TWI231576B - Molding device and system of lead frame - Google Patents

Molding device and system of lead frame Download PDF

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Publication number
TWI231576B
TWI231576B TW091138209A TW91138209A TWI231576B TW I231576 B TWI231576 B TW I231576B TW 091138209 A TW091138209 A TW 091138209A TW 91138209 A TW91138209 A TW 91138209A TW I231576 B TWI231576 B TW I231576B
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TW
Taiwan
Prior art keywords
lead frame
sealing
mold
plastic
glue
Prior art date
Application number
TW091138209A
Other languages
Chinese (zh)
Other versions
TW200411849A (en
Inventor
Wei-Chih Wang
Chia-Ming Chang
Original Assignee
Advanced Semiconductor Eng
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Publication date
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Priority to TW091138209A priority Critical patent/TWI231576B/en
Publication of TW200411849A publication Critical patent/TW200411849A/en
Application granted granted Critical
Publication of TWI231576B publication Critical patent/TWI231576B/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

A molding device of a lead frame is used for encapsulating a semiconductor package with molding compound, and the semiconductor package has a lead frame defining a molding area and having a through opening which extends from the inside of the molding area to the outside thereof. The molding device comprises a cavity, a runner, and a control pin. The cavity is corresponding to the molding area. The runner abuts the through opening for injecting the molding compound. The control pin is disposed at the runner and movable relating to the lead frame such that the injection velocity of the molding compound is controlled.

Description

1231576 五、發明說明（1) "'" 【發明所屬之技術領域】 本發明係有關於一種半導體之導線架（Lea(i Frame)之封模 裝置，更特別係有關於一種大尺寸之導線架條之封膠體之封 裝模具。 【先前技術】 具有導線架之半導體封裝構造，於本技藝中係廣為人知 的。參考第1圖，其顯示習用之一導線架條（lead f rame strip)l〇。該導線架條1〇具有縱向支架16、18及橫向支架 1 2，用以支撐排列為複數個導線架2 〇。該導線架2 〇且一曰 片承座（die pad )22，用以承載一晶片（圖中未示）、複數個 内引腳28 ’固定於壩桿27(dam bar)上，藉由連接線 (bonding wire)電性連接至該晶片、複數個外引腳24，與該 内引腳2 8相連接，用以連接至外部電路、以及複數個支撐肋 條（tie bar)26支撐該晶片承座。 典型上，該晶片、晶片承座、導線架之引腳、以及^之條 連接線係包覆於一封膠體中。該封膠體係以絕緣之封膠塑 料，例如環氧樹脂（epoxy)，藉由轉移封模（Transfer Molding)製造。於封模過程中，該導線架2〇係置於一模具之 模穴中’且將該模穴區分為一上模穴及一下模穴，再由一注 入口注入該封膠塑料。然而，由於該注入口一般係位於上、 下模穴之一側’故封膠塑料並不能均勻且迅速的填充於該模 穴中。 當應用於陣列式導線架條時，封膠塑料可能在填充的過程 中硬化’造成半導體裝置的損壞。該導線架條丨〇典型上係為1231576 V. Description of the invention (1) " '" [Technical field to which the invention belongs] The present invention relates to a semiconductor lead frame (Lea (i Frame) mold sealing device, and more particularly relates to a large-size Packaging mold for encapsulation of lead frame strips. [Prior art] A semiconductor package structure with a lead frame is well known in the art. Refer to Figure 1, which shows one of the conventional lead frame strips. 〇. The lead frame strip 10 has a longitudinal support 16, 18 and a horizontal support 12 to support the arrangement of a plurality of lead frames 20. The lead frame 20 and a die pad 22 for A chip (not shown in the figure) is carried, and a plurality of inner pins 28 ′ are fixed on a dam bar 27 (dam bar), and are electrically connected to the chip through a bonding wire and a plurality of outer pins 24. Is connected to the inner pin 28 for connecting to an external circuit, and a plurality of tie bars 26 support the wafer holder. Typically, the wafer, the wafer holder, the pins of the lead frame, And ^ of the connecting lines are covered with a piece of colloid The sealing system is made of insulating sealing plastic, such as epoxy, by Transfer Molding. During the molding process, the lead frame 20 is placed in the cavity of a mold. "The mold cavity is divided into an upper mold cavity and a lower mold cavity, and then the sealing plastic is injected through an injection port. However, since the injection port is generally located on one side of the upper and lower mold cavities," the sealant Plastic cannot be filled into the cavity uniformly and quickly. When applied to an array type lead frame strip, the sealing plastic may harden during the filling process, causing damage to the semiconductor device. The lead frame strip is typically for

