CN101887861B - Chip packaging mould - Google Patents
Chip packaging mould Download PDFInfo
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- CN101887861B CN101887861B CN2010102067347A CN201010206734A CN101887861B CN 101887861 B CN101887861 B CN 101887861B CN 2010102067347 A CN2010102067347 A CN 2010102067347A CN 201010206734 A CN201010206734 A CN 201010206734A CN 101887861 B CN101887861 B CN 101887861B
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Abstract
The invention discloses a chip packaging mould comprising a first mould and a second mould, wherein the second mould and the first mould are oppositely arranged; the second mould is provided with a plurality of glue injection units; each glue injection unit at least comprises a first glue injection unit and a second glue injection unit, wherein the volume of the packaging colloid material contained in the first glue injection unit is substantially equal to the volume of the packaging colloid material contained in the second glue injection unit; and the amount of the chip packaging structure formed by the first glue injection unit is more than the amount of the chip packaging structure formed by the second glue injection unit.
Description
Technical field
The invention relates to a kind of chip packaging mould, and the chip packaging mould that particularly can be effectively utilized and can avoid the layout of carrier to be restricted relevant for a kind of area that can make carrier.
Background technology
With the encapsulation of integrated circuit, generally can earlier the carrier that disposes chip (carrier) be placed between a plurality of moulds.Then, these moulds are combined to define die cavity (cavity), carrier and chip then are arranged in die cavity.Then, with cast gate (pin gate) the injection die cavity of packing colloid material via mould.Afterwards, mould is removed, promptly accomplish the chip-packaging structure of generally knowing.
A kind of mode of the packing colloid material being injected die cavity is for injecting die cavity with the packing colloid material from carrier and chip top through the cast gate that is arranged in mold.Formed chip-packaging structure comprises carrier, be disposed at chip and the packing colloid of covered section carrier and chip on the carrier.
The employed mold of above-mentioned injecting glue technology has the glue injection units of a plurality of same design usually.Each glue injection units all comprises a material cave (pot) and the identical runner (runner) that is connected with the material cave with quantity of a plurality of size, and each runner has the cast gate of equal number.In the process of carrying out injecting glue, utilize piston that the packing colloid material of hot melt is pressed in each material cave of mold earlier.Then, the packing colloid material in the material cave is along the runner that is connected with the material cave, and the cast gate of flowing through injects in the die cavity, and colloidal materials to be packaged can form packing colloid after solidifying.
Usually have the runner of a plurality of balanced configurations in material both sides, cave in the above-mentioned glue injection units, and two sides of glue injection units have the runner of equal number respectively, therefore, this glue injection units has the runner of even number bar.Therefore, in the process of injecting glue, can avoid causing the flow velocity of packing colloid material uneven, to improve the yield of chip package process because of injecting glue pressure is unequal.Yet, on carrier, have prime number row (example 11 rows, 13 rows, 17 rows ... etc.) during chip, and consider can't use above-mentioned mould to carry out sealing adhesive process under the situation of packing colloid characteristic.For instance; When in having 13 row's chips and mold on the carrier, having 6 glue injection units (each glue injection units has 2 current drainage roads); Only can carry out packaging technology to the row of 12 on carrier chip; Therefore wasted the carrier or the chip of part, also can make that the layout of carrier is restricted.
Summary of the invention
The present invention provides a kind of chip packaging mould, and it can make the area of carrier effectively utilized.
The present invention provides a kind of chip packaging mould in addition, can avoid the layout of carrier to be restricted.
The present invention provides a kind of chip packaging mould again, can avoid the carrier or the chip of waste part when carrying out packaging technology.
