multi-layer HDI circuit board blind hole windowing process - Google Patents
Multi-layer HDI circuit board blind hole windowing process Download PDFInfo
- Publication number
- CN102036508A CN102036508A CN 201110000958 CN201110000958A CN102036508A CN 102036508 A CN102036508 A CN 102036508A CN 201110000958 CN201110000958 CN 201110000958 CN 201110000958 A CN201110000958 A CN 201110000958A CN 102036508 A CN102036508 A CN 102036508A
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- China
- Prior art keywords
- blind hole
- windowing
- layer
- target
- laser blind
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
- H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/166—Alignment or registration; Control of registration
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a multi-layer high density interconnector (HDI) circuit board blind hole windowing process, which comprises the following steps of: manufacturing a target hole pattern on a PAD layer at the bottom of a laser blind hole; laminating by adopting a resin copper foil, drilling a target hole by adopting an X-RAY machine, and aligning and exposing by adopting an automatic exposure machine; and finally, developing, and etching for windowing. The process breaks through the conventional laser blind hole processing mode (positioning by adopting three tube holes and drilling the laser blind hole windowing and positioning hole through mechanical drilling), four target holes of a plate corner positioned on the same plane as the PAD layer at the bottom of the laser blind hole are accurately aligned, the target holes are drilled by an X-RAY precise drilling machine, repeated use and mechanical drilling error for outer tube holes are avoided, and the aim of accurately windowing the laser blind hole is fulfilled finally. The process is simple and the efficiency is high.
Description
Technical field
The present invention relates to printed-board technology, the blind hole that the is specifically related to multi-layer H DI printed substrate manufacture craft of windowing.
Background technology
Can the PCB substrate densification depend on micropore and the circuit that interlayer connects, and decide in conjunction with the performance of electronic product, so the laser blind hole windowing technology of pcb board becomes one of guardian technique of making micropore.In the industry, traditional laser blind hole windowing method mainly is the contraposition of windowing that realizes laser blind hole by brill clappers registration holes, and this just needs to increase the machine drilling operation.But the power auger registration holes can be chewed the influence of objective factors such as quality, drilling parameter, employee's operation, the plate storage environment registration holes that causes having the final say because of brill and in various degree inclined to one side hole or distortion be occurred, directly have influence on precision and quality that laser blind hole is windowed, production efficiency also can affect greatly, and the overall quality of laser blind hole also is difficult to further raising.
Summary of the invention
The present invention is intended to solve in the prior art laser blind hole and windows that precision is not enough, the instability quality problem, and then a kind of technological process is simple, quality stability good, production cost the is low laser blind hole technology of windowing is provided.
For solving the problems of the technologies described above, the technical scheme that the present invention takes is: a kind of blind hole of the multi-layer H DI wiring board technology of windowing is provided, may further comprise the steps:
(1) the PAD layer is made the wad cutter figure at the bottom of laser blind hole;
(2) adopt the resin Copper Foil to carry out pressing;
(3) adopt a hole, X-RAY machine target practice position;
(4) adopt automatic exposure machine contraposition and exposure;
(5) develop;
(6) the blind hole etching is windowed.
Concrete, wad cutter figure described in the step (1) is arranged on four angles on PAD laminate limit at the bottom of the laser blind hole, and formed plane, four angles can comprise all unit in the plate.
Preferably, one side at the bottom of laser blind hole PAD laminate limit any two auxiliary contraposition target figures are set; Described auxiliary contraposition target figure is arranged on any one long limit of PAD laminate at the bottom of the laser blind hole.
Preferred, described auxiliary contraposition target figure is identical with four wad cutter feature size in the step (1) with size.