00634-TW. ptd 第5頁 1231576 五、發明說明（2) 單排的。既使該導線架係為雙排的，其尺寸大小亦 的（Cri tical )。習用技術中，該雙排之導線架條中^ = f性 臨界的寬度係約為45mm，整個導線架條丨0之長度係約為条4 215 mm。再者，於去殘膠（degating)過程中，注入口附、 封膠塑料，由於體積過小，易於碎裂，而無法完全去付。近之 影響封裝件的美觀。 # ’ @ 有鑑於此，便有需供一種導線架模具，用以克服前述的問 題0 【發明内容】 本發明之一目的在於提供一種導線架封模裝置，於封模過 程中，可使該封膠塑料均勻且快速的填充於模具之模穴中^ 為達上述目的’本發明提供一種導線架之封模裝置，用以 將一封膠塑料包封一半導體封裝構造，該半導體封裝構造具 有一導線架界定一封膠區域，並具有一貫穿開口 ，由該 區域内侧延伸至外側。該封模裝置包含一模穴、一注膠道:、 以及一控制銷。該模穴係與該封膠區域相對應。該注膠道係 配置接近該貫穿開口，用以注入該封膠塑料。該控制銷係配 置於該注膠道處，可相對於該導線架移動，如此以控制該封 膠塑料注入之速度。 根據本發明之封模裝置，係具有一控制銷，相對於該導線 架移動’並可控制封膠塑料注入之速度。因此，當封裝大面 積之導線架條上之導線架時，該封膠塑料可以適當的速度注 入個別的模穴中。該封膠塑料之注入速度不致於過高，而沖 擊該半導體裝置。該封膠塑料之注入速度亦不至於過低，而00634-TW. Ptd Page 5 1231576 V. Description of the invention (2) Single row. Even if the lead frame is double-row, its size is also Critical. In conventional technology, the critical width of the double-row lead frame strip is about 45mm, and the length of the entire lead frame strip is about 4 215 mm. In addition, during the degating process, the injection port attached and sealed plastic is too small and easily broken, so it cannot be completely paid. This affects the aesthetics of the package. # '@ In view of this, there is a need for a lead frame mold to overcome the aforementioned problems. [Summary of the Invention] An object of the present invention is to provide a lead frame mold sealing device, which can be used during the mold sealing process. The sealing plastic is evenly and quickly filled in the cavity of the mold ^ In order to achieve the above-mentioned purpose, the present invention provides a mold mounting device for a lead frame for encapsulating a piece of plastic with a semiconductor package structure. The semiconductor package structure has A lead frame defines a glue region and has a through opening extending from the inside to the outside of the region. The mold sealing device includes a mold cavity, a glue injection channel, and a control pin. The mold cavity corresponds to the sealing area. The glue injection channel is arranged near the through opening for injecting the sealing plastic. The control pin is arranged at the injection channel and can be moved relative to the lead frame, so as to control the injection speed of the sealing plastic. The mold sealing device according to the present invention has a control pin which is moved relative to the lead frame and can control the injection speed of the sealing plastic. Therefore, when encapsulating the lead frame on a large area lead frame strip, the sealing plastic can be injected into the individual mold cavity at an appropriate speed. The injection speed of the sealant plastic is not too high, which impacts the semiconductor device. The injection speed of the sealing plastic is not too low, and

