CN214445531U

CN214445531U - Grinding equipment

Info

Publication number: CN214445531U
Application number: CN202120138101.0U
Authority: CN
Inventors: 吴镐硕; 朴灵绪
Original assignee: Suzhou Enteng Semiconductor Technology Co ltd
Current assignee: Suzhou Enteng Semiconductor Technology Co ltd
Priority date: 2021-01-19
Filing date: 2021-01-19
Publication date: 2021-10-22
Anticipated expiration: 2031-01-19

Abstract

The utility model provides a grinding device, including grinding pad, pure water storage jar, high-pressure pump and sprinkler, pure water storage jar and pure water source intercommunication, the high-pressure pump with pure water storage jar and sprinkler are linked together, the pure water warp of pure water storage jar warp behind the high-pressure pump pressure boost the sprinkler high pressure is sprayed grinding pad surface is in order to right the grinding pad is maintained. The utility model discloses a grinding equipment can spray the grinding pad surface with the high pressure mode with the pure water through the structural design who improves in order to maintain the grinding pad, utilizes foreign matters such as granule impurity in the high pressure impact force will grinding pad to get rid of completely, can effectively restrain the vitrification of grinding pad, improves the surface homogeneity of grinding pad, reduces the use amount of grinding pad from this and improves wafer surface flatness, and need not to use the chemicals, helps reducing environmental pollution. By adopting the grinding equipment to grind and polish the wafer, the grinding yield is improved and the grinding cost is reduced.

Description

Grinding equipment

Technical Field

The utility model relates to a semiconductor manufacturing technology field especially relates to a grinding device.

Background

In order to reduce the production cost and improve the device performance, the semiconductor technology is rapidly developed towards high integration. As the design line width of a semiconductor device is smaller, the variation in the flatness of the wafer surface is more likely to cause the wiring to be distorted and deformed, thereby causing the yield of the device to be lowered. Therefore, the requirements for the surface flatness and surface characteristics of the wafer are becoming more stringent.

A series of polishing processes in the wafer preparation process is to remove defects generated in the previous processes by performing a certain amount of grinding on the surface of the wafer, thereby finally determining the surface topography of the wafer. Meanwhile, the fine characteristics of the surface of the wafer are controlled by carrying out mirror grinding on the wafer. Typically, the first polishing process is to ensure a certain amount of abrasion and flatness, while the second polishing is to control the fine features of the surface.

In the first polishing process, when the wafer surface is removed to a certain thickness, the abraded material on the wafer surface is combined with the particles in the polishing agent, and a part of the combined product permeates into the polishing pad, resulting in vitrification of the polishing pad (the transition from a high elastic state to a glass state, i.e., the polishing pad loses elasticity and the surface becomes hard, which may cause damage to the wafer, so that the polishing pad with severe vitrification cannot be used continuously), while a part is recycled to the polishing agent supply tank. The degree of vitrification of the polishing pad is accumulated, resulting in an increase in the number of times of replacement of the polishing pad and deterioration in the surface uniformity of the polishing pad, and further, in a decrease in the polishing work amount (service life) of the polishing pad and deterioration in the surface flatness of the wafer.

In the existing batch type polishing process, after a batch of wafers are polished, a dresser with a brush and/or a diamond is used for dressing the polishing pad, but the foreign matters existing in the polishing pad are difficult to be effectively and completely removed.

SUMMERY OF THE UTILITY MODEL

In view of the above-mentioned shortcomings of the prior art, an object of the present invention is to provide a polishing apparatus, which is used for solving the problems that when the polishing apparatus is used for polishing a wafer, a material abraded from the surface of the wafer can be combined with particles in an abrasive, a part of the combined product can permeate into a polishing pad, resulting in vitrification of the polishing pad, the vitrification degree of the polishing pad is accumulated continuously, resulting in increase of the replacement frequency of the polishing pad and deterioration of the surface uniformity of the polishing pad, and further resulting in reduction of the polishing workload (service life) of the polishing pad and deterioration of the surface flatness of the wafer, and it is difficult to effectively remove the foreign material existing in the polishing pad by trimming the dresser with a brush and/or a diamond in the prior art.

