CN114340225B - Multilayer packaging substrate alignment method suitable for laser blind holes - Google Patents
Multilayer packaging substrate alignment method suitable for laser blind holes Download PDFInfo
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- CN114340225B CN114340225B CN202111593315.8A CN202111593315A CN114340225B CN 114340225 B CN114340225 B CN 114340225B CN 202111593315 A CN202111593315 A CN 202111593315A CN 114340225 B CN114340225 B CN 114340225B
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- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 9
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Abstract
The invention relates to a multilayer packaging substrate alignment method suitable for laser blind holes, which comprises the following steps: cutting: cutting a substrate with a certain size; inner layer graphic circuit: manufacturing a target of the reference A and a target of the outer layer circuit alignment reference D; pressing: adding layers to the substrate by utilizing the PP layer and the outer copper foil layer to form a multilayer board; X-Ray targeting: manufacturing an alignment reference A and an alignment reference D; step 5: outer laser front line: a manufacturing position alignment reference B; laser drilling: manufacturing a blind hole and an alignment reference C; copper deposition electroplating; and (5) an outer layer pattern line. The invention not only improves the alignment degree of the laser blind holes and the inner layer patterns, but also takes the alignment degree between multiple layers into consideration.
Description
Technical Field
The invention relates to a packaging substrate, in particular to a multilayer packaging substrate alignment method suitable for laser blind holes.
Background
Currently, the main flow of packaging substrates has three processing technologies, namely a Tenting technology, an MSAP technology and an SAP technology, which are three different technological systems. In the Tenting process, the conventional multilayer board alignment system takes a target hole as a reference, so that the alignment degree of the hole and an inner layer pattern is better; or the outer layer drilling is used as a reference, so that the alignment degree of the holes and the outer layer patterns is better; therefore, according to the conventional alignment system design, only the design with the hole ring more than 60 μm and the target PAD ring more than 70 μm can be satisfied, and the high-precision wiring design can not be satisfied.
Along with the trend of electronic products becoming smaller, the precision requirement of the packaging substrate is also higher, the introduction of higher-precision equipment can increase the fixed assets of enterprises, so that the cash flow of the enterprises is reduced intangibly, and the operation burden of the enterprises is increased. Therefore, a new set of alignment system development is required to be developed, so that the product design requirement is met, and large investment is not required.
Disclosure of Invention
In order to overcome the defects, the invention provides a multilayer packaging substrate alignment method suitable for laser blind holes, wherein the alignment method relates to multiple alignment references, so that the alignment degree of the laser blind holes and an inner layer pattern is improved, and meanwhile, the alignment degree between multiple layers is also considered.
The technical scheme adopted by the invention for solving the technical problems is as follows:
a multilayer packaging substrate alignment method suitable for laser blind holes comprises the following steps:
step 1: cutting: cutting a substrate with a certain size, wherein the substrate is provided with a core layer, and a first inner copper foil layer and a second inner copper foil layer which are respectively arranged on the front side and the back side of the core layer;
step 2: inner layer graphic circuit: performing line pretreatment, dry film pressing, exposure, development, etching and film stripping treatment on the first inner copper foil layer and the second inner copper foil layer of the substrate to form an inner layer pattern line, simultaneously manufacturing a target of an outer layer laser windowing alignment reference A and a target of an outer layer line alignment reference D on the edge of the substrate, and forming an avoidance groove on the first inner copper foil layer;
step 3: pressing: adding layers to the substrate by utilizing the PP layer and the outer copper foil layer to form a multilayer board;
step 4: X-Ray targeting: according to the target of the inner layer graph, an outer layer laser windowing alignment reference A and an outer layer graph line alignment reference D are manufactured on the outer copper foil layer;
step 5: outer laser front line: b, using the A as a reference to manufacture a laser drilling alignment reference B, a laser blind hole windowing and a line alignment reference C windowing;
step 6: laser drilling: b is taken as a reference, laser blind holes in an effective area are manufactured for interlayer conduction, and a circuit alignment reference C passes through an avoidance groove on the first inner copper foil layer;
step 7: copper deposition electroplating: the blind holes for interlayer conduction and the through holes of the reference C are treated by desmear, chemical copper and electroplating copper, so that the inner walls of the holes are plated with copper to conduct the layers mutually;
step 8: outer layer graphics circuitry: and carrying out line pretreatment, dry film pressing, exposure, development, etching and film stripping treatment on the outer copper foil layer of the multilayer board to form an outer pattern line, wherein when the outer pattern line is manufactured, a composite hole fitted by the standard C and the standard D is used as an alignment standard.