00634-TW. ptd 第6頁 1231576 五、發明說明（3) 使該封膠塑料過早硬化。 領為和其他目的、特徵、和優點能更明 說明如下：+ 佳實施例’並配合所附圖示，作詳細 【實施方式】 現請參考第2及3圖，其顯示根據本發 :，Λ有；模具3 00,用以封模一半導體封裝才==膠 體。於1 4過程中，一導線架20 0及配置於其上之一晶片i 係放置於一封模裝置，諸如轉移封模裝置（tunsferaa molding apparatus) 350中。該封模裝置35q具有多個活塞 352，用以擠壓一熔融之封膠塑料3〇2，經過多個注膠道 354，進入該模具3 00之多個模穴31〇中，藉此封模該封膠 體。 參考第4圖’其顯示應用於本發明之該封模裝置35〇與^^ 具300之一導線架條（lead frame strip)l〇〇。該導線架餐 100具有縱向支架106、108、110及橫向支架1〇2，用以支撐 排列為多列之複數個導線架200 (圖示為兩列）。該導線架200 具有一晶片承座（d i e pa d ) 2 1 2，用以承載一晶片1 5 2 (如第5 圖所示）、複數個内引腳218，固定於壩桿（dam bar )21 7上， 藉由連接線（bondi ng wi re) 1 54電性連接至該晶片1 52、複數 個外引腳2 1 4，與該内引腳2 1 8相連接，用以連接至一外部電 路、以及複數個支撐肋條（tie bar) 216支撐該晶片承座。該 壩桿21 7位於該内引腳21 8及該外引腳214之間。 如第3圖所示，該模穴3 1 0係為該導線架2 0 0區分為一上模00634-TW. Ptd Page 6 1231576 V. Description of the invention (3) Prematurely harden the sealing plastic. Collaboration and other purposes, features, and advantages can be more clearly explained as follows: + The preferred embodiment 'and the accompanying drawings make detailed [implementation] Now please refer to Figures 2 and 3, which show according to the present invention :, Λ Yes; mold 3 00 is used to seal a semiconductor package == colloid. In the process of 14, a lead frame 200 and a wafer i disposed thereon are placed in a mold device, such as a tunsferaa molding apparatus 350. The mold sealing device 35q has a plurality of pistons 352 for extruding a molten sealant plastic 302, passes through a plurality of injection channels 354, and enters into a plurality of cavities 31 of the mold 300, thereby sealing. Mold the sealant. Refer to FIG. 4 ', which shows one of the mold sealing device 35 and the lead frame strip 100 applied to the present invention. The lead frame meal 100 has longitudinal supports 106, 108, 110 and a transverse support 102 for supporting a plurality of lead frames 200 arranged in multiple rows (two rows are shown in the figure). The lead frame 200 has a die pad 2 1 2 for carrying a wafer 1 5 2 (as shown in FIG. 5), a plurality of inner pins 218, and is fixed to a dam bar. On 21 7, it is electrically connected to the chip 1 52 and a plurality of outer pins 2 1 4 through a connecting wire (bondi ng wi re) 1 54 and is connected to the inner pins 2 1 8 for connection to a chip. An external circuit and a plurality of tie bars 216 support the wafer holder. The dam rod 21 7 is located between the inner pin 21 8 and the outer pin 214. As shown in Figure 3, the mold cavity 3 1 0 is divided into an upper mold for the lead frame 2 0 0

