CN1402313A - Grinding pad recovery device structure and use - Google Patents
Grinding pad recovery device structure and use Download PDFInfo
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- CN1402313A CN1402313A CN 02140921 CN02140921A CN1402313A CN 1402313 A CN1402313 A CN 1402313A CN 02140921 CN02140921 CN 02140921 CN 02140921 A CN02140921 A CN 02140921A CN 1402313 A CN1402313 A CN 1402313A
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- grinding pad
- water
- restorer
- grinding
- ultrasonic oscillator
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Abstract
A restoring device for the grinding pad is composed of high-pressure water supplying tube, ultrasonic oscillator, water tank and water knife emitter in the water tank for emitting water knife toward the grinding pad to clean it when said restoring device and grinding pad move oppositely.
Description
Technical field
The present invention relates to a kind of apparatus structure and application thereof that is applied to the semiconductor fabrication process, particularly relate to structure and the application thereof of a kind of grinding pad restorer (Polishing Pad Conditioner), this grinding pad restorer utilize water cutter (Water Knife) come cleaning chemistry mechanical lapping manufacture craft (ChemicalMechanical Polishing, CMP) in employed grinding pad (Polishing Pad).
Background technology
After semiconductor fabrication process entered time micron field, cmp had become an indispensable manufacture craft technology, for example is in the manufacture craft of copper conductor.This is that the manufacture craft of copper conductor is still based on damascene (Damascene) fiting chemical mechanical lapping manufacture craft because before the etching technique prematurity still of copper.
The basic practice of cmp manufacture craft is as follows: the grinding pad with rough surface at first is provided, then wafer is pressed on the grinding pad of rotation, cooperate the surface that slurry polishes wafer of grinding with abrasive grains simultaneously.Grinding pad generally can be divided into hard grinding pad and soft grinding pad, and the former material is that (Polyurethane is main PU), and the latter's material then is based on adhesive-bonded fabric with polyurethane.Because grinding pad in use for some time, its rough surface can the attached many grinding waste materials of embedding and reduce its grinding rate, so generally can use the grinding pad restorer to remove grinding waste material on the grinding pad.Grinding pad restorer commonly used can be divided into two kinds of diamond grains type and bristle-type, and wherein the diamond grains type is commonly used to the cleaning hard grinding pad, and bristle-type is commonly used to clean soft grinding pad.
Yet because the relation of material hardness, above-mentioned two kinds of grinding pad restorers all can injure the surface of grinding pad, and shorten its service time.In addition, diamond grains on the grinding pad restorer and bristle also might come off on grinding pad, make this grinding pad cause the defective of wafer surface in CMP manufacture craft backward, as the defective of scratch (Scratching) and so on.
Summary of the invention
The object of the present invention is to provide a kind of structure and application thereof of grinding pad restorer, to address the above problem.
The object of the present invention is achieved like this, and a kind of structure of grinding pad restorer promptly is provided, comprising a water under high pressure input pipe, a ultrasonic oscillator (Ultrasonic Oscillator), an aqua storage tank and a water knife emitter.Wherein, the water under high pressure input pipe is used for supplying a High-Pressure Water, and ultrasonic oscillator is connected the end of water under high pressure input pipe, and supplying energy is given High-Pressure Water.Aqua storage tank is connected with ultrasonic oscillator, and is used for storing the High-Pressure Water of ultrasonic oscillator of flowing through.Water knife emitter is positioned on the aqua storage tank, and this water knife emitter is used for spraying High-Pressure Water, thereby forms a water cutter with the cleaning grinding pad.
The present invention also proposes a kind of method that cleans grinding pad, and its grinding pad restorer by the invention described above is reached.The method makes grinding pad restorer and grinding pad do relative motion, and the water cutter that the grinding pad restorer is produced is able to the inswept grinding pad whole district, to reach the purpose of comprehensive cleaning.