Preferably, in step 4, the reference a and the reference D are target holes made with the inner layer target as a reference, and the aperture of the reference a and the reference D is 0.1 to 5.0mm.
Preferably, in step 5, the reference B is an etched PAD, and the shape may be circular, square or triangular.
Preferably, in step 6, the reference C is formed by a circle of through holes surrounding the reference D, the through holes are laser through holes, the aperture of each through hole is 0.2-0.5 mm, an avoidance groove is formed at the first inner copper foil layer corresponding to each through hole, the aperture of the avoidance groove is larger than that of the through hole, and copper layer avoidance is formed on the first inner copper foil layer corresponding to the hole position of the through hole.
Preferably, in the step 8, during graph alignment, a circle of virtual circular holes of the through hole center of the reference C are grasped, meanwhile, a circle of circular holes of the reference D are grasped, the virtual circular holes and the reference D are calculated in proportion to obtain a final fitting alignment reference, and the outer layer graph circuit is manufactured according to the fitting alignment reference.
Preferably, the graphic circuit in the steps 2 and 8 specifically includes the following steps:
(1) Pretreatment: cleaning the surface of the plate by using a cleaning solution containing hydrogen peroxide, and coarsening the surface of the copper foil layer by using a sulfuric acid solution;
(2) Pressing dry film: adhering a photosensitive dry film on the surface of the copper foil layer in a hot pressing mode;
(3) Exposure: polymerizing the photosensitive substance in the photosensitive dry film by using an LDI exposure machine, so that the designed pattern is transferred to the photosensitive dry film;
(4) Developing: saponification reaction of the developing solution and the unexposed dry film is utilized to remove the film;
(5) Etching: spraying copper chloride liquid medicine on the copper surface through an etching machine, and etching the copper surface which is not protected by the dry film by utilizing chemical reaction of the liquid medicine and copper to form a circuit;
(6) Film stripping: spraying NaOH or KOH liquid medicine on the board surface through a film removing machine, and removing the dry film by utilizing the chemical reaction of the liquid medicine and the dry film to finish the manufacture of the circuit;
(7) AOI: the AOI system checks the lines on the copper surface against the differences between the etched lines and the original design lines.
Preferably, the pressing in the step 3 specifically includes the following steps:
(1) Pretreatment: acid washing: removing oxide on the surface of the copper foil layer by utilizing sulfuric acid; cleaning: hydrolyzing the grease into small molecular substances which are easy to dissolve in water by using a cleaning agent; presoaking: pre-soaking the inner layer plate by using brown liquid;
(2) Brown chemical: the surface of the copper foil layer is subjected to brown treatment by using brown liquid, so that the surface of the copper layer forms an uneven surface shape, and the contact area of the copper surface and resin is increased;
(3) Overlapping: sequentially overlapping the substrate, the PP layer and the outer copper foil layer;
(4) Pressing: fusing and bonding the substrate, the PP layer and the outer copper foil layer to form a multilayer board at high temperature and high pressure of a press;
(5) Post-treatment: drilling: imaging a plate target by utilizing X-rays, and drilling a positioning hole and a fool-proof hole required by a subsequent process on the target by using a drill bit; edge milling: and cutting and removing redundant rim charge by using a milling machine.
Preferably, the step 7 copper deposition electroplating specifically includes the following steps:
(1) Removing glue residues: removing the gumming slag generated during drilling by using a plasma method;
(2) Chemical copper: depositing a thin uniform chemical copper layer with conductivity in the hole through chemical action;
(3) Electroplating copper: plating a layer of electroplated copper layer on the surface of the chemical copper layer in an electroplating mode.
The beneficial effects of the invention are as follows:
1) According to the invention, the reference C manufactured by using laser windowing and laser drilling is used as the alignment reference of the outer layer pattern circuit, so that the alignment deviation of the pattern circuit and the laser drilling is only the deviation of circuit exposure, the design requirement that the minimum hole ring is 20 mu m can be realized, the alignment reference C is designed into a circle of small holes, and the circle of small holes are used as the reference, so that the alignment deviation problem caused by poor manufacturing of one hole can be solved;
2) According to the invention, the Target Kong Jizhun D manufactured by taking the inner layer Target as a reference is added into the graph line alignment reference, so that on one hand, the alignment degree with the inner layer graph can be improved, and therefore, the design of a smaller Target PAD ring is realized, the minimum Target PAD ring can reach 30 mu m, on the other hand, the leakage of the interlayer alignment degree can be avoided because the alignment degree of a single layer graph and a hole is simply pursued, the interlayer alignment degree can be ensured, and the design requirement that the interlayer alignment degree is less than or equal to 25 mu m is met on the premise of ensuring the alignment degree of the same layer graph and the hole; the invention only improves the alignment degree in design, the related processes are mature processes, equipment with higher precision is not needed to be input, the input cost is greatly reduced, and the design requirement of high-precision products is met on the premise of not obviously improving the enterprise cost.