The laser blind hole of the present invention technology of windowing is broken the Large window or the Conformal laser blind hole processing mode of present routine, employing is carried out accurate contraposition with four wad cutters that PAD layer at the bottom of the laser blind hole is in the plate angle on same plane, and adopt the accurate target-shooting machine of X-RAY to stamp to state four contraposition wad cutters and realize accurate contraposition, finally realize the purpose that laser blind hole is accurately windowed.Compared with prior art, effectively effect is as follows: (1) has saved power auger registration holes operation, has optimized the work flow that blind hole is windowed; (2) avoided the repeated use in hole, three drill pipe positions, the off normal that causes holing to prevent drill pipe position bore deformation; (3) contraposition accuracy improves and then has improved the precision that laser blind hole is windowed, and has guaranteed blind hole window quality and blind hole quality; (4) help reducing the manufacture difficulty of outer-layer circuit.
Description of drawings
Fig. 1 is a contraposition wad cutter pictorial diagram of the present invention.
Embodiment
For the ease of those skilled in the art's understanding, the present invention is further described in detail below in conjunction with specific embodiment and accompanying drawing:
The laser blind hole of the disclosed multi-layer H DI wiring board processing step of windowing is:
(1) the PAD layer is made the wad cutter figure at the bottom of laser blind hole;
(2) adopt LD PP or RCC resin Copper Foil to carry out pressing;
(3) adopt a hole, X-RAY machine target practice position;
(4) adopt automatic exposure machine contraposition and exposure;
(5) develop;
(6) the blind hole etching is windowed.
In this technology, need overcome four guardian techniques, be respectively: inferior outer wad cutter graphic making, a hole, X-RAY machine target practice position, automatic exposure machine contraposition and exposure, blind hole etching are windowed.
In the processing step 1 of the present invention, the target figure must be arranged on the same plane of PAD at the bottom of the laser blind hole on, and be positioned on four angles on this laminate limit, shown in A, B, C, D among the figure, here noting can not be overlapping with the fabrication hole on other any edges of boards, on any one long limit of plate, two auxiliary contraposition target figures are set in addition, represent, further guarantee the accuracy of contraposition as e, f among the figure.These two auxiliary contraposition target figures and size and A, B, four wad cutter figures of C, D are with big or small identical, and mark on a map the distance of shape of these two contraposition auxiliary targets need meet the processing procedure ability of X-RAY automatic exposure machine.Auxiliary contraposition target figure is identical with the target feature size with size, and like this, in actual production process, the X-RAY machine can be about to disposable being up to of all wad cutters of plate face by a kind of drill bit when practicing shooting, and enhances productivity, reduces operation easier.Two auxiliary registration holes that long limit is provided with can be used for auxiliary automatic exposure machine and carry out quick pre-determined bit, enhance productivity.
The target figure in number in the figure 1,2,3 expression holes, three outer drill pipe positions; A1, B1, C1, D1 are the standby target figure of A, B, C, four targets of D, the standby target figure that four blind holes of PAD layer are windowed at the bottom of the expression laser blind hole, if reasons such as one or several incompleteness in A, B, four target figures of C, D, distortion, damage cause accurately under the positional punch situation, can adopt this standby target figure to position, not influence operating efficiency.
Adopt of the abbreviation of special-purpose HDI plate in the described step 2 with LD PP(Laser Drill Prepreg, the special-purpose prepreg of laser drill) or RCC(Resin Coated Copper, resin-coated Copper Foil) resin-coated Copper Foil carries out pressing, and purpose is to make laser blind hole to be convenient to process and obtain good laser blind hole pass.
Described step 3 need to adopt precision in the 1mil scope with interior X-RAY target-shooting machine.
Described step 4 needs to adopt automatic exposure machine production, guarantees that precision is controlled in the 0.4mil scope, to guarantee the window stability of quality of laser blind hole.
Described step 5 adopts general dry film developing machine normal parameter production to get final product, and need do the development point before producing, and avoids occurring developing unclean phenomenon.
Described step 6 adopts the acid etching line to produce, and speed and liquid medicine spray pressure need to adjust accordingly according to initial workpiece.
