CN103501579A - Circuit board aligning method - Google Patents
Circuit board aligning method Download PDFInfo
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- CN103501579A CN103501579A CN201310453822.0A CN201310453822A CN103501579A CN 103501579 A CN103501579 A CN 103501579A CN 201310453822 A CN201310453822 A CN 201310453822A CN 103501579 A CN103501579 A CN 103501579A
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Abstract
The invention relates to a circuit board aligning method, which comprises the following steps that targets are set, i.e. four targets are set at four corners of the second outer layer of a circuit board; punching is formed, i.e. four round holes are punched in corresponding positions of the outer layer of the circuit board according to the positions of the four targets; blind holes are drilled, i.e. four blind holes are drilled in the corresponding positions of the outer layer of the circuit board in a laser hole drilling mode according to the positions of the four targets; through holes are drilled, i.e. through holes are drilled out in the homocentric positions according to the round holes punched in the punching step; dry film positioning holes are set, i.e. the through holes are adopted as dry film positioning holes of the outer layer of the circuit board; aligning is formed, i.e. the circle centers of the blind holes, the through holes and the dry film positioning holes are aligned, and the blind holes, the through holes and the dry film positioning holes are considered to be matched if the concentric degree meets the aligning tolerance. The aligning method has the advantages that the problem of blind hole and through hole breaking caused by mismatching of a circuit board blind hole and through hole aligning system can be solved, and the production abandonment of the circuit board is reduced.
Description
Technical field
The present invention relates to the wiring board field, particularly a kind of alignment method of wiring board.
Background technology
Along with the development of electronic industry, the wiring board industry is also more and more flourishing, the technology of laser drill progressively occurred adopting.The appearance of laser drill technology, can obtain the machining accuracy meticulousr than machine drilling processing method, aperture narrows down to 0.05mm from the 0.2mm of original minimum, and the wiring density of wiring board and cloth hole density increase greatly, pore size also reduces gradually, and the requirement of its manufacturing technology is also more and more higher.For high-density circuit board, its number of plies is many, in manufacturing process, need each layer of exactitude position, and its line width and pad is all very little, and the difficulty of making is very large.Take wiring board as example, often occur that blind hole and through hole do not mate, bad point, appear in blind hole and through hole contraposition deviation; On the other hand, the SP hole arranged in the through hole alignment system usually can't represent wiring board time outer field whole harmomegathus, thereby easily occurs that the blind hole holes causes wiring board to be scrapped.
Summary of the invention
The technical problem underlying that the application will solve is, a kind of alignment method of wiring board is provided, and the method can effectively solve the problem of blind hole holes, greatly reduces the probability that blind hole is broken.
In order to solve the problems of the technologies described above, the present invention adopts following technical scheme:
A kind of alignment method of wiring board, comprise the steps: to arrange target, at wiring board time outer field four angles, four targets is set; Punching stamps out four circular holes according to the position of four targets on the outer field correspondence position of wiring board; Drilling blind hole, get out four blind holes according to position mode with laser drilling on the outer field correspondence position of wiring board of described four targets; Drill through hole, the circular hole stamped out according to described punching step, get out through hole at its concentric position; The dry film location hole is set, adopts described through hole as the outer field dry film location hole of wiring board; Contraposition, carry out contraposition by the center of circle of described blind hole, through hole and dry film location hole, if its concentric degree meets alignment tolerance, thinks coupling.
In further technical scheme, circular hole and through hole are the SP hole.
In further technical scheme, the first orifice ring is arranged after the through hole etching.
In further technical scheme, through hole is at least 6mil.
In further technical scheme, the first orifice ring is at least 2mil.
In further technical scheme, the second orifice ring is arranged after the blind hole etching.
In further technical scheme, blind hole is at least 3mil.
In further technical scheme, described the second orifice ring is 1mil at least.
The application is with respect to prior art, and it has following advantage and beneficial effect:
This alignment method can solve wiring board blind hole and through hole alignment system and not mate and cause the broken problem of blind hole and through hole hole, reduces the problem of wiring board manufacturing scrap.
The accompanying drawing explanation
Fig. 1 is the structural representation of a preferred embodiment ectomesoderm wiring board of the alignment method of a kind of wiring board of the present invention.
Fig. 2 is the flow chart in the preferred embodiment of alignment method of a kind of wiring board of the present invention.
Embodiment
Below by embodiment, by reference to the accompanying drawings the present invention is described in further detail.
Be illustrated in figure 2 flow chart of the present invention, and with reference to Fig. 1, the alignment method of a kind of wiring board of the present invention is comprised of five steps, be respectively: target 101 is set, at wiring board time outer field four angles, four targets are set, according to the position of four targets, stamp out four circular holes on the outer field correspondence position of wiring board; Drilling blind hole 102, get out four blind holes 2 according to position mode with laser drilling on the outer field correspondence position of wiring board of four targets; Drill through hole 103, the circular hole stamped out according to the punching step, get out through hole 1 at its concentric position; Dry film location hole 104 is set, adopts through hole as the outer field dry film location hole of wiring board; Contraposition 105, carry out contraposition by the center of circle of blind hole 2, through hole 1 and dry film location hole, if its concentric degree meets alignment tolerance, thinks coupling.