The present invention proposes a kind of chip packaging mould, and it comprises first mould and second mould of relative position configuration.First mould combines the back to form a plurality of die cavitys with second mould, in order to ccontaining carrier be disposed at the chip on the carrier.Second mould comprises a plurality of glue injection units.These glue injection units comprise first glue injection units and second glue injection units at least.First glue injection units comprises material cave and a plurality of runners that are connected with the material cave respectively with second glue injection units, and wherein each runner has a plurality of cast gates, and each cast gate connects with corresponding die cavity.The packing colloid material is injected in each die cavity via material cave, runner and cast gate and coats carrier and chip; To form a plurality of chip-packaging structures; Wherein the volume of the packing colloid material (molding compound) that holds of first glue injection units equals the volume of the packing colloid material that second glue injection units holds in fact; And the quantity of the formed chip-packaging structure of first glue injection units is greater than the quantity of the formed chip-packaging structure of second glue injection units, and the quantity of the runner of the first above-mentioned glue injection units is for example greater than the quantity of the runner of second glue injection units.
According to the described chip packaging mould of the embodiment of the invention, the width of the runner of the first above-mentioned glue injection units is for example less than the width of the runner of second glue injection units.
According to the described chip packaging mould of the embodiment of the invention, the degree of depth of the runner of the first above-mentioned glue injection units is for example less than the degree of depth of the runner of second glue injection units.
According to the described chip packaging mould of the embodiment of the invention, the volume in the material cave of the first above-mentioned glue injection units is for example less than the volume in the material cave of second glue injection units.
According to the described chip packaging mould of the embodiment of the invention, the second above-mentioned glue injection units can also comprise the fender cave that is connected with the material cave of second glue injection units.
According to the described chip packaging mould of the embodiment of the invention; In at least one glue injection units; The volume of the packing colloid material that runner held that lays respectively at material cave two sides is for example identical in fact, and the quantity of chip-packaging structure of a side that is positioned at the material cave is for example greater than the quantity of the chip-packaging structure of the opposite side that is positioned at the material cave.
According to the described chip packaging mould of the embodiment of the invention, in glue injection units, the quantity of runner of a side that is positioned at the material cave is for example greater than the quantity of the runner of the opposite side that is positioned at the material cave.
According to the described chip packaging mould of the embodiment of the invention, in glue injection units, the width of runner of a side that is positioned at the material cave is for example less than the width of the runner of the opposite side that is positioned at the material cave.
According to the described chip packaging mould of the embodiment of the invention, in glue injection units, the degree of depth of runner of a side that is positioned at the material cave is for example less than the degree of depth of the runner of the opposite side that is positioned at the material cave.
The present invention proposes a kind of chip packaging mould in addition, and it comprises first mould and second mould of relative position configuration.First mould combines the back to form a plurality of die cavitys with second mould, in order to ccontaining carrier be disposed at the chip on the carrier.Second mould comprises a plurality of glue injection units.Each glue injection units comprises material cave and a plurality of runners that are connected with the material cave, and wherein each runner has a plurality of cast gates, and each cast gate connects with corresponding die cavity.The packing colloid material is injected in each die cavity via material cave, runner and cast gate and coats carrier and chip; To form a plurality of chip-packaging structures; Wherein at least one of these glue injection units; The volume that lays respectively at the packing colloid material that runner held of expecting cave two sides is identical in fact; And the quantity of chip-packaging structure of a side that is positioned at the material cave is greater than the quantity of chip-packaging structure of the opposite side that is positioned at the material cave, and the quantity of runner of a side that is positioned at the material cave is for example greater than the quantity of the runner of the opposite side that is positioned at the material cave.
According to the described chip packaging mould of the embodiment of the invention, these glue injection units this at least one in, the width of runner of a side that is positioned at the material cave is for example less than the width of the runner of the opposite side that is positioned at the material cave.
According to the described chip packaging mould of the embodiment of the invention, these glue injection units this at least one in, the degree of depth of runner of a side that is positioned at the material cave is for example less than the degree of depth of the runner of the opposite side that is positioned at the material cave.
The present invention proposes a kind of chip packaging mould again, and it comprises first glue injection units and second glue injection units.The runner that first glue injection units has the first material cave and is connected with the first material cave.The runner that second glue injection units has the second material cave and is connected with the second material cave.The runner quantity of first glue injection units is greater than the runner quantity of second glue injection units.
According to the described chip packaging mould of the embodiment of the invention, the volume of the packing colloid material that the first above-mentioned glue injection units is held for example equals the volume of the packing colloid material that second glue injection units holds in fact.