In order to realize above-mentioned purpose and other relevant purposes, the utility model provides a grinding device, including grinding pad, pure water storage jar, high-pressure pump and sprinkler, pure water storage jar and pure water source intercommunication, the high-pressure pump with pure water storage jar and sprinkler are linked together, the pure water warp of pure water storage jar warp behind the high-pressure pump pressure boost the sprinkler high pressure is sprayed the grinding pad surface is in order to right the grinding pad is maintained.

Optionally, be provided with the level gauge in the pure water storage jar, pure water storage jar with be provided with the valve on the pipeline that the pure water source is connected, work as the level gauge monitors pure water in the pure water storage jar is less than when predetermineeing the liquid level, opens the valve carries out the supply to pure water storage jar.

More optionally, the valve is an electrically operated valve, and the grinding apparatus further includes a control device, where the control device is connected to the electrically operated valve and the liquid level meter to control the opening and closing of the valve according to a monitoring result of the liquid level meter.

Optionally, the number of the high-pressure pumps is multiple, and the multiple high-pressure pumps are sequentially communicated with each other to pressurize the pure water layer by layer.

Optionally, the pure water storage tank comprises a polyethylene storage tank.

Alternatively, the pure water storage tank has a volume of 400L or more and a spray pressure of pure water sprayed onto the polishing pad after pressurization is 40kgf or more.

Optionally, the spraying device includes a nozzle, a supply pipeline and a support frame, the supply pipeline is communicated with the high-pressure pump and connected with the support frame, and the nozzle is connected with one end of the supply pipeline far away from the high-pressure pump.

Optionally, the polishing apparatus further includes a driving device connected to the supporting frame and/or the polishing pad, for driving the supporting frame and/or the polishing pad to rotate and/or lift.

Optionally, the polishing apparatus further includes a position sensor connected to the support frame, and the position sensor is connected to the driving device, so that the driving device adjusts the position of the support frame and/or the polishing pad according to a detection result of the position sensor.

Optionally, the number of the high-pressure pumps is multiple, the multiple high-pressure pumps are connected between the pure water storage tank and the spraying device through multiple pipelines, and each pipeline is provided with a switching valve so as to switch the pipeline for supplying water to the spraying device as required.

As mentioned above, the utility model discloses a grinding device has following beneficial effect: the utility model discloses a grinding equipment can spray the grinding pad surface with the high pressure mode with the pure water through the structural design who improves in order to maintain the grinding pad, utilizes the impact force of high-pressure pure water to get rid of foreign matters such as granule impurity in the grinding pad completely, can effectively restrain the vitrification of grinding pad, improves the surface uniformity of grinding pad, reduces the use amount of grinding pad from this and improves wafer surface flatness, and need not to use the chemicals, helps reducing environmental pollution. Adopt the utility model discloses a grinding equipment carries out the grinding and polishing of wafer, helps improving to grind the yield and reduces and grinds the cost.

Drawings

Fig. 1 is a schematic view of a partial top view of a grinding apparatus according to the present invention.

Fig. 2 is a schematic diagram showing a positional relationship between a spraying device and a polishing pad in a polishing apparatus according to the present invention.

FIG. 3 is a schematic cross-sectional view taken along line AA' of FIG. 1.

Description of the element reference numerals

11 polishing pad

12 pure water storage tank

13 pipeline

14 high pressure pump

15 spraying device

151 spray nozzle

152 supply line

153 support frame

16 liquid level meter

17 valve

18 drive device

19 position sensor

20 switching valve

21 water spraying gun

22 drainage line

23 draw off valve

Detailed Description

The following description is provided for illustrative purposes, and other advantages and features of the present invention will become apparent to those skilled in the art from the following detailed description.

Please refer to fig. 1 to 3. It should be understood that the structure, ratio, size and the like shown in the drawings attached to the present specification are only used for matching with the content disclosed in the specification, so as to be known and read by those skilled in the art, and are not used for limiting the limit conditions that the present invention can be implemented, so that the present invention has no technical essential meaning, and any structure modification, ratio relationship change or size adjustment should still fall within the scope covered by the technical content disclosed in the present invention without affecting the function and the achievable purpose of the present invention. Meanwhile, the terms such as "upper", "lower", "left", "right", "middle" and "one" used in the present specification are for convenience of description, and are not intended to limit the scope of the present invention, and changes or adjustments of the relative relationship thereof may be made without substantial technical changes.

When the existing grinding equipment needs to finish the grinding pad, a dresser with a brush and/or a diamond is usually adopted for finishing, but the finishing mode is difficult to effectively remove foreign matters such as particle impurities in the grinding pad, and is difficult to effectively inhibit vitrification of the grinding pad. The present application thus proposes an improvement.

As shown in fig. 1 to 3, the present invention provides a polishing apparatus, which comprises a polishing pad 11, a pure water storage tank 12, a high-pressure pump 14 and a spraying device 15; the pure water storage tank 12 is in communication with a pure water source (not shown) through a pipeline for storing pure water; the high-pressure pump 14 is communicated with the pure water storage tank 12 and the spraying device 15 through pipelines, and the pure water in the pure water storage tank 12 is pressurized by the high-pressure pump 14 and then sprayed to the surface of the polishing pad 11 through the spraying device 15 in a high-pressure mode so as to trim the polishing pad 11. The utility model discloses a grinding equipment is through the structural design who improves, can spray the grinding pad surface with the high pressure mode with the pure water and repair in order to grinding the grinding pad, the impact force that utilizes high-pressure pure water gets rid of foreign matters such as granule impurity in the grinding pad completely, can effectively restrain the vitrification of grinding pad, improve the surface uniformity of grinding pad, reduce the use amount of grinding pad (prolong its life promptly) and improve wafer surface flatness from this, and need not to use the chemicals, help reducing environmental pollution. Adopt the utility model discloses a grinding equipment carries out the grinding and polishing of wafer, helps improving to grind the yield and reduces and grinds the cost.

In an example, a liquid level meter 16 is arranged in the pure water storage tank 12, the liquid level meter 16 may be single or multiple, a valve 17 is arranged on the pure water storage tank 12 and the pipeline 13 connected with the pure water source, and when the liquid level meter 16 monitors that the pure water in the pure water storage tank 12 is lower than a preset liquid level, the valve 17 is opened to supply pure water to the pure water storage tank 12.

In a further example, the valve 17 is an electric valve, and the grinding apparatus further includes a control device (not shown) connected to the electric valve and the liquid level meter 16 to control the opening and closing of the valve 17 according to the monitoring result of the liquid level meter 16, i.e. to realize the automatic replenishment function of the pure water storage tank 12. The control means includes, but is not limited to, a PLC controller, which can control the operation of the entire grinding apparatus, such as the spraying operation of the spraying device 15 and the driving device 18 mentioned later, etc., in addition to the aforementioned water replenishment, to improve the automation level of the entire apparatus.

The pure water storage tank 12 may be made of any material as required, such as a transparent storage tank, including but not limited to a polyethylene storage tank. The volume of the pure water storage tank 12 may be determined according to the specification of the grinding apparatus and/or the requirements of the grinding process, for example, in a grinding apparatus of 200mm or more, the volume of the pure water storage tank is preferably 400L or more. To ensure a good cleaning effect, the spraying pressure of pure water sprayed onto the polishing pad 11 after pressurization is, for example, 40kgf or more. The pure water storage tank 12 is further provided with a water outlet (not shown), the pure water storage tank 12 is connected with a water discharge pipeline 22 through the water outlet, a water discharge valve 23 can be arranged on the water discharge pipeline 22, and the water discharge valve 23 can be an electric valve and can be connected with the control device to discharge water when needed. The grinding equipment can also be provided with a water spray gun 21, the water spray gun 21 is also communicated with the high-pressure pump 14 through a pipeline 13, and the corresponding pipeline 13 can also be provided with an electric valve and controlled by a control device.

In one example, the number of the high-pressure pumps 14 is multiple, such as 2 or more, and the multiple high-pressure pumps 14 are sequentially communicated with each other to pressurize the pure water layer by layer (i.e. the multiple high-pressure pumps 14 are located on the same water supply channel) so as to increase the pressure of the sprayed pure water to enhance the decontamination capability thereof. The power of the plurality of high pressure pumps 14 may be the same or different, and is not particularly limited.

In one example, the high-pressure pump 14 is provided in plurality, the high-pressure pumps 14 are connected between the pure water storage tank 12 and the spraying device 15 through a plurality of pipes 13, each pipe 13 is provided with a switching valve 20, the switching valve 20 can be positioned on the pipe 13 between the high-pressure pump 14 and the pure water storage tank 12 and/or on the pipe 13 between the pure water storage tank 12 and the spraying device 15 to switch the pipe 13 for supplying water to the spraying device 15 as required, that is, the high-pressure pumps 14 form a plurality of pure water supply channels, and the spraying pressures of the pure water of the plurality of supply channels can be the same or different. The provision of a plurality of supply channels can improve the stability of the polishing apparatus, for example, when one of the supply channels fails, it is possible to switch to another supply channel in time. Of course, a single line 13 may include a single or multiple high pressure pumps 14.

The spraying device 15 comprises at least a water outlet end, such as a pipe with a water outlet. To achieve a better spraying effect, the spraying device 15 includes, as an example, a nozzle 151, a supply pipe 152 and a support frame 153, the supply pipe 152 is communicated with the high-pressure pump 14 and is connected to the support frame 153, the supply pipe 152 may also be made of polyethylene, and the nozzle 151 is connected to one end of the supply pipe 152, which is far away from the high-pressure pump 14. Due to the support of the support frame 153, the shape, length, etc. of the supply pipe 152 can be more flexibly set, so that the position of the nozzle 151 can be adjusted to uniformly dress the surface of the polishing pad 11 during the dressing process. The nozzles 151 may be single or multiple, or the nozzles 151 may be a water outlet device including a plurality of outlet holes of the same size and evenly spaced apart, such as a shower head-like structure.

In a further example, the polishing apparatus further includes a driving device 18, such as a motor, connected to the supporting frame 153 and/or the polishing pad 11 for driving the supporting frame 153 and/or the polishing pad 11 to rotate and/or move up and down, and the driving device 18 may be connected to the aforementioned control device. For example, the driving device 18 can drive the supporting frame 153 to rotate, thereby driving the supply pipe 152 and the nozzle 151 to rotate. The driving device 18 can also drive the supporting frame 153 to move up and down, so as to adjust the height of the nozzle 151 relative to the polishing pad 11 as required. Alternatively, the driving device 18 may drive the polishing pad 11 to rotate, or the supporting frame 153 and the polishing pad 11 may be driven simultaneously (the supporting frame 153 and the polishing pad 11 may be driven by the same or different motors). By providing the driving device 18, the dressing uniformity can be further improved, and the surface flatness of the polishing pad 11 can be improved.

In a further example, the polishing apparatus further includes a position sensor 19 connected to the supporting frame 153, and the position sensor 19 is connected to the driving device 18, so that the position of the supporting frame 153 and/or the polishing pad 11 is adjusted by the driving device 18 according to the detection result of the position sensor 19. The position sensor 19 can be connected to the aforementioned control device to further increase the automation level of the device.

Adopt the utility model discloses a grinding equipment can spray the maintenance to the grinding pad after the polishing of accomplishing every wafer, also can spray the maintenance to the grinding pad after the polishing of accomplishing the multi-disc wafer. Utilize high-pressure pure water in time effectively to get rid of foreign matters such as granule impurity in with the grinding pad, can alleviate and even avoid the vitrification of grinding pad under the condition that need not to use the chemicals, help improving the surface homogeneity and the life of grinding pad to help improving and grind the yield and reduce and grind the cost.

To sum up, the utility model provides a grinding device, including grinding pad, pure water storage jar, high-pressure pump and sprinkler, pure water storage jar and pure water source intercommunication, the high-pressure pump with pure water storage jar and sprinkler are linked together, the pure water warp of pure water storage jar warp behind the high-pressure pump pressure boost the sprinkler high pressure sprays the grinding pad surface is in order to right the grinding pad is maintained. The utility model discloses a grinding equipment can spray the grinding pad surface with the high pressure mode with the pure water through the structural design who improves in order to maintain the grinding pad, utilizes foreign matters such as granule impurity in the high pressure impact force will grinding pad to get rid of completely, can effectively restrain the vitrification of grinding pad, improves the surface homogeneity of grinding pad, reduces the use amount of grinding pad from this and improves wafer surface flatness, and need not to use the chemicals, helps reducing environmental pollution. Adopt the utility model discloses a grinding equipment carries out the grinding and polishing of wafer, helps improving to grind the yield and reduces and grinds the cost. Therefore, the utility model effectively overcomes various defects in the prior art and has high industrial utilization value.

The above embodiments are merely illustrative of the principles and effects of the present invention, and are not to be construed as limiting the invention. Modifications and variations can be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which may be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.

Claims

1. The utility model provides a grinding equipment, its characterized in that, includes grinding pad, pure water storage jar, high-pressure pump and sprinkler, pure water storage jar and pure water source intercommunication, the high-pressure pump with pure water storage jar and sprinkler are linked together, the pure water warp of pure water storage jar warp behind the high-pressure pump pressure boost sprinkler high pressure spray to the grinding pad surface is in order to right the grinding pad is maintained.

2. The grinding apparatus according to claim 1, wherein a liquid level meter is disposed in the pure water storage tank, a valve is disposed on a pipeline connecting the pure water storage tank and the pure water source, and when the liquid level meter monitors that pure water in the pure water storage tank is lower than a preset liquid level, the valve is opened to replenish the pure water storage tank.

3. The grinding apparatus according to claim 2, wherein the valve is an electrically operated valve, and the grinding apparatus further comprises a control device connected to the electrically operated valve and the liquid level meter to control the opening and closing of the valve according to the monitoring result of the liquid level meter.

4. The grinding apparatus according to claim 1, wherein said high-pressure pump is plural, and plural high-pressure pumps are sequentially communicated with each other to pressurize pure water layer by layer.

5. The grinding apparatus of claim 1, wherein said pure water storage tank comprises a polyethylene tank.

6. The polishing apparatus as recited in claim 1, wherein said pure water storage tank has a volume of 400L or more, and a spray pressure of pure water sprayed onto the polishing pad after pressurization is 40kgf or more.

7. The grinding apparatus of claim 1, wherein the spray device includes a nozzle, a supply line and a support frame, the supply line being in communication with the high pressure pump and being connected to the support frame, the nozzle being connected to an end of the supply line remote from the high pressure pump.

8. The polishing apparatus as claimed in claim 7, further comprising a driving device connected to the supporting frame and/or the polishing pad for driving the supporting frame and/or the polishing pad to rotate and/or move up and down.

9. The polishing apparatus as claimed in claim 8, further comprising a position sensor connected to the supporting frame, wherein the position sensor is connected to the driving device to adjust the position of the supporting frame and/or the polishing pad by the driving device according to the detection result of the position sensor.

10. The grinding apparatus according to any one of claims 1 to 9, wherein the high-pressure pump is plural, plural high-pressure pumps are connected between the pure water storage tank and the sprinkling device through plural pipes, and a switching valve is provided on each pipe to switch a pipe for supplying water to the sprinkling device as required.