CN101833235B - 掩模版原片的质量检测***和方法 - Google Patents
掩模版原片的质量检测***和方法 Download PDFInfo
- Publication number
- CN101833235B CN101833235B CN2009100476318A CN200910047631A CN101833235B CN 101833235 B CN101833235 B CN 101833235B CN 2009100476318 A CN2009100476318 A CN 2009100476318A CN 200910047631 A CN200910047631 A CN 200910047631A CN 101833235 B CN101833235 B CN 101833235B
- Authority
- CN
- China
- Prior art keywords
- radiation
- original mask
- copy
- quality
- mask copy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/50—Mask blanks not covered by G03F1/20 - G03F1/34; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
- G03F1/84—Inspecting
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
Description
Claims (11)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009100476318A CN101833235B (zh) | 2009-03-13 | 2009-03-13 | 掩模版原片的质量检测***和方法 |
US12/724,276 US8319959B2 (en) | 2009-03-13 | 2010-03-15 | System and method for quality assurance for reticles used in manufacturing of integrated circuits |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009100476318A CN101833235B (zh) | 2009-03-13 | 2009-03-13 | 掩模版原片的质量检测***和方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101833235A CN101833235A (zh) | 2010-09-15 |
CN101833235B true CN101833235B (zh) | 2012-11-14 |
Family
ID=42717352
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2009100476318A Expired - Fee Related CN101833235B (zh) | 2009-03-13 | 2009-03-13 | 掩模版原片的质量检测***和方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US8319959B2 (zh) |
CN (1) | CN101833235B (zh) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011151116A1 (en) * | 2010-06-03 | 2011-12-08 | Carl Zeiss Sms Gmbh | A method for determining the performance of a photolithographic mask |
CN102436138B (zh) * | 2011-07-12 | 2014-04-02 | 上海华力微电子有限公司 | 一种紫外线掩模板干法清洗设备 |
CN103206924A (zh) * | 2012-01-11 | 2013-07-17 | 昆山允升吉光电科技有限公司 | 金属掩模板面形测量***及其测量方法 |
JP6339807B2 (ja) * | 2014-01-16 | 2018-06-06 | 株式会社ニューフレアテクノロジー | 露光用マスクの製造方法、露光用マスクの製造システム、及び半導体装置の製造方法 |
JP6394544B2 (ja) * | 2015-09-04 | 2018-09-26 | 信越化学工業株式会社 | フォトマスクブランクの欠陥検査方法、選別方法及び製造方法 |
WO2019147730A1 (en) * | 2018-01-24 | 2019-08-01 | Corning Incorporated | Apparatus and methods for inspecting damage intensity |
CN110398880B (zh) * | 2018-04-24 | 2021-09-28 | 台湾积体电路制造股份有限公司 | 曝光设备及曝光方法 |
CN111618710B (zh) * | 2020-05-21 | 2021-07-23 | 武汉华星光电半导体显示技术有限公司 | 掩模版修复设备 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001153637A (ja) | 1999-11-29 | 2001-06-08 | Nec Corp | マスク検査装置及び検査方法 |
US6627362B2 (en) * | 2001-10-30 | 2003-09-30 | Intel Corporation | Photolithographic mask fabrication |
EP1704445A2 (de) | 2004-01-16 | 2006-09-27 | Carl Zeiss SMT AG | Vorrichtung und verfahren zur optischen vermessung eines optischen systems, messstrukturträger und mikrolithographie-projekti onsbelichtungsanlage |
TWI261726B (en) * | 2004-04-09 | 2006-09-11 | Allied Integrated Patterning C | Acceptable defect positioning and manufacturing method for large-scaled photomask blanks |
JP2007219130A (ja) * | 2006-02-16 | 2007-08-30 | Renesas Technology Corp | マスクブランクの欠陥検査方法及び欠陥検査装置、並びにそれらを用いた半導体装置の製造方法 |
JP4993934B2 (ja) * | 2006-03-31 | 2012-08-08 | Hoya株式会社 | パターン欠陥検査方法、フォトマスクの製造方法、及び表示デバイス用基板の製造方法 |
JP4359689B2 (ja) * | 2007-02-09 | 2009-11-04 | レーザーテック株式会社 | 検査装置及び検査方法、パターン基板の製造方法 |
JP5046394B2 (ja) * | 2007-08-07 | 2012-10-10 | Hoya株式会社 | マスクブランク用基板の製造方法、マスクブランクの製造方法、マスクの製造方法、及びマスクブランク用基板 |
-
2009
- 2009-03-13 CN CN2009100476318A patent/CN101833235B/zh not_active Expired - Fee Related
-
2010
- 2010-03-15 US US12/724,276 patent/US8319959B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US8319959B2 (en) | 2012-11-27 |
US20100233594A1 (en) | 2010-09-16 |
CN101833235A (zh) | 2010-09-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING Effective date: 20121109 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20121109 Address after: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Patentee after: Semiconductor Manufacturing International (Shanghai) Corporation Patentee after: Semiconductor Manufacturing International (Beijing) Corporation Address before: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Patentee before: Semiconductor Manufacturing International (Shanghai) Corporation |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121114 Termination date: 20200313 |