CN101844328A - The apparatus and method that are used for cleaning polishing cloth - Google Patents
The apparatus and method that are used for cleaning polishing cloth Download PDFInfo
- Publication number
- CN101844328A CN101844328A CN201010141121A CN201010141121A CN101844328A CN 101844328 A CN101844328 A CN 101844328A CN 201010141121 A CN201010141121 A CN 201010141121A CN 201010141121 A CN201010141121 A CN 201010141121A CN 101844328 A CN101844328 A CN 101844328A
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- Prior art keywords
- abrasive cloth
- cloth
- nozzle
- abrasive
- workpiece
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The present invention relates to be used for the apparatus and method of cleaning polishing cloth, the device that is used for cleaning polishing cloth of the present invention can improve the rinse water that abrasive cloth is subjected to pressure, guarantee to remove deposit and improve grinding efficiency from abrasive cloth.This device that is used for cleaning polishing cloth is used for following milling apparatus: at this milling apparatus, workpiece is forced on the abrasive cloth that adheres to abrasive sheet, when lapping liquid is supplied to abrasive cloth workpiece is moved with respect to abrasive sheet, thus grinding work-piece.This device that is used for cleaning polishing cloth comprises that have can be to the nozzle unit of abrasive cloth inject high pressure rinse water with the nozzle of cleaning polishing cloth.Described nozzle is a straight nozzle, this straight nozzle can linearity ground jet cleaning water and with abrasive cloth jet cleaning water vertically.
Description
Technical field
The present invention relates to be used for the apparatus and method of cleaning polishing cloth.
Background technology
For example workpiece such as semiconductor crystal wafer is ground in milling apparatus as follows: workpiece is pressed onto the abrasive cloth that adheres to abrasive sheet; Abrasive sheet is moved with respect to workpiece; And in grinding work-piece, lapping liquid (slurry) is supplied to abrasive cloth.
Incidentally, under the situation of long-time use abrasive cloth, for example various deposits such as abrasive dust, lapping liquid, reaction product are deposited on abrasive cloth gradually.Deposit will cause some problems, for example, reduces grinding efficiency, damage workpiece.Therefore, high-pressure wash water is periodically sprayed to abrasive cloth with cleaning polishing cloth.
A conventional clean device is disclosed in Japanese kokai publication hei 7-9340A.This conventional clean device sprays high pressure (about 50kg/cm2) rinse water to abrasive cloth obliquely from nozzle, makes deposit in the abrasive cloth float and is removed.Notice that nozzle can be surrounded to prevent that high-pressure wash water from splashing by the brush portion part.
Yet in above-mentioned conventional apparatus, deposits such as for example abrasive dust in the abrasive cloth can not be removed fully, can not obtain desired grinding efficiency.
Because the high-pressure wash water of Pen Sheing is with the diffusion of fan-shaped form with being tilted, deposit can not be removed fully.It is less because of the rinse water pressure of the suffered cellar area of abrasive cloth that the present inventor thinks, so can not address this problem fully.
Recently, abrasive cloth mainly is made of foamed polyurethane.Compare with the abrasive cloth that constitutes by nonwoven, more be difficult to remove deposit from the abrasive cloth that constitutes by foamed polyurethane by jet cleaning water.
Summary of the invention
Therefore, the purpose of one aspect of the present invention is to be provided for the apparatus and method of cleaning polishing cloth, its can improve the suffered rinse water of abrasive cloth pressure, guarantee to remove deposit and improve grinding efficiency from abrasive cloth.
For realizing this purpose, a kind of device that is used for cleaning polishing cloth is provided, this device is used to following milling apparatus: in this milling apparatus, workpiece is forced on the abrasive cloth that adheres to abrasive sheet, when lapping liquid is supplied to abrasive cloth, workpiece is moved with respect to abrasive sheet, thereby grinding work-piece, this device comprises: nozzle unit, this nozzle unit has can be to the nozzle of abrasive cloth inject high pressure rinse water with cleaning polishing cloth, nozzle be can linearity ground jet cleaning water and with the abrasive cloth straight nozzle of jet cleaning water vertically.
