CN101909840B - Forming mold, and optical element molding method - Google Patents
Forming mold, and optical element molding method Download PDFInfo
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- CN101909840B CN101909840B CN200880122856.9A CN200880122856A CN101909840B CN 101909840 B CN101909840 B CN 101909840B CN 200880122856 A CN200880122856 A CN 200880122856A CN 101909840 B CN101909840 B CN 101909840B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/1742—Mounting of moulds; Mould supports
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Abstract
This aims to provide a forming mold capable of performing precise positioning easily and retaining a sufficient support strength, and a molding method using the forming mold. A mold body (63) is fixed on a template (61) by urging the mold body (63) to the template (61) through spacers (81 and 82) by means of fixing devices (64 and 65). Thus, the mold body (63) can be centered by preparing the spacers (81 and 82) of various thicknesses thereby to select and use the spacer of a proper thickness. Then, the spacers (81 and 82) are clamped between the mold body (63) and the template (61) so that the support and fixture of the mold body (63) can be stabilized to enhance the precision reliabilities of two molds (41 and 42) and to give sufficient strength to the two molds (41 and 42).
Description
Technical field
The present invention relates to the employed mould of injection mo(u)lding and use the forming method of this mould, particularly relate to a kind of mould and use the optical element forming method of this mould, described mould is applicable to following situation, namely, the die main body of a plurality of mold inserts (going into son) shape is disposed at template, and relatively template is adjusted the position of each die main body respectively.
Background technology
As mold for forming, thereby known have the internal face that makes when keeping mold insert with the mold insert butt to move the mould (referring to Patent Document 1) of regulating the mold insert position.In this mould, the wall inboard of extending is provided with two vertical internal faces meeting at right angles.By the thread spindle of being combined with the wall screw thread, can regulate the distance apart from wall, can eliminate the core shift of the relative template of mold insert.And, after the adjustment, by pressing mold insert, it is pressed over two internal faces, thereby the relative template of mold insert is fixed
Patent documentation 1: Japanese kokai publication hei 5-96580 communique
Summary of the invention
The technical problem that invention will solve
But, in the method for core shift aforesaid, eliminate the relative template of mold insert by thread spindle, be difficult to mold insert is accurately located, can not guarantee sufficient support strength.
And employed other number of components and parts are many except thread spindle, for the complex structure that internal face is moved, therefore make the (of the repeatability repeatedly Zai Now of location) reduce.And because amount of parts is many, when using repeatedly or using for a long time, the degree of abrasion, thermal expansion is difference with each parts, is difficult to realize the stabilisation of moulding resistance.
Therefore, the object of the present invention is to provide a kind of mould and use the forming method of this mould, described mould can carry out accurate in locating simply, can guarantee sufficient support strength.
And, a kind of mould particularly being provided and using the forming method of this mould, described mould is applicable to that the die main body with a plurality of mold insert shapes is disposed at template, and template is adjusted the position of each die main body respectively relatively.
The means of technical solution problem
In order to solve above technical problem, mould of the present invention has following structure: (a) mold insert shape die main body, and it has transfer surface (translocation is write face); (b) template, it has the recess of accommodating die main body; (c) pad removably, it is configured to be sandwiched between die main body and the template; (d) fixture, it makes die main body fix by die main body is pressed over via pad on template.
In described mould, fixture makes die main body be fixed in template by die main body is pressed over via pad on the template, therefore, owing to prepare the pad of multiple different-thickness in advance, increase and decrease the thickness of pad and change to suitable thickness, the position of the relative template of die main body can be adjusted, specifically, the location of die main body can be realized.Thus, can between the fixed half and moving half that has die main body respectively, realize high-precision accent core (Tone core).At this moment, pad is sandwiched between die main body and the template, the support of die main body, fixedly becomes stable, can improve the precision reliability of mould, simultaneously, can make mould have full intensity.
In the concrete embodiment or viewpoint of the present invention, in described mould, pad is along vertically extending at least one planar configuration of land area (type closes ゎ せ face) of relative die main body.At this moment, can realize precision positioning with the land area vertical direction.
In other embodiments of the present invention, die main body has prism (corner post) shape profile, have end face and relative this end face vertically extending a plurality of sides corresponding with land area, be located at mutually perpendicular two sides in a plurality of sides of die main body and be located between two supporting surfaces of recess of template and be inserted with pad respectively.At this moment, utilize the side of the die main body of prism-shaped, can realize the precision positioning of both direction.
In further other embodiments of the present invention, pad is the tabular plate member.At this moment, the contact of the relative die main body of pad and template face, the support of die main body and fixedly become more stable.
In further other embodiments of the present invention, pad has the bar part that contacts with the recess wire of template.Like this, the relative die main body of pad and the contact of template line are easy to be limited to the necessary part of supporting mould main body.
In further other embodiments of the present invention, it is characterized in that pad has abutting part at least one face side, this abutting part than peripheral part outstanding and with template and die main body in a parts butt.In addition, relatively die main body, template fix pad or wait to locate and keep pad by pin by for example screw threads for fastening etc.
In described mould, as the pad that is used for being clipped between die main body and the template, prepare the pad of multiple different-thickness in advance, increase and decrease the thickness of pad and change to suitable thickness, thereby, the position of the relative template of die main body can be adjusted, specifically, the location of die main body can be realized.Thus, can realize having the dynamic model of die main body and the high-precision accent core between the cover half respectively.Here, because at least one face side at pad is provided with the abutting part more outstanding than peripheral part, change, clean, during keeping pad etc., even cause the damage of pad peripheral part because instrument, mould, pad contact with each other, also easy damaged can be not simply and keep the dimensional accuracy of pad for a long time to abutting part.
In further other embodiments of the present invention, in described mould, pad has two connecting hole (Parties Knot holes), these two connecting holes can be realized being connected of another parts in pad and die main body and the template, in at least one face side, abutting part is formed between two connecting holes.Like this, pad is fixed in another parts in die main body and the template via two connecting holes by screw threads for fastening etc., thereby can make maintenance, the fixing-stableization of pad.And, because abutting part is disposed between two connecting holes, abutting part can be formed at more limited zone.Thus, it is stable to guarantee that abutting part supports, and the form accuracy that simultaneously, can keep, manage abutting part accurately is the dimensional accuracy of pad.
In further other embodiments of the present invention, two connecting holes have the fastening carrier of using, and this carrier is formed at the position that is lower than abutting part.Like this, when parts that pad are screwed in die main body and the template, even the nut part also can from connecting hole is outstanding.And because being provided with the fastening carrier of using, the separation property of connecting hole and abutting part, isolation improve, and can prevent from causing the abutting part distortion because of screw threads for fastening.
In further other embodiments of the present invention, between two connecting holes and abutting part, further has the thinner wall section (the thin portion of meat) of groove shape.Like this, improved abutting part and connecting hole separation property, isolation all around, can prevent from causing the abutting part distortion because of screw threads for fastening.
In further other embodiments of the present invention, a surface of pad via abutting part with die main body and template in a parts butt, another surface form smooth and with die main body and template in another parts butt.Like this, pad another parts in another face side stable support die main body and template.
In further other embodiments of the present invention, at least one surface of pad is covered by inorganic material film.
In described mould, as the pad that is used for being clipped between die main body and the template, prepare the pad of multiple different-thickness in advance, increase and decrease is clipped in the thickness of the pad between die main body and the template and selects, changes suitable pad, thereby, die main body can be adjusted with respect to the position of template, specifically, the location of die main body can be realized.Thus, can realize having the dynamic model of die main body and the high-precision accent core between the cover half respectively.Here, because pad is the structure that at least one surface is covered by inorganic material film, can be critically the thickness of pad be made as desirable thickness.By the machining that for example surface of the material that will become pad base material (base material) is comprised cutting, grinds, be processed as thinner slightly than the target thickness that finally will form after, forming inorganic material film and make pad at this base material is target thickness.Here, because the control ratio of inorganic material film thickness is easier to, can stop the generation of defective products, simultaneously, make the processing of base material can improve the productivity of making accurate pad very rapidly.Thus, can obtain having the pad of the multiple different-thickness of being set by precision simply.Thereby, can lay in the accurate pad of quantity abundance simply, can realize the accurate location of die main body, simultaneously, can aspect equipment, realize the simplification of a large amount of production moulding product.