In a preferred embodiment, please continue with reference to Fig. 1, in this outer-layer circuit plate, at first four circular holes have been bored according to the position of inferior outer four targets in this outer-layer circuit plate, four blind holes 2 have been bored in the position of these four circular holes according to the position of target again, and then get out four through holes 1 at the concentric position of this blind hole 2, in the preferred embodiment, circular hole and through hole 1 are the SP hole, certainly, in other embodiments, it is the SP hole that circular hole and through hole 1 might not limit, also can be other boring, the first orifice ring 11 is arranged after through hole 1 etching, through hole 1 is 6mil, the first orifice ring 11 is 2mil, certainly, not conduct limits, in other embodiment, the natural ratio 6mil in the aperture of through hole 1 is large, and the first orifice ring 11 is larger than 2mil, the second orifice ring 22 is arranged after blind hole 2 etchings, and this blind hole 2 is set to 3mil in this preferred embodiment, this second orifice ring 22 is set to 1mil, and certainly, in other embodiment, the aperture of blind hole can arrange larger than 3mil, and the ring footpath of the second orifice ring 22 can arrange larger than 1mil.In the preferred embodiment, adopted the setting of four through holes 1 and four blind holes 2, during the alignment system that forms due to this through hole 1 and blind hole 2, according to time outer target boring, form, and the setting in four holes more can approach representative time outer field harmomegathus, make through hole 1, blind hole 2 and dry film location hole in same alignment system, greatly reduce broken the scrapping of wiring board hole, improved the income of enterprise.
The above embodiment has only expressed the preferred embodiment of the present invention, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection range of patent of the present invention should be as the criterion with claims.
Claims (8)
1. the alignment method of a wiring board, is characterized in that, comprises the steps:
Target 101 is set, at described wiring board time outer field four angles, four targets is set;
Punching 102 stamps out four circular holes according to the position of described four targets on the correspondence position of wiring board outer (10);
Drilling blind hole 103 gets out four blind holes (2) by the mode of laser drilling according to the position of described four targets on the correspondence position of wiring board outer (10);
Drill through hole 104, the circular hole stamped out according to described punching 102 steps, get out through hole (1) at its concentric position; Dry film location hole 105 is set, adopts the dry film location hole of described through hole 104 as wiring board outer (10);
Contraposition 106, carry out contraposition by the center of circle of described blind hole (2), through hole (1) and dry film location hole, if its concentric degree meets alignment tolerance, thinks coupling.
2. the alignment method of a kind of wiring board as claimed in claim 1, is characterized in that, described circular hole and through hole (1) are the SP hole.
3. the alignment method of a kind of wiring board as claimed in claim 1, is characterized in that, after described through hole (1) etching, the first orifice ring (11) arranged.
4. the alignment method of a kind of wiring board as claimed in claim 3, is characterized in that, described through hole (1) is at least 6mil.
5. the alignment method of a kind of wiring board as claimed in claim 3, is characterized in that, described the first orifice ring (11) is at least 2mil.
6. the alignment method of a kind of wiring board as claimed in claim 1, is characterized in that, after described blind hole (2) etching, the second orifice ring (22) arranged.
7. the alignment method of a kind of wiring board as claimed in claim 6, is characterized in that, described blind hole (2) is at least 3mil.
8. the alignment method of a kind of wiring board as claimed in claim 6, is characterized in that, described the second orifice ring (22) is 1mil at least.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310453822.0A CN103501579A (en) | 2013-09-29 | 2013-09-29 | Circuit board aligning method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310453822.0A CN103501579A (en) | 2013-09-29 | 2013-09-29 | Circuit board aligning method |
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| CN103501579A true CN103501579A (en) | 2014-01-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310453822.0A Pending CN103501579A (en) | 2013-09-29 | 2013-09-29 | Circuit board aligning method |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106170181A (en) * | 2016-08-31 | 2016-11-30 | 博敏电子股份有限公司 | Hole docking calculation is folded in a kind of wiring board production high-precision laser hole |
| CN106341940A (en) * | 2016-09-29 | 2017-01-18 | 广州兴森快捷电路科技有限公司 | Punching method of circuit board |
| CN104023467B (en) * | 2014-06-11 | 2017-02-01 | 深圳华麟电路技术有限公司 | Multi-layer circuit board with high mechanical hole drilling yield and manufacturing method thereof |
| CN104053300B (en) * | 2014-06-11 | 2017-03-01 | 深圳华麟电路技术有限公司 | The positioning pore structure of soft or hard multilayer circuit board and the establishing method of this location hole |
| CN106739384A (en) * | 2016-12-07 | 2017-05-31 | 苏州维业达触控科技有限公司 | A kind of laminating alignment method of Rotating fields flexibility touch screen |
| CN108811331A (en) * | 2018-06-12 | 2018-11-13 | 昆山大洋电路板有限公司 | A kind of boring method of multilayer number superposition printed wiring board |
| CN108966500A (en) * | 2018-08-07 | 2018-12-07 | 向耀 | The pcb board of view-based access control model tracking is secondary and multiple accurate drilling method |
| CN105491818B (en) * | 2015-11-23 | 2018-12-28 | 广州兴森快捷电路科技有限公司 | High aligning accuracy buries method for manufacturing circuit board |
| CN109561596A (en) * | 2018-10-17 | 2019-04-02 | 欣强电子（清远）有限公司 | A kind of choosingization dry film, the fool proof tooling for selecting allelopathic gloss oil |
| CN110896594A (en) * | 2019-09-30 | 2020-03-20 | 宜兴硅谷电子科技有限公司 | Pin-positioning-free automatic expansion and contraction drilling production method |
| CN112867232A (en) * | 2020-12-31 | 2021-05-28 | 鹤山市世安电子科技有限公司 | High-density integrated circuit board composite target and preparation method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101494954A (en) * | 2009-02-27 | 2009-07-29 | 深圳市五株电路板有限公司 | Control method for laser drilling contraposition accuracy of high-density lamination circuit board |
| JP2010087168A (en) * | 2008-09-30 | 2010-04-15 | Aica Kogyo Co Ltd | Method for manufacturing multilayer printed circuit board |
| CN101959373A (en) * | 2009-07-17 | 2011-01-26 | 北大方正集团有限公司 | Method for improving blind hole alignment of printed circuit board |
| CN102036508A (en) * | 2011-01-05 | 2011-04-27 | 惠州中京电子科技股份有限公司 | Multi-layer HDI circuit board blind hole windowing process |
-
2013
- 2013-09-29 CN CN201310453822.0A patent/CN103501579A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010087168A (en) * | 2008-09-30 | 2010-04-15 | Aica Kogyo Co Ltd | Method for manufacturing multilayer printed circuit board |
| CN101494954A (en) * | 2009-02-27 | 2009-07-29 | 深圳市五株电路板有限公司 | Control method for laser drilling contraposition accuracy of high-density lamination circuit board |
| CN101959373A (en) * | 2009-07-17 | 2011-01-26 | 北大方正集团有限公司 | Method for improving blind hole alignment of printed circuit board |
| CN102036508A (en) * | 2011-01-05 | 2011-04-27 | 惠州中京电子科技股份有限公司 | Multi-layer HDI circuit board blind hole windowing process |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104023467B (en) * | 2014-06-11 | 2017-02-01 | 深圳华麟电路技术有限公司 | Multi-layer circuit board with high mechanical hole drilling yield and manufacturing method thereof |
| CN104053300B (en) * | 2014-06-11 | 2017-03-01 | 深圳华麟电路技术有限公司 | The positioning pore structure of soft or hard multilayer circuit board and the establishing method of this location hole |
| CN105491818B (en) * | 2015-11-23 | 2018-12-28 | 广州兴森快捷电路科技有限公司 | High aligning accuracy buries method for manufacturing circuit board |
| CN106170181A (en) * | 2016-08-31 | 2016-11-30 | 博敏电子股份有限公司 | Hole docking calculation is folded in a kind of wiring board production high-precision laser hole |
| CN106170181B (en) * | 2016-08-31 | 2018-12-21 | 博敏电子股份有限公司 | A kind of wiring board production folded hole interconnection method in high-precision laser hole |
| CN106341940B (en) * | 2016-09-29 | 2019-04-12 | 广州兴森快捷电路科技有限公司 | The hole-punching method of wiring board |
| CN106341940A (en) * | 2016-09-29 | 2017-01-18 | 广州兴森快捷电路科技有限公司 | Punching method of circuit board |
| CN106739384A (en) * | 2016-12-07 | 2017-05-31 | 苏州维业达触控科技有限公司 | A kind of laminating alignment method of Rotating fields flexibility touch screen |
| CN108811331A (en) * | 2018-06-12 | 2018-11-13 | 昆山大洋电路板有限公司 | A kind of boring method of multilayer number superposition printed wiring board |
| CN108966500A (en) * | 2018-08-07 | 2018-12-07 | 向耀 | The pcb board of view-based access control model tracking is secondary and multiple accurate drilling method |
| CN109561596A (en) * | 2018-10-17 | 2019-04-02 | 欣强电子（清远）有限公司 | A kind of choosingization dry film, the fool proof tooling for selecting allelopathic gloss oil |
| CN110896594A (en) * | 2019-09-30 | 2020-03-20 | 宜兴硅谷电子科技有限公司 | Pin-positioning-free automatic expansion and contraction drilling production method |
| CN112867232A (en) * | 2020-12-31 | 2021-05-28 | 鹤山市世安电子科技有限公司 | High-density integrated circuit board composite target and preparation method thereof |
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Application publication date: 20140108 |