CN112888166B

CN112888166B - Manufacturing process for improving blind-through mismatching and drilling deviation of resin plugged plate

Info

Publication number: CN112888166B
Application number: CN202011518015.9A
Authority: CN
Inventors: 孙保玉; 彭卫红; 宋建远; 苟成
Original assignee: Shenzhen Suntak Multilayer PCB Co Ltd
Current assignee: Shenzhen Suntak Multilayer PCB Co Ltd
Priority date: 2020-12-21
Filing date: 2020-12-21
Publication date: 2022-08-16
Anticipated expiration: 2040-12-21
Also published as: CN112888166A

Abstract

The invention discloses a manufacturing process for improving blind-hole mismatching and drilling deviation holes of a resin plugged plate, which comprises the following steps of: manufacturing two groups of first target groups and second target groups which are composed of a plurality of targets at the plate edge of an inner core plate in a production plate; drilling first target holes at positions corresponding to the first target group on the production plate, and measuring the target distance between the first target holes to obtain the expansion and contraction coefficient of the production plate; drilling a plug hole to be filled with resin on a board and metallizing the plug hole; manufacturing a plating hole pattern on the production plate and thickening hole copper in the plug hole; filling resin in the plug holes and curing, and then removing the resin protruding out of the plate surface by grinding the plate; drilling second target holes at positions corresponding to the second target group on the production plate, and measuring the target distance between the second target holes to obtain the expansion and contraction coefficient of the production plate; through holes and/or blind holes are drilled in the plate according to the coefficient of expansion. The method can avoid the problem that the mismatching of the deviated holes and the open holes caused by the variation of the target holes when the same group of target holes are drilled and used twice.

Description

Manufacturing process for improving blind-through mismatching and drilling deviation of resin plugged plate

Technical Field

The invention relates to the technical field of printed circuit board manufacturing, in particular to a manufacturing process for improving blind hole mismatching and drilling deviation holes of a resin plug hole plate.

Background

In the prior art, the process of manufacturing a sanding belt grinding plate and an outer layer drilling hole on a PCB plate after resin hole plugging is roughly as follows: front blurring → lamination → resin hole plugging → outer layer copper deposition → whole plate plating → outer layer hole plating pattern → plated hole → film removal → resin hole plugging → abrasive belt plate → outer layer hole drilling → outer layer copper deposition → whole plate plating → outer layer pattern → outer layer etching.

The problems of blind-through mismatching and hole deviation exist in the manufacturing process according to the flow, and the specific reason is analyzed as follows:

1. from the picture of the scrapped surface of the offset hole, the whole plate is offset towards the same direction and belongs to the pair offset; from the etched picture, the drilled hole has the phenomena of expansion and shrinkage and deviated hole, but the drilled hole is in an acceptable range according to the deviation hole inspection standard;

2. after the plate with the resin plug holes passes through a sanding belt, a plate conveying staff carries the plate to a pressing X-RAY machine target keeper or measures a harmomegathus value on the X-RAY machine by himself and attaches the harmomegathus value to an LOT card, and then a drilling tape engineer changes a drilling tape;

3. look for "eccentric hole material number" resin consent and use interim area of driling, coefficient: x is 1:1Y is-2.5/10000, and the outer layer of the drill hole is sent to a drilling change drill zone through abrasive belt grinding plate personnel to measure data to confirm that the drill hole is a normal drill zone;

4. checking that the resin plug holes are plugged by normal drilling strips after 'blind-passing mismatch', and sending plate conveying personnel measurement data through a sand belt grinding plate to change the drilling strips to confirm that the normal drilling strips are also used for outer layer drilling;

5. checking an outer layer alignment system of the 'eccentric hole material number', wherein a CCD hole (for ensuring a blind hole) drilled during resin hole plugging is used during outer layer alignment;

6. the target hole used when drilling the outer layer is plated with copper after the copper plating process of the first resin hole plugging, and the drilling is reused, so that the pin is easily prevented from being plated on the plate and has a deviated hole risk.

