CN101828434A - Adhesive composition, circuit connecting material using the adhesive composition, method for connecting circuit member, and circuit connecting body - Google Patents
Adhesive composition, circuit connecting material using the adhesive composition, method for connecting circuit member, and circuit connecting body Download PDFInfo
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- CN101828434A CN101828434A CN200880111995A CN200880111995A CN101828434A CN 101828434 A CN101828434 A CN 101828434A CN 200880111995 A CN200880111995 A CN 200880111995A CN 200880111995 A CN200880111995 A CN 200880111995A CN 101828434 A CN101828434 A CN 101828434A
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- circuit
- adhesive composite
- circuit block
- connecting body
- organosilicon
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
- H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0212—Resin particles
Abstract
Provided is an adhesive composition for bonding circuit members with each other and for electrically connecting with each other circuit electrodes respectively provided on the circuit members. The adhesive component contains an epoxy resin, an epoxy resin curing agent, and silicone fine particles having a primary grain average diameter of 300nm or less.
Description
Technical field
The present invention relates to adhesive composite and use its circuit connection material and the circuit connecting body that obtains of circuit member connecting method and employing the method.
Background technology
Drive the method for using IC as encapsulated liquid crystal on the glass substrate of using in LCD, extensive use CHIP-ON-GLASS encapsulates (to call " COG encapsulation " in the following text).COG encapsulation is directly to join liquid crystal drive on the glass substrate method with IC.
In above-mentioned COG encapsulation, use adhesive composite usually with anisotropic conductive as circuit connection material.The conducting particles that this adhesive composite contains the bonding agent composition and cooperates as required.To be configured in by the circuit connection material that this adhesive composite constitutes on the part that is formed with electrode on the glass substrate, by semiconductor element such as crimping IC, LSI in the above or packaging body etc., according to keeping each other conducting state of comparative electrode, guaranteeing that adjacent electrode mode insulated from each other is electrically connected and the mechanicalness adhesion.
Yet, as the bonding agent composition of adhesive composite, from bringing into use the combination of epoxy resin and imidazole curing agent in the past.For the adhesive composite that has cooperated these compositions, generally make epoxy resin cure 5 seconds by keeping 200 ℃ of temperature, carry out the COG encapsulation of IC chip.
But, in recent years follow the maximization of crystal liquid substrate and the progress of slimming, when if employing adhesive composite in the past carries out the COG encapsulation under the said temperature condition, thermal expansion that temperature difference during owing to heating causes and contraction difference produce internal stress, have the problem that warpage takes place on IC chip or glass substrate.If carry out temperature cycling test for the circuit connecting body that warpage has taken place, then internal stress increases, and may peel off at the connecting portion of circuit connecting body.
Method as reducing in circuit block generation warpage records the circuit connecting adhesive film that contains the potentiality curing agent that comprises sulfonium salt as curing agent for epoxy resin in patent documentation 1.Putting down in writing by using this bonding film, can the heating-up temperature when encapsulating be reduced to below 160 ℃, can lower the internal stress (with reference to the paragraph [0019] of patent documentation 1) that in the circuit connecting body of circuit block, produces.
Patent documentation 1: TOHKEMY 2004-221312 communique
Summary of the invention
The problem that invention will solve
But though can bring into play good effect aspect the reduction heating-up temperature, owing to use special potentiality curing agent, there is short problem pot life in the bonding film of record in patent documentation 1.Therefore, this bonding film is compared with the bonding film that had cooperated imidazole curing agent in the past, and present situation is that its purposes is restricted.
The present invention finishes in view of above situation, the objective of the invention is, even a kind of circuit connection material that also can fully reduce the adhesive composite of the internal stress that produces in the circuit connecting body and use it when the imidazoles epoxy curing agent that adopts in the past is provided.
In addition, the objective of the invention is, provide by foregoing circuit to connect material with the circuit connecting body of lower connection resistance connecting circuit parts and in order to obtain the circuit member connecting method of this circuit connecting body.
The means of dealing with problems
Adhesive composite of the present invention is used for circuit block being bonded to each other and the circuit electrode that each circuit block had being electrically connected to each other, and it contains epoxy resin, epoxy curing agent and the average grain diameter organosilicon particulate below 300nm.
In adhesive composite of the present invention, the effect of above-mentioned organosilicon particulate performance stress moderator.Therefore, though use in order to obtain fully long pot life imidazole curing agent as epoxy curing agent, carrying out about 200 ℃ under the situation of cured, also can relax internal stress effectively.So, can fully suppress the warpage of circuit connecting body or on the component interface of packaging body, take place peel off phenomenon.
Adhesive composite of the present invention preferably further contains conducting particles.By in the bonding agent composition, being dispersed with the adhesive composite of conducting particles, can make circuit connecting body with outstanding connection reliability.
In addition, adhesive composite of the present invention is a benchmark in the gross mass of this adhesive composite, preferably contains the organosilicon particle of 10～40 quality %.By making the organosilicon particle that contains 10～40 quality % in the adhesive composite, the internal stress in the mitigation circuits connector more fully.
Adhesive composite of the present invention, the coating layer preferably formulated, that described hud typed organosilicon particulate has the nuclear particle that is made of the organosilicon particulate and constituted and be provided with according to the mode that coats above-mentioned nuclear particle by the material that contains acrylic resin by cooperating hud typed organosilicon particulate.Contain the coating layer (shell) of acrylic resin and the compatibility height of epoxy resin, thereby can suppress the aggegation of organosilicon particulate, can fully keep the high degree of dispersion state of organosilicon particulate in the bonding agent composition.Consequently can stablize the stress alleviation effects of performance to circuit connecting body.Gross mass in this hud typed organosilicon particulate is a benchmark, and the organosilicon content of hud typed organosilicon particulate is preferably 40～90 quality %.
For adhesive composite of the present invention, the storage elastic modulus of the solidfied material that obtained in 1 hour in the heating of 200 ℃ of temperature during preferably at 40 ℃ is 1～2GPa.Be used for circuit block connection each other if will satisfy the adhesive composite of above-mentioned condition of the storage elastic modulus of solidfied material, can produce circuit connecting body with outstanding connection reliability.