According to the described chip packaging mould of the embodiment of the invention, the quantity of the above-mentioned formed chip-packaging structure of first glue injection units is for example greater than the quantity of the formed chip-packaging structure of second glue injection units.
Based on above-mentioned; The present invention is through the quantity of the glue injection units in the adjustment mould, the kind of glue injection units, the size of runner, the size or the configuration fender cave in material cave; And the volume that makes the packing colloid material that each glue injection units holds equates in fact and make the volume of the packing colloid material that runner held that lays respectively at material cave two sides equal in fact; Therefore can in the usage space of limited mould, increase the quantity of runner; With the usable floor area of the carrier that avoids waste, and can avoid the layout of carrier to be restricted.
For letting the above-mentioned feature and advantage of the present invention can be more obviously understandable, hereinafter is special lifts embodiment, and cooperates appended diagram to elaborate as follows.
Description of drawings
Fig. 1 is according to the chip packaging mould that the embodiment of the invention illustrated and the sketch map of formed chip-packaging structure.
Fig. 2 is the sketch map according to the molded structure of gained after the packing colloid material cured that one embodiment of the invention illustrated.
Fig. 3 is the sketch map according to the mold in the chip packaging mould that one embodiment of the invention illustrated.
Fig. 4 is the sketch map according to the mold in the chip packaging mould that another embodiment of the present invention illustrated.
Fig. 5 is the sketch map according to the glue injection units during one embodiment of the invention illustrated.
Fig. 6 is the sketch map according to the mold in the chip packaging mould that further embodiment of this invention illustrated.
Fig. 7 is the sketch map according to the molded structure of gained after the packing colloid material cured that another embodiment of the present invention illustrated.
Description of reference numerals
10: chip packaging mould
20,70: molded structure
22,72: chip-packaging structure
24,74a, 74b: runner adhesive tape
26,76: the cast gate adhesive tape
28,78a, 78b: blob of viscose
100: bed die
102,400: mold
104: chip
106: carrier
108: die cavity
110: piston
112: the packing colloid material
114,200a, 202a, 400a, 502a: material cave
116,200b, 202b, 400b, 400c, 502b, 502c: runner
118,200c, 202c: cast gate
200,202,402,500: glue injection units
202d: fender cave
Embodiment
Can be as shown in Figure 1 about chip packaging mould and formed chip-packaging structure.Fig. 1 is according to the chip packaging mould that the embodiment of the invention illustrated and the sketch map of formed chip-packaging structure.In general, chip is that the mode with array is disposed on the carrier, and each chip is measure-alike, and the die cavity that therefore is used for ccontaining these chips also has identical size.But,, in Fig. 1, be that example is explained only with a chip and a die cavity in order to make clarity.Please with reference to Fig. 1, chip packaging mould 10 comprises first mould and second mould.In the present embodiment, first mould is a bed die 100, and second mould is a mold 102.Chip 104 is disposed on the carrier 106.In the present embodiment, carrier 106 for example is lead frame (lead frame).Certainly, in other embodiments, carrier 106 also can be a substrate.Mold 102 combines to form die cavity 108 with bed die 100.Chip 104 is arranged in die cavity 108 with part carrier 106.In the process of carrying out injecting glue, utilize piston 110 that the packing colloid material 112 of hot melt is pressed in the material cave 114 of mold 102 earlier.Then, the packing colloid material 112 in the material cave 114 flows along the runner 116 that is connected with material cave 114.Runner 116 has cast gate 118.Packing colloid material 112 in the runner 116 can inject die cavity 108 via cast gate 118.Treat to form packing colloid after packing colloid material 112 curing in the die cavity 108.