In further other embodiments of the present invention, inorganic material film is formed by the arbitrary material in metal and the metallic compound.Like this, be easy to guarantee the inorganic material film strength, also be easy to carry out film formation process such as evaporation.
In further other embodiments of the present invention, inorganic material film is formed by the carbon element film.Like this, because inorganic material film has higher hardness, wearability, can improve the service life (durability) of pad simply.
In further other embodiments of the present invention, the thickness range of inorganic material film is below the above 2.0 μ m of 0.1 μ m.Because making the thickness of inorganic material film is more than the 0.1 μ m, regulate spacer thickness by inorganic material film and become easily, can reduce the burden of the machining accuracy in the base material manufacturing procedure.On the other hand, because to make the thickness of inorganic material film be below the 2.0 μ m, can prevent that inorganic material film is blocked up and cause base material to deform because of the stress of film.And, can not make film formation time long, can easily guarantee the thickness and precision of inorganic material film.
In further other embodiments of the present invention, the base material that is coated with the pad of inorganic material film is to be formed by the arbitrary material in stainless steel, superhard alloy and the carbon steel.Like this, can keep base material intensity and service life to a certain degree, the thickness adjustment when also making machining becomes easy.
In further other embodiments of the present invention, pad has first and second, and first is plane, second mask has abutting part, only first face is coated with inorganic material film, and first butt also is fixed in die main body separably, and second abutting part is connected to template.Like this, owing between pad and die main body, dispose inorganic material film, damage inorganic material film in the time of can preventing that die main body is installed on template.And, because having abutting part, can keep the dimensional accuracy of pad simply for a long time.
In further other embodiments of the present invention, pad can load and unload with respect to die main body.
Optical element forming method of the present invention is characterised in that, uses aforesaid mould of the present invention to carry out injection mo(u)lding.
In the described forming method, owing to use mould of the present invention to carry out injection mo(u)lding, the result is adjusted in position as the die main body of aforesaid mould of the present invention, can realize having the dynamic model of such die main body and the high-precision accent core between the cover half respectively.Thus, can stably obtain high-precision moulding product.Particularly, by mould of the present invention being applicable to the making of the high NA lens more than the NA0.8, the coma aberration that can easily be inhibited object lens (it is poor that コ マ receives), that satisfy the optical property that requires, the above high NA lens of described NA0.8 for example are can carry out the record of BD (Bru-ray Disc) or the light of regeneration at least and pick up the object lens that (ピ ッ Network ァ ッ プ) installs.This is that the error permissible range of finished product is little, can carry out high-precision accent core by aforesaid mould because such BD is highly sensitive with the core shift of object lens.
The invention effect
According to the present invention, can provide a kind of and can carry out accurate in locating simply, and can guarantee the mould of sufficient support strength and use the forming method of the optical element of this mould.
Description of drawings
Fig. 1 is the front view that the shaped device of the mould that is assembled with first embodiment is described.
Fig. 2 (A) is the end view drawing of mould, and Fig. 2 (B) is the side sectional view of mould.
Fig. 3 is that the explanation pad is with respect to the amplification view of the installation method of die main body.
Fig. 4 is the cutaway view of the variation of explanation pad installation method.
Fig. 5 (A), Fig. 5 (B) are the cutaway views of the variation of explanation gasket shape.
Fig. 6 is the figure of structure of the cover half of explanation second embodiment.
Fig. 7 is the figure of structure of the cover half of explanation the 3rd embodiment.
Fig. 8 (A)～Fig. 8 (C) is the figure of variation of shape of the pad of explanation the 4th embodiment.
Fig. 9 is the figure of variation of shape of the pad of explanation the 4th embodiment.
Figure 10 (A), Figure 10 (B) are end view drawing and the vertical views of variation of shape of the pad of the 4th embodiment.
Figure 11 (A)～Figure 11 (C) is the vertical view of the pad of the 5th embodiment, along the cutaway view of the G-G direction of arrow and along the cutaway view of the H-H direction of arrow.
Figure 12 (A) is the vertical view of the pad of the 6th embodiment, and Figure 12 (B) is the cutaway view along the I-I direction of arrow.
Figure 13 is the cutaway view of variation of the pad of explanation the 6th embodiment shown in Figure 12.
Figure 14 (A) is the vertical view of the pad of the 7th embodiment, and Figure 14 (B) is partial sectional view.
Figure 15 is the figure of variation of the pad of expression the 7th embodiment shown in Figure 14, and Figure 15 (A) is vertical view, and Figure 15 (B) is partial sectional view.
Figure 16 (A)～Figure 16 (C) is the vertical view of the pad of the 8th embodiment, along cutaway view and the back view of the J-J direction of arrow.
Figure 17 (A)～Figure 17 (C) is the vertical view of the pad of the 9th embodiment, along the cutaway view of the G-G direction of arrow and along the cutaway view of the H-H direction of arrow.
Figure 18 (A)～Figure 18 (C) is the figure of each pad production process of explanation the 9th embodiment.
Figure 19 (A)～Figure 19 (C) is the figure that illustrates the manufacture method of the pad kit that is made of a plurality of each pad with the 9th embodiment of a series of thickness from conceptive.
Figure 20 (A)～Figure 20 (C) is the vertical view of the pad of the tenth embodiment, along the cutaway view of the G-G direction of arrow and along the cutaway view of the H-H direction of arrow.
Figure 21 is the figure of the cover half structure of explanation the 11 embodiment.
Description of reference numerals
10 injection machines
11 solid plates
12 moving platens
13 matched moulds plates
15 driven for opening and closing devices
16 injection devices
30 control device
41 cover half
42 dynamic models
61 templates
The 61a host cavity
63 die main bodies
63a, 63b end face
The 63k recess
64,65 fixtures
The 64a pressing plate
The 64b screw element
81,82 pads
83 bolts
85 nut through holes
86 installing holes
100 shaped devices
P21, P22, P23, P24 inner surface
S11, S12, S13, S14 side
The TS transfer surface
The specific embodiment
First embodiment
Below, mould and the localization method to first embodiment of the invention describes with reference to the accompanying drawings.
Fig. 1 is the front view that the shaped device of the mould that is assembled with present embodiment is described.Illustrated shaped device 100 has with lower member: injection mo(u)lding (ejection formation) machine 10, and it is for coming the main part of actual fabrication synthetic resin by injection mo(u)lding; Control device 30, its unified control constitutes the running of the each several part of injection moulding machine 10.
Injection machine 10 has following structure: solid plate 11; Moving platen 12; Matched moulds (type Parties め) plate 13; Driven for opening and closing device 15; Injection (ejaculation) device 16.By dynamic model 42 and cover half 41 being held between solid plate 11 and the moving platen 12 and with two moulds 41,42 matched moulds, injection machine 10 can carry out processing and forming.
By linear guide 15a, moving platen 12 relative solid plates 11 can be supported movably forward and backward.Dynamic model 42 releasably is supported in moving platen 12.In addition, moving platen 12 is assembled with stripper 45.Extruded synthetic resin from dynamic model 42 when this stripper 45 is used for the demoulding and in dynamic model 42, be pressed out to cover half 41 sides.
Matched moulds plate 13 is fixed in the end of bracing frame 14.During matched moulds, matched moulds plate 13 supports moving platen 12 from behind via the power transmissioning part 15d of driven for opening and closing device 15.