As mentioned above; because grinding pad restorer of the present invention cleans grinding pad by the formed water cutter of High-Pressure Water; but not as existing grinding pad restorer, there is an entity directly to contact with grinding pad; so can not damage the surface of grinding pad, and do not have that foreign material such as diamond grains or bristle drop on the grinding pad and the defective that causes wafer.
Description of drawings
Fig. 1 is first kind of grinding pad restorer of the embodiment of the invention, and wherein nozzle opening is point-like;
Fig. 2 is second kind of grinding pad restorer of the embodiment of the invention, and wherein nozzle opening is slit-shaped;
Fig. 3 is the schematic diagram of first kind of grinding pad clean method of the embodiment of the invention, and wherein mobile person is the grinding pad restorer;
Fig. 4 is the schematic diagram of second kind of grinding pad clean method of the embodiment of the invention, and wherein rotation person is a grinding pad;
Fig. 5 is the schematic diagram of the third grinding pad clean method of the embodiment of the invention, is one to rewind the formula grinding pad by the scrolling person wherein.
Concrete implementation content
Two kinds of grinding pad restorers of present embodiment at first are described.
Please refer to Fig. 1, it is first kind of grinding pad restorer of the embodiment of the invention.As shown in Figure 1, grinding pad restorer 100 comprises water under high pressure input pipe 110, ultrasonic oscillator 120, thin-and-long aqua storage tank 130, and the point-like open nozzles 140 that forms a line.Above-mentioned water under high pressure input pipe 110 is used for importing High-Pressure Water 10, and the pressure of this High-Pressure Water 10 for example is about 100psi (pound per squareinch).Ultrasonic oscillator 120 is connected water under high pressure input pipe 110 ends, the frequency of this ultrasonic oscillator 120 is for example between between the 20kHz to 60kHz, and be used for energize to High-Pressure Water 10, this energy stores with the state of " bubble ", and its principle will be in following explanation.
One end of thin-and-long aqua storage tank 130 is connected with ultrasonic oscillator 120, and thin-and-long aqua storage tank 130 is used for storing the High-Pressure Water 10 of ultrasonic oscillator 120 of flowing through.Point-like open nozzles 140 is positioned at the other end of thin-and-long aqua storage tank 130, and is used for penetrating High-Pressure Water 10 and becomes water cutter 150, and cleans grinding pad thus.These point-like open nozzles 140 with arrange must be enough closely, and preferable situation becomes continuously the water cutter 150 of ejaculation and the average water curtain of flow everywhere, so could remove the grinding waste material on the grinding pad equably.
Please refer to Fig. 2, it is the another kind of grinding pad restorer of the embodiment of the invention.As shown in Figure 2, grinding pad restorer 200 comprises water under high pressure input pipe 210, ultrasonic oscillator 220, thin-and-long aqua storage tank 230, and slit-shaped openings nozzle 240, wherein have only in slit-shaped openings nozzle 240 and the grinding pad restorer 100 counterpart different, and the water cutter 250 that slit-shaped openings nozzle 240 is sprayed is easy to become continuously and the average water curtain of flow everywhere, and is removed the grinding waste material on the grinding pad equably.
Above-mentioned two kinds of grinding pad restorers all are the impulsive forces by water cutter 150/250, and the energy that provided of ultrasonic oscillator 120/220 removes the grinding waste material on the grinding pad, and wherein ultrasonic oscillator 120/220 provides the principle of energy to be summarized as follows.Ultrasonic oscillator 120/220 can cause the disturbance of hydraulic pressure in water, thereby produces numerous air-bubble, can produce power when these bubbles collapse stain; That is to say that supersonic energy can store with the kenel of bubble.Because these bubbles have certain lifetime (Lifetime), so High-Pressure Water 10 is provided after the energy by ultrasonic oscillator 120/220, when becoming water cutter 150/250 through thin-and-long aqua storage tank 130/230 with point-like/slit-shaped openings nozzle 140/240 again, bubble still can exist, and collapse and released energy will be on being sprayed to grinding pad the time, make that grinding waste material on the grinding pad is loosening and be easy to remove.