Claims (7)
1. the blind hole of the multi-layer H DI wiring board technology of windowing may further comprise the steps:
(1) the PAD layer is made the wad cutter figure at the bottom of laser blind hole;
(2) adopt the resin Copper Foil to carry out pressing;
(3) adopt a hole, X-RAY machine target practice position;
(4) adopt automatic exposure machine contraposition and exposure;
(5) develop;
(6) the blind hole etching is windowed.
2. the blind hole of the multi-layer H DI wiring board according to claim 1 technology of windowing is characterized in that: wad cutter figure described in the step (1) is arranged on four angles on PAD laminate limit at the bottom of the laser blind hole, and formed plane, four angles can comprise all unit in the plate.
3. the blind hole of the multi-layer H DI wiring board according to claim 2 technology of windowing is characterized in that: one side PAD laminate limit any is provided with two auxiliary contraposition target figures at the bottom of laser blind hole, this contraposition target figure is used for auxiliary automatic exposure machine operation.
4. the blind hole of the multi-layer H DI wiring board according to claim 3 technology of windowing is characterized in that: described auxiliary contraposition target figure is arranged on any one long limit of PAD laminate at the bottom of the laser blind hole.
5. the blind hole of the multi-layer H DI wiring board according to claim 4 technology of windowing is characterized in that: described auxiliary contraposition target figure is identical with four wad cutter feature size in the step (1) with size.
6. the blind hole of the multi-layer H DI wiring board according to claim 1 technology of windowing is characterized in that: adopt LD PP or RCC resin Copper Foil to carry out pressing in the described step 2.
7. according to the blind hole of any described multi-layer H DI wiring board among the claim 1-6 technology of windowing, it is characterized in that: each wad cutter figure that the PAD layer is made at the bottom of laser blind hole is other also to be provided with standby target figure.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110000958 CN102036508A (en) | 2011-01-05 | 2011-01-05 | Multi-layer HDI circuit board blind hole windowing process |
| PCT/CN2011/083792 WO2012092806A1 (en) | 2011-01-05 | 2011-12-09 | Blind hole opening process of multilayer hdi circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110000958 CN102036508A (en) | 2011-01-05 | 2011-01-05 | Multi-layer HDI circuit board blind hole windowing process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102036508A true CN102036508A (en) | 2011-04-27 |
Family
ID=43888596
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201110000958 Pending CN102036508A (en) | 2011-01-05 | 2011-01-05 | Multi-layer HDI circuit board blind hole windowing process |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN102036508A (en) |
| WO (1) | WO2012092806A1 (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012092806A1 (en) * | 2011-01-05 | 2012-07-12 | 惠州中京电子科技股份有限公司 | Blind hole opening process of multilayer hdi circuit board |
| CN103179812A (en) * | 2013-04-18 | 2013-06-26 | 梅州市志浩电子科技有限公司 | Manufacturing method of high-order multistage HDI (High Density Interconnection) printed circuit board |
| CN103313517A (en) * | 2012-03-16 | 2013-09-18 | 北大方正集团有限公司 | Drilling positioning method for PCB (printed circuit board) |
| CN103501579A (en) * | 2013-09-29 | 2014-01-08 | 胜华电子（惠阳）有限公司 | Circuit board aligning method |
| CN106455370A (en) * | 2016-11-17 | 2017-02-22 | 深圳崇达多层线路板有限公司 | Blind hole window manufacturing method capable of improving unfilled hole filling |
