CN101888764B - 气流导罩及使用该气流导罩的电子装置 - Google Patents

气流导罩及使用该气流导罩的电子装置 Download PDF

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CN101888764B
CN101888764B CN200910302339.6A CN200910302339A CN101888764B CN 101888764 B CN101888764 B CN 101888764B CN 200910302339 A CN200910302339 A CN 200910302339A CN 101888764 B CN101888764 B CN 101888764B
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CN101888764A (zh
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官志彬
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Taizhou Wisdom Software Park Co Ltd
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Priority to US12/626,576 priority patent/US8077458B2/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718—Forced ventilation of a gaseous coolant
    • H05K7/20727—Forced ventilation of a gaseous coolant within server blades for removing heat from heat source
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structures Of Non-Positive Displacement Pumps (AREA)

Abstract

一种电子装置，包括一基座、装设于所述基座内的至少一风扇、一设置有至少一电子元件的主板及一气流导罩，所述气流导罩包括一顶板及两支撑所述顶板的挡板，所述顶板与所述两挡板之间形成一具有两开口端的气流通道，所述电子元件收容于所述气流通道内，所述气流通道的一开口端正对所述风扇，所述气流导罩的顶板邻近所述正对风扇的开口端设有若干通孔，用以降低噪音。

Description

气流导罩及使用该气流导罩的电子装置
技术领域
本发明是关于一种气流导罩及使用该气流导罩的电子装置。
背景技术
电子装置，如电脑等，为了满足散热需要，通常在发热电子元件上装设一气流导罩，使该气流导罩的出风口一端正对一风扇，通过该风扇与气流导罩的配合可将电子元件产生的热量集中快速的排出电子装置。然而，风扇叶片转动时，电子装置内的气流压力梯度会发生剧烈变化，从而产生气动噪音。如果气流导罩设计不良，将导致电子装置内气动噪音明显。
发明内容
鉴于以上，有必要提供一种可减小气动噪音的气流导罩及使用该气流导罩的电子装置。
一种气流导罩，包括一顶板及两垂直于所述顶板向下延伸的挡板，所述顶板与所述两挡板之间形成一具有两开口端的气流通道，所述顶板邻近一开口端设有若干贯穿该顶板上表面与下表面的通孔。
一种电子装置，包括一基座、装设于所述基座内的至少一风扇、一设置有至少一电子元件的主板及一气流导罩，所述气流导罩包括一顶板及两支撑所述顶板的挡板，所述顶板与所述两挡板之间形成一具有两开口端的气流通道，所述电子元件收容于所述气流通道内，所述气流通道的一开口端正对所述风扇，所述气流导罩的顶板邻近所述正对风扇的开口端设有若干贯穿该顶板上表面与下表面的通孔。
相较现有技术，上述气流导罩及电子装置，通过在气流导罩设置通孔，可减小***内的气流压力梯度的变化，从而可以降低气动噪音。
附图说明
图1是本发明电子装置第一实施方式的立体分解图。
图2是图1的立体组装图。
图3是本发明电子装置第二实施方式的立体组装图。
具体实施方式
请参照图1与图2，为本发明电子装置的第一实施方式。该第一实施方式中的电子装置10包括一基座12、一主板13、若干风扇151及一气流导罩20。该基座12设有一底板121及两相对的侧板123，该基座12的两相对端于所述两侧板123之间分别形成一进风口124与一出风口125。该主板13装设于该底板121上，该主板13上装设有若干电子元件134。这些风扇151组成一风扇组15，并排设置于该底板121邻近出风口125处，用于将该主板13上的电子元件134发出的热量抽出至该电子装置10外。该气流导罩20可装设于该主板13上，该气流导罩20包括一顶板21及两垂直于该顶板21向下延伸的挡板22。该顶板21与所述两挡板22之间形成一具有两开口端的气流通道23。该顶板21邻近一开口端设有若干减音区24，每一减音区24设有若干呈阵列排列的贯穿该顶板上表面与下表面的通孔241。这些减音区24间隔排列，分别对应该基座12的这些风扇151。
将该气流导罩20装设于该主板13上时，该主板13上的电子元件134收容于该气流导罩20的气流通道23内，该气流导罩20的设有减音区24的开口端正对该基座12上的这些风扇151，且该顶板21上的这些减音区24分别正对这些风扇151的上方。该气流导罩20的两挡板22分别位于该风扇组15的两侧，这些风扇151可将该气流导罩20的气流通道23内的热量抽出。
该电子装置10工作时，该风扇组15的这些风扇151运转，将该气流导罩20的气流通道23内的热量抽出，以给该主板13上的这些电子元件134散热。该电子装置10的气流压力梯度发生变化，尤其是在该气流导罩20靠近这些风扇151的位置气流压力梯度变化最大。此时，该气流导罩20顶板21上的这些减音区24的通孔241可以将气流通道23内的气流部分释放到气流导罩20外，以减小气流压力梯度的变化，从而可以降低气动噪音。
请参照图3，为本发明电子装置的第二实施方式。该第二实施方式中的电子装置40包括一底板421、两侧板423、一主板43、由若干风扇451组成的一风扇组45及一气流导罩30。其中，该底板421、两侧板423、主板43及由若干风扇451组成的风扇组45的结构与第一实施方式中的对应元件的结构相同。该气流导罩30的结构与第一实施方式中的气流导罩20的结构基本相同，包括一顶板31及两垂直于该顶板31向下延伸的挡板32。区别在于，该顶板31邻近该底板421上的这些风扇451设置一连续的减音区34，该减音区34正对这些风扇451的上方设有若干呈阵列排列的贯穿该顶板上表面与下表面的通孔341。

Claims (6)

1.一种气流导罩，包括一顶板及两垂直于所述顶板向下延伸的挡板，所述顶板与所述两挡板之间形成一具有两开口端的气流通道，其特征在于：所述顶板邻近一开口端设有若干贯穿该顶板上表面与下表面的通孔。
2.如权利要求1所述的气流导罩，其特征在于：所述若干通孔呈阵列排列，并形成若干间隔的减音区。
3.一种电子装置，包括一基座、装设于所述基座内的至少一风扇、一设置有至少一电子元件的主板及一气流导罩，所述气流导罩包括一顶板及两支撑所述顶板的挡板，所述顶板与所述两挡板之间形成一具有两开口端的气流通道，所述电子元件收容于所述气流通道内，所述气流通道的一开口端正对所述风扇，其特征在于：所述气流导罩的顶板邻近所述正对风扇的开口端设有若干贯穿该顶板上表面与下表面的通孔。
4.如权利要求3所述的电子装置，其特征在于：所述风扇有若干个，所述气流导罩的顶板上的通孔分别对应所述若干个风扇形成若干间隔的减音区。
5.如权利要求4所述的电子装置，其特征在于：所述减音区分别正对所述若干风扇的上方。
6.如权利要求3至5中任意一项所述的电子装置，其特征在于：所述基座设有一出风口，所述风扇装设于所述基座邻近所述出风口处，用于向所述基座外抽风。
CN200910302339.6A 2009-05-15 2009-05-15 气流导罩及使用该气流导罩的电子装置 Active CN101888764B (zh)

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US12/626,576 US8077458B2 (en) 2009-05-15 2009-11-25 Airflow guiding cover and electronic device having the same

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CN101888764A (zh) 2010-11-17
US8077458B2 (en) 2011-12-13

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