On the other hand, the clean method of three kinds of grinding pads of present embodiment is described as follows, the common ground of these three kinds of methods all is to make grinding pad restorer and grinding pad do relative motion, so that the water cutter of grinding pad restorer manufacturing can clean grinding pad comprehensively.
Please refer to Fig. 3, it shows first kind of grinding pad clean method of the embodiment of the invention.The method is a fixed abrasive pad sheet 300, and being the center of circle a bit near the major axis (shown in dotted line) of microscler aqua storage tank 130, spin finishing pad restorer 100 on a plane on parallel grinding pad 300 surfaces, so that the water cutter (is covered by grinding pad restorer 100, so not shown) inswept grinding pad 300 whole districts, and reach the purpose of comprehensive cleaning.
Please refer to Fig. 4, it shows second kind of grinding pad clean method of the embodiment of the invention.The method fixed abrasive pad sheet restorer 100, and make grinding pad 300 rotation so that the inswept grinding pad of water cutter (being covered by grinding pad restorer 100, so not shown) 300 whole districts, and is reached the purpose of comprehensive cleaning.In practical application, grinding pad 300 can be placed on the rotary-type CMP board, again grinding pad restorer 100 is moved to a location, rotate grinding pad 300 then.In addition, among Fig. 4 and draw wafer putting position 310, to compare the size of grinding pad restorer 100.
Please refer to Fig. 5, it shows the third grinding pad clean method of the embodiment of the invention, and wherein grinding pad 500 is one to rewind the formula grinding pad, and they are different with the cleaning object in preceding two kinds of clean methods.The method fixed abrasive pad sheet restorer 100 is nested with grinding pad 500 on second wheel 520 again, and by roller 520 rolling grinding pads 500, with the inswept grinding pad of water cutter 150 500 whole districts, reaches the purpose of comprehensive cleaning.In practical application, grinding pad 500 can be placed one rewind on the formula CMP board, again grinding pad restorer 500 is moved to a location, the scrolling grinding pad 500 then.In addition, among Fig. 5 and draw wafer putting position 510, to compare the size of grinding pad restorer 100.
As mentioned above; because the grinding pad restorer 100/200 of the embodiment of the invention cleans grinding pad by High-Pressure Water 10 formed water cuttves 150/250; but not as existing grinding pad restorer, there is an entity directly to contact with grinding pad; so can not damage the surface of grinding pad, and do not have that foreign material such as diamond grains or bristle drop on the grinding pad and the defective that causes wafer.
Though disclosed the present invention in conjunction with an above preferred embodiment; yet it is not in order to limit the present invention; any those skilled in the art can be used for a variety of modifications and variations without departing from the spirit and scope of the present invention, so protection scope of the present invention should be with being as the criterion that claim was defined.
Claims (18)
1. the structure of a grinding pad restorer is applicable to cleaning one grinding pad, and this structure comprises:
One water under high pressure input pipe, it is used for importing a High-Pressure Water;
One ultrasonic oscillator, it is connected this water under high pressure input pipe end, and this High-Pressure Water is this ultrasonic oscillator of flowing through, and by this ultrasonic oscillator energize;
One aqua storage tank, it is connected with this ultrasonic oscillator, and this aqua storage tank is used for storing this High-Pressure Water of this ultrasonic oscillator of flowing through; And
One water knife emitter, its be the position on this aqua storage tank, and be to be used for penetrating this High-Pressure Water and to become a water cutter, this water cutter is to be used for cleaning this grinding pad person.
2. the structure of grinding pad restorer as claimed in claim 1, wherein the pressure of this High-Pressure Water is about 100psi.
3. the structure of grinding pad restorer as claimed in claim 1, wherein the frequency of this ultrasonic oscillator is between between the 20kHz to 60kHz.
4. the structure of grinding pad restorer as claimed in claim 1, wherein this aqua storage tank comprises a thin-and-long aqua storage tank.
5. the structure of grinding pad restorer as claimed in claim 4, wherein this water knife emitter on this thin-and-long aqua storage tank comprises a plurality of point-like open nozzles that form a line at least.