| CN106793474A (en) * | 2017-01-19 | 2017-05-31 | 广州美维电子有限公司 | A kind of printed circuit board (PCB) and its processing method |
| CN106973493A (en) * | 2017-03-30 | 2017-07-21 | 生益电子股份有限公司 | PCB preparation method and PCB |
| CN107318233A (en) * | 2017-07-13 | 2017-11-03 | 深圳明阳电路科技股份有限公司 | A kind of preparation method of HDI board blind holes |
| CN113375540A (en) * | 2021-05-17 | 2021-09-10 | 深圳市景旺电子股份有限公司 | Circuit board, circuit board blind hole testing module and testing method thereof |
| CN114501799A (en) * | 2020-10-27 | 2022-05-13 | 健鼎（无锡）电子有限公司 | Alignment method and composite target point for circuit board manufacturing process |
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| CN109922604A (en) * | 2019-04-30 | 2019-06-21 | 深圳市铭鸿捷技术有限公司 | A kind of pre- aligning structure of circuit inner cord perforating press |
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| CN112272451B (en) * | 2020-11-10 | 2023-08-29 | 深圳市昶东鑫线路板有限公司 | Alignment method of circuit board |
| CN112467059A (en) * | 2020-11-12 | 2021-03-09 | 安徽熙泰智能科技有限公司 | Method for opening Pad of Mirco OLED, Mirco OLED and manufacturing method of Mirco OLED |
| CN112888166B (en) * | 2020-12-21 | 2022-08-16 | 深圳崇达多层线路板有限公司 | Manufacturing process for improving blind-through mismatching and drilling deviation of resin plugged plate |
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Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012092806A1 (en) * | 2011-01-05 | 2012-07-12 | 惠州中京电子科技股份有限公司 | Blind hole opening process of multilayer hdi circuit board |
| CN103313517A (en) * | 2012-03-16 | 2013-09-18 | 北大方正集团有限公司 | Drilling positioning method for PCB (printed circuit board) |
| CN103313517B (en) * | 2012-03-16 | 2016-03-23 | 北大方正集团有限公司 | A kind of pcb board drilling and positioning method |
| CN103179812A (en) * | 2013-04-18 | 2013-06-26 | 梅州市志浩电子科技有限公司 | Manufacturing method of high-order multistage HDI (High Density Interconnection) printed circuit board |
| CN103179812B (en) * | 2013-04-18 | 2016-05-11 | 梅州市志浩电子科技有限公司 | The preparation method of high multistage HDI printed circuit board (PCB) |
| CN103501579A (en) * | 2013-09-29 | 2014-01-08 | 胜华电子（惠阳）有限公司 | Circuit board aligning method |
| CN106455370B (en) * | 2016-11-17 | 2019-01-01 | 深圳崇达多层线路板有限公司 | It is a kind of to improve the not full blind hole windowing production method of filling perforation |
| CN106455370A (en) * | 2016-11-17 | 2017-02-22 | 深圳崇达多层线路板有限公司 | Blind hole window manufacturing method capable of improving unfilled hole filling |
| CN106793474A (en) * | 2017-01-19 | 2017-05-31 | 广州美维电子有限公司 | A kind of printed circuit board (PCB) and its processing method |
| CN106973493A (en) * | 2017-03-30 | 2017-07-21 | 生益电子股份有限公司 | PCB preparation method and PCB |
| CN107318233A (en) * | 2017-07-13 | 2017-11-03 | 深圳明阳电路科技股份有限公司 | A kind of preparation method of HDI board blind holes |
| CN107318233B (en) * | 2017-07-13 | 2019-09-10 | 深圳明阳电路科技股份有限公司 | A kind of production method of HDI board blind hole |
| CN114501799A (en) * | 2020-10-27 | 2022-05-13 | 健鼎（无锡）电子有限公司 | Alignment method and composite target point for circuit board manufacturing process |
| CN114501799B (en) * | 2020-10-27 | 2023-05-30 | 健鼎（无锡）电子有限公司 | Alignment method for circuit board manufacturing process and composite target point |
| CN113375540A (en) * | 2021-05-17 | 2021-09-10 | 深圳市景旺电子股份有限公司 | Circuit board, circuit board blind hole testing module and testing method thereof |
| CN113375540B (en) * | 2021-05-17 | 2023-03-03 | 深圳市景旺电子股份有限公司 | Circuit board, circuit board blind hole testing module and testing method thereof |
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|---|---|
| WO2012092806A1 (en) | 2012-07-12 |
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Application publication date: 20110427 |