Driven for opening and closing device 15 has following structure: linear guide 15a; Power transmissioning part 15d; Driver 15e.Linear guide 15a supports moving platen 12, and can realize that moving platen 12 is smoothly moving back and forth with respect to the advance and retreat direction of solid plate 11.Power transmissioning part 15d accepts to stretch from the driving force of driver 15e.Thus, moving platen 12 is advanced and retreat mobile freely and the template 13 that is involutory approaches or separates, and the result is, can make moving platen 12 and solid plate 11 near each other or separate, and can carry out the matched moulds of cover half 41 and dynamic model 42 or separates.
In addition, control device 30 has following structure etc.: be used for mould 41,42 mold temperature control part; The open and close controlling portion that is used for driven for opening and closing device 15; The injection control part that is used for injection machine 10; The stripper control part that is used for stripper 45.
Fig. 2 (A) is the figure of a part of end face structure of explanation cover half 41 shown in Figure 1, and Fig. 2 (B) is the figure of a part of side sectional structure of explanation cover half 41.
In the template 61, two adjacent smooth inner surface P21, P22 of host cavity 61a are supporting surface, and it props up adjacent side S11, the S12 that stays at die main body 63 respectively via pad 81,82.That is, at least a portion of pad 81,82 surperficial S31, S32 and inner surface P21, the P22 of host cavity 61a fit tightly mutually by clamping force described later.
In this host cavity 61a, be provided with first fixture 64 with inner surface P21 interior surface opposing P23 side, it has pressing plate 64a, screw element 64b, guide 64c.Pressing plate 64a is connected to the side S13 of die main body 63, and with this side S13 to inner surface P21 side pressured (pay gesture).Thus, can between the inner surface P21 of the side of die main body 63 S11 and template 61, accompany pad 81 and realize die main body 63 in the location of AB direction and fixing with suitable clamping force.At this moment, can adapt to the shape of (な ぅ ぅ) side S11, inner surface P21 owing to make pad 81 have suitable elasticity, the flatness of these faces can be very high.In addition, guide 64c is the parts for the level and smooth movement of guiding pressing plate 64a.
The inner surface P24 side of host cavity 61a is provided with second fixture 65, and it has pressing plate 65a, screw element 65b, guide 65c.Pressing plate 65a is connected to the side S14 of die main body 63, and this side S14 is pressured to inner surface P22 side.Thus, can between the inner surface P22 of the side of die main body 63 S12 and template 61, accompany pad 82 and realize die main body 63 in the location of CD direction and fixing with suitable clamping force.At this moment, owing to making pad 82 keep suitable elasticity to adapt to the shape of side S12, inner surface P22, the flatness of these faces can be very high.In addition, guide 65c is the parts for the level and smooth movement of guiding pressing plate 65a.
Die main body 63 is quadrangular or cuboid, and its two ends at described side S11, S12, S13, S14 have a pair of end face 63a, 63b.The end face 63a of front side is the land area of dynamic model 42 shown in Figure 1 relatively, and center side has transfer surface TS, and described transfer surface TS forms die cavity (キ ャ PVC テ ィ).Each side S11, S12, S13, S14 this end face 63a relatively vertically extend.On the other hand, the end face 63a of the relative front side of end face 63b of rear side forms abreast, to fix with the state of the bottom surface P51 butt of the host cavity 61a of template 61.When dynamic model 42 was carried out matched moulds with respect to cover half 41 closures, this bottom surface P51 stoped die main body 63 to move to the EF direction.
Fig. 3 is the cutaway view of the installation method of explanation pad 81,82 relative die main bodies 63.In illustrated example, pad 81, the 82nd utilizes bolt 83 to be fixed in side S11, the S12 of die main body 63.The nut 83a of the bolt 83 after tightening imbeds the large-diameter portion of pad 81,82 bolt hole 85, is lower than side S31, S32 and is disposed at the inboard.The pad 81, the 82nd of this first embodiment, tabular has the thickness of homogeneous.Namely, as shown in Figure 2, when die main body 63 is fixed in template 61, the side S11 of die main body 63 and the inner surface P21 of template 61 are vertical with the AB direction and parallel with CD, EF direction via pad 81, and the side S12 of die main body 63 and the inner surface P22 of template 61 are vertical with the CD direction and parallel with AB, EF direction via pad 82.And then, can change two pads 81,82 by unclamping bolt 83, by the pad 81,82 of preparing multiple different-thickness in advance, and change to suitable thickness by increase and decrease pad 81,82 thickness, can adjust the position of die main body 63 relative templates 61, can transfer core with dynamic model.In addition, preparing in advance by a plurality of for example pads 81,82 thickness difference is the several microns pad kit that the plate member about (μ m) constitutes, from pad kit, select any and replace with the pad 81,82 that is fit to die main body 63, thereby can regulate pad 81,82 thickness freely.Owing to can fine change the thickness of the pad that constitutes aforesaid pad kit, can improve and transfer the core precision.Can engrave mark or the numerical value of its thickness of expression in advance at each pad 81,82.Preferred pad 81,82 material are consistent with the material of die main body 63, can suppress like this because of the different influences such as dislocation that cause of thermal expansion, still also can use the material different with die main body 63.Like this, owing to can utilize pad 81,82 location of realizing die main body 63, the accent core in the time of can reliably and accurately changing die main body 63.And then, when owing to long-time use die main body 63 and need transfer core again the time, can be simple and easy and carry out the such core of accent again operation reliably.
Fig. 4 is the cutaway view of the variation of explanation pad 81,82 installation method.At this moment, pad 81,82 utilizes pin 84 and is installed on side S11, the S12 of die main body 63.Pin 84 can embed the installing hole 86 that is formed at die main body 63, can stop pad 81,82 to move freely.In addition, in illustrated example, pin 84 is located at pad 81,82 sides, but also can be located at die main body 63 sides.
Fig. 5 (A) and Fig. 5 (B) are the cutaway views of the variation of explanation pad 81,82 shapes.At this moment, pad 81, the 82nd has the structure of recess (recess) RE of thickness attenuation in suitable zone.
In addition, more than, to can realizing that simple and reliablely the cover half 41 of the relative positioning of the relative template of die main body is illustrated by aforesaid pad 81,82, dynamic model 42 also can adopt the structure identical with having aforesaid pad 81,82 described cover half 41.Thus, in dynamic model 42, by described pad 81,82, also can realize the relative location of the relative template of die main body.
From above explanation, can learn, at the mould of present embodiment, be in cover half 41 and the dynamic model 42, fixture 64,65 is via pad 81,82 die main body 63 is pressured to template 61, make die main body 63 be fixed in template 61 thus, therefore, by the pad 81,82 of preparing multiple different-thickness in advance, increase and decrease pad 81,82 thickness and change to suitable thickness can be realized the location of die main body 63 relative templates 61.Thereby, can be fixed in the die main body 63 of cover half 41 and be fixed in accent core between the die main body 63 of dynamic model 42.At this moment, pad 81,82 is clipped between die main body 63 and the template 61, and the support of die main body 63, fixing more stable can improve two moulds 41,42 precision reliability, simultaneously, can make two moulds 41,42 keep full intensity.Owing to guarantee the accurate and stable accent core between such mould 41,42, can stably obtain the little optical element of core shift (for example objective lens for optical pickup device).
In addition, fixedly have in template 61 under the situation of a plurality of die main bodies 63, can realize each die main body 63 accurate and stable location, mould 41,42 each several part are transferred core by precision, can stably obtain accurate moulding product such as optical element.
Second embodiment
Below, the mould of second embodiment is described.In addition, the mould of second embodiment is the distortion of first embodiment, and the part of Te Bieshuominging is not identical with first embodiment.
Fig. 6 is the figure of employed cover half 141 structures in the explanation present embodiment.This cover half 141 has single fixture 164, its part between a pair of inner surface P23, the P24 of the non-supporting surface side of template 61.Fixture 164 has pressing plate 64a, screw element 64b, guide 64c.Pressing plate 65a is connected to the side S61 of die main body 63, and this side S61 is namely pressured to inner surface P21 and the inner surface P22 side of supporting surface side to the direction that tilts.Thus, pad 81 is sandwiched between the inner surface P21 of the side S11 of die main body 63 and template 61 and be pressed (give as security and press), can realize die main body 63 in the location of AB direction and fixing; Pad 82 is sandwiched between the inner surface P22 of the side S12 of die main body 63 and template 61 and is pressed, and can realize die main body 63 in the location of CD direction and fixing.