6. the structure of grinding pad restorer as claimed in claim 5, wherein the arrangement of this each point-like open nozzles is enough tight, this water cutter of ejection is become continuously and the average water curtain of flow everywhere.
7. the structure of grinding pad restorer as claimed in claim 4, wherein this water knife emitter comprises at least one slit-shaped openings nozzle, and the trend of this slit-shaped openings nozzle is parallel with this thin-and-long aqua storage tank.
8. a method that cleans grinding pad comprises the following steps:
A grinding pad to be cleaned is provided; And
Use a grinding pad restorer to clean this grinding pad, wherein this grinding pad restorer and this grinding pad are done a relative motion, clean this grinding pad, and this grinding pad restorer comprise thus comprehensively:
One water under high pressure input pipe, it is used for importing a High-Pressure Water;
One ultrasonic oscillator, it is connected this water under high pressure input pipe end, this High-Pressure Water this ultrasonic oscillator of flowing through, and by this ultrasonic oscillator energize;
One thin-and-long aqua storage tank, it is connected with this ultrasonic oscillator, and is used for storing this High-Pressure Water of this ultrasonic oscillator of flowing through; And
One thin-and-long water knife emitter, it is positioned on this thin-and-long aqua storage tank, and is used for penetrating this High-Pressure Water and becomes a water cutter, to clean this grinding pad.
9. the method for cleaning grinding pad as claimed in claim 8, the method for wherein carrying out this relative motion comprises:
Fix this grinding pad;
This water cutter of this grinding pad restorer is aimed at this grinding pad; And
With near the specified point the major axis of this microscler aqua storage tank is the center of circle, this grinding pad restorer of rotation on a specific plane on parallel this grinding pad surface, and make this water cutter can inswept this grinding pad whole district.
10. the method for cleaning grinding pad as claimed in claim 8, the method for wherein carrying out this relative motion comprises:
Fix this grinding pad restorer, and make this water cutter aim at this grinding pad; And
Make the rotation of this grinding pad, make this water cutter can inswept this grinding pad whole district.
11. the method for cleaning grinding pad as claimed in claim 10, the method for wherein carrying out this relative motion comprises:
This grinding pad is put on a rotary work-table of chemicomechanical grinding mill;
This grinding pad restorer is moved to a location of this grinding pad top; And
Make this rotary work-table of chemicomechanical grinding mill drive this grinding pad rotation.
12. the method for cleaning grinding pad as claimed in claim 8, wherein this grinding pad is one to rewind the formula grinding pad, and the method for carrying out this relative motion comprises:
This is rewinded the formula grinding pad is placed on a plurality of rollers;
Fix this grinding pad restorer, and make this water cutter aim at this to rewind the formula grinding pad; And
This rewinds the formula grinding pad with this each roller scrolling, makes inswept this grinding pad whole district of this water cutter.
13. the method for cleaning grinding pad as claimed in claim 12, the method for wherein carrying out this relative motion comprises:
This is rewinded the formula grinding pad place one to rewind on the formula work-table of chemicomechanical grinding mill, this rewinds has this each roller on the formula work-table of chemicomechanical grinding mill;
This grinding pad restorer is moved to a location of this grinding pad top; And
This rewinds the formula grinding pad with this each roller scrolling.
14. the method for cleaning grinding pad as claimed in claim 8, wherein the pressure of this High-Pressure Water is about 100psi.
15. the method for cleaning grinding pad as claimed in claim 8, wherein the frequency of this ultrasonic oscillator is between between the 20kHz to 60kHz.
16. the method for cleaning grinding pad as claimed in claim 8, wherein this thin-and-long water knife emitter comprises a plurality of point-like open nozzles of lining up at least one row.
17. the method for cleaning grinding pad as claimed in claim 16, wherein the arrangement of this each point-like open nozzles is enough tight, and this water cutter of ejaculation is become continuously and the average everywhere water curtain of flow.