In summary, the following steps: the following problems are to be solved in the process from resin hole plugging to outer layer etching of such a board:

1. when the outer drill is used, the target hole after the first copper plating is reduced, so that the risk of hole deviation exists;

2. the coefficient of the outer drill is measured artificially, and data errors and range data analysis are avoided, so that the expansion and shrinkage judgment abnormity is easy to occur;

3. the outer layer alignment system uses a CCD (charge coupled device) of a resin plug hole, the risk of blind through hole deviation exists due to the factors of abrasive belt plate grinding, and the risk of blind through mismatch exists if an externally drilled CCD hole is used;

4. the X-RAY inspection standard for such plates is wide when drilling out.

Disclosure of Invention

The invention aims at the problem that the existing circuit board has the defects, and provides a manufacturing process for improving the blind-through mismatching and the off-blind drilling of a resin plugged plate.

In order to solve the technical problems, the invention provides a manufacturing process for improving blind-through mismatching and drilling deviation holes of a resin plugged plate, which comprises the following steps:

s1, when inner-layer circuits are manufactured on an inner-layer core board in a production board, two groups of first target groups and second target groups, which are composed of a plurality of targets, are manufactured on the board edges;

s2, drilling first target holes at positions corresponding to the first target group on the production plate, and measuring the target distance between the first target holes to obtain the expansion and contraction coefficient of the production plate;

s3, drilling a plug hole to be filled with resin on the plate by taking the first target hole as an alignment hole according to the expansion and contraction coefficient, and metallizing the plug hole by copper deposition and full-plate electroplating;

s4, manufacturing a plated hole pattern on the production plate, thickening the thickness of hole copper in the plug hole, and then removing the film;

s5, filling resin in the plug holes and curing, and then removing the resin protruding out of the plate surface through plate grinding;

s6, drilling second target holes at positions corresponding to the second target group on the production board, and measuring the target distance between the second target holes to obtain the expansion and contraction coefficient of the production board;

and S7, drilling through holes and/or blind holes on the plate according to the expansion and contraction coefficient obtained in the step S6 and by taking the second target hole as an alignment hole.

Further, step S1 specifically includes the following steps:

s11, cutting a core plate according to the size of the jointed plate;

s12, manufacturing an inner layer circuit on the core board, and manufacturing two groups of first target groups and second target groups which are composed of a plurality of targets on the board edge of the core board;

and S13, laminating the core board and the outer layer copper foil through a prepreg to form a production board.

Further, in step S1, the first target group includes a first target, a second target, and a third target, wherein a connecting line between the first alignment target and the second alignment target is parallel to the long side of the core plate, and a connecting line between the second alignment target and the third alignment target is parallel to the short side of the core plate.

Further, in step S1, the second target group includes a fourth target, a fifth target, and a sixth target, wherein a connection line between the fourth alignment target and the fifth alignment target is parallel to the long side of the core plate, and a connection line between the fifth alignment target and the sixth alignment target is parallel to the short side of the core plate.

Further, the fourth target, the fifth target and the sixth target are respectively arranged at one side of the first target, the second target and the third target.

Further, the target distance between the fourth target and the first target, the target distance between the fifth target and the second target, and the target distance between the sixth target and the third target are the same.

Further, the target distance between the fourth target and the first target is 3-10 mm.

Further, in step S2, the target distance between the first target and the second target and the target distance between the second target and the third target are measured through the first target hole, and the target distance obtained by the measurement is compared with a designed target distance standard value to calculate the expansion and contraction coefficient of the production board.

Further, in step S6, the target distance between the fourth target and the fifth target and the target distance between the fifth target and the sixth target are measured through the second target hole, and the target distance obtained by the measurement is compared with the designed target distance standard value to calculate the expansion and contraction coefficient of the production board.

Further, in steps S2 and S6, a first target hole and a second target hole are respectively drilled by laser.