Fig. 2 is the sketch map according to the molded structure of gained after the packing colloid material cured that one embodiment of the invention illustrated.Please with reference to Fig. 2, molded structure 20 comprises the chip-packaging structure of arranging with array way 22.In Fig. 2,, only show the packing colloid part that coats carrier and chip in order to clearly demonstrate.In addition, molded structure 20 also comprises runner adhesive tape 24, cast gate adhesive tape 26 and blob of viscose 28.At length say, formed runner adhesive tape 24 after the packing colloid material cured in the runner; Formed cast gate adhesive tape 26 after the packing colloid material cured in the cast gate; Formed blob of viscose 28 after the packing colloid material cured in the material cave.Runner adhesive tape 24 is connected with blob of viscose 28.In addition, runner adhesive tape 24 is connected with chip-packaging structure 22 via cast gate adhesive tape 26.Special one carry be, the size of blob of viscose 28 be with the material cave volume corresponding.
In the present invention, has different glue injection units in the mold 102.The quantity of the formed chip-packaging structure of these glue injection units is also inequality.Owing to have different glue injection units in the mold 102, that is the configuration of visual actual conditions has the glue injection units of the runner of varying number, the usable floor area of carrier that therefore can avoid waste, and can avoid the layout of carrier to be restricted.In addition; The material cave through adjusting these glue injection units and the quantity and/or the volume of runner; So that the volume of the packing colloid material that these glue injection units are held is equal in fact, therefore can avoid when carrying out injecting glue, descending because of injecting glue pressure inequality causes the different yields of packaging technology that cause of flow velocity of packing colloid material.Below will do explanation at length to the mold in the chip packaging mould 10 102.
Fig. 3 is the sketch map according to the mold in the chip packaging mould that one embodiment of the invention illustrated.Please with reference to Fig. 3, mold 102 has a plurality of glue injection units.In the present embodiment, these glue injection units comprise glue injection units 200 and glue injection units 202.The quantity of glue injection units 200 and glue injection units 202 and configuration mode are not limited to shown in Figure 3, visual actual demand and adjusting.For fear of when carrying out injecting glue, causing the yield of packaging technology to descend because of the flow velocity of packing colloid material is different, so the volume of the packing colloid material that held of glue injection units 200 and glue injection units 202 must equate in fact.In addition, the quantity of glue injection units 200 formed chip-packaging structures is greater than the quantity of glue injection units 202 formed chip-packaging structures.Say that at length in the present embodiment, glue injection units 200 comprises material cave 200a and four runner 200b that are connected with material cave 200a, and each runner 200b have four cast gate 200c.That is to say that a glue injection units 200 can form 16 chip-packaging structures.In addition, glue injection units 202 comprises material cave 202a and three runner 202b that are connected with material cave 202a, and each runner 202b has four cast gate 202c.That is to say that a glue injection units 202 can form 12 chip-packaging structures.Certainly, in other embodiments, the runner in glue injection units 200 and the glue injection units 202 and the also visual actual conditions of quantity of cast gate and adjust.In addition, glue injection units 200 is adjusted with the also visual actual conditions of indivedual quantity of glue injection units 202.
For the volume that makes the packing colloid material that glue injection units 200 and glue injection units 202 held equates in fact, so the volume of runner 202b must be greater than the volume of runner 200b.In the present embodiment, can reach above-mentioned purpose greater than the width of runner 200b through the width that makes runner 202b.In another embodiment, also can reach above-mentioned purpose greater than the degree of depth of runner 200b through the degree of depth that makes runner 202b.
In the present embodiment; Because glue injection units 200 is different with the quantity of glue injection units 202 formed chip-packaging structures, promptly the two has the runner of varying number, therefore can look the quantity that glue injection units 200 and glue injection units 202 are adjusted in actual demand; To effectively utilize the space in the mold 102; And the number of chips that can meet on the carrier to be disposed with the usable floor area of the carrier that avoids waste, and can avoid the layout of carrier to be restricted.
In addition; In another embodiment; For the volume that makes the packing colloid material that glue injection units 200 and glue injection units 202 held equates in fact; Under the volume of runner 200b and situation that the volume of runner 202b equates in fact, can reach greater than the volume of material cave 200a through the volume that makes material cave 202a.In the case, correspondence material cave 200a and the formed blob of viscose of 202a (like the blob of viscose among Fig. 2 28) can be of different sizes respectively.