1231576 五、發明說明（4) --- 穴320及一下模穴3 22，並具有一注入口312，用以注入熔融 之封膠塑料3 02。請注意，該模穴31〇於該導線架2〇〇上界定 一封膠區域224(如第4圖之陰影區域所示），典型上係與該導 線架20 0之壩桿217相對應。該導線架200進一步具有二水滴 狀貫穿開口 220 (請參考第4圖），位於該複數個支撐肋條2〇4 中之一者上，與該注入口31 2相對應，且由該封膠區域224之 内侧延伸至其外側。 如圖所示，該熔融之封膠塑料302係由該導線架2〇〇之上 方，通過該注入口312注入該模穴31〇中，藉以包封該導線架 200及該晶片152。由於該水滴狀貫穿開口 22〇係由該封膠區 域224之内側延伸至其外側，並與該注入口312相對應，故該 熔融之封膠塑料30 2可通過該水滴狀貫穿開口22〇，^入該= 穴310之该下模穴322中。因此，該熔融之封膠塑料可迅、 速且平均的注入該模穴3 1 0中。精於本技藝者將可瞭 滴狀貫穿開口可以替換為任何其他適當的外形，諸如、 長條狀、三角形等等。 y、 該轉移封模裝置35 0另具有一控制銷356，可相對於該 狀貫穿開口 2 20，亦即該注入口 312位移，藉此以改變^嘀 狀貫穿開口 2 20之開啟尺寸，而進一步改變該熔融的封膠_ 料302流入該下模穴322之速度。該控制銷356之位置可取 於該導線架2 0 0對於該活塞3 52之位置，亦即該注膠道3 = 長度。 之 再參考第5圖，其顯示使用本發明之該封模裝置35〇盥 具300所製造之一半導體封裝構造15〇。該半導體封裳^果1231576 V. Description of the invention (4) --- The cavity 320 and the lower mold cavity 3 22, and has an injection port 312, which is used to inject the molten sealing plastic 302. Please note that the mold cavity 31 defines a glue area 224 on the lead frame 200 (as shown by the shaded area in Figure 4), which typically corresponds to the dam pole 217 of the lead frame 200. The lead frame 200 further has two waterdrop-shaped through openings 220 (refer to FIG. 4), which are located on one of the plurality of supporting ribs 204 and correspond to the injection port 31 2 and are formed by the sealing area. The inside of 224 extends to the outside. As shown in the figure, the molten sealant plastic 302 is injected from above the lead frame 2000 through the injection port 312 into the cavity 31, thereby encapsulating the lead frame 200 and the chip 152. Since the drop-shaped through opening 22o extends from the inside to the outside of the sealant region 224 and corresponds to the injection port 312, the molten sealant plastic 302 can pass through the drop-shaped through-opening 22o, ^ Enter the lower mold cavity 322 of the = cavity 310. Therefore, the molten sealant can be injected into the cavity 3 10 quickly, quickly and evenly. Those skilled in the art will appreciate that the drop-shaped through openings can be replaced with any other suitable shape, such as a strip, a triangle, and so on. y. The transfer mold sealing device 350 has another control pin 356, which can be displaced relative to the shape of the through opening 2 20, that is, the injection port 312, so as to change the opening size of the shape of the through opening 2 20, and The speed at which the molten sealant 302 flows into the lower cavity 322 is further changed. The position of the control pin 356 can be taken from the position of the lead frame 2 0 0 to the piston 3 52, that is, the injection channel 3 = length. Referring again to FIG. 5, there is shown a semiconductor package structure 150 manufactured using the mold sealing device 350 of the present invention. The semiconductor seal ^ fruit

00634-TW. ptd 第8頁 1231576 五、發明說明（5) 1 5 0具有該導線架2 0 0，用以承載該晶片1 5 2，以及一封膠塑 料1 5 6包封該導線架2 0 0及該晶片1 5 2。該晶片1 5 2係藉由銀膠 黏著固定於該晶片承座2 02上，並藉由該連接線154，電性連 接至該導線架20 0之該内引腳218。 該導線架條100之橫向支架102上可另具有多個貫穿孔 222(見於第4圖中）。參考第6圖，複數個衝擊銷358係配置與 該導線架條1 00之該貫穿孔2 22及該水滴狀貫穿開口 220相對 應。该複數個衝擊銷3 5 8可提供於一去殘膠裝置（圖中未示） 中。當該溶融之封膠塑料3 0 2硬化之後，該衝擊銷可穿過該 導線架條1 0 0之該貫穿孔2 2 2及水滴狀貫穿開口 2 2 0，而衝掉 該注膠道354。無庸贅述，封裝後之該導線架條丨〇〇會再分割 為單個之該半導體封裝構造1 5 〇。 當該 膠塑料 程中， 封膠塑 於碎裂 請注 度之範 之數量 雖然 瞭解到 例，而 精神及 炼融的封膠塑料3 1 2硬化之後，於該注入口 3 1 2處之全 ，可藉由衝擊（punch)製程去除。於衝擊去殘膠髮 由於該注入口 312處，亦即該水滴狀貫穿開口 22 之 料相較於先前技術具有大的體積，該封膠塑料較不易 ，故可將該多餘的封膠塑料完全的去除。 思’於此配置下，該導線架條丨〇 〇之該導線架2 〇 〇之寛 f為約45mm至約78mm。該導線架2〇〇之引腳214、218 :達2 08。該導線架條1〇〇之總長度可達_25〇mm。 ^述的描述及圖不已揭示本發明之較佳實施例，必須 種增添、修改和取代可能使用於本發明較佳實施 =$脫離如所附申請專利範圍所界定的本發明原理之 热悉^技藝者將可體會本發明可能使用於很多00634-TW. Ptd Page 8 1231576 V. Description of the invention (5) 1 5 0 The lead frame 2 0 0 is used to carry the chip 1 5 2 and a plastic 1 5 6 encloses the lead frame 2 0 0 and this chip 152. The chip 15 2 is fixed on the chip holder 202 by silver glue, and is electrically connected to the inner pin 218 of the lead frame 200 through the connection line 154. The lateral bracket 102 of the lead frame strip 100 may further have a plurality of through holes 222 (see FIG. 4). Referring to FIG. 6, a plurality of impact pins 358 are arranged corresponding to the through holes 22 and the water drop-shaped through openings 220 of the lead frame strip 100. The plurality of impact pins 3 5 8 can be provided in a glue removing device (not shown). After the molten sealant plastic 3 2 is hardened, the impact pin can pass through the through hole 2 2 2 of the lead frame strip 1 2 0 and the water-drop-shaped through opening 2 2 0 to flush out the injection channel 354 . Needless to say, the leadframe strips after packaging will be divided into individual semiconductor package structures 150. In the process of plastics, although the number of sealant plastics in the fragmentation, please note the number of examples, but the spirit and melted sealant plastic 3 1 2 is hardened at the injection port 3 1 2 all, It can be removed by the punch process. In the case of impact-removing gel hair, the material of the injection opening 312, that is, the material of the water drop-shaped penetration opening 22 has a larger volume than the prior art, and the sealing plastic is not easy, so the excess sealing plastic can be completely removed. Removal. In this configuration, the lead frame 200f of the lead frame strip 001 is about 45 mm to about 78 mm. Pins 214 and 218 of the lead frame 2000 are up to 08. The total length of the lead frame bar 100 can reach _250 mm. The description and drawings described above have not revealed the preferred embodiment of the present invention, and there must be additions, modifications, and substitutions that may be used in the preferred embodiment of the present invention. The artist will appreciate that the invention may be used in many ways

00634-TW. ptd 1231576 五、發明說明（6) 形式、結構、佈置、比例、材料、元件和組件的修改。因 此，本文於此所揭示的實施例於所有觀點，應被視為用以說 明本發明，而非用以限制本發明。本發明的範圍應由後附申 請專利範圍所界定，並涵蓋其合法均等物，並不限於先前的 描述。00634-TW. Ptd 1231576 V. Description of the invention (6) Modification of form, structure, arrangement, proportion, materials, components and components. Therefore, the embodiments disclosed herein should be considered in all respects to illustrate the present invention and not to limit the present invention. The scope of the invention should be defined by the scope of the appended patents and cover their legal equivalents and are not limited to the foregoing description.

00634-TW. ptd 第10頁 1231576 圖式簡單說明 【圖式簡單說明】 第1圖：係先前技術之 第2圖·係根據本發明 圖。 第3圖·係為根據本發 圖。 第4圖：係根據本發明 苐5圖·係利用根據本 之剖面示意圖。 第6圖：係為一立體示 製程。 圖號說明： 導線架條之上平面視圖。 之一實施例之-模具之立體示意 明之該模具之封模過程之剖面示意 之一導線架條之上平面視 發明之導線架之一半導體 意圖’顯示根據本發 10 導線架條 12 橫向支架 16 縱向支架 18 縱向支架 20 導線架 22 晶片承座 24 外引腳 26 支撐肋條 27 壩桿 28 内引腳 100 導線架條 102 橫向支架 106 縱向支架 108 縱向支架 110 縱向支架 150 半導體封裝構造 152 晶片 154 連接線 156 封膠塑料 200 導線架 206 彈簧元件 212 晶片承座 208 L形貫穿開00634-TW. Ptd Page 10 1231576 Brief description of the drawings [Simplified description of the drawings] Fig. 1: It is the prior art. Fig. 2 is the figure according to the present invention. Fig. 3 is a drawing according to the present invention. Fig. 4 is a schematic view of the present invention, Fig. 5 is a sectional view of the present invention. Figure 6: It is a three-dimensional display process. Drawing number description: Plane view above the lead frame. One embodiment-a three-dimensional illustration of the mold, a cross-section illustration of the molding process of the mold, one of the lead frame strips, a plan view of the lead frame of the invention, a semiconductor intent, "shows according to the present invention 10, a lead frame strip, 12 a lateral support, 16 Vertical bracket 18 Vertical bracket 20 Lead frame 22 Wafer socket 24 Outer pin 26 Support rib 27 Dam bar 28 Inner pin 100 Lead frame strip 102 Horizontal bracket 106 Vertical bracket 108 Vertical bracket 110 Vertical bracket 150 Semiconductor package structure 152 Wafer 154 Connection Wire 156 Sealing plastic 200 Lead frame 206 Spring element 212 Wafer holder 208 L-shaped through

00634-TW. ptd 第11頁 封裝構造 明之去 殘膠 之 1231576 圖式簡單說明 214 外引腳 217壩桿 2 2 0 水滴狀貫穿開口 2 2 4 封膠區域 208 L形貫穿開口 300模具 3 1 0 模穴 3 2 0 上模穴 350轉移封模裝置 354 注膠道 358 衝擊銷 2 1 6 支撐肋條 218 内引腳 222 貫穿孔 2 0 6 彈簧元件 3 0 2 熔融之封膠塑料 31 2 注入口 3 2 2 下模穴 3 5 2 活塞 3 5 6 控制銷00634-en. Mold cavity 3 2 0 Upper mold cavity 350 Transfer mold sealing device 354 Injection channel 358 Impact pin 2 1 6 Support rib 218 Inner pin 222 Through hole 2 0 6 Spring element 3 0 2 Molten sealant plastic 31 2 Injection inlet 3 2 2 Lower cavity 3 5 2 Piston 3 5 6 Control pin

00634-TW. ptd 第12頁00634-TW. Ptd Page 12

Claims (1)

1231576 六、申請專利範圍 1、一種導線架之封模裝置，用以將一封膠塑料包封一半導 體封裝構造，該半導體封裝構造具有一導線架界定一封膠區| 域’並具有一貫穿開口，由該封膠區域内側延伸至外側，該| 封模裝置包含： 至少一模六，與該封膠區域相對應； 一注膠道，配置接近該貫穿開口，用以注入該封膠塑料； 以及 一控制銷，配置於該注膠道處。 2、依申請專利範圍第1項之導線架之封模裝置，其中該控制| 銷可相對於該導線架移動，如此以控制該封膠塑料注入之 度。 3加且依/_^曰專/^範圍第1項之導線架之封模裝置，其中該導 :條=二配置於該封膠區域之内，及複數個奮撑丨 一=承座’…穿一一一I 4、一種導線架之封模 田丨”时 體封裝構造，該半導矽：壯？將—封膠塑料包封-半導 域，該封模裝置包含：-衣構造具有一導線架界定一封膠區| ϊΐ膠ί穴查與該封膠區域相對應； -控制配=模穴1以注入該封膠塑料；以及 月配置於該注膠道處。 00634-TW. ptd 第13頁 ^231576 、、申請專利範園 5 N 鎖依申靖專利範圍第4項之導線架之封模裝置，其中該控制 可相對於該導線架移動，如此以控制該封膠塑料注入之速 條一、〃種導線架之封模系統，用以將封膠塑料包封一導線架 口，由該封膠區域内側延伸至外側，該封模系統 二之複數個導線架，每個該導線架皆界定一封膠區域，並具 有一貫穿開 包含： < t個模穴，與該封膠區域相對應； 複數個注膠道，配置接近該貫穿開口，用以注入該封膠塑 抖；以及 複數個控制銷，配置於該注膠道處。 依申請專利範圍第6項之導線架之封模系統，其中該4制 二可相對於該導線架移動，如此以控制該封膠塑料注入之速 度0 相、申請專利範圍第6項之導線架之封模系統，另包含複數 '銷，疋位與该貫穿開口相對應，用以衝掉該注膠道。 加依申請專利範圍第6項之導線架之封模系統，其中該導線 另包含複數個支架，用以支撐該導線架，並具有複數個 貝穿孔，且該注膠道通過該貫穿孔，該封模系統另包含複數1231576 6. Scope of patent application 1. A mold mounting device for a lead frame for encapsulating a piece of plastic with a semiconductor package structure. The semiconductor package structure has a lead frame defining an adhesive area | domain 'and has a through An opening extending from the inside to the outside of the sealing area, the | mold sealing device includes: at least one mold six corresponding to the sealing area; an injection channel configured near the through opening for injecting the sealing plastic ; And a control pin arranged at the injection channel. 2. The mold sealing device of the lead frame according to item 1 of the scope of the patent application, wherein the control | pin can be moved relative to the lead frame, so as to control the degree of injection of the sealing plastic. 3 plus and according to / _ ^ said special / ^ range of the lead frame of the mold sealing device, wherein the guide: strip = two arranged in the sealing area, and a plurality of struts 丨 one = bearing ' … Wrap one-on-one I 4, a lead frame of the mold field 丨 "time body packaging structure, the semiconducting silicon: Zhuang? Will-plastic encapsulated-semiconducting domain, the mold sealing device includes:-clothing structure There is a lead frame to define a glue area | ϊΐ 胶 ίcavity corresponding to the glue sealing area; -control distribution = mold cavity 1 to inject the glue plastic; and arranged at the glue injection channel. 00634-TW ptd page 13 ^ 231576, patent application Fanyuan 5 N lock Yishenjing patent scope of the lead frame mold sealing device, wherein the control can be moved relative to the lead frame, so as to control the sealing plastic The injection moulding system of the speed stick and the lead frame is used for encapsulating the plastic of a lead frame and extending from the inside to the outside of the sealing area. The lead frame of the mold sealing system includes a plurality of lead frames. Each of the lead frames defines a glue area, and has a through opening including: < t mold cavities, and the seal glue Corresponds to the area; a plurality of glue injection channels are arranged close to the through opening for injecting the plastic sealing plastic shake; and a plurality of control pins are arranged at the glue injection channels. The mold sealing system, in which the 4 and 2 can be moved relative to the lead frame, so as to control the injection speed of the sealing plastic 0 phase, the lead frame sealing system of item 6 of the patent application, and also includes a plurality of 'pins, The position corresponds to the through-opening, and is used to flush out the glue injection channel. The sealing system of the lead frame according to item 6 of the patent application, wherein the lead further includes a plurality of brackets for supporting the lead frame, And has a plurality of shell perforations, and the injection channel passes through the through hole, the mold sealing system further includes a plurality of 第14頁 1231576 六、申請專利範圍 個衝擊銷，定位與該貫穿孔相對應，用以衝掉該注膠道。 1 0、依申請專利範圍第6項之導線架之封模系統，其中該導 線架具有一晶片承座，配置於該封膠區域之内，及複數個支 撐肋條支撐該晶片承座，且該貫穿開口係配置於該複數個支 撐肋條中之一者上。Page 14 1231576 VI. Scope of patent application An impact pin is positioned corresponding to the through hole to flush out the injection channel. 10. The mold-sealing system for a lead frame according to item 6 of the scope of the patent application, wherein the lead frame has a wafer holder disposed in the sealing area, and a plurality of supporting ribs support the wafer holder, and the The through opening is arranged on one of the plurality of support ribs. 00634-TW. ptd 第15頁00634-TW. Ptd Page 15
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