Compared with the prior art, the invention has the following beneficial effects:

according to the invention, two groups of target holes are designed, and are drilled before resin hole plugging and outer layer drilling are respectively carried out, and corresponding drilling operation is carried out after the expansion coefficient of the plate is measured after the target holes are drilled each time, so that the drilled hole plugging and the blind through hole are aligned well, the problem of inaccurate alignment caused by copper plating reduction of the first drilled target hole and expansion and contraction of the plate after the plate is ground by using an abrasive belt can be avoided by the target holes drilled for the second time, and the problem of unmatched offset hole and blind through hole caused by variation of the target holes when the same group of target holes are drilled for two times can be avoided; the invention also limits the position limit between the two groups of targets, is convenient for the design and manufacture of the two groups of targets and the accurate grabbing of all the targets of the corresponding group in the later period of drilling the target holes, avoids the problem of drilling the target holes caused by the mistaken grabbing and is also convenient for the measurement of the expansion and contraction coefficient.

Drawings

FIG. 1 is a schematic diagram of the target production on a core plate in the example.

Detailed Description

In order to more fully understand the technical contents of the present invention, the technical solutions of the present invention will be further described and illustrated with reference to specific embodiments.

Examples

As shown in fig. 1, the method for manufacturing a resin plugging plate in this embodiment specifically includes the following processing steps:

(1) cutting: the core plate is cut according to the size of the jointed board of 520mm multiplied by 620mm, the thickness of the core plate is 0.5mm (the thickness is the thickness without the outer layer copper foil), and the thickness of the outer layer copper foil is 0.5 oz.

(2) And inner layer circuit manufacturing (negative film process): transferring the inner layer pattern, coating a photosensitive film with a vertical coating machine, controlling the film thickness of the photosensitive film to be 8 μm, completing the exposure of the inner layer circuit on a core plate by using a full-automatic exposure machine and 5-6 exposure rulers (21 exposure rulers), and forming the inner layer circuit pattern after development; etching the inner layer, etching the exposed and developed core board to form an inner layer circuit, wherein the line width of the inner layer is 3mil, and manufacturing two groups of a first target group and a second target group which are composed of three targets on the board edge of the core board; and (4) inner layer AOI, and then, detecting defects of an inner layer circuit, such as open short circuit, circuit notch, circuit pinhole and the like, and performing defect scrapping treatment, wherein a defect-free product is discharged to the next flow.

As shown in fig. 1, the first target group includes a first target 1, a second target 2, and a third target 3, wherein a connection line between the first target 1 and the second target 2 is parallel to a long side of the core plate 10, and a connection line between the second target 2 and the third target 3 is parallel to a short side of the core plate 10, so that the three targets in the first target group are used to facilitate measurement and calculation of expansion and contraction coefficients on the long side and the short side of the core plate after the first target hole is drilled in the later period; the second target group comprises a fourth target 4, a fifth target 5 and a sixth target 6, wherein a connecting line between the fourth alignment target 4 and the fifth alignment target 5 is parallel to the long side of the core plate 10, and a connecting line between the fifth alignment target 5 and the sixth alignment target 6 is parallel to the short side of the core plate 10, so that the expansion and contraction coefficients of the long side and the short side of the plate can be measured and calculated by using the three targets in the second target group after the second target hole is drilled in the later period.

The fourth target, the fifth target and the sixth target are respectively arranged on one side of the first target, the second target and the third target in the same direction, and the target distance between the fourth target and the first target, the target distance between the fifth target and the second target and the target distance between the sixth target and the third target are the same, so that the three targets in the second target group can be correspondingly superposed with the three targets in the first target group one by one after being deviated in the same direction by a certain distance (namely the target distance between the fourth target and the first target), the position relationship facilitates the design and manufacture of the two groups of targets, and facilitates the accurate grabbing of all targets in the corresponding group during the later-stage target hole drilling, the problem of target hole drilling caused by mistaken grabbing is avoided, the target distance design values of the two groups of targets are the same, and the measurement and calculation of the expansion and contraction coefficients of two times are also facilitated; in a specific embodiment, the target distance between the fourth target and the first target is controlled to be 3-10mm, and the target distance can better distinguish and accurately grab the two groups of targets.