Circuit connection material of the present invention possesses membranaceous base material and is constituted and be arranged on bond layer on the face of base material by above-mentioned adhesive composite of the present invention.By adopting the circuit connection material of this structure, can be easy to placement of adhesives layer on circuit block, can increase work efficiency.In addition, when using circuit connection material, membranaceous base material is suitable is stripped from.
Circuit connecting body of the present invention, it possesses a pair of circuit block and the connecting portion of relative configuration, described connecting portion is made of the solidfied material of above-mentioned adhesive composite of the present invention, between a pair of circuit block, the mode that is electrically connected to each other according to the circuit electrode that each circuit block is had is bonded to each other this circuit block.
For circuit connecting body of the present invention, at least one of a pair of circuit block can be to be the IC chip.In addition, with regard to this circuit connecting body, at least one side's of the circuit electrode that a pair of circuit block has separately surface can be to be made of at least a material that is selected from gold, silver, tin, ruthenium, rhodium, palladium, osmium, iridium, platinum and the tin indium oxide.
In addition, with regard to circuit connecting body of the present invention, with at least one of bearing surface of a pair of circuit block of connecting portion butt can be to have the part that constitutes by at least a above material that is selected from silicon nitride, organo-silicon compound and the polyimide resin.
As for circuit member connecting method of the present invention, it is to make above-mentioned adhesive composite of the present invention between a pair of circuit block of relative configuration, to all heat and pressurize, form connecting portion, thereby obtain possessing the circuit connecting body of a pair of circuit block and connecting portion, described connecting portion is bonded to each other circuit block by the mode that the solidfied material of adhesive composite constitutes, is electrically connected to each other between a pair of circuit block, according to the circuit electrode that each circuit block is had.
The invention effect
The internal stress that produces in the circuit connecting body can be fully lowered in the present invention.
The simple declaration of accompanying drawing
Fig. 1 is the sectional view of an execution mode of expression circuit connection material of the present invention.
Fig. 2 is the sectional view of the hud typed organosilicon particulate of expression.
Fig. 3 is illustrated in to use the sectional view of circuit connection material of the present invention with circuit electrode state connected to one another between circuit electrode.
Fig. 4 utilizes schematic section to represent the process chart of an execution mode of circuit member connecting method of the present invention.
Fig. 5 is the sectional view of other forms of expression conducting particles.
Fig. 6 is other the sectional view of execution mode of expression circuit connection material of the present invention.
Symbol description
5,15: circuit connection material
6,6a, 6b: base material
7,8: bond layer
7a: contain the conducting particles layer
7b: do not contain the conducting particles layer
9: the bonding agent composition
10: hud typed organosilicon particulate
10a: organosilicon particulate
10b: coating layer
20A, 20B: conducting particles
30: the 1 circuit blocks
40: the 2 circuit blocks
50a: connecting portion
100: circuit connecting body
Embodiment
Below, the preferred implementation that present invention will be described in detail with reference to the accompanying.In addition, in the description of the drawings, give prosign, omit repeat specification identity element.And for the purpose of making the drawing convenience, the accompanying drawing dimensional ratios might not be consistent with description.
＜circuit connection material 〉
At first, the circuit connection material to present embodiment describes.Fig. 1 is the sectional view of the circuit connection material 5 of expression present embodiment.The bond layer 8 that circuit connection material 5 has membranaceous base material 6 and is provided with on a face of membranaceous base material 6.Bond layer 8 is by containing bonding agent composition 9 and be dispersed in organosilicon particulate 10a in the bonding agent composition 9 and the adhesive composite of conducting particles 20A constitutes, and described bonding agent composition 9 contains (a) epoxy resin and (b) epoxy curing agent.
Circuit connection material 5 is by the solution that adopts spreading implement coating adhesive composition on membranaceous base material 6, makes through stipulated time heated-air drying formation bond layer 8.By forming the bond layer 8 that constitutes by adhesive composite, relatively, has the advantage of increasing work efficiency when being used for the COG encapsulation of integrated circuit (IC) chip etc. or COF encapsulation (CHIP-ON-FLEX encapsulation) during for example with direct use pasty state adhesive composite.
Can use the various adhesive tapes that constitute by PETG (PET), PEN, polyethylene glycol isophthalate, polybutylene terephthalate (PBT), polyolefin, poly-acetic acid esters, Merlon, polyphenylene sulfide, polyamide, ethylene-vinyl acetate copolymer, polyvinyl chloride, polyvinylidene chloride, synthetic rubber class, liquid crystal polymer etc. as base material 6.But the material that constitutes base material 6 is not limited to this.In addition, as base material 6, also can use with the face of bond layer 8 butts etc. on carried out the base material of Corona discharge Treatment, sticking priming coat processing, antistatic treatment etc.
In addition, when using circuit connection material 5, can be easy to peel off, also can on the surface of base material 6, be coated with stripping treatment agent and use from bond layer 8 in order to make base material 6.As stripping treatment agent, can adopt various stripping treatment agents such as copolymer, alkyd resins, the amino-alkyd resin of organic siliconresin, organosilicon and organic resin, resin, resin, lac resin with fluoroalkyl with chain alkyl.
The thickness of base material 6 is not particularly limited, and considers the preservation, the convenience when using of circuit connection material 5 etc., is preferably 4～200 μ m, and then considers material cost and productivity ratio, more preferably 15～75 μ m.
The thickness of bond layer 8 can suitably be adjusted according to the shape of the circuit block that connects etc., but preferred 5～50 μ m.If the thickness deficiency of bond layer 85 μ m, the amount of the adhesive composite of filling between the circuit block is often insufficient.On the other hand, if thickness surpasses 50 μ m, the conducting between the circuit electrode that often is difficult to guarantee connect.