From above explanation, can learn, in the present embodiment, can be by single fixture 164 that two pads 81,82 are fixing in the lump.
The 3rd embodiment
Below, the mould of the 3rd embodiment is described.In addition, the mould of the 3rd embodiment is the distortion of first embodiment, and the part of Te Bieshuominging is not identical with first embodiment.
Fig. 7 is the figure of employed cover half 241 structures in the explanation present embodiment.This cover half 241 has as the fastening first bolt 264b and the second bolt 264d with fixture, the described first bolt 264b and the second bolt 264d be positioned at template 61, as inner surface P21, P22 side in the face of pad 81,82 supporting surface.The first bolt 264b inserts the bolt hole 264f of template 61 and is combined with the screwed hole screw thread of being located at die main body 63, and die main body 63 is fastening in the mode to the inner surface P21 side tractive of AB direction.At this moment, because bolt hole 264f is provided with the gap, allow the position deviation of CD direction.On the other hand, the second bolt 264d inserts the bolt hole 264e of template 61 and is combined with the screwed hole screw thread of being located at die main body 63, and die main body 63 is fastening in the mode to the inner surface P22 side tractive of CD direction.At this moment, because bolt hole 264e is provided with the gap, allow the position deviation of AB direction.
From above explanation, can learn, in the present embodiment, by the simple mechanism that is constituted by bolt 264b, 264d, can be via pad 81,82 with die main body 63 location and be fixed in template 61.
The 4th embodiment
Below, the mould of the 4th embodiment is described.In addition, the mould of the 4th embodiment is the distortion of first embodiment, and the part of Te Bieshuominging is not identical with first embodiment.
Fig. 8 (A) is the figure of the pad 181 of explanation first variation.At this moment, the pad 181 of being located at cover half 41 is that section is the parts of L type, although be single parts, can transfer core and is fixed in AB direction and CD direction die main body 63.In the pad 181, the function of the 181a of first is equivalent to the pad 81 of first embodiment shown in Figure 2, can realize the accent core of AB direction, and the function of second portion 181b is equivalent to pad shown in Figure 2 82, can realize the accent core of CD direction.When using this pad 181, prepare in advance the thickness combination of two parts 181a, 181b different, a fairly large number of pad kit (ス ペ one サ セ ッ ト).
Fig. 8 (B) is the figure of the pad 218 of explanation second variation.At this moment, the pad 281 of being located at cover half 41 is the cylindric bar parts (bar portion material) with circular section, can embed among the recess 63k of the side S11, the S12 that are located at die main body 63 and fixes.Pad 281 is dismantled and assembled, can regulate apart from the height of side S11, S12 by changing pad 281.Like this, because the linear parts at corresponding pad 281 tops contacts with inner surface P21, the P22 of template 61, can realize the high-precision location of AB direction, CD direction.
Fig. 8 (C) is the figure of the pad 318 of explanation the 3rd variation.At this moment, the pad 381 of being located at cover half 41 is the semi-cylindrical bar parts with semi-circular cross-section, can be fixed in side S11, the S12 of die main body 63.Pad 381 is dismantled and assembled, can regulate apart from the height of side S11, S12 by changing pad 381.Like this, because the linear parts at corresponding pad 381 tops contacts with inner surface P21, the P22 of template 61, can realize the hi-Fix of AB direction, CD direction.
Fig. 9 is the figure of the pad 418 of explanation the 4th variation.At this moment, be located at the pad 481 of cover half 41, shown in the vertical view of the end view drawing and 10 (B) of Figure 10 (A), have following structure, namely by connector 481c two semi-cylindrical bar part 481a, 481b are linked.Part such as the connecting portion 481c of this pad 481 side S11, the S12 of die main body 63 is relatively fixed removably.Can regulate apart from the height of side S11, S12 by changing pad 481.Like this, because the linear parts at corresponding bar part 481a, 481b top contacts with inner surface P21, the P22 of template 61, can realize the high-precision location of AB direction, CD direction.
In addition, Fig. 8～pad 181～481 shown in Figure 10 can be replaced Fig. 3～ pad 81,82 shown in Figure 5.
In addition, although the diagram of omission, but shown in Fig. 8 (a), Fig. 8 (b), Fig. 8 (c) and Fig. 9 etc., be not limited to first and second fixture 64,65 shown in Figure 2 via the fastening method of the die main body 63 of pad, also can use fixture shown in Figure 6 164, bolt 264b, 264d etc. shown in Figure 7.And that each pad 181,281,381,481 fixing means are not limited to is shown in Figure 3, utilize the fixing method of bolt 83, also shown in Figure 4, utilize the fixing methods of pin 84 etc.And, in first～the 4th above variation, to have aforesaid pad 181 respectively, 281,381,481 cover half 41 is illustrated, that dynamic model 42 also can adopt is identical with described cover half 41, have each pad 181,281,381 respectively, 481 structure.
The 5th embodiment
Below, the mould of the 5th embodiment is described.In addition, the mould of the 5th embodiment is the distortion of first embodiment, and the part of Te Bieshuominging is not identical with first embodiment.
Figure 11 (A) is pad 81,82 vertical view, and Figure 11 (B) is pad 81,82 the cutaway view of looking along the G-G direction of arrow, and Figure 11 (C) is pad 81,82 the cutaway view of looking along the H-H direction of arrow.Each pad 81,82 has main part 85 and abutting part 81a, 82a.Wherein, main part 85 be formed on abutting part 81a, 82a around, step back and reduce to rear side than surperficial S31, the S32 of abutting part 81a, 81b, and it is fixing with connecting hole 85a, 85b that described main part 85 has a double thread.Bolt B O passes each connecting hole 85a, 85b, and by with suitable torque this bolt B O being screwed into the screwed hole 63c that is formed at die main body 63, the HD of nut portion that can utilize bolt B O is with pad 81,82 fastening.That is, fastening by bolt B O can make pad 81,82 stable and be fixed in side S11, the S12 of die main body 63 with desirable depended on pressure (paying force).In addition, form the fastening carrier 85e that uses around each connecting hole 85a, the 85b, this carrier 85e is positioned at the position of the surperficial 85c that is lower than main part 85.Increase by the internal diameter with connecting hole 85a, 85b, these carriers 85e forms step-like.By these carriers 85e, can make the top ratio of the HD of nut portion be lower than surperficial 85c and be disposed at the inboard, can reduce other parts etc. are caused the possibility of damage.
As shown in Figure 2, when die main body 63 is fixed in template 61, the side S11 of die main body 63 and the inner surface P21 of template 61 are vertical with the AB direction and parallel with CD, EF direction via pad 81, and the side S12 of die main body 63 and the inner surface P22 of template 61 are vertical with the CD direction and parallel with AB, EF direction via pad 82.And then, as shown in figure 11, can change pad 81,82 by unclamping bolt B O, prepare the pad 81,82 of multiple different-thickness in advance, simultaneously, increase and decrease pad 81,82 thickness also change to suitable thickness, can adjust the position of die main body 63 relative templates 61, can realize the accent core of the die main body 63 relative dynamic models 42 of cover half 41 sides.In addition, pad 81, the representative of 82 thickness from surperficial S33, the S34 of main part 85 to the surperficial S31 of abutting part 81a, 82a, the distance of S32.Prepare the pad kit that a plurality of pads set about for number μ m of thickness difference for example form in advance, from this pad kit, select and be replaced by the pad 81,82 that is fit to die main body 63, can regulate the thickness of pad thus freely.Owing to can fine change the pad 81 that constitutes aforesaid pad kit, 82 thickness, can improve and transfer the core precision.Can engrave mark or the numerical value of its thickness of expression in advance at each pad 81,82.Preferred pad 81,82 material are consistent with the material of die main body 63, thereby can suppress because of the different influences such as dislocation that cause of thermal expansion, still also can use the material different with die main body 63.Like this, owing to can utilize pad 81,82 location of realizing die main body 63, the accent core in the time of can reliably and accurately changing die main body 63.And then, when owing to long-time use die main body 63 and need transfer core again the time, also can be simple and easy and carry out the such core of accent again operation reliably.
In the above content, abutting part 81a, 82a shown in Figure 11 (A)～Figure 11 (C) etc. form more side-prominent to one than the peripheral part 85g of main part 85.Thus; when carrying out pad 81,82 replacing, cleaning, keeping etc.; even because of pad 81,82 with instrument contact or pad 81,82 contacts with each other and causes peripheral part 85g damage (for example forming the kick of burr shape); peripheral part 85g works as protecting component or guard block and makes damage be difficult to involve to abutting part 81a, 82a, can keep pad 81,82 dimensional accuracy simply for a long time.And described pad 81,82 abutting part 81a, 82a are formed between two connecting hole 85a, the 85b.Thus, can make pad 81,82 maintenance, fixing-stableization.And described pad 81,82 abutting part 81a, 82a are formed at narrow rectangular area between two connecting hole 85a, the 85b.Thus, the form accuracy that can keep, manage abutting part 81a, 82a accurately is pad 81,82 dimensional accuracy.The words that this point is elaborated, namely, because abutting part 81a, 82a are configured to separate certain distance with connecting hole 85a, 85b, carrier 85e, the separation property of connecting hole 85a, 85b, carrier 85e and abutting part 81a, 82a improves, and can prevent from reliably causing abutting part 81a, 82a distortion because of the influence of screw threads for fastening.And, owing to surperficial S31, the S32 of abutting part 81a, 82a can be defined as suitable area, when measuring pad 81,82 shape, thickness in order to make, to manage, can easily determine the mensuration position, the result is, can improve pad 81,82 fixed precision simply, reliably.And, owing to reduce surperficial S31, the S32 of abutting part 81a, 82a, can not increase manufacturing procedure and improve the flatness of surperficial S31, S32, can make high-precision pad 81,82 simply.
In addition, in the above description, for simply, only the configuration mode to the die main body 63 relative templates 61 of a mold insert shape is illustrated.That is, though diagram is omitted, actual template 61 has two above host cavity 61a, by pad 81,82 and fixture 64,65, fixes die main body 63 adjustable cores that can quantity is corresponding with host cavity 61a.
And, in the above content, cover half 41 is illustrated the pad 81,82 of its abutting part 81a, 82a by having projection, the location that can realize die main body 63 relative templates 61 simple and reliablely.The structure of dynamic model 42 also can be identical with described cover half 41.Thus, for dynamic model 42, also can be by described pad 81,82 location of realizing the relative template of die main body simple and reliablely.
The 6th embodiment
Below, the mould of the 6th embodiment is described.In addition, the mould of the 6th embodiment is the distortion of first embodiment, and the part of Te Bieshuominging is not identical with first embodiment.
Figure 12 (A) is the vertical view of the pad 181 of present embodiment, and Figure 12 (B) is the cutaway view along the I-I direction of arrow of pad 181.
In the pad 181 of present embodiment, abutting part 181a forms more side-prominent to one than the peripheral part 85g of main part 185.Thus, when carrying out the replacing, cleaning, keeping etc. of pad 181, peripheral part 85g works as protecting component or guard block and makes damage be difficult to involve to abutting part 181a, can keep the dimensional accuracy of pad 181 simply for a long time.
Figure 13 is the cutaway view of variation of the pad 181 of explanation the 6th embodiment shown in Figure 12.At this moment, for pad 281, form inclined-plane 285c and replace the surperficial 85c that forms step at peripheral part 85g.Like this, mainly be that the outer edge side of inclined-plane 285c is as protecting component or guard block and work.In addition, the formed angle θ in plane of preferred inclined-plane 285c and abutting part 181a is the small skew of satisfied 135 °＜θ＜180 °.
The 7th embodiment
Below, the mould of the 7th embodiment is described.In addition, the mould of the 7th embodiment is the distortion of first embodiment, and the part of Te Bieshuominging is not identical with first embodiment.
Figure 14 (A) is the vertical view of pad 381, and Figure 14 (B) is the partial sectional view of pad 381.
In the pad 381 of present embodiment, abutting part 381a forms more side-prominent to one than the peripheral part 85g of main part 385.And, in the present embodiment, between abutting part 381a and connecting hole 85a, 85b, form two slot parts 88.By two slot parts 88, improved abutting part 381a and connecting hole 85a, 85b separation property all around, can prevent from reliably causing abutting part 381a distortion because of the influence of screw threads for fastening.
Figure 15 (A) is the vertical view of variation of the pad 381 of explanation the 7th embodiment shown in Figure 14, and Figure 15 (B) is the partial sectional view of the pad of variation.At this moment, pad 481 has the encirclement abutting part 381a slot part 488 as thinner wall section all around.In addition, because main part 385 is thicker around connecting hole 85a, 85b, be located at each connecting hole 85a, 85b fastening carrier 85e that uses all around, not only be configured in the surperficial S31 that is lower than abutting part 381a, the position of S32, and be configured in the position of the surperficial 85c that is lower than main part 385.
The 8th embodiment
Below, the mould of the 8th embodiment is described.In addition, the mould of the 8th embodiment is the distortion of first embodiment, and the part of Te Bieshuominging is not identical with first embodiment.
Figure 16 (A) is the vertical view of pad 581, and Figure 16 (B) is the cutaway view along the J-J direction of arrow of pad 581, and Figure 16 (C) is the back view of pad 581.At this moment, pad 581 has main part 585 and the first abutting part 81a, the second abutting part 581a.Surperficial 585c in the main part 585 around the first abutting part 81a of face side forms surperficial S31, the S32 that is lower than the first abutting part 81a.And the surperficial 585c in the main part 585 around the second abutting part 581a of rear side forms surperficial S33, the S34 that is lower than the second abutting part 581a.In addition, at this moment, main part 585 has a pair of screw threads for fastening connecting hole 85a, 85b, this connecting hole 85a, 85b, across abutting part 81a configuration, side is formed in the second abutting part 581a by a part of removing the second abutting part 581a overleaf in face side.
In addition, Figure 12～pad 181～581 shown in Figure 16 can be replaced pad shown in Figure 11 81,82.
The 9th embodiment
Below, the mould of the 9th embodiment is described.In addition, the mould of the 9th embodiment is the distortion of first embodiment, and the part of Te Bieshuominging is not identical with first embodiment.
Figure 17 (A) is pad 81,82 vertical view, and Figure 17 (B) is pad 81,82 the cutaway view along the G-G direction of arrow, and Figure 17 (C) is pad 81,82 the cutaway view along the H-H direction of arrow.
Each pad 81, the 82nd is that base material 81a, the 82a of rectangular plate-like forms by integral body, in the face of the surface coverage of die main body 63 sides has very thin uniform inorganic material film 93.Here, inorganic material film 93 for critically adjust pad 81,82 thickness is established, detailed content is narrated subsequently.And tabular base material 81a, 82a has abutting part 81b, 82b and main part 81c, 82c, and described abutting part 81b, 82b are overshooting shape, and described main part 81c, 82c support abutting part 81b, 82b from behind.Under the state that pad 81,82 is assembled as shown in Figure 2, surperficial S31, the S32 of abutting part 81b, the 82b of one side side fit tightly in template 61 sides, and surperficial S33, the S34 of the inorganic material film 93 of main body covered part 81c, the 82c of another side fits tightly in die main body 63 sides.Here, the rectangular box-like surperficial 85c that exposes around base material 81a, the 82a forms, specific surface S31, S32 are that surperficial S33, S34 side are stepped back and be lower than surperficial S31, S32 to dorsal part more, shown in Figure 17 (A), abutting part 81b, 82b overlook size than the little circle of size of main part 81c, 82c.