In this device, nozzle unit can comprise a plurality of nozzles.
This device can also comprise the unit that is used for moving nozzle unit above abrasive sheet.
Then, a kind of method that is used for cleaning polishing cloth is provided, this method is used for following milling apparatus: at this milling apparatus, workpiece is forced on the abrasive cloth that adheres to abrasive sheet, when lapping liquid is supplied to abrasive cloth, workpiece is moved with respect to abrasive sheet, thereby grinding work-piece, this method comprise the steps: nozzle from nozzle unit to abrasive cloth inject high pressure rinse water with cleaning polishing cloth, wherein, nozzle is a straight nozzle, and straight nozzle linearity ground jet cleaning water and with abrasive cloth jet cleaning water vertically.
In the method, the pressure of the rinse water that is subjected to of abrasive cloth can be approximately equal to or be applied to during greater than grinding work-piece the grinding load (polishing load) of workpiece.
For example, the pressure of the rinse water that is subjected to of abrasive cloth is 150～350gf/cm
2
In the method, the main material of abrasive cloth can be a foamed polyurethane.
In the method, in cleaning polishing cloth, in straight nozzle jet cleaning water can so that nozzle unit above abrasive sheet, move.
In the present invention,, can increase the pressure of the rinse water that abrasive cloth is subjected to, make that the deposits such as for example abrasive dust in the abrasive cloth can be removed fully by adopting straight nozzle.Therefore, can prevent damage widely, and can improve grinding precision surface of the work.In addition, can improve grinding efficiency, shorten milling time, can prolong the service life of abrasive cloth.
Objects and advantages of the present invention can be utilized particularly the element that proposes in the claims and combination to realize and obtain.
Should be appreciated that previous general introduction and detailed description subsequently all are exemplary with illustrative, and be not in order to limit as the present invention for required protection.
Description of drawings
To and embodiments of the present invention be described with reference to the accompanying drawings by example now, in the accompanying drawings:
Fig. 1 is the key diagram of milling apparatus;
Fig. 2 is the key diagram of another example of grinding head;
Fig. 3 is the key diagram of cleaning device;
Fig. 4 is the key diagram of nozzle unit.
The specific embodiment
Describe preferred implementation of the present invention in detail referring now to accompanying drawing.
Fig. 1 is the key diagram that the profile of milling apparatus 10 is shown.
For example workpiece 20 such as semiconductor crystal wafer is maintained at the following side of each grinding head 18.Each grinding head 18 is rotated by known driving mechanism (not shown) such as for example motors with rotating shaft 22.Each grinding head 18 by for example piston-cylinder unit etc. up and down driving mechanism move up and down.
Lapping liquid supply nozzle 24 with lapping liquid supply to abrasive cloth 16 above.
Known various types of grinding head is not so limit the type of grinding head 18 of the present invention.For example, as shown in Figure 2, grinding head 18 can be able to be remained on rotationally keeps roller 28 and between the central roller 26 at the central portion place of abrasive sheet 12, each keep roller 28 can the outer fix in the outside of abrasive sheet 12 with along mobile between the inner side of the outer rim of abrasive sheet 12.Each keeps roller 28 to be kept around the rocking arm (swingarm) that axle 30 rotates.
Then, Fig. 3 is the key diagram that the embodiment of the device 34 that is used for cleaning polishing cloth 16 is shown.
Cleaning device 34 is positioned at the side of the abrasive sheet 12 of milling apparatus 10.
Lifting platform 36 moves up and down by known mechanisms such as for example piston-cylinder units 38.The movable member 40 that can move to abrasive sheet 12 and can leave abrasive sheet 12 is set at lifting platform 36.Movable member 40 moves back and forth by suitable known mechanisms (mobile unit).Structure to mobile unit does not limit.For example, movable member 40 can move back and forth by ball-screw or the piston-cylinder unit that is arranged at lifting platform 36.
As shown in Figure 4, straight nozzle (straight nozzle) 50 is installed to nozzle unit 48.Straight nozzle 50 vertically is fixed to the housing 54 of nozzle unit 48 by fixture (fixture) 52.Straight nozzle 50 can not have diffusely, linearity ground is towards abrasive cloth 16 inject high pressure rinse water, and can with the ground jet cleaning water that meets at right angles above the abrasive cloth 16.
High-pressure wash water is fed into straight nozzle 50 via flexible pipe arrangement 56 and the pipe arrangement 58 that is set at movable member 40 and arm 46.Brush member 60 be set at housing 54 below.The outlet that brush member 60 surrounds nozzle 50 is to prevent splash (splash) of high-pressure wash water, and wherein, high-pressure wash water is injected to abrasive cloth 16 from this outlet.
In above-mentioned example, mobile unit is moving nozzle unit 48 point-blank as described above, and still, mobile unit can reciprocally be rotated the arm 46 that is provided with nozzle unit 48 around the axle 47 shown in Fig. 2.
In addition, nozzle unit 48 can have a plurality of nozzle 50 (not shown).In this case, for example, nozzle 50 can be set to and be disposed at point-blank arm 46.
Then, will the step of cleaning polishing cloth 16 be described.
In grinding work-piece 20, movable member 40 is moved backward, and nozzle unit 48 has been placed in position of readiness can not hinder the carrying out of grinding work-piece 20.
After workpiece 20 is finished grinding, the processing of beginning cleaning polishing cloth 16.At first, movable member 40 is moved to abrasive sheet 12 tops, and nozzle unit 48 radially moves back and forth the length of the radius of abrasive sheet 12 on abrasive cloth 16, simultaneously high-pressure wash water is sprayed to abrasive cloth 16 from straight nozzle 50.Abrasive sheet 12 is rotated.Utilize this action, the whole surface of energy cleaning polishing cloth 16.
The cleaning device 34 of the embodiment shown in the utilization has carried out once experiment.The surface of straight nozzle 50 and the abrasive cloth 16 ground jet cleaning water that meets at right angles.The spray angle of rinse water is a zero degree, and just, rinse water is sprayed to abrasive cloth 16 by near linear shape ground, and not diffusion.The pressure of the rinse water of spraying from straight nozzle 50 is 13Mpa, and emitted dose is 1l/min.The internal diameter of the outlet of nozzle 50 is about 4mm, and the pressure of the suffered rinse water of abrasive cloth 16 is 270gf/cm
2Note, when grinding work-piece 20, for example about 150gf/cm
2Predetermined load be applied to abrasive cloth 16 from workpiece 20.
Distance between straight nozzle 50 and the abrasive cloth 16 is about 100mm.But, straight nozzle 50 near linear shape ground jet cleaning water, thus the pressure that abrasive cloth 16 is subjected to can not be subjected to the influence of the distance between straight nozzle 50 and the abrasive cloth 16.Even this variable in distance approximately ± 20mm, the pressure that abrasive cloth 16 is subjected to is approximately constant also.Therefore, do not need strictly to set distance between straight nozzle 50 and the abrasive cloth 16.
In addition, also compare experiment.The surface of plain nozzle and abrasive cloth is jet cleaning water vertically.The spray angle of rinse water is 25 degree, in order to cleaning polishing cloth.From the pressure of the rinse water of nozzle ejection is 13Mpa, and emitted dose is 1l/min, identical with above-mentioned experiment.The internal diameter of the outlet of nozzle is about 4mm, and the pressure of the rinse water that is subjected to of abrasive cloth is about 80gf/cm
2When grinding work-piece, for example about 150gf/cm
2Predetermined load be applied to abrasive cloth from workpiece.
Distance between plain nozzle and the abrasive cloth is about 100mm, and is identical with above-mentioned experiment.
According to the experiment that the cleaning device 34 of this embodiment carries out, the pressure that abrasive cloth 16 is subjected to can increase by using straight nozzle 50.By improving described pressure, main material is that the deposits such as for example abrasive dust in the abrasive cloth 16 of foamed polyurethane can suitably be removed.In comparative example, the surface of workpiece sustains damage; On the other hand, in the embodiment that the device by this embodiment carries out, deposit can suitably be removed, thereby can reduce the damage of the abradant surface of workpiece 20 greatly.In the device 34 of this embodiment, half (1/2) of the incidence of the damage of the incidence of damage the chances are comparative example.Therefore, can improve grinding precision.Grinding efficiency (milling time) can improve about 10%.The frequency of finishing (dressing) abrasive cloth 16 can once reduce to per 10 batches from per 3 batches and carry out once.Therefore, can prolong the service life of abrasive cloth 16.
By adopting straight nozzle 50, even the variable in distance between nozzle 50 and the abrasive cloth 16, the pressure that abrasive cloth 16 is subjected to is approximately constant also.Therefore, can omit meticulous adjustment for the distance between nozzle 50 and the abrasive cloth 16.
Notice that by adopting straight nozzle 50, jet cleaning water regional less is so need the whole surface of the time cleaning polishing cloth 16 of length.But if 20% or following not being cleaned on the surface of abrasive cloth 16, the abradant surface of workpiece 20 also has enough qualities.
If the pressure that abrasive cloth 16 is subjected to is bigger, then increased cleaning action (detergency).But if described pressure is excessive, abrasive cloth 16 will break.When grinding work-piece 20, the pressure that is applied to abrasive cloth 16 from workpiece 20 is 150-300gf/cm
2The pressure that abrasive cloth 16 is subjected to can be less times greater than this pressure.For example, the suitable pressure that is subjected to of abrasive cloth 16 is 150-350gf/cm
2
In the above-described embodiment, milling apparatus is one-sided milling apparatus, and still, cleaning device of the present invention can clean the abrasive cloth of double-side grinding equipment.
Here the whole examples mentioned and conditional language intention are used for the purpose of teaching, to help the present invention and the notion of reader understanding by inventor's contribution, progress with the promotion technology, the present invention is appreciated that and is not limited to example and the condition of being mentioned especially, and the tissue of the example in the specification is not that Pros and Cons of the present invention is shown.Although described embodiments of the present invention in detail, should be appreciated that and under situation without departing from the spirit and scope of the present invention, can make various changes, replacement and modification.
Quoting of related application
The application is based on the Japanese patent application No.P2009-79630 that submitted on March 27th, 2009, and requires the priority of this Japanese patent application, and the full content of this Japanese patent application is contained in this by reference.
Claims (10)
1. device that is used for cleaning polishing cloth, this device is used to following milling apparatus: in this milling apparatus, workpiece is forced on the abrasive cloth that adheres to abrasive sheet, when lapping liquid is supplied to described abrasive cloth, described workpiece is moved with respect to described abrasive sheet, thereby grind described workpiece
Described device comprises:
Nozzle unit, described nozzle unit have can be to described abrasive cloth inject high pressure rinse water cleaning the nozzle of described abrasive cloth,
Wherein, described nozzle is to spray described rinse water and vertically to spray the straight nozzle of described rinse water with described abrasive cloth in linearity ground.
2. device according to claim 1 is characterized in that,
Described nozzle unit comprises a plurality of described nozzles.
3. device according to claim 1 is characterized in that,
Described device also is included in the unit that described nozzle unit is moved in described abrasive sheet top.
4. device according to claim 2 is characterized in that,
Described device also is included in the unit that described nozzle unit is moved in described abrasive sheet top.
5. method that is used for cleaning polishing cloth, this method is used for following milling apparatus: at this milling apparatus, workpiece is forced on the abrasive cloth that adheres to abrasive sheet, when lapping liquid is supplied to described abrasive cloth workpiece is moved with respect to described abrasive sheet, thereby grind described workpiece
Described method comprises the steps:
From the nozzle of nozzle unit to described abrasive cloth inject high pressure rinse water cleaning described abrasive cloth,
Wherein, described nozzle is a straight nozzle, and
Described straight nozzle linearity ground sprays described rinse water and vertically sprays described rinse water with described abrasive cloth.
6. method according to claim 5 is characterized in that,
The pressure of the described rinse water that described abrasive cloth is subjected to is approximately equal to or loads greater than the grinding that is applied to described workpiece when grinding described workpiece.