18. the method for cleaning grinding pad as claimed in claim 8, wherein this thin-and-long water knife emitter comprises at least one slit-shaped openings nozzle, and the trend of this slit-shaped openings nozzle is parallel with this thin-and-long aqua storage tank.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/921,414 US20030015215A1 (en) | 2001-07-20 | 2001-08-02 | Polishing pad conditioner and application thereof |
| US09/921,414 | 2001-08-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1402313A true CN1402313A (en) | 2003-03-12 |
Family
ID=25445395
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 02140921 Pending CN1402313A (en) | 2001-08-02 | 2002-07-10 | Grinding pad recovery device structure and use |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1402313A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101947525A (en) * | 2006-12-19 | 2011-01-19 | 朗姆研究公司 | Million precision cleanings of semiconductor manufacturing equipment assembly and parts |
| CN102416596A (en) * | 2011-05-26 | 2012-04-18 | 上海华力微电子有限公司 | Device for improving wafer surface scratched by fixed abrasive polishing pad |
| CN102485426A (en) * | 2010-12-03 | 2012-06-06 | 中芯国际集成电路制造(上海)有限公司 | Grinding pad finisher and grinding pad finishing method |
| CN103252721A (en) * | 2012-02-15 | 2013-08-21 | 台湾积体电路制造股份有限公司 | Cmp pad cleaning apparatus |
| CN112476228A (en) * | 2019-08-23 | 2021-03-12 | 台湾积体电路制造股份有限公司 | Method for operating chemical mechanical planarization tool |
| CN115464471A (en) * | 2022-09-15 | 2022-12-13 | 湘潭大学 | Ultrasonic auxiliary polishing device capable of self-adapting to irregular complex curved surface |
| US12030159B2 (en) | 2023-06-14 | 2024-07-09 | Taiwan Semiconductor Manufacturing Company, Ltd. | Chemical mechanical planarization tool |
-
2002
- 2002-07-10 CN CN 02140921 patent/CN1402313A/en active Pending
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101947525A (en) * | 2006-12-19 | 2011-01-19 | 朗姆研究公司 | Million precision cleanings of semiconductor manufacturing equipment assembly and parts |
| US8607806B2 (en) | 2006-12-19 | 2013-12-17 | Lam Research Corporation | Megasonic precision cleaning of semiconductor process equipment components and parts |
| CN102485426A (en) * | 2010-12-03 | 2012-06-06 | 中芯国际集成电路制造(上海)有限公司 | Grinding pad finisher and grinding pad finishing method |
| CN102416596A (en) * | 2011-05-26 | 2012-04-18 | 上海华力微电子有限公司 | Device for improving wafer surface scratched by fixed abrasive polishing pad |
| CN103252721A (en) * | 2012-02-15 | 2013-08-21 | 台湾积体电路制造股份有限公司 | Cmp pad cleaning apparatus |
| CN103252721B (en) * | 2012-02-15 | 2016-12-21 | 台湾积体电路制造股份有限公司 | Cmp tool and the method for cleaning chemistry mechanical polishing pad |
| CN112476228A (en) * | 2019-08-23 | 2021-03-12 | 台湾积体电路制造股份有限公司 | Method for operating chemical mechanical planarization tool |
| CN112476228B (en) * | 2019-08-23 | 2023-02-14 | 台湾积体电路制造股份有限公司 | Method for operating chemical mechanical planarization tool |
| US11712778B2 (en) | 2019-08-23 | 2023-08-01 | Taiwan Semiconductor Manufacturing Company, Ltd. | Chemical mechanical planarization tool |
| CN115464471A (en) * | 2022-09-15 | 2022-12-13 | 湘潭大学 | Ultrasonic auxiliary polishing device capable of self-adapting to irregular complex curved surface |
| CN115464471B (en) * | 2022-09-15 | 2023-08-29 | 湘潭大学 | Ultrasonic auxiliary polishing device capable of self-adapting to irregular complex curved surface |
| US12030159B2 (en) | 2023-06-14 | 2024-07-09 | Taiwan Semiconductor Manufacturing Company, Ltd. | Chemical mechanical planarization tool |
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