As shown in Figure 2, when die main body 63 is fixed in template 61, the side S11 of die main body 63 and the inner surface P21 of template 61 are vertical with the AB direction and parallel with CD, EF direction via pad 81, and the side S12 of die main body 63 and the inner surface P22 of template 61 are vertical with the CD direction and parallel with AB, EF direction via pad 82.And then, can change pad 81,82 by unclamping bolt B O, owing to prepare the pad 81,82 of multiple different-thickness in advance, simultaneously, change to suitable thickness by increase and decrease pad 81,82 thickness, the position of die main body 63 relative templates 61 can be adjusted, the accent core of the die main body 63 relative dynamic models 42 of cover half 41 sides can be realized.In addition, pad 81, the representative of 82 thickness from surperficial S33, the S34 of main part 81c, 82c to the surperficial S31 of abutting part 81b, 82b, the distance of S32.Prepare pad kit in advance, it is a plurality of pads about a few tenths of μ m～a few tenths of ten μ m that its set has thickness difference for example, from this pad kit, select to be fit to the pad 81,82 and replace of die main body 63, can to regulate the thickness of pad thus freely.Owing to can fine change the pad 81 that constitutes aforesaid pad kit, 82 thickness, can improve and transfer the core precision.Can engrave mark or the numerical value of its thickness of expression in advance at each pad 81,82.Like this, owing to can utilize pad 81,82 location of realizing die main body 63, the accent core in the time of can reliably and accurately changing die main body 63.And, when owing to long-time use die main body 63 and need transfer core again the time, also can be simple and easy and carry out the such core of accent again operation reliably.
Figure 18 is the figure of the manufacture method of explanation pad 81 shown in Figure 17.At first, shown in Figure 18 (A), prepare the plate member 92 as the blank (unit) of pad 81.This plate 92 is that thickness is greater than the flat board of target thickness of slab.This plate 92 is to be formed by stainless steel (for example SUS420), carbon steel (for example S45C), superhard alloy etc.Wherein, carbon steel is softer and be processed into target shape easily.And superhard alloy hardness is high and be difficult for processing, but can critically control thickness through cutting progressively.As Figure 18 (B) shown in, by the machining that comprises cutting, grind, remove the superficial layer 92a of plate 92 and form as the processing of base material 81a dull and stereotyped 92b thereafter.This is processed dull and stereotyped 92b and has the high surperficial 92c of flatness and back side 92d, and its thickness t p is thinner slightly than final goal thickness, allows the error of prescribed limit.Here, can finish the processing of the dull and stereotyped 92b of processing by cutting at one time and leveling operation, but usually, preferred limit monitors the thickness t p of the dull and stereotyped 92b of processing, repeatedly cut and the leveling operation on the limit.Use contact, all thickness sensor such as contactless to measure the thickness t p of the dull and stereotyped 92b of processing.In addition, processing can be processed the abutting part 81b of overshooting shape during the 92d of the back side together, and like this, back side 92d becomes the surperficial S31 with the inner surface P21 butt of template 61.Then, shown in Figure 18 (C), by forming inorganic material film 93, on the surperficial 92c formation of the dull and stereotyped 92b of processing and the surface 33 of the side S11 butt of die main body 63.Thus, can access the pad 81 that is coated with inorganic material film 93 in the one side of base material 81a.This pad 81 has following structure: the first face portion 81u, and it is disposed at an interarea side (upside of drawing) of pad 81 and has inorganic material film 93; The second face portion 81s, it is disposed at another interarea side (downside of drawing) of pad 81 and has abutting part 81b; Mid portion 81t, it is sandwiched between the first face portion 81u and the second face portion 81s.As the filmogen of the inorganic material film 93 that is used to form the first face portion 81u, can use for example metal, metallic compound, carbon film etc.As the metal filmogen, can use titanium, chromium etc., to use under the situation of chromium, the hardness, particularly plate member 92 that can improve inorganic material film 93 are under the stainless situation, thermal coefficient of expansion is close, prevents that the effect that inorganic material film 93 comes off from improving.In addition, as the metallic compound filmogen, can use for example titanium nitride etc.And as the carbon element film of filmogen, diamond-like-carbon (ダ ィ ャ モ Application De ラ ィ Network カ one ボ Application) specifically is because the hardness height of diamond-like-carbon is easy to keep dimensional accuracy, not the advantage of easy damaged.Above film forming can be undertaken by PVD such as vacuum evaporation, sputter (physical vapour deposition (PVD)) method, also can be undertaken by CVD (chemical vapour deposition (CVD)) method.Through after the above film formation process, the thickness summation tf that processes dull and stereotyped 92b and inorganic material film 93 equals final goal thickness, and in the desired error allowed band of pad 81 finished products.That is, the thickness of inorganic material film 93 equals the value that final goal thickness t f deducts the thickness t p gained of measuring before the film forming.In addition, for example by the PVD method, when the CVD method is carried out film forming, come the thickness of inorganic material film 93 is controlled by adjusting film formation time.And, by changing the film forming amount in the unit interval, also can adjust the thickness of inorganic material film 93.
In addition, for the material of pad 81,82 base material 81a, be not only to consider that the machining difficulty gets final product, also need to consider and die main body 63 matchings (phasic property).For example, the thermal coefficient of expansion of the thermal coefficient of expansion of preferred substrates 81a and die main body 63 is close, thereby, can suppress the different and dislocation that causes of thermal expansion.And, more than be the manufacture method of a pad 81, another pad 82 also can use the same method to make.
Figure 19 is the diagram that illustrates the manufacture method of the pad kit that is made of a plurality of pads with a series of thickness from conceptive.Figure 19 (A) is the diagram that the manufacture method of the thinnest shim pack (a group 5) is described.At this moment, the plate 92 of Figure 19 (A) is cut and obtain processing dull and stereotyped 92b, its thickness is between lower thickness T1a and upper thickness T1b.At this moment, the value Δ is as the tolerance of the thickness of machining and be set, though comparatively loose to the required precision of thickness, the required precision of flatness is not loosened.Process the final thickness of dull and stereotyped 92b and namely process thickness T 10, be equivalent to the thickness t p shown in Figure 18 (B).In operation thereafter, dull and stereotyped 92b forms for example inorganic material film 93 of thickness T11 in processing.The result is, the thickness of pad 81 (the thickness t f that is equivalent to Figure 18 (C)) is T10+T11, and this value is as the minimum of a value of described shim pack and be set at first.Thickness T12, the T13, T14, the T15 that are set in the inorganic material film 93 in the same shim pack are set as 4 grades, and every grade increase is 0.5 μ m for example.The result is, the thickness of pad 81 becomes 5 grades, namely, T10+T11, T10+T12, T10+T13, T10+T14, T10+T15, for example, if minimum of a value (T10+T11)=3mm then can be that 5 pads of 3.0000mm, 3.0005mm, 3.0010mm, 3.0015mm, 3.0020mm are supporting with thickness.
In addition, in the above description, for the processing thickness T 10 that simply makes the dull and stereotyped 92b of processing equates, but it is not waited, at this moment, set each thickness T12, T13, T14, T15 respectively with the deviation between the part of compensation processing thickness T 10.
Figure 19 (B) is the figure of the manufacture method of the thicker shim pack of next group thickness of explanation.At this moment, carry out machining and obtain processing dull and stereotyped 92b, its thickness is between lower thickness T2a and upper thickness T2b.The final thickness of processing dull and stereotyped 92b is namely processed thickness T 20 and is equivalent to the thickness t p shown in Figure 18 (B).On 5 dull and stereotyped 92b of processing, form the inorganic material film 93 that thickness is T21, T22, T23, T24, T25 individually respectively.The result is, the thickness of pad 81 that is equivalent to the thickness t f of Figure 18 (C) is set as 5 grades of T20+T21, T20+T22, T20+T23, T20+T24, T20+T25, and every grade increases by 0.5 μ m.The result is, the concrete thickness of 5 supporting pads 81 is, for example, and 3.0050mm, 3.0055mm, 3.0060mm, 3.0065mm, 3.0070mm.More than, for the processing thickness T 20 that simply makes the dull and stereotyped 92b of processing all equates, but it is not waited, at this moment, set each thickness T21, T22, T23, T24, T25 respectively with deviation between the part of compensation processing thickness T 20.
Figure 19 (C) is the figure of the manufacture method of the thicker shim pack of next group thickness of explanation.At this moment, carry out machining and obtain processing dull and stereotyped 92b, its thickness is between lower thickness T3a and upper thickness T3b.The final thickness of processing dull and stereotyped 92b is namely processed thickness T 30 and is equivalent to the thickness t p shown in Figure 18 (B).On 5 dull and stereotyped 92b of processing, form the inorganic material film 93 that thickness is T31, T32, T33, T34, T35 respectively.The result is, the thickness of pad 81 that is equivalent to the thickness t f of Figure 18 (C) is set as 5 grades of T30+T31, T30+T32, T30+T33, T30+T34, T30+T35, and every grade increases by 0.5 μ m.The result is, the concrete thickness of 5 supporting pads 81 is, for example, and 3.0100mm, 3.0105mm, 3.0110mm, 3.0115mm, 3.0120mm.More than, for the processing thickness T 30 that simply makes the dull and stereotyped 92b of processing all equates, but it is not waited, at this moment, set each thickness T31, T32, T33, T34, T35 respectively with deviation between the parts of compensation processing thickness T 30.
Though below omit, in order to last method a plurality of shim pack are laid in as pad kit, can access the very wide thickness of scope, can utilize pad 81,82 very critically die main body 63 to be positioned.In addition, there is no need indivedual each pad 81,82 that constitutes above each shim pack of making, can form a plurality of inorganic material films 93 that thickness for example equates or approaches simultaneously, at this moment, utilize mask etc. can carry out the fine setting of film formation time alternately.And the thickness of inorganic material film 93 is not limited to 5 grades, can be made as various grades.But in the practical application, the thickness of inorganic material film 93 preferably sets more than 0.1 μ m in the scope below the 2.0 μ m.
Get back to Figure 17 (A)～Figure 17 (C), be located at pad 81,82 abutting part 81a, 82a form more side-prominent to one than the peripheral part 85g of main part 81c, 82c.Thus; when carrying out pad 81,82 replacing, cleaning, keeping etc.; even because pad 81,82 contacts with instrument or pad 81,82 contacts with each other and causes peripheral part 85g damage (for example forming the kick of burr shape); peripheral part 85g works as protecting component or guard block and makes damage be difficult to involve to abutting part 81b, 82b, can keep pad 81,82 dimensional accuracy simply for a long time.
In addition, in the above description, for the simple and only configuration mode to the die main body 63 relative templates 61 of a mold insert shape is illustrated.That is, though diagram is omitted, actual template 61 has two above host cavity 61a, utilizes pad 81,82 and fixture 64,65, fixes respectively die main body 63 adjustable cores that number is corresponding with host cavity 61a.
And, more than cover half 41 is illustrated the pad 81,82 of its abutting part 81b, 82b by having projection, the location that can realize die main body 63 relative templates 61 simple and reliablely.The structure of dynamic model 42 also can be identical with described cover half 41.Thus, by described pad 81,82, for dynamic model 42, also can realize the location of the relative template of die main body simple and reliablely.
Can learn that from above explanation according to the pad 81,82 of present embodiment, the surface of one side is covered by inorganic material film 93, the material of the material of this inorganic material film 93 and pad 81,82 base material 81a, 82a is different.Therefore, since thinner base material 81a, the 82a of processing form have thickness for the inorganic material film 93 of poor (difference) of target thickness, can realize target thickness tf, make the processing of base material 81a, 82a can improve the pad 81 of making precision, 82 efficient and operation very rapidly.Thus, can obtain having the pad 81,82 of the multiple thickness of being set by precision simply, be pad kit owing to can lay in the pad 81,82 of the precision of quantity abundance simply, can realize the accurate in locating of die main body 63.
The tenth embodiment
Below, the mould of the tenth embodiment is described.In addition, the mould of the tenth embodiment is the distortion of first embodiment, and the part of Te Bieshuominging is not identical with first embodiment.
Figure 20 (A) is the vertical view of pad 181, and Figure 20 (B) is the cutaway view along the G-G direction of arrow of pad 181, and Figure 11 (C) is the cutaway view along the H-H direction of arrow of pad 181.This pad 181 can be replaced the pad 81,82 shown in Figure 17 (A)～Figure 17 (C).
Identical with the situation of the 9th embodiment, above pad 181 is also by the operation manufacturing shown in Figure 18 (A)～Figure 18 (C).That is, in the tenth embodiment also be, utilize inorganic material film 93 that the thickness of pad 181 is adjusted into desirable value, make the processing of base material 81a can improve efficient and the operation of making accurate pad 181 very rapidly.Thus, can obtain pad 181 simply, it has the multiple different-thickness of being set by precision, owing to can lay in the pad 181 of the precision of quantity abundance simply, can realize the accurate in locating of die main body 63.
In addition, in the pad 181 of present embodiment, abutting part 181b is formed at narrow rectangular area between two connecting hole 85a, the 85b.Thus, the form accuracy that can keep, manage abutting part 181b accurately is the dimensional accuracy of pad 181.Words to this some detailed description, namely, make abutting part 181b be configured to separate certain distance with connecting hole 85a, 85b, carrier 85e, make the separation property of connecting hole 85a, 85b, carrier 85e and abutting part 181b improve, can prevent from reliably causing abutting part 181b distortion because of the influence of screw threads for fastening.And, because the surperficial S31 of abutting part 181b is defined in suitable area, when the shape of measuring pad 181 in order to make, to manage, thickness, determine easily to measure the position, consequently can improve the fixed precision of pad 181 simply, reliably.And, owing to reduced the surperficial S31 of abutting part 181b, can not increase manufacturing procedure and improve the flatness of surperficial S31, can make high-precision pad 181 simply.
The 11 embodiment
Below, the mould of the 11 embodiment is described.In addition, the mould of the 11 embodiment is the distortion of first embodiment, and the part of Te Bieshuominging is not identical with first embodiment.
Figure 21 is the figure that the structure of the cover half 241 that uses in the present embodiment is described.In template 261, this cover half 241 has two adjacent host cavity 61a.And corresponding each host cavity 61a has single fixture 264, its part between a pair of inner surface P23, the P24 of the non-supporting surface side of template 261.Each fixture 264 has pressing plate 64a, screw element 64b, guide 64c.Pressing plate 64a is connected to the side S61 of die main body 63 and this side S61 is namely pressured to inner surface P21 and the inner surface P22 side of supporting surface side to the direction that tilts.Thus, pad 81 is sandwiched between the inner surface P21 of the side S11 of die main body 63 and template 61 and is pressed, and can realize die main body 63 in the location of AB direction and fixing; Pad 82 is sandwiched between the inner surface P22 of the side S12 of die main body 63 and template 61 and is pressed, and can realize die main body 63 in the location of CD direction and fixing.
Present embodiment, in each host cavity 61a, can be by single fixture 264 pressured two pads 81,82 die main body 63 is fixing in the lump.
Suitably select illustrated pad in the above embodiment, it is applicable to mould, described mould is assembled into injection moulding machine, when manufacturing BD uses object lens, the lens with desired optical property of the coma that can be inhibited reliably.
And inorganic material film 93 and the nonessential main part 81c of base material 81a, 82a, the surface of 82c side of being formed at also can be formed at the surface of abutting part 81b, 82b, 181b side, even, also can be formed at two surfaces of base material 81a, 82a.