In the above-described embodiments, because the volume of the packing colloid material that glue injection units 200 and glue injection units 202 are held equates in fact, so can avoid the flow velocity of the packing colloid material in the glue injection units 200 and glue injection units 202 when carrying out injecting glue different.
In addition; In another embodiment; For the volume that makes the packing colloid material that glue injection units 200 and glue injection units 202 held equates in fact; The volume of runner 200b equate in fact with the volume of runner 202b and the volume of expecting cave 200a and situation that the volume of material cave 202a equates in fact under, also can reach above-mentioned purpose with expecting the fender cave that cave 202a is connected through configuration.
Fig. 4 is the sketch map according to the mold in the chip packaging mould that another embodiment of the present invention illustrated.Please with reference to Fig. 4, the volume of runner 200b equates in fact with the volume of runner 202b, and the volume of material cave 200a equates in fact with the volume of material cave 202a, and fender cave 202d with expect that cave 202a is connected, to hold unnecessary packing colloid material.In the present embodiment, fender cave 202d is a hemisphere, and in other embodiments, fender cave 202d also can be other shapes.
Other one what carry is that to other glue injection units in the mould, the present invention also can further let the volume of the packing colloid material that runner held that lays respectively at material cave two sides identical in fact, so that the flow velocity of the packing colloid material of material cave two sides is identical.In one embodiment, two sides in the material cave can form the chip-packaging structure of equal number, and the quantity of runner that promptly lays respectively at material cave two sides is identical, expect that therefore the flow velocity of packing colloid material of cave two sides is also identical.In another embodiment, if the quantity of the formed chip-packaging structure of material cave two sides and inequality, the quantity that promptly lays respectively at the runner of expecting cave two sides is different, and the volume that then lays respectively at the runner of material cave two sides must be different.
Fig. 5 is the sketch map according to the glue injection units during one embodiment of the invention illustrated.Please with reference to Fig. 5; In glue injection units 500; Because material cave 502a top has two runner 502b, and material cave 502a below only has a runner 502c, the volume that therefore is positioned at the runner 502c of material cave 502a below must be greater than the volume of the runner 502b that is positioned at material cave 502a top.In the present embodiment, the width of runner 502c is greater than the width of runner 502b.In another embodiment, also can be the degree of depth of the degree of depth of runner 502c greater than runner 502b.In the present embodiment, the side of material cave 502a has two runner 502b, and opposite side only has a runner 502c.Certainly, in other embodiments, also can look actual demand and in the runner of the two sides configurations varying number in material cave.
Fig. 6 is the sketch map according to the mold in the chip packaging mould that further embodiment of this invention illustrated.Please with reference to Fig. 6, in the present embodiment, mold 400 has a plurality of identical and each other with the staggered glue injection units 402 of mode reversed left to right.Glue injection units 402 comprises material cave 400a and five runners that are connected with material cave 400a, and wherein two runner 400b are positioned at a side of expecting cave 400a, and other three runner 400c are positioned at the opposite side of material cave 400a.In the present embodiment, because each glue injection units 402 is all identical and can form the chip-packaging structure of equal number, promptly have equal number (five s') runner, so the flow velocity of the packing colloid material in each glue injection units 402 is all identical.Yet; For each glue injection units 402; Owing to the quantity of the formed chip-packaging structure of two sides of expecting cave 400a is also inequality, promptly is positioned at the quantity difference of the runner of material cave 400a two sides, so must adjusts the volume that is positioned at the runner of expecting cave 400a two sides.In the present embodiment, the width of runner 400b is greater than the width of runner 400c.In another embodiment, also can be the degree of depth of the degree of depth of runner 400b greater than runner 400c.Perhaps, in another embodiment, also can be in the other configuration in material cave fender cave.In the present embodiment,, therefore can in the usage space of limited mold, increase the quantity of runner,, and can avoid the layout of carrier to be restricted with the usable floor area of the carrier that avoids waste in the different runner of two side number of configured of material cave 400a.
Fig. 7 is the sketch map according to the molded structure of gained after the packing colloid material cured that another embodiment of the present invention illustrated.Please with reference to Fig. 7, similar with Fig. 2, molded structure 70 comprises the chip-packaging structure of arranging with array way 72.In Fig. 7,, only show the packing colloid part that coats carrier and chip in order to clearly demonstrate.In addition, molded structure 70 also comprises runner adhesive tape 74a and 74b, cast gate adhesive tape 76 and blob of viscose 78a and 78b.The width of runner adhesive tape 74b is greater than the width of runner adhesive tape 74a, and the size of blob of viscose 78b is greater than the size of blob of viscose 78a.In addition, the width of runner adhesive tape 74b that is positioned at blob of viscose 78b one side is greater than the width of the runner adhesive tape 74b that is positioned at blob of viscose 78b opposite side.Therefore, can learn in the mold that forms molded structure 70, to have two groups of glue injection units by molded structure 70.In first group of glue injection units, have four runners, and in second group of glue injection units, have three runners.For the volume that makes the packing colloid material that each glue injection units holds identical in fact; Therefore the width of the runner of second group of glue injection units is greater than the width of the runner of first group of glue injection units, and the volume in the material cave of second group of glue injection units is greater than the volume in the material cave of first group of glue injection units.In addition, in second group of glue injection units, the width of runner that is positioned at a side is greater than the width of the runner that is positioned at a side.
Special one carry be; The present invention is not limited to above-mentioned each embodiment, and the visual actual conditions of user are adjusted the quantity of the glue injection units in the mold, the kind of glue injection units, the arrangement mode of glue injection units, the size of runner, the quantity of runner, the size or the configuration fender cave in material cave.
Though the present invention discloses as above with embodiment; Right its is not in order to limit the present invention; Those of ordinary skill in the technical field under any; Do not breaking away from the spirit and scope of the present invention, when doing a little change and retouching, so protection scope of the present invention is as the criterion when looking appended the claim person of defining.
Claims (19)
1. chip packaging mould; First mould and second mould that comprise the relative position configuration; This first mould combines the back to form a plurality of die cavitys with this second mould, each die cavity is in order to ccontaining carrier and be disposed at the chip on this carrier, and this second mould comprises:
A plurality of glue injection units, those glue injection units comprise first glue injection units and second glue injection units at least, and this first glue injection units and this second glue injection units comprise respectively:
The material cave; And
A plurality of runners are connected with this material cave, and wherein each runner has a plurality of cast gates, and each cast gate connects with corresponding die cavity;
Wherein the packing colloid material is injected in each die cavity via those material caves, those runners and those cast gates and coats this carrier and this chip; To form a plurality of chip-packaging structures; And wherein the volume of this packing colloid material of holding of this first glue injection units equals the volume of this packing colloid material that this second glue injection units holds; And the quantity of formed those chip-packaging structures of this first glue injection units is greater than the quantity of formed those chip-packaging structures of this second glue injection units, and the quantity of those runners of this first glue injection units is greater than the quantity of those runners of this second glue injection units.
2. chip packaging mould as claimed in claim 1, wherein the width of those runners of this first glue injection units is less than the width of those runners of this second glue injection units.
3. chip packaging mould as claimed in claim 1, wherein the degree of depth of those runners of this first glue injection units is less than the degree of depth of those runners of this second glue injection units.
4. chip packaging mould as claimed in claim 1, wherein the volume in this material cave of this first glue injection units is less than the volume in this material cave of this second glue injection units.
5. chip packaging mould as claimed in claim 1, wherein this second glue injection units also comprises the fender cave, is connected with this material cave of this second glue injection units.
6. chip packaging mould as claimed in claim 1; Wherein at least one glue injection units; The volume of this packing colloid material that those runners held that lays respectively at these material cave two sides is identical, and the quantity of those chip-packaging structures of a side that is positioned at this material cave is greater than the quantity of those chip-packaging structures of the opposite side that is positioned at this material cave.
7. chip packaging mould as claimed in claim 6, wherein in this glue injection units, the quantity of those runners of this side that is positioned at this material cave is greater than the quantity of those runners of this opposite side that is positioned at this material cave.
8. chip packaging mould as claimed in claim 7, wherein in this glue injection units, the width of those runners of this side that is positioned at this material cave is less than the width of those runners of this opposite side that is positioned at this material cave.
9. chip packaging mould as claimed in claim 7, wherein in this glue injection units, the degree of depth of those runners of this side that is positioned at this material cave is less than the degree of depth of those runners of this opposite side that is positioned at this material cave.
10. chip packaging mould; First mould and second mould that comprise the relative position configuration; This first mould combines the back to form a plurality of die cavitys with this second mould, each die cavity is in order to ccontaining carrier and be disposed at the chip on this carrier, and this second mould comprises:
A plurality of glue injection units, each glue injection units comprises:
The material cave; And
A plurality of runners are connected with this material cave, and wherein each runner has a plurality of cast gates, and each cast gate connects with corresponding die cavity;
Wherein a packing colloid material is injected in each die cavity via those material caves, those runners and those cast gates and coats this carrier and this chip; To form a plurality of chip-packaging structures; And wherein at least one of those glue injection units; The volume of this packing colloid material that those runners held that lays respectively at these material cave two sides is identical; And the quantity of those chip-packaging structures of a side that is positioned at this material cave is greater than the quantity of those chip-packaging structures of the opposite side that is positioned at this material cave, and the quantity of those runners of this side that is positioned at this material cave is greater than the quantity of those runners of this opposite side that is positioned at this material cave.
11. chip packaging mould as claimed in claim 10, wherein those glue injection units this at least one in, the width of those runners of this side that is positioned at this material cave is less than the width of those runners of this opposite side that is positioned at this material cave.
12. chip packaging mould as claimed in claim 10, wherein those glue injection units this at least one in, the degree of depth of those runners of this side that is positioned at this material cave is less than the degree of depth of those runners of this opposite side that is positioned at the material cave.
13. a chip packaging mould comprises:
First glue injection units, the runner that has one first material cave and be connected with this first material cave; And
Second glue injection units, the runner that has one second material cave and be connected with this second material cave;
Wherein the runner quantity of this first glue injection units is greater than the runner quantity of this second glue injection units.
14. chip packaging mould as claimed in claim 13, wherein the volume of the packing colloid material that holds of this first glue injection units equals the volume of the packing colloid material that this second glue injection units holds.
15. chip packaging mould as claimed in claim 14, wherein the width of the runner of this first glue injection units is less than the width of the runner of this second glue injection units.
16. chip packaging mould as claimed in claim 14, wherein the degree of depth of the runner of this first glue injection units is less than the degree of depth of the runner of this second glue injection units.
17. chip packaging mould as claimed in claim 14, wherein the volume in this first material cave is less than the volume in this second material cave.
18. chip packaging mould as claimed in claim 14, wherein this second glue injection units also comprises the fender cave, is connected with this second material cave.
19. chip packaging mould as claimed in claim 13, wherein the quantity of the formed chip-packaging structure of this first glue injection units is greater than the quantity of the formed chip-packaging structure of this second glue injection units.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102067347A CN101887861B (en) | 2010-06-11 | 2010-06-11 | Chip packaging mould |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102067347A CN101887861B (en) | 2010-06-11 | 2010-06-11 | Chip packaging mould |
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| CN101887861A CN101887861A (en) | 2010-11-17 |
| CN101887861B true CN101887861B (en) | 2012-01-11 |
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| CN2010102067347A Active CN101887861B (en) | 2010-06-11 | 2010-06-11 | Chip packaging mould |
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| TWI478251B (en) * | 2012-04-06 | 2015-03-21 | 矽品精密工業股份有限公司 | Casting mold device for packaging semiconductor elements |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201364884Y (en) * | 2008-12-31 | 2009-12-16 | 深圳市三浦半导体有限公司 | Semiconductor encapsulation mould |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH01129426A (en) * | 1987-11-16 | 1989-05-22 | Mitsubishi Electric Corp | Resin packaging device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201364884Y (en) * | 2008-12-31 | 2009-12-16 | 深圳市三浦半导体有限公司 | Semiconductor encapsulation mould |
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