Drawings
FIG. 1 is a schematic view of a substrate according to the present invention;
FIG. 2 is a schematic diagram of the structure of the inner circuit of the substrate according to the present invention;
FIG. 3 is a top view of the substrate of the present invention after the inner traces;
FIG. 4 is a schematic view of the structure of the multi-layer board according to the present invention;
FIG. 5 is a schematic diagram of a post-targeting datum A according to the present invention;
FIG. 6 is a schematic diagram of a post-targeting datum D according to the present invention;
FIG. 7 is a schematic diagram of the structure of the laser front circuit and the laser rear circuit of the multilayer board according to the invention;
FIG. 8 is a top view of the multilayer board of the present invention after laser front routing;
FIG. 9 is a schematic diagram of a multi-layer board reference B in the present invention;
FIG. 10 is a schematic diagram of a laser drilling structure of a multi-layer board according to the present invention;
FIG. 11 is a top view of the multi-layer board of the present invention after laser drilling;
FIG. 12 is a schematic view of the structure of a multilayer board after copper deposition plating in accordance with the present invention;
FIG. 13 is a schematic diagram of references C and D in the present invention;
in the figure: 10-base plate, 11-core layer, 12-first inner copper foil layer, 13-second inner copper foil layer, 14-avoiding groove, 20-multilayer board, 21-PP layer, 22-outer copper foil layer.
Detailed Description
The technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the embodiments of the present invention, and it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be noted that the terms "first," "second," and the like in the description and claims of the present application and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that embodiments of the present application described herein may be capable of being practiced otherwise than as specifically illustrated and described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
Spatially relative terms, such as "above … …," "above … …," "upper surface at … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial location relative to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "above" or "over" other devices or structures would then be oriented "below" or "beneath" the other devices or structures. Thus, the exemplary term "above … …" may include both orientations of "above … …" and "below … …". The device may also be positioned in other different ways (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
Examples: as shown in fig. 1-13, a multilayer packaging substrate alignment method suitable for laser blind holes comprises the following steps:
step 1: cutting: as shown in fig. 1, a substrate 10 having a core layer 11 and first and second inner copper foil layers 12 and 13 respectively provided on both front and back sides of the core layer is cut to a certain size;
step 2: inner layer graphic circuit: as shown in fig. 2 and 3, the first inner copper foil layer and the second inner copper foil layer of the substrate are subjected to line pretreatment, dry film pressing, exposure, development, etching and film stripping treatment to form an inner layer pattern line, and simultaneously, a target of an outer layer laser windowing alignment reference a and a target of an outer layer line alignment reference D are manufactured on the edge of the substrate, and an avoidance groove 14 is formed on the first inner copper foil layer 12;
step 3: pressing: the PP layer 21 and the outer copper foil layer 22 are utilized to carry out layer adding on the substrate to form a multilayer board 20; as shown in fig. 4, the multilayer board 20 is sequentially an outer copper foil layer 22, a PP layer 21, a first inner copper foil layer 12, a core layer 11, and a second inner copper foil layer 13;
step 4: X-Ray targeting: as shown in fig. 5 and 6, an outer layer laser window alignment reference a and an outer layer graph line alignment reference D are manufactured on the outer copper foil layer according to the targets of the inner layer graph;
step 5: outer laser front line: b, using the A as a reference to manufacture a laser drilling alignment reference B, a laser blind hole windowing and a line alignment reference C windowing; fig. 7 and 8 show windowing of the line alignment references C, fig. 9 shows the alignment references B,
step 6: laser drilling: b is taken as a reference, laser blind holes in an effective area are manufactured for interlayer conduction, and a circuit alignment reference C passes through the avoiding groove 14 on the first inner copper foil layer 12; the step is completed to manufacture the blind holes of the effective area for layer conduction, wherein the blind holes are manufactured by taking B as a reference and B is taken A as a reference, so that the alignment degree of the laser blind holes and the inner layer circuit is high, as shown in fig. 10 and 11, and meanwhile, the reference C is laser emitted;
step 7: copper deposition electroplating: as shown in fig. 12, desmear, electroless copper and electrolytic copper plating are performed on the blind holes for interlayer conduction and the through holes of the reference C, copper plating is performed on the inner walls of the holes to conduct the layers to each other; at the moment, the blind holes can be filled with copper, only one layer of copper is plated on the side wall of the reference C, and the blind holes are not filled with copper, so that line alignment grabbing is facilitated;
step 8: outer layer graphics circuitry: the outer copper foil layer 22 of the multilayer board is subjected to line pretreatment, dry film pressing, exposure, development, etching and film stripping treatment to form an outer pattern line, wherein the outer pattern line is manufactured by taking a composite hole fitted by a reference C and a reference D as an alignment reference. As shown in fig. 13, when the outer layer line is manufactured, reference D and reference C are both used as alignment references, reference C is manufactured by using reference B as reference, and reference D is a target hole manufactured according to the inner layer target, so that the alignment degree of the outer layer line and the blind hole for layer conduction is also high; all the alignment references are arranged at the edge of the substrate without affecting the effective area on the substrate.