In addition, abutting part is formed at pad illustrated in the above embodiment, and its profile is not limited to rectangle, also various profiles such as ellipse.At this moment, the number of being located at the abutting part of each pad also is not limited to one, also more than two.
And pad discussed above, and nonessential die main body 63 sides that are fixed in also can be fixed in template 61 sides.
And illustrated fixture is a kind of illustration in the described embodiment, also can be by between the internal face of die main body 63 and template 61, inserting wedge-shaped bushings pressured die main body 63 and being fixed.
And, in said embodiment, expressed the embodiment that can adjust the position at vertical both direction, described embodiment also can be applicable to the mould of only adjusting the position in one direction.
And, also nonessential orthogonal as inner surface P21, the P22 of the supporting surface of being located at host cavity 61a in template 61,261, also can intersect suitable acute angle or obtuse angle.
Claims (18)
1. a mould is characterized in that, has following structure:
Mold insert shape die main body, it has transfer surface;
Template, it has the recess of accommodating described die main body;
Pad removably, it is configured to be sandwiched between described die main body and the described template;
Fixture, it makes described die main body fix by described die main body is pressed over via described pad on described template;
At least one surface of described pad is covered by inorganic material film.
2. mould according to claim 1 is characterized in that, described pad is along vertically extending at least one planar configuration of land area of described relatively die main body.
3. mould according to claim 2 is characterized in that,
Described die main body has the prism-shaped profile, has end face and the relative described end face vertically extending a plurality of sides corresponding with described land area,
Mutually perpendicular two sides and being located between two supporting surfaces of described recess of described template in being located at a plurality of described side of described die main body are inserted with described pad respectively.
4. according to claim 1 each described mould to the claim 3, it is characterized in that described pad is the tabular plate member.
5. according to claim 1 each described mould to the claim 3, it is characterized in that described pad has the bar part that is connected with the described recess wire of described template.
6. according to claim 1 each described mould to the claim 3, it is characterized in that, described pad has abutting part at least one face side, this abutting part than peripheral part outstanding and with described template and described die main body in a parts butt.
7. mould according to claim 6 is characterized in that, described pad has two connecting holes, and these two connecting holes can be realized being connected of another parts in described pad and described die main body and the described template,
In described at least one face side, described abutting part is formed between described two connecting holes.
8. mould according to claim 7 is characterized in that, described two connecting holes have the fastening carrier of using, and this carrier is formed at the position that is lower than described abutting part.
9. mould according to claim 7 is characterized in that, further has the thinner wall section of groove shape between described two connecting holes and described abutting part.
10. mould according to claim 8 is characterized in that, further has the thinner wall section of groove shape between described two connecting holes and described abutting part.
11. mould according to claim 6, it is characterized in that, a described surface of described pad is via the described parts butt in described abutting part and described template and the described die main body, another surface of described pad form smooth and with described template and described die main body in described another parts butt.
12. mould according to claim 1 is characterized in that, described inorganic material film is formed by any material in metal and the metallic compound.
13. mould according to claim 1 is characterized in that, described inorganic material film is formed by the carbon element film.
14., it is characterized in that the thickness of described inorganic material film is below the above 2.0 μ m of 0.1 μ m according to each described mould in claim 1, claim 12, the claim 13.
15., it is characterized in that the base material of the described pad that is covered by described inorganic material film is to be formed by any material in stainless steel, superhard alloy and the carbon steel according to each described mould in claim 1, claim 12, the claim 13.
16. according to each described mould in claim 1, claim 12, the claim 13, it is characterized in that, described pad has first and second, described first is plane, described second mask has abutting part, only described first face is coated with described inorganic material film, and described first butt also is fixed in described die main body separably, and described second described abutting part is connected to described template.
17. according to claim 1 each described mould to claim 3, claim 12, the claim 13, it is characterized in that the described relatively die main body of described pad can load and unload.
18. an optical element forming method is characterized in that, right to use require 1 to the claim 17 each described mould and carry out injection mo(u)lding.
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP339879/07 | 2007-12-28 | ||
| JP2007339879 | 2007-12-28 | ||
| JP2008049883 | 2008-02-29 | ||
| JP049883/08 | 2008-02-29 | ||
| JP088497/08 | 2008-03-28 | ||
| JP2008088497 | 2008-03-28 | ||
| PCT/JP2008/072759 WO2009084414A1 (en) | 2007-12-28 | 2008-12-15 | Forming mold, and optical element molding method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101909840A CN101909840A (en) | 2010-12-08 |
| CN101909840B true CN101909840B (en) | 2013-08-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200880122856.9A Expired - Fee Related CN101909840B (en) | 2007-12-28 | 2008-12-15 | Forming mold, and optical element molding method |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2009084414A1 (en) |
| CN (1) | CN101909840B (en) |
| WO (1) | WO2009084414A1 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011122201A1 (en) * | 2010-03-31 | 2011-10-06 | コニカミノルタオプト株式会社 | Molding die and method for manufacturing optical element |
| US20140084502A1 (en) * | 2011-05-26 | 2014-03-27 | Konica Minolta, Inc. | Method for producing wafer lens, device for producing wafer lens, and method for producing optical element |
| JP5255133B2 (en) * | 2012-01-20 | 2013-08-07 | ファナック株式会社 | Injection molding machine having a mold mounting position adjusting mechanism |
| JP5681235B2 (en) * | 2013-06-05 | 2015-03-04 | ファナック株式会社 | Molding device for injection molding machine |
| CN104260286B (en) * | 2014-09-26 | 2016-07-20 | 中山联合光电科技有限公司 | A kind of plastic cement optical lens die structure of adjustable core shift |
| CN105058721A (en) * | 2015-08-11 | 2015-11-18 | 苏州市博奥塑胶电子有限公司 | Mold |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1170476A (en) * | 1994-10-19 | 1998-01-14 | 艾利森电话股份有限公司 | Injection of encapsulating material on optocomponent |
| CN101003158A (en) * | 2006-01-18 | 2007-07-25 | 鸿富锦精密工业（深圳）有限公司 | Forming die for optical element |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5944978B2 (en) * | 1979-07-03 | 1984-11-02 | トヨタ自動車株式会社 | Injection mold insert positioning method |
| JPS60245512A (en) * | 1984-05-21 | 1985-12-05 | Nissei Plastics Ind Co | Molding die |
| JPH0733041B2 (en) * | 1989-03-02 | 1995-04-12 | 日精樹脂工業株式会社 | Nesting mold and mounting method |
| JPH0596580A (en) * | 1991-10-04 | 1993-04-20 | Olympus Optical Co Ltd | Mold for molding plastic lens |
| JP3189347B2 (en) * | 1991-12-24 | 2001-07-16 | 住友電気工業株式会社 | Resin mold, resin mold manufacturing method, and resin molding method |
| JP4142485B2 (en) * | 2003-04-17 | 2008-09-03 | オリンパス株式会社 | Mold equipment |
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2008
- 2008-12-15 JP JP2009547982A patent/JPWO2009084414A1/en not_active Withdrawn
- 2008-12-15 WO PCT/JP2008/072759 patent/WO2009084414A1/en active Application Filing
- 2008-12-15 CN CN200880122856.9A patent/CN101909840B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1170476A (en) * | 1994-10-19 | 1998-01-14 | 艾利森电话股份有限公司 | Injection of encapsulating material on optocomponent |
| CN101003158A (en) * | 2006-01-18 | 2007-07-25 | 鸿富锦精密工业（深圳）有限公司 | Forming die for optical element |
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| Title |
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| JP平2-229020A 1990.09.11 |
| JP特开2004-314464A 2004.11.11 |
| JP特开平5-96580A 1993.04.20 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2009084414A1 (en) | 2009-07-09 |
| CN101909840A (en) | 2010-12-08 |
| JPWO2009084414A1 (en) | 2011-05-19 |
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