7. method according to claim 5 is characterized in that,
The pressure of the described rinse water that described abrasive cloth is subjected to is 150gf/cm
2～350gf/cm
2
8. method according to claim 6 is characterized in that,
The pressure of the described rinse water that described abrasive cloth is subjected to is 150gf/cm
2～350gf/cm
2
9. method according to claim 5 is characterized in that,
The main material of described abrasive cloth is a foamed polyurethane.
10. method according to claim 5 is characterized in that,
When cleaning described abrasive cloth, described nozzle unit is moved above described abrasive sheet.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009079630A JP2010228058A (en) | 2009-03-27 | 2009-03-27 | Washing device and washing method for abrasive cloth |
| JP2009-079630 | 2009-03-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101844328A true CN101844328A (en) | 2010-09-29 |
Family
ID=42245563
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010141121A Pending CN101844328A (en) | 2009-03-27 | 2010-03-25 | The apparatus and method that are used for cleaning polishing cloth |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20100248597A1 (en) |
| EP (1) | EP2236245A3 (en) |
| JP (1) | JP2010228058A (en) |
| KR (1) | KR20100108254A (en) |
| CN (1) | CN101844328A (en) |
| TW (1) | TW201103697A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109937117A (en) * | 2016-11-15 | 2019-06-25 | 胜高股份有限公司 | The edge polishing device and method of chip |
| CN111482901A (en) * | 2020-04-30 | 2020-08-04 | 杨圣 | Cleaning device of chemical mechanical polishing equipment |
| CN114786871A (en) * | 2020-01-09 | 2022-07-22 | 信越半导体株式会社 | Cleaning device of grinding device |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102615589B (en) * | 2012-04-12 | 2014-09-24 | 浙江金瑞泓科技股份有限公司 | Polishing system and polishing method using polishing disk guide disc |
| US9754622B2 (en) | 2014-03-07 | 2017-09-05 | Venmill Industries Incorporated | Methods for optimizing friction between a pad and a disc in an optical disc restoration device |
| US9620166B2 (en) | 2012-05-18 | 2017-04-11 | Venmill Industries | Methods for restoring optical discs |
| EP2850614A4 (en) * | 2012-05-18 | 2016-01-20 | Venmill Ind | Device, methods and systems for restoring optical discs |
| JP6146375B2 (en) * | 2014-06-12 | 2017-06-14 | 信越半導体株式会社 | Polishing pad cleaning method and wafer polishing method |
| JP2017121672A (en) | 2016-01-05 | 2017-07-13 | 不二越機械工業株式会社 | Method for polishing workpiece and method for dressing polishing pad |
| US10096460B2 (en) * | 2016-08-02 | 2018-10-09 | Semiconductor Components Industries, Llc | Semiconductor wafer and method of wafer thinning using grinding phase and separation phase |
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- 2010-03-12 TW TW099107177A patent/TW201103697A/en unknown
- 2010-03-25 CN CN201010141121A patent/CN101844328A/en active Pending
- 2010-03-25 KR KR1020100026642A patent/KR20100108254A/en not_active Application Discontinuation
- 2010-03-26 US US12/732,904 patent/US20100248597A1/en not_active Abandoned
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109937117A (en) * | 2016-11-15 | 2019-06-25 | 胜高股份有限公司 | The edge polishing device and method of chip |
| CN109937117B (en) * | 2016-11-15 | 2021-06-22 | 胜高股份有限公司 | Edge polishing device and method for wafer |
| CN114786871A (en) * | 2020-01-09 | 2022-07-22 | 信越半导体株式会社 | Cleaning device of grinding device |
| CN114786871B (en) * | 2020-01-09 | 2024-03-08 | 信越半导体株式会社 | Cleaning device for grinding device |
| CN111482901A (en) * | 2020-04-30 | 2020-08-04 | 杨圣 | Cleaning device of chemical mechanical polishing equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| EP2236245A3 (en) | 2013-09-11 |
| TW201103697A (en) | 2011-02-01 |
| EP2236245A2 (en) | 2010-10-06 |
| JP2010228058A (en) | 2010-10-14 |
| KR20100108254A (en) | 2010-10-06 |
| US20100248597A1 (en) | 2010-09-30 |
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Application publication date: 20100929 |