In step 4, the reference A and the reference D are target holes manufactured by taking an inner layer target as a reference, and the aperture of the reference A and the reference D is 0.1-5.0 mm. Fig. 5 shows the alignment reference a, and fig. 6 shows the alignment reference D.
In step 5, the reference B is an etched PAD, and the shape may be circular, square or triangular. As shown in fig. 9, the reference B in this embodiment is a circular PAD.
In step 6, as shown in fig. 10 and 11, the reference C is formed by a circle of through holes surrounding the reference D, the through holes are laser through holes, the aperture of each through hole is 0.2-0.5 mm, an avoiding groove 14 is formed at the position of the first inner copper foil layer corresponding to each through hole, the aperture of the avoiding groove 14 is larger than that of the through hole, and copper layer avoiding is formed on the first inner copper foil layer 12 corresponding to the hole position of the through hole. Namely, the area of the copper etched away at the inner copper foil layer corresponding to the circle of through holes is larger than the area of the aperture of the through holes, so that a certain distance is reserved between the copper plating layer in the holes and the first inner copper foil layer, laser through holes are realized, the situation that the holes are blocked by copper during hole filling electroplating and the recognition of outer layer graph alignment is affected is avoided, and the avoiding position of the first inner copper foil layer is shown in fig. 10.
In the step 8, during graph alignment, a circle of virtual round holes of the through hole center of the reference C are grabbed, meanwhile, round holes of the reference D are grabbed, the virtual round holes and the reference D are calculated according to proportion to obtain a final fitting alignment reference, and the outer layer graph line is manufactured according to the fitting alignment reference. Illustrating: fitting a final alignment reference by using the ratio of a round hole virtually formed by the reference C to 60% and the ratio of the reference D to 40%, wherein the alignment degree between an outer layer circuit manufactured by the alignment reference and a blind hole for interlayer conduction is higher; the round hole (shown in figure 13) formed by a circle of small holes of the alignment reference C is taken as a reference, so that the problem of alignment deviation caused by poor manufacture of one hole can be solved; when the outer layer circuit is manufactured, the reference C and the reference D are used as alignment references, so that the alignment degree of the laser blind holes and the inner layer patterns is improved, and the alignment degree among multiple layers is also improved.
The graphic circuit in the steps 2 and 8 specifically comprises the following steps:
(1) Pretreatment: cleaning the surface of the plate by using a cleaning solution containing hydrogen peroxide, and coarsening the surface of the copper foil layer by using a sulfuric acid solution; cleaning the plate surface to remove attachments such as stains, oxides and the like; the copper surface can be roughened by microetching with sulfuric acid solution, the adhesive force with the dry film is increased, and the main chemical reaction is as follows: cu+H 2 O 2 →CuO+H 2 O；CuO+H 2 SO 4 →CuSO 4 +H 2 O; the copper foil layer can be an inner copper foil layer, a secondary outer copper foilThe layer and the outer copper foil layer are the same as below;
(2) Pressing dry film: adhering a photosensitive dry film on the surface of the copper foil layer in a hot pressing mode; a photosensitive dry film is pressed on the copper surface layer and used for subsequent image transfer, and after the dry film is heated, the dry film has fluidity and a certain filling property, and is attached to the surface of the board in a hot pressing mode by utilizing the characteristic;
(3) Exposure: polymerizing the photosensitive substance in the photosensitive dry film by using an LDI exposure machine, so that the designed pattern is transferred to the photosensitive dry film; an LDI exposure machine (Laser Direcl Imaging laser direct imaging) utilizes Ultraviolet (UV) energy to complete pattern transfer;
(4) Developing: saponification reaction of the developing solution and the unexposed dry film is utilized to remove the film; the exposed dry film does not react with the developer, and the development main chemical reaction: R-COOH+Na 2 CO 3 →R-COO-Na + +2NaHCO 3 ；
(5) Etching: spraying copper chloride liquid medicine on the copper surface through an etching machine, and etching the copper surface which is not protected by the dry film by utilizing chemical reaction of the liquid medicine and copper to form a circuit; the main chemical reaction: 3Cu+NaClO 3 +6HCl→3CuCl 2 +3H 2 O+NaCl；
(6) Film stripping: spraying NaOH or KOH liquid medicine on the board surface through a film removing machine, and removing the dry film by utilizing the chemical reaction of the liquid medicine and the dry film to finish the manufacture of the circuit;
(7) AOI: the AOI system checks the lines on the copper surface against the differences between the etched lines and the original design lines. AOI is Automatic Optical Inspection automated optical inspection), the Genesis system processes the CAM data of the original design line into reference data for inspection and outputs to the AOI system. The AOI system uses the optical principle to judge defects such as short circuit, circuit break, notch and the like by comparing the difference between the etched circuit and the designed circuit.
The step 3 of lamination specifically comprises the following steps:
(1) Pretreatment: acid washing: removing oxide on the surface of the copper foil layer by utilizing sulfuric acid; cleaning: hydrolysis of fats and oils to readily soluble fats and oils by means of detergentsSmall molecular substances of water; presoaking: pre-soaking the inner layer plate by using brown liquid; the pretreatment is for preparing the browning process; acid washing: the chemical reaction of sulfuric acid and CuO is utilized to remove oxides on the copper surface, and the main chemical reaction is as follows: cuO+H 2 SO 4 →CuSO 4 +H 2 O; cleaning by reaction of cleaning agent with oil and fat, and main chemical reaction is KOH+R 1 COOH→RNHCOR 1 +H 2 O; the presoaking makes the board have similar components to the browning liquid to prevent water from damaging the browning liquid;
(2) Brown chemical: the surface of the copper foil layer is subjected to brown treatment by using brown liquid, so that the surface of the copper layer forms an uneven surface shape, and the contact area of the copper surface and resin is increased; the brown oxide liquid is sulfuric acid and hydrogen peroxide, the sulfuric acid and the hydrogen peroxide are utilized to microetch the copper surface, and a layer of extremely thin, uniform and consistent organic metal conversion film is generated at the same time of microetching, and the main purpose of brown oxide is as follows: coarsening copper surface, increasing surface area contacted with PP sheet (pre preg prepreg is sheet material impregnated with resin and solidified to intermediate degree), improving adhesion with PP sheet, preventing delamination; the wettability of the copper surface and the flowing resin is increased; passivating the copper surface, and blocking the action of ammonia substances generated by polymerization and hardening of epoxy resin on the copper surface in the pressing plate process, wherein the ammonia substances attack the copper surface to generate water vapor, so that the explosion plate is caused;
(3) Overlapping: sequentially laminating the substrate 10, the PP layer 21 and the outer copper foil layer 22;
(4) Pressing: fusing and bonding the substrate, the PP layer and the outer copper foil layer to form a multilayer board 20 at high temperature and high pressure of a press;
(5) Post-treatment: drilling: imaging a plate target by utilizing X-rays, and drilling a positioning hole and a fool-proof hole required by a subsequent process on the target by using a drill bit; edge milling: and cutting and removing redundant rim charge by using a milling machine.
The step 7 copper deposition electroplating specifically comprises the following steps:
(1) Removing glue residues: removing the gumming slag generated during drilling by using a plasma method; in the high temperature of laser, when the temperature exceeds the Tg point of the resin, the resin is in a softened or even gasified state, the formed fluid can be coated on the hole wall, and after cooling, glue residue paste (smooth) is formed, so that a gap is formed between copper walls of an inner copper hole ring which is subsequently manufactured, and therefore, before chemical copper (PTH), formed glue residues are required to be removed, so that smooth adhesion of the chemical copper which is subsequently manufactured Cheng Kongna is facilitated;
(2) Chemical copper: depositing a thin uniform chemical copper layer with conductivity in the hole through chemical action; namely, the original non-metallized hole wall is metallized, so that the subsequent smooth plating of electrochemical copper is facilitated;
(3) Electroplating copper: plating a layer of electroplated copper layer on the surface of the chemical copper layer in an electroplating mode. In the electroplating bath, the copper ion components in the solution are uniformly reduced on the copper surface and in the holes by using a mode of applying alternating current (cathode to obtain electronic copper plating and anode to lose electronic dissolved copper), so that the thickness of the copper layer is required by specifications.
It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.
Claims (8)
1. A multilayer packaging substrate alignment method suitable for laser blind holes is characterized in that: the method comprises the following steps:
step 1: cutting: cutting a substrate (10) with a certain size, wherein the substrate is provided with a core layer (11), a first inner copper foil layer (12) and a second inner copper foil layer (13) which are respectively arranged on the front side and the back side of the core layer;
step 2: inner layer graphic circuit: performing line pretreatment, dry film pressing, exposure, development, etching and film withdrawal treatment on the first inner copper foil layer and the second inner copper foil layer of the substrate to form an inner layer pattern line, simultaneously manufacturing a target of an outer layer laser windowing alignment reference A and a target of an outer layer line alignment reference D on the edge of the substrate, and forming an avoidance groove (14) on the first inner copper foil layer (12);
step 3: pressing: adding layers to the substrate by utilizing the PP layer (21) and the outer copper foil layer (22) to form a multilayer board (20);
step 4: X-Ray targeting: according to the target of the inner layer graph, an outer layer laser windowing alignment reference A and an outer layer graph line alignment reference D are manufactured on the outer copper foil layer;
step 5: outer laser front line: taking the outer layer laser window alignment reference A as a reference, manufacturing a laser drilling alignment reference B, a laser blind hole window and a line alignment reference C window;
step 6: laser drilling: the laser blind hole in the effective area is manufactured for interlayer conduction by taking the laser drilling alignment reference B as a reference, and the line alignment reference C penetrates through the avoidance groove (14) on the first inner copper foil layer (12);
step 7: copper deposition electroplating: the blind holes for interlayer conduction and the through holes of the reference C are treated by desmear, chemical copper and electroplating copper, so that the inner walls of the holes are plated with copper to conduct the layers mutually;
step 8: outer layer graphics circuitry: and carrying out line pretreatment, dry film pressing, exposure, development, etching and film stripping treatment on the outer copper foil layer (22) of the multilayer board to form an outer pattern line, wherein the outer pattern line is manufactured by taking a composite hole fitted by the standard C and the standard D as an alignment standard.
2. The method for aligning a multi-layer package substrate suitable for laser blind vias according to claim 1, wherein: in step 4, the reference A and the reference D are target holes manufactured by taking an inner layer target as a reference, and the aperture of the reference A and the reference D is 0.1-5.0 mm.
3. The method for aligning a multi-layer package substrate suitable for laser blind vias according to claim 1, wherein: in step 5, the reference B is an etched PAD, and the shape may be circular, square or triangular.
4. The method for aligning a multi-layer package substrate suitable for laser blind vias according to claim 1, wherein: in step 6, the reference C is formed by a circle of through holes surrounding the reference D, the through holes are laser through holes, the aperture of each through hole is 0.2-0.5 mm, an avoidance groove (14) is formed at the position of the first inner copper foil layer corresponding to each through hole, the aperture of the avoidance groove (14) is larger than that of the through hole, and copper layer avoidance is formed on the first inner copper foil layer (12) corresponding to the hole position of the through hole.
5. The method for aligning a multi-layer package substrate suitable for laser blind vias according to claim 1, wherein: in the step 8, during graph alignment, a circle of virtual round holes of the through hole center of the reference C are grabbed, meanwhile, round holes of the reference D are grabbed, the virtual round holes and the reference D are calculated according to proportion to obtain a final fitting alignment reference, and the outer layer graph line is manufactured according to the fitting alignment reference.
6. The method for aligning a multi-layer package substrate suitable for laser blind vias according to claim 1, wherein: the graphic lines in the step 2 and the step 8 specifically include the following steps:
(1) Pretreatment: cleaning the surface of the plate by using a cleaning solution containing hydrogen peroxide, and coarsening the surface of the copper foil layer by using a sulfuric acid solution;
(2) Pressing dry film: adhering a photosensitive dry film on the surface of the copper foil layer in a hot pressing mode;
(3) Exposure: polymerizing the photosensitive substance in the photosensitive dry film by using an LDI exposure machine, so that the designed pattern is transferred to the photosensitive dry film;
(4) Developing: saponification reaction of the developing solution and the unexposed dry film is utilized to remove the film;
(5) Etching: spraying copper chloride liquid medicine on the copper surface through an etching machine, and etching the copper surface which is not protected by the dry film by utilizing chemical reaction of the liquid medicine and copper to form a circuit;
(6) Film stripping: spraying NaOH or KOH liquid medicine on the board surface through a film removing machine, and removing the dry film by utilizing the chemical reaction of the liquid medicine and the dry film to finish the manufacture of the circuit;
(7) AOI: the AOI system checks the lines on the copper surface against the differences between the etched lines and the original design lines.
7. The method for aligning a multi-layer package substrate suitable for laser blind vias according to claim 1, wherein: the step 3 of lamination specifically comprises the following steps:
(1) Pretreatment: acid washing: removing oxide on the surfaces of the first inner copper foil layer and the second inner copper foil layer by utilizing sulfuric acid; cleaning: hydrolyzing the grease into small molecular substances which are easy to dissolve in water by using a cleaning agent; presoaking: pre-soaking the inner layer plate by using brown liquid;
(2) Brown chemical: the surface of the first inner copper foil layer and the surface of the second inner copper foil layer are subjected to brown treatment by using brown treatment liquid, so that the surfaces of the first inner copper foil layer and the second inner copper foil layer form uneven surface shapes, and the contact area of the copper surface and resin is increased;
(3) Overlapping: sequentially superposing a substrate (10), a PP layer (21) and an outer copper foil layer (22);
(4) Pressing: fusing and bonding the substrate, the PP layer and the outer copper foil layer to form a multilayer board (20) at high temperature and high pressure of a press;
(5) Post-treatment: drilling: imaging a plate target by utilizing X-rays, and drilling a positioning hole and a fool-proof hole required by a subsequent process on the target by using a drill bit; edge milling: and cutting and removing redundant rim charge by using a milling machine.
8. The method for aligning a multi-layer package substrate suitable for laser blind vias according to claim 1, wherein: the step 7 copper deposition electroplating specifically comprises the following steps:
(1) Removing glue residues: removing the gumming slag generated during drilling by using a plasma method;
(2) Chemical copper: depositing a thin uniform chemical copper layer with conductivity in the hole through chemical action;
(3) Electroplating copper: plating a layer of electroplated copper layer on the surface of the chemical copper layer in an electroplating mode.
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| CN114845484A (en) * | 2022-05-05 | 2022-08-02 | 博敏电子股份有限公司 | Cross-layer blind hole alignment method of multilayer board |
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Citations (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001156424A (en) * | 1999-11-30 | 2001-06-08 | Mitsubishi Gas Chem Co Inc | Method of boring hole on copper-clad board |
| JP2001230518A (en) * | 2000-02-16 | 2001-08-24 | Mitsubishi Gas Chem Co Inc | Method for forming hole by using carbon dioxide gas laser and its post-treatment method |
| CN101494954A (en) * | 2009-02-27 | 2009-07-29 | 深圳市五株电路板有限公司 | Control method for laser drilling contraposition accuracy of high-density lamination circuit board |
| CN101646304A (en) * | 2008-08-05 | 2010-02-10 | 比亚迪股份有限公司 | Alignment method for printed circuit board |
| CN101959373A (en) * | 2009-07-17 | 2011-01-26 | 北大方正集团有限公司 | Method for improving blind hole alignment of printed circuit board |
| WO2012092806A1 (en) * | 2011-01-05 | 2012-07-12 | 惠州中京电子科技股份有限公司 | Blind hole opening process of multilayer hdi circuit board |
| CN102843875A (en) * | 2011-06-21 | 2012-12-26 | 昆山华扬电子有限公司 | Alignment control method for multiple layers of PCBs |
| CN103179812A (en) * | 2013-04-18 | 2013-06-26 | 梅州市志浩电子科技有限公司 | Manufacturing method of high-order multistage HDI (High Density Interconnection) printed circuit board |
| CN105764236A (en) * | 2015-04-29 | 2016-07-13 | 东莞生益电子有限公司 | Processing method of PCB, and PCB |
| CN106604577A (en) * | 2017-01-03 | 2017-04-26 | 江苏博敏电子有限公司 | HDI circuit board manufacturing process capable of realizing accurate alignment |
| CN107295751A (en) * | 2017-08-16 | 2017-10-24 | 梅州市志浩电子科技有限公司 | A kind of method of the compound contraposition of figure |
| CN207070445U (en) * | 2017-08-16 | 2018-03-02 | 梅州市志浩电子科技有限公司 | A kind of compound alignment target of figure |
| CN110213912A (en) * | 2019-06-26 | 2019-09-06 | 江门市众阳电路科技有限公司 | The radium-shine blind hole alignment method of HDI multi-layer board |
| CN111356309A (en) * | 2020-04-15 | 2020-06-30 | 江苏普诺威电子股份有限公司 | Manufacturing method of multilayer circuit board with high line alignment precision |
| CN111556669A (en) * | 2020-04-02 | 2020-08-18 | 深圳市景旺电子股份有限公司 | Method for manufacturing high-density interconnection board |
| WO2020185023A1 (en) * | 2019-03-12 | 2020-09-17 | 에스케이씨 주식회사 | Packaging substrate and method for manufacturing same |
| CN112533385A (en) * | 2020-12-15 | 2021-03-19 | 红板（江西）有限公司 | PCB through hole filling process |
| CN113286434A (en) * | 2021-05-14 | 2021-08-20 | 宜兴硅谷电子科技有限公司 | Alignment method of HDI (high Density interconnection) boards in any interconnection |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100449876B1 (en) * | 2002-12-05 | 2004-09-22 | 삼성전기주식회사 | A multi-layer PCB for connecting multi-channel optical signals of block type, and methods thereof |
-
2021
- 2021-12-23 CN CN202111593315.8A patent/CN114340225B/en active Active
Patent Citations (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001156424A (en) * | 1999-11-30 | 2001-06-08 | Mitsubishi Gas Chem Co Inc | Method of boring hole on copper-clad board |
| JP2001230518A (en) * | 2000-02-16 | 2001-08-24 | Mitsubishi Gas Chem Co Inc | Method for forming hole by using carbon dioxide gas laser and its post-treatment method |
| CN101646304A (en) * | 2008-08-05 | 2010-02-10 | 比亚迪股份有限公司 | Alignment method for printed circuit board |
| CN101494954A (en) * | 2009-02-27 | 2009-07-29 | 深圳市五株电路板有限公司 | Control method for laser drilling contraposition accuracy of high-density lamination circuit board |
| CN101959373A (en) * | 2009-07-17 | 2011-01-26 | 北大方正集团有限公司 | Method for improving blind hole alignment of printed circuit board |
| WO2012092806A1 (en) * | 2011-01-05 | 2012-07-12 | 惠州中京电子科技股份有限公司 | Blind hole opening process of multilayer hdi circuit board |
| CN102843875A (en) * | 2011-06-21 | 2012-12-26 | 昆山华扬电子有限公司 | Alignment control method for multiple layers of PCBs |
| CN103179812A (en) * | 2013-04-18 | 2013-06-26 | 梅州市志浩电子科技有限公司 | Manufacturing method of high-order multistage HDI (High Density Interconnection) printed circuit board |
| CN105764236A (en) * | 2015-04-29 | 2016-07-13 | 东莞生益电子有限公司 | Processing method of PCB, and PCB |
| CN106604577A (en) * | 2017-01-03 | 2017-04-26 | 江苏博敏电子有限公司 | HDI circuit board manufacturing process capable of realizing accurate alignment |
| CN107295751A (en) * | 2017-08-16 | 2017-10-24 | 梅州市志浩电子科技有限公司 | A kind of method of the compound contraposition of figure |
| CN207070445U (en) * | 2017-08-16 | 2018-03-02 | 梅州市志浩电子科技有限公司 | A kind of compound alignment target of figure |
| WO2020185023A1 (en) * | 2019-03-12 | 2020-09-17 | 에스케이씨 주식회사 | Packaging substrate and method for manufacturing same |
| CN110213912A (en) * | 2019-06-26 | 2019-09-06 | 江门市众阳电路科技有限公司 | The radium-shine blind hole alignment method of HDI multi-layer board |
| CN111556669A (en) * | 2020-04-02 | 2020-08-18 | 深圳市景旺电子股份有限公司 | Method for manufacturing high-density interconnection board |
| CN111356309A (en) * | 2020-04-15 | 2020-06-30 | 江苏普诺威电子股份有限公司 | Manufacturing method of multilayer circuit board with high line alignment precision |
| CN112533385A (en) * | 2020-12-15 | 2021-03-19 | 红板（江西）有限公司 | PCB through hole filling process |
| CN113286434A (en) * | 2021-05-14 | 2021-08-20 | 宜兴硅谷电子科技有限公司 | Alignment method of HDI (high Density interconnection) boards in any interconnection |
Non-Patent Citations (1)
| Title |
|---|
| 任意层HDI板精准层间对位技术研究;陈世金;胡文广;李志丹;邓宏喜;;印制电路信息(第S1期);全文 * |
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