(3) And pressing: and (3) brown oxidizing at the brown oxidizing speed according to the copper thickness of the bottom copper, and laminating the outer-layer copper foil, the prepreg, the core plate, the prepreg and the outer-layer copper foil in sequence and then pressing to form the production plate.

(4) Drilling a first target hole: snatch the first target group in the production inboard layer through X-RAY target drone, then utilize laser to drill out a first target hole respectively in the position department that corresponds first target, second target and third target on the production board, then measure the target distance between first target and the second target and the target distance between second target and the third target respectively through first target hole, thereby measure the target distance on the long limit of board and the minor face, the target distance that will measure and obtain compares the harmomegathus coefficient of production board with the target distance standard value of design.

(5) Drilling a hole to be plugged: and drilling a plug hole to be filled with resin on the plate by using the three first target holes as alignment holes according to the expansion and contraction coefficient obtained by the calculation.

(6) And copper deposition: a layer of thin copper is deposited on the hole wall in a chemical reaction mode to provide a foundation for the whole plate electroplating, the backlight test is 10 grades, and the thickness of the copper deposition in the hole is 0.5 mu m.

(7) And electroplating the whole plate: according to the mechanism of electrochemical reaction, a layer of copper is electroplated on the basis of copper deposition, the thickness of the hole copper is ensured to meet the product requirement, and electroplating parameters are set according to the thickness of the finished hole copper.

(8) Plating hole patterns: and pasting a film on the production plate, and windowing at the position corresponding to the plug hole on the production plate through exposure and development.

(9) Plating holes: the thickness of the hole copper in the plug hole is thickened through electroplating, and the film is removed after the electroplating is finished.

(10) Grinding a plate by using an abrasive belt: and then removing the resin protruding out of the board surface through a belt sanding board to enable the board surface to be flat.

(11) Drilling a second target hole: snatch the second target group in the production inboard layer through X-RAY target drone, then utilize laser to drill out a second target hole respectively in the position punishment that corresponds the fourth target, fifth target and sixth target on the production board, then measure the target distance between fourth target and the fifth target and the target distance between fifth target and the sixth target respectively through the second target hole, thereby measure the target distance on the board long limit and the minor face, the target distance that will measure and obtain compares with the target distance standard value of design and calculates the harmomegathus coefficient of production board.

(12) And outer layer drilling: and (4) drilling through holes and/or blind holes on the production plate by using a mechanical drilling mode by taking the three first target holes as alignment holes according to the expansion and contraction coefficients and the drilling data obtained by the calculation in the step (10).

(13) And copper deposition: a layer of thin copper is deposited on the hole wall in a chemical reaction mode to provide a foundation for the subsequent full-board electroplating, the backlight test is 10 grades, and the thickness of the copper deposition in the hole is 0.5 mu m.

(14) And electroplating the whole plate: according to the mechanism of electrochemical reaction, a layer of copper is electroplated on the basis of copper deposition, the thickness of the hole copper is ensured to meet the product requirement, and electroplating parameters are set according to the thickness of the finished hole copper.

(15) And manufacturing an outer layer circuit (positive process): transferring an outer layer pattern, completing outer layer line exposure by using a full-automatic exposure machine and a positive film line film with 5-7 exposure rulers (21 exposure rulers), and forming an outer layer line pattern on a production board through development; electroplating an outer layer pattern, and then respectively plating copper and tin on the production plate, wherein the copper plating is carried out for 60min at the current density of 1.8ASD, the tin plating is carried out for 10min at the current density of 1.2ASD, and the tin thickness is 3-5 mu m; then sequentially removing the film, etching and removing tin, and etching an outer layer circuit on the production board; and (4) performing outer layer AOI, then checking the defects of an outer layer circuit, such as open short circuit, circuit notch, circuit pinhole and the like, performing defective scrapping treatment, and discharging a defect-free product to the next flow.

(16) Solder resist and silk screen printing of characters: by making a green oil layer on the outer layer of the production plate and silk-printing characters, the thickness of the green oil is as follows: 10-50 μm, so that the influence of environmental change on the production plate can be reduced in the subsequent use process.

(17) Surface treatment (nickel-gold deposition): the copper surface of the welding pad at the solder stop windowing position is communicated with a chemical principle, a nickel layer and a gold layer with certain required thickness are uniformly deposited, and the thickness of the nickel layer is as follows: 3-5 μm; the thickness of the gold layer is as follows: 0.05-0.1 μm.

(18) And molding: according to the prior art and according to the design requirement, the shape is gong, and the tolerance of the shape is +/-0.05 mm; and (5) preparing the resin plugging hole plate.

(19) And electrical test: testing the electrical conduction performance of the finished board, wherein the board use testing method comprises the following steps: and (5) flying probe testing.

(20) FQC: and (4) inspecting the appearances of the step plates twice according to the customer acceptance standard and the my inspection standard, and timely repairing defects to ensure that excellent quality control is provided for customers.

(21) FQA: and measuring whether the appearance, the hole copper thickness, the dielectric layer thickness, the green oil thickness, the inner layer copper thickness and the like of the stepped plate twice meet the requirements of customers or not.

(22) And packaging: and hermetically packaging the two step plates according to the packaging mode and the packaging quantity required by the customer, putting a drying agent and a humidity card, and then delivering.

In other embodiments, the following steps may be added between steps (3) and (4):

(31) browning/blackening: the production board is subjected to browning/blackening treatment in a chemical reaction mode, so that a brown oxide layer is generated on the surface of a copper layer of the production board, and the wavy shape of the browned surface can effectively absorb CO ² Laser energy is convenient for later laser drilling.

The technical solutions provided by the embodiments of the present invention are described in detail above, and the principles and embodiments of the present invention are explained herein by using specific examples, and the descriptions of the embodiments are only used to help understanding the principles of the embodiments of the present invention; meanwhile, for a person skilled in the art, according to the embodiments of the present invention, there may be variations in the specific implementation manners and application ranges, and in summary, the content of the present description should not be construed as a limitation to the present invention.

Claims

1. A manufacturing process for improving blind-through mismatching and drilling deviation holes of a resin plugging plate is characterized by comprising the following steps of:

s1, when inner-layer circuits are manufactured on an inner-layer core board in a production board, two groups of first target groups and second target groups, which are composed of a plurality of targets, are manufactured on the board edges; the first target group comprises a first target, a second target and a third target, wherein a connecting line between the first alignment target and the second alignment target is parallel to the long side of the core plate, and a connecting line between the second alignment target and the third alignment target is parallel to the short side of the core plate; the second target group comprises a fourth target, a fifth target and a sixth target, wherein a connecting line between the fourth alignment target and the fifth alignment target is parallel to the long side of the core plate, and a connecting line between the fifth alignment target and the sixth alignment target is parallel to the short side of the core plate; the fourth target, the fifth target and the sixth target are respectively arranged on one side of the first target, the second target and the third target in the same direction, and the target distance between the fourth target and the first target, the target distance between the fifth target and the second target and the target distance between the sixth target and the third target are the same;

2. The manufacturing process for improving the blind via mismatch and the drilled deviated via of the resin plugging plate according to claim 1, wherein the step S1 specifically comprises the following steps:

s11, opening a core plate according to the size of the jointed plate;

and S13, laminating the core board and the outer layer of copper foil through the prepreg to form a production board.

3. The process for improving blind via mismatch and off-drilled via of a resin plugged plate as claimed in claim 1, wherein the target distance between the fourth target and the first target is 3-10 mm.

4. The process of claim 1, wherein in step S2, the target distance between the first target and the second target and the target distance between the second target and the third target are measured through the first target hole, and the target distance is compared with a target distance standard value to calculate the coefficient of expansion and contraction of the production board.

5. The process of claim 1, wherein in step S6, the target distance between the fourth target and the fifth target and the target distance between the fifth target and the sixth target are measured through the second target hole, and the target distance is compared with a target distance standard value to calculate the coefficient of expansion and contraction of the production board.

6. The process of claim 1, wherein the steps S2 and S6 are performed by laser drilling a first target hole and a second target hole respectively.