The adhesive composite that forms bond layer 8 preferably formed the adhesive composite of the solidfied material that meets the following conditions in 1 hour in 200 ℃ of heating of temperature.That is, with regard to the solidfied material of adhesive composite, from the viewpoint of connection reliability, the storage elastic modulus when preferably it adopts 40 ℃ that the Measurement of Dynamic Viscoelasticity device measures is 1～2GPa.
The solidfied material of the adhesive composite of present embodiment can reach the principal element of the relevant excellent characteristic of storage elastic modulus, supposition is that this organosilicon particulate 10a plays a role as the stress moderator because contain the organosilicon particulate 10a of average grain diameter below 300nm of the primary particle of high degree of dispersion in binding agent composition 9.
(organosilicon particulate)
Fig. 2 is the sectional view of hud typed organosilicon particulate of the form of the organosilicon particulate 10a before expression is coupled in the bonding agent composition 9.Hud typed organosilicon particulate 10 shown in Figure 2 has the organosilicon particulate 10a that forms nuclear particle forms shell with coating this organosilicon particulate 10a coating layer 10b.By bonding agent composition 9 is mixed with hud typed organosilicon particulate 10, organosilicon particulate 10a is disperseed in bonding agent composition 9.
The average grain diameter of organosilicon particulate 10a is below the 300nm.If this average grain diameter surpasses 300nm, the dispersion of the organosilicon particulate 10a in the bonding agent composition 9 heterogeneity that becomes then, the flowability that contains its adhesive composite becomes insufficient, and easily forms the secondary agglutination body of organic silicon particle 10a.Preferred 50～250 μ m of the average grain diameter of the primary particle of organosilicon particulate 10a, more preferably 70～170 μ m.If the not enough 50nm of average grain diameter, then often the stress alleviation effects of organosilicon particulate 10a performance is insufficient.
Organosilicon particulate 10a has the organosiloxane skeleton, is the organosilicon polymer of solid during normal temperature.As preferred organosilicon polymer, can enumerate by be selected from [RR ' SiO
2/2], [RSiO
3/2] and [SiO
4/2] polysiloxane that constitutes more than a kind or 2 kinds of siloxy of expression.At this, R represents carbon number at the alkyl below 6, aryl or terminal substituting group with the two keys of carbon, and R ' expression carbon number is at the alkyl or aryl below 6.
In the said units that forms organic silicon particle 10a, if form [the RSiO of cross-linked structure
3/2] and [SiO
4/2] increasing proportion, then the hardness of organosilicon polymer, modulus of elasticity have the tendency of increase.Its result, organosilicon particulate 10a is often insufficient to the stress abirritation of circuit connecting body.In order to obtain having the hardness of appropriateness and the organosilicon particulate 10a of modulus of elasticity, can suitably adjust [RSiO
3/2] and [SiO
4/2] ratio.
The thickness of the coating layer 10b of hud typed organosilicon particulate 10 is preferably 5～100nm, more preferably 10～50nm.If the not enough 5nm of the thickness of coating layer 10b, the then dispersion of organosilicon particulate 10a in bonding agent composition 9 heterogeneity often.On the other hand, if the thickness of coating layer 10b surpasses 100nm, the stress abirritation of organosilicon particulate 10a is often insufficient.
Hud typed organosilicon particulate 10 is a benchmark in the gross mass of this hud typed organosilicon particulate 10, and organosilyl content is preferably 40～90 quality %, more preferably 50～80 mass parts.If the organosilyl quantity not sufficient 40 quality % that contain, then the stress abirritation of organosilicon particulate 10a is often insufficient.On the other hand, if organosilyl content surpasses 90 quality %, coating layer 10b is to the coating of the organosilicon particulate 10a heterogeneity that becomes, and the dispersiveness of organosilicon particulate 10a is often insufficient in bonding agent composition 9.
As the method for making hud typed organosilicon particulate 10, can enumerate following method, be that the phase I polymerization is by the synthetic organosilicon particulate 10a as nuclear of emulsion polymerisation, then the polymerization of second stage is organosilicon particulate 10a, acrylic monomer and initator are mixed and to carry out polymerization, forms coating layer 10b on the surface of organosilicon particulate 10a.
In addition, hud typed organosilicon particulate 10 can be synthetic by said method, perhaps also can buy the commercially available prod.As the hud typed organosilicon particulate that can buy, for example can enumerate GENIOPERL P series (trade name, Wa Ke Asahi Kasei Corporation system).
If when the preparation adhesive composite, use hud typed organosilicon particulate 10, with use the organosilicon particulate that coated by coating layer 10b relatively, have and can produce the advantage that can more stably obtain the adhesive composition of the stress alleviation effects of circuit connecting body.Its main cause is presumed as follows.That is,, therefore in the process for preparation of adhesive composite, can suppress the aggegation of hud typed organosilicon particulate 10 fully owing to contain the coating layer 10b of acrylic resin and the compatibility height of epoxy resin.Its result has suppressed to form the aggegation of organosilicon particulate 10a in bonding agent composition 9 of nuclear particle, can fully keep the high degree of dispersion state of organosilicon particulate 10a in bonding agent composition 9.
The content of the organosilicon particulate 10a that is contained in the adhesive composite of circuit connection material 5 (bond layer 8) is preferably 10～40 mass parts with respect to adhesive composite 100 mass parts, more preferably 20～35 mass parts.If organosilicon particulate 10a contains quantity not sufficient 10 mass parts, then often the performance minimizing insufficient, warpage that relaxes of stress is insufficient.On the other hand, if the content of organosilicon particulate 10a surpasses 40 mass parts, then often be difficult to make organosilicon particulate 10a homogeneous in bonding agent composition 9 to disperse, connecting resistance value if organosilicon particulate 10a in the aggegation of the coupling part of circuit block, then hinders conductivity has the tendency that uprises.In addition, the flowability of adhesive composite reduces, and the cementability on the surface of bond layer 8 has the tendency of reduction.
Secondly, to (a) epoxy resin of being contained in the bonding agent composition 9 and (b) epoxy curing agent describe.
As (a) epoxy resin, can enumerate bisphenol A type epoxy resin, bisphenol f type epoxy resin, bisphenol-s epoxy resin, phenol novolak type epoxy resin, cresols phenolic resin varnish type epoxy resin, bisphenol-A phenolic varnish type epoxy resin, bisphenol F phenolic varnish type epoxy resin, alicyclic epoxy resin, glycidyl ester type epoxy resin, glycidyl amine type epoxy resin, steric hindrance phenol-type epoxy resin, fulminuric acid ester type epoxy resin, aliphat chain epoxy resin etc.These epoxy resin can also can be hydrogenated by halogenation.These epoxies can use a kind separately, perhaps are used in combination more than 2 kinds.
As (b) epoxy curing agent, can enumerate amine, phenols, anhydrides, imidazoles, acyl trap class, dicyandiamide, boron trifluoride-amine complex, sulfonium salt, salt compounded of iodine, aminimide etc.Wherein, from the viewpoint of curable and pot life, preferably use imidazole curing agent.As imidazole curing agent, can enumerate 2-ethyl-4-methylimidazole, glyoxal ethyline, 1-cyano ethyl-2-phenylimidazole etc.These can be used in combination separately or more than 2 kinds, also can mixed decomposition promoter, use such as inhibitor.In addition, in order to realize long pot life and rapidly-curable preferably using the potentiality curing accelerator simultaneously high-levelly, specifically preferably use the additive compound (microcapsule-type curing agent or add-on type potentiality curing agent etc.) of imidazoles and epoxy resin.
(a) content of epoxy resin is benchmark in the gross mass of bonding agent composition 9, preferred 3～50 quality %, more preferably 10～30 quality %.If (a) epoxy resin contain quantity not sufficient 3 quality %, then curing reaction carry out insufficiently, often be difficult to obtain good adhesive strength or connect resistance value.On the other hand, if surpass 50 quality %, the flowability that has bonding agent composition 9 reduces, or the tendency that shortens pot life.In addition, the connection resistance value of the connecting portion of circuit connecting body has the tendency of rising.
(b) content of epoxy curing agent is benchmark in the gross mass of bonding agent composition 9, preferred 0.1～60 quality %., more preferably 1.0～20 quality %.If (b) epoxy curing agent contain quantity not sufficient 0.1 quality %, carrying out of curing reaction is insufficient, often is difficult to obtain good adhesive strength or connects resistance value.On the other hand, if surpass 60 quality %, the flowability that has bonding agent composition 9 reduces, or the tendency that shortens pot life.In addition, the connection resistance value of the connecting portion of circuit connecting body has the tendency of rising.
(conducting particles)
Conducting particles 20 is dispersed in the bonding agent composition 9.Conducting particles 20A for example can enumerate the particle of metals such as gold, silver, platinum, nickel, copper, tungsten, antimony, tin, scolding tin or carbon.The average grain diameter of conducting particles 20A is from preferred 1～18 μ m of viewpoint dispersed, conductivity.
The cooperation ratio of conducting particles 20, bonding agent composition 100 parts by volume with respect to bond layer 8 is contained are preferably 0.1～30 parts by volume, more preferably 0.1～10 parts by volume.This cooperation ratio is suitably adjusted according to the purposes of adhesive composite.If cooperation ratio less than 0.1 parts by volume of conducting particles 20, then the connection resistance between electrode of opposite has the tendency that increases, if surpass 30 parts by volume, the short circuit between adjacent electrode often takes place easily then.
And then the adhesive composite that forms bond layer 8 can also contain packing material, softening agent, promoter, antiaging agent, colouring agent, fire retardant, thixotropic agent, coupling agent, melamine resin, isocyanates etc.When containing packing material, owing to can obtain raising such as connection reliability, thereby preferred.The preferred maximum particle diameter of packing material is less than the particle diameter person of conducting particles.In addition, the content of packing material is benchmark in the cumulative volume of adhesive composite, preferably in the scope of 5～60 volume %.If surpass 60 volume %, the tendency that connection reliability and adhesiveness reduction take place is arranged.In addition, as coupling agent, from improving the viewpoint of cementability, preferably contain more than one the compound of group that is selected from the group that vinyl, acrylic, amino, epoxy radicals and NCO form.
＜circuit connecting body 〉
Then, describe for the circuit connecting body that uses circuit connection material 5 to make.Fig. 3 is the indication circuit electrode summary sectional view of connected circuit connecting body each other.Circuit connecting body 100 shown in Figure 3 has opposed the 1st circuit block 30 and the 2nd circuit block 40 mutually, between the 1st circuit block 30 and the 2nd circuit block 40, is provided with the connecting portion 50a that connects them.
The circuit electrode 32 that the 1st circuit block 30 has circuit substrate 31 and forms on the interarea 31a of circuit substrate 31.The circuit electrode 42 that the 2nd circuit block 40 has circuit substrate 41 and forms on the interarea 41a of circuit substrate 41.
Object lesson as circuit block can be enumerated: chip parts such as semiconductor chip (IC chip), resistance chip, electric capacity chip etc.These circuit blocks have circuit electrode, have a plurality of circuit electrodes usually.The object lesson of the opposing party's who couples together as the foregoing circuit parts circuit block can be enumerated: have flexibility band, flexible print circuit board, the evaporation of metal wiring that the circuit base plate of the glass substrate etc. of indium tin oxide (ITO) is arranged.
The surface of each circuit electrode 32,42 can be to be made of at least a material that is selected from gold, silver, tin, ruthenium, rhodium, palladium, osmium, iridium, platinum and the tin indium oxide (ITO), also can be made of two or more.In addition, the Facing material of circuit electrode 32,42 can be identical in whole circuit electrodes, also can be different.
Connecting portion 50a has the solidfied material 9A of the bonding agent composition 9 that bond layer 8 contained and is dispersed in wherein conducting particles 20A.So in circuit connecting body 100, opposed circuit electrode 32 is electrically connected by conducting particles 20A with circuit electrode 42.Therefore, can fully reduce the connection resistance between the circuit electrode 32,42, realize good electrical connection between the circuit electrode 32,42.On the other hand, solidfied material 9A has electrical insulating property, can guarantee adjacent circuit electrode insulating properties each other.Therefore, the electric current between the circuit electrode 32,42 is flowed reposefully, give full play to the function that circuit has.
The manufacture method of＜circuit connecting body 〉
Then, the manufacture method for circuit connecting body 100 describes.Fig. 4 utilizes summary sectional view to represent the process chart of an execution mode of circuit member connecting method of the present invention.In the present embodiment, make bond layer 8 hot curings of circuit connection material 5, finally produce circuit connecting body 100.
At first, circuit connection material 5 is cut into specific length, and bond layer 8 is stated from towards the below on the surface that is formed with circuit electrode 32 of the 1st circuit block 30 (Fig. 4 (a)).At this moment, base material 6 is peeled off from bond layer 8.
Subsequently, along the arrow A of Fig. 4 (b) and the direction pressurization of B, bond layer 8 is connected to (Fig. 4 (c)) on the 1st circuit block 30 temporarily.The pressure of this moment needs only and can not cause the scope of damage just to be not particularly limited to circuit block, usually preferred 0.1～3.0MPa.In addition, pressurize while also can heat, heating-up temperature is the temperature that bond layer 8 does not solidify basically.Preferred 50～100 ℃ usually of heating-up temperatures.These heating and pressurization were preferably carried out in the scope at 0.1～10 second.
Then, shown in Fig. 4 (d),, the 2nd circuit block 40 is stated from the bond layer 8 according to the mode that makes the 2nd circuit electrode 42 towards the 1st circuit block 30 1 sides.Then, on one side with bond layer 8 heating, on one side on the arrow A of Fig. 4 (d) and B direction to entire pressurisation.The heating-up temperature of this moment is the temperature that the bonding agent composition 9 of bond layer 8 can solidify.Preferred 120～230 ℃ of heating-up temperature, more preferably 140～210 ℃, further preferred 160～200 ℃.If heating-up temperature is less than 120 ℃, then curing rate is often slack-off, if surpass 230 ℃, undesirable side reaction often takes place easily.Preferred 0.1～30 second of heating time, more preferably 1～25 second, further preferred 2～20 seconds.
By the curing of bonding agent composition 9, form adhesive portion 50a, obtain circuit connecting body 100 as shown in Figure 3.The condition that connects can suitably be selected according to the purposes of using, adhesive composite, circuit block.In addition, when the material that solidifies by light being arranged as the bonding agent components matching of bond layer 8, can be to bond layer 8 suitable radiation active ray or energy-rays.Can list ultraviolet ray, visible light, infrared ray etc. as active ray.Can enumerate electron ray, X ray, gamma-rays, microwave etc. as energy-ray.
More than preferred implementation of the present invention is illustrated, but the present invention is not limited to above-mentioned execution mode.The present invention can do various variations in the scope that does not break away from its main idea.
For example, in the above-described embodiment, for example understand the adhesive composite contain conducting particles 20A, but according to the shape of the circuit block of encapsulation etc., adhesive composite also can not contain conducting particles 20A.In addition, replace conducting particles 20A, also can use the conducting particles that constitutes by the nuclear particle with conductivity and a plurality of insulating properties particles of on the surface of this nuclear particle, being provided with.
Conducting particles 20B shown in Figure 5, the lip-deep a plurality of insulating properties particles 2 that have the nuclear particle 1 that has conductivity and be arranged on this nuclear particle 1.Nuclear particle 1 is made of substrate particle 1a that constitutes core and the conductive layer 1b that is provided with on the surface of this substrate particle 1a.Below, 20B describes to conducting particles.
As the material of substrate particle 1a, can list glass, pottery, organic high molecular compound etc.In these materials, preferably can be by heating and/or the material (for example, glass, organic high molecular compound) of pressurizeing and deforming.If substrate particle 1a is the distortion material, at conducting particles 20B during, increase with the contact area of circuit electrode by the pushing of circuit electrode 32,42.In addition, can absorb the concavo-convex of circuit electrode 32,42 surfaces.Therefore, the connection reliability between circuit electrode has improved.
Set out by above-mentioned viewpoint, as the material that constitutes substrate particle 1a preferably for example acrylic resin, styrene resin, benzoguanamine resin, organic siliconresin, polybutadiene or their copolymers and they are crosslinked and material that obtain.Substrate particle 1a can be the material of identical or different kind between particle, also the material that can use a kind of material or be mixed with two or more separately in same particle.
The average grain diameter of substrate particle 1a can be according to suitably designs such as purposes, preferred 0.5～20 μ m, more preferably 1～10 μ m, further preferred 2～5 μ m.Make conducting particles if adopt average grain diameter less than the substrate particle of 0.5 μ m, the secondary that particle often takes place assembles, the insulating properties between adjacent circuit electrode becomes insufficient, if adopt average grain diameter to make conducting particles, because the insulating properties between the often adjacent circuit electrode of its size becomes insufficient greater than the substrate particle of 20 μ m.
Conductive layer 1b is a layer that the mode according to covering substrates particle 1a surface is provided with, that be made of the material with conductivity.From fully guaranteeing the viewpoint of conductivity, conductive layer 1b preferably coats all surfaces of substrate particle 1a.
As the material of conductive layer 1b, can enumerate for example gold, silver, platinum, nickel, copper and alloy thereof, contain the alloy of the scolding tin etc. of tin, and carbon etc. has the nonmetal of conductivity.For substrate particle 1a, owing to can adopt electroless plating to coat, the material of conductive layer 1b is metal preferably.In addition, in order to obtain sufficient pot life, more preferably gold, silver, platinum or its alloy are further preferred golden.And it can use a kind separately, perhaps is used in combination more than 2 kinds.
The thickness of conductive layer 1b can be according to suitably design such as the material of its use or purposes, preferred 50～200nm, more preferably 80～150nm.If thickness is less than 50nm, often connecting portion can not obtain fully low resistance value.On the other hand, thickness surpasses the conductive layer 1b of 200nm, and often productivity ratio is low.
Conductive layer 1b can by one deck or two-layer more than constitute.In any case, from the conservatory viewpoint of the adhesive composite that adopts its manufacturing, the superficial layer of nuclear particle 1 preferably is made of gold, silver, platinum or its alloy, more preferably is made of gold.When one deck that conductive layer 1b is formed by gold, silver, platinum or its alloy (to call metals such as " " gold in the following text) constituted, for connecting portion can access fully low resistance value, its thickness was preferably 10～200nm.
On the other hand, conductive layer 1b is when constituting more than two-layer, and the outermost layer of conductive layer 1b preferably is made of metals such as gold, and the layer between outermost layer and the substrate particle 1a also can the metal level of nickel, copper, tin or its alloy constitutes by for example containing.In this case, by the metal layer thickness that the metals such as outermost gold that constitute conductive layer 1b form, the conservatory viewpoint from adhesive composite is preferably 30～200nm.Nickel, copper, tin or their alloy are sometimes because redox produces free radical.Therefore, if the outermost thickness that forms by metals such as gold less than 30nm, with have free-radical polymerised bonding agent composition when share, often be difficult to fully prevent the influence of free radical.
As the method that on substrate particle 1a, forms conductive layer 1b, can enumerate electroless plating processing or physics coating and handle.The viewpoint of the easiness that forms from conductive layer 1b is preferably handled by electroless plating and form the conductive layer 1b that metal constitutes on the surface of substrate particle 1a.
Insulating properties particle 2 is made of organic high molecular compound.As organic high molecular compound, preferably has the compound of thermal softening.The preferred material of insulating properties particle for example is a polyethylene, ethene-acetate copolymer, ethene-(methyl) propylene-based copolymer, ethene-(methyl) acrylic copolymer, ethene-(methyl) acrylate copolymer, polyester, polyamide, polyurethane, polystyrene, styrene diethylene benzene copoly mer, styrene-isobutylene copolymers, Styrene-Butadiene, styrene-(methyl) propylene-based copolymer, ethylene-propylene copolymer, (methyl) esters of acrylic acid rubber, styrene-ethylene-butylene copolymer, phenoxy resin, solid epoxy etc.These can use a kind separately, perhaps are used in combination more than 2 kinds.And, from decentralization, solvent resistance and the stable on heating viewpoint of particle size distribution, special optimization styrene-(methyl) propylene-based copolymer.Manufacture method as insulating properties particle 2 can be enumerated seeding polymerization method etc.
At this, (methyl) propenyl polymer is meant propenyl polymer and corresponding with it metering system based polyalcohol, for example, above-mentioned ethene-(methyl) propylene-based copolymer is meant ethylene-propylene base co-polymer and corresponding with it ethene-metering system base co-polymer.In addition, (methyl) acrylic acid is meant acrylic acid and corresponding with it methacrylic acid.
The softening point of the organic high molecular compound of formation insulating properties particle 2 preferably is higher than the heating-up temperature when connecting between the circuit block.If softening point is lower than the heating-up temperature when connecting,, often can not reach good electrical connection owing to insulating properties particle 2 excessive deformations when connecting.
The average grain diameter of insulating properties particle 2 can be according to suitably designs such as purposes, preferred 50～500nm, more preferably 50～400nm, further preferred 100～300nm.If average grain diameter is less than 50nm, the insulating properties between often adjacent circuit becomes insufficient, on the other hand, if greater than 500nm, often is difficult to take into account the fully low initial stage resistance value in coupling part and suppresses two aspects of resistance value rising in time.
In addition, circuit connection material of the present invention is not limited to form the single layer structure of the bond layer 8 of individual layer on base material 6 as the circuit connection material in the above-mentioned execution mode 5, also can be sandwich construction on base material 6 that a plurality of bond layers are laminated.The circuit connection material of sandwich construction can carry out multiple-layer laminated the manufacturing by kind or the different layer of its content with bonding agent composition and conducting particles.For example, circuit connection material also can have contain conducting particles contain the conducting particles layer and on this contains at least one face of conducting particles layer, be provided with do not contain conducting particles do not contain the conducting particles layer.
When circuit block being connected to each other, can fully suppress minimizing because of the conducting particles number on the circuit electrode that causes that flows of bonding agent composition with circuit connection material 15.Therefore, when for example being connected to substrate on by COG encapsulation or COF encapsulation the IC chip, can fully guarantee the number of the conducting particles on the metal bump of IC chip.At this moment, preferably bond layer 7 is configured to make the face with metal bump of IC chip and do not contain conducting particles layer 7b butt, on the other hand, makes the substrate that will encapsulate the IC chip and contain conducting particles layer 7a butt.
Embodiment
The nuclear particle that has conductivity by following manufacturing.That is, prepare crosslinked polystyrene particle (Soken Chemical ﹠ Engineering Co., Ltd.'s system, trade name: SX series, average grain diameter:, on the surface of this particle, Ni layer (thick 0.08 μ m) is set by the electroless plating processing 4 μ m) as substrate particle.And then, by the electroless plating processing Au layer (thick 0.03 μ m) is set in the outside of this Ni layer, obtain having the nuclear particle of the conductive layer that constitutes by Ni layer and Au layer.
Prepare crosslinked acrylic resin (Soken Chemical ﹠ Engineering Co., Ltd.'s system, trade name: MP series) as the organic high molecular compound that is used to coat the nuclear particle surface (insulation coats).This crosslinked acrylic resin 4g and nuclear particle 20g are imported powder surface modification device Hybridization (Co., Ltd. of nara machinery making institute system, trade name: NHS series), make conducting particles.Here, the treatment conditions of powder surface modification device Hybridization are rotating speed 16000/ minute, 60 ℃ of reactive tank temperature.
Then, adopt bisphenol f type epoxy resin and 9,9-two (4-hydroxyphenyl) fluorenes, the phenoxy resin that the synthetic glass transition temperature is 80 ℃.50g is dissolved in the solvent with this phenoxy resin, is mixed with the solution of solid constituent 40 quality %.In addition, as solvent, use mixed solvent (both mixing quality ratios=1: 1) of toluene and ethyl acetate.
On the other hand, preparation has hud typed organosilicon particulate (organosilicon Co., Ltd. of Wa Ke Asahi Chemical Industry system of rerum natura shown in table 1 embodiment 1 one hurdles, trade name: GENIOPERL P22) (below, should hud typed organosilicon particulate be called " hud typed organosilicon particles A ").Here, the average grain diameter of the nuclear particle of hud typed organosilicon particulate (organosilicon particulate) is by following mensuration.That is, adopt homogenizer that hud typed organosilicon particulate 100g and bisphenol f type epoxy resin 300g are mixed, obtain both mixtures.The average grain diameter of nuclear particle is obtained in the laser granularmetric analysis of the tetrahydrofuran solution by containing this mixture 1 quality %.
Hud typed organosilicon particles A 25 mass parts, phenoxy resin 30 mass parts (solid constituent), bisphenol f type epoxy resin 30 mass parts (solid constituent) and liquid epoxy resin 40 mass parts (solid constituent) that contain microcapsule-type potentiality curing agent (imidazole curing agent) are mixed obtain mixed liquor.These mixed liquor 100 parts by volume are cooperated above-mentioned conducting particles 5 parts by volume, at 23 ℃ of solution that obtain adhesive composite by stirring of temperature.
(thick: on the surface 50 μ m), the solution that whitewashes adhesive composite is coated with for film Co., Ltd. of Supreme Being people Du Pont system, trade name: Purex adopting stripping treatment agent (organic siliconresin) to carry out surface-treated PET film.Subsequently, by it being carried out heated-air drying (80 ℃ 5 minutes), what obtain thick 10 μ m that the PET film supports contains the conducting particles layer.
In addition, hud typed organosilicon particles A 30 mass parts, phenoxy resin 20 mass parts (solid constituent), bisphenol f type epoxy resin 40 mass parts (solid constituent) and liquid epoxy resin 40 mass parts (solid constituent) that contain microcapsule-type potentiality curing agent (imidazole curing agent) are mixed, do not contained the solution of the adhesive composite of conducting particles.With the solution of this adhesive composite adopt stripping treatment agent (organic siliconresin) carried out surface-treated PET film (film Co., Ltd. of Supreme Being people Du Pont system, trade name: Purex, thick: as to whitewash coating on the surface 50 μ m).Subsequently, by it being carried out heated-air drying (80 ℃ 5 minutes), what obtain thick 15 μ m that the PET film supports does not contain the conducting particles layer.
Use known in the past laminating machine that these bonding films are fitted each other.Like this, obtain double-deck circuit connection material shown in Figure 6.
(making of circuit connecting body)
(thick 0.7mm, sheet resistance＜20 Ω/) be connected with IC chip (thick 0.55mm) form circuit connecting body to the circuit connection material of employing as above-mentioned manufacturing with ito substrate.The IC chip uses has protruding area 2500 μ m
2The chip of the metal bump of (50 μ m * 50 μ m), spacing 100 μ m, high 20 μ m.Ito substrate uses the substrate that forms by evaporation ITO on the surface of the glass substrate of thick 1.1mm.
Circuit connection material is placed between IC chip and ito substrate, adopt compression bonding apparatus (Dongli Engineering Co., Ltd's system, trade name: FC-1200) connect.Specifically, the PET film that at first will contain conducting particles layer one side is peeled off, and circuit connection material is placed on the glass substrate, makes to contain conducting particles layer and ito substrate butt.Then, use compression bonding apparatus to carry out interim crimping (2 seconds under 75 ℃ of temperature, pressure 1.0MPa).After the PET film that does not contain conducting particles layer one side peeled off, mounting IC chip made gold bump and does not contain conducting particles layer butt.By use quartz glass on the base, heating and pressurizing obtains having the circuit connecting body of connecting portion 5 seconds under 200 ℃ of temperature, pressure 80MPa.
(mensuration of storage elastic modulus)
The double-deck circuit connection material of making in the present embodiment was made its curing in 1 hour 200 ℃ of heating.Cut determined sample (wide 5mm, long 20mm, thickness 25 μ m) from the solidfied material of circuit connection material, by following mensuration storage elastic modulus.That is,, adopt Measurement of Dynamic Viscoelasticity device RAS II (TA instrument company system), under the condition of 5 ℃/minute of programming rates, frequency 10Hz, amplitude 3 μ m, stretch mode, measure about the dynamic viscoelastic of determined sample.Then, according to the result who obtains, the storage elastic modulus when obtaining 40 ℃.
(mensuration of amount of warpage)
For the amount of warpage of the ito substrate that is packaged with the IC chip, adopt non-contact laser type 3 dimension shape measuring apparatus (KEYENCE system, trade names: LT-9000) measure.IC chip one side is towards the below, and the back side of ito substrate places circuit connecting body on the smooth platform towards the top.Then, measure the central part at the ito substrate back side with on this ito substrate back side from the two ends of IC chip apart from the difference in height at 5mm place.With the amount of warpage of this difference in height as glass substrate.
(initial stage connects the mensuration of resistance)
Adopt resistance measurement machine (ADVANTEST Co., Ltd. system, trade name: digital multimeter (Digitalmultimeter)) the initial stage resistance of the connecting portion of the circuit connecting body of mensuration as above-mentioned making.Measure when in addition, interelectrode electric current is for 1mA.
(evaluation of the insulating properties between adjacent electrode)
Adopt resistance measurement machine (ADVANTEST Co., Ltd. system, trade name: digital multimeter (Digitalmultimeter)) according to the insulation resistance between following program determination adjacent electrode.At first, the voltage of connecting portion external dc (DC) 50V of circuit connecting body 1 minute.Then, for the connecting portion behind the applied voltage, adopt 2 terminals measurement methods to carry out the mensuration of insulation resistance.In addition, adopt potentiometer (ADVANTEST Co., Ltd. system, trade name: ULTRA HIGH TESISTANCE METER) be used for the pressurization of above-mentioned voltage.
(evaluation of connection reliability)
For the connection reliability of the connecting portion of circuit connecting body, estimate by carrying out temperature cycling test.Temperature cycling test is carried out according to following: circuit connecting body is placed temperature cycles groove (ETAC system, trade name: NT1020), carry out 250 times repeatedly and be cooled to-40 ℃, be warming up to 100 ℃ and from 100 ℃ of temperature cycles that are cooled to room temperature from-40 ℃ from room temperature.Retention time when-40 ℃ and 100 ℃ is 30 minutes.The mensuration of the coupling part resistance after the temperature cycling test is identical with the mensuration of initial stage resistance.
(for having or not the evaluation that interface peel takes place)
(the KEYENCE system, trade name: the VH-8000) circuit connecting body after the observation temperature cycling test, evaluation has or not the generation interface peel to adopt electron microscope.Particularly, from the connecting portion of the glass substrate unilateral observation circuit connecting body of circuit connecting body, confirm to have or not interface peel on the glass substrate.
Table 3 shows the storage elastic modulus of determined sample (solidfied material of circuit connection material) when-50 ℃ and 100 ℃, maximum and the minimum value and the glass transition temperature of the storage elastic modulus of determined sample in-50 ℃～100 ℃ scope.In addition, the measurement result of the amount of warpage of table 4 demonstration ito substrate, connection resistance value, insulating resistance value.
When formation contains the conducting particles layer, replace cooperating the hud typed organosilicon particles A of 25 mass parts, cooperate the hud typed organosilicon particles B shown in the table 1 of 25 mass parts, and when formation does not contain the conducting particles layer, replace cooperating the hud typed organosilicon particles A of 30 mass parts, the hud typed organosilicon particles B that cooperates 30 mass parts, in addition according to embodiment 1 identical operations, make double-deck circuit connection material and circuit connecting body.In addition, hud typed organosilicon particles B is the GENIOPERLP52 (trade name) of organosilicon Co., Ltd. of Wa Ke Asahi Chemical Industry system.
Embodiment 3
When formation contains the conducting particles layer, cooperate the hud typed organosilicon particles A of 40 mass parts, in addition, according to embodiment 1 identical operations, make double-deck circuit connection material and circuit connecting body.
Embodiment 4
When formation contains the conducting particles layer, cooperate the hud typed organosilicon particles B of 40 mass parts, in addition, according to embodiment 2 identical operations, make double-deck circuit connection material and circuit connecting body.
Comparative example 1
When making double-deck circuit connection material, in each solution, mismatch hud typed organosilicon particulate, form by the cooperation ratio shown in the table 2 and contain the conducting particles layer and do not contain the conducting particles layer with cross-linked structure, in addition, according to embodiment 1 identical operations, make double-deck circuit connection material and circuit connection material.
Table 1
Table 2
Table 3
Application on the industry
According to the present invention, can fully reduce the internal stress that produces in the circuit connecting body.
Claims (12)
1. an adhesive composite is used for circuit block being connected to each other and the circuit electrode that each circuit block had being electrically connected to each other, and it contains epoxy resin, epoxy curing agent, the average grain diameter organosilicon particulate below 300nm.
2. adhesive composite as claimed in claim 1 wherein, further contains electroconductive particle.
3. adhesive composite as claimed in claim 1 or 2 wherein, is a benchmark in the gross mass of this adhesive composite, contains the described organosilicon particulate of 10～40 quality %.
4. as any described adhesive composite in the claim 1～3, it is formulated by cooperating hud typed organosilicon particulate, the coating layer that described hud typed organosilicon particulate has the nuclear particle that is made of described organosilicon particulate and constituted and be provided with according to the mode that coats described nuclear particle by the material that contains acrylic resin.
5. adhesive composite as claimed in claim 4 wherein, is a benchmark in the gross mass of described hud typed organosilicon particulate, and the organosilyl content of this hud typed organosilicon particulate is 40～90 quality %.
6. as any described adhesive composite in the claim 1～5, wherein, the storage elastic modulus of the solidfied material that obtained in 1 hour in heating under 200 ℃ the temperature during at 40 ℃ is 1～2GPa.
7. circuit connection material, it possesses membranaceous base material and is constituted and be arranged on bond layer on the face of described base material by any described adhesive composite in the claim 1～6.
8. circuit connecting body, it possesses a pair of circuit block and the connecting portion of relative configuration, wherein, described connecting portion is made of the solidfied material of any described adhesive composite in the claim 1～6, between described a pair of circuit block, the mode that is electrically connected to each other according to the circuit electrode that each circuit block is had is bonded to each other this circuit block.
9. circuit connecting body as claimed in claim 8, wherein, at least one side of described a pair of circuit block is an integrated circuit (IC) chip.
10. circuit connecting body as claimed in claim 8 or 9, wherein, at least one side's of the circuit electrode that has separately of described a pair of circuit block surface is to be made of at least a material that is selected from gold, silver, tin, ruthenium, rhodium, palladium, osmium, iridium, platinum and the tin indium oxide.
11. as any described circuit connecting body in the claim 8～10, wherein, at least one side with the bearing surface of the described a pair of circuit block of described connecting portion butt has the part that is made of at least a above material that is selected from silicon nitride, organo-silicon compound and photonasty or the non-photosensitive polyimide resin.
12. circuit member connecting method, wherein, make in the claim 1～6 any described adhesive composite between a pair of circuit block of relative configuration, to all heating and pressurizeing, form connecting portion, thereby obtain possessing the circuit connecting body of described a pair of circuit block and described connecting portion, described connecting portion is constituted, between described a pair of circuit block and according to the mode that the circuit electrode that each circuit block is had is electrically connected to each other described circuit block is bonded to each other by the solidfied material of described adhesive composite.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510202528.1A CN104893655B (en) | 2007-10-18 | 2008-10-10 | Adhesive composition, circuit connecting material using same, method for connecting circuit member, and circuit connected body |
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| JP2007271263 | 2007-10-18 | ||
| JP2007-271263 | 2007-10-18 | ||
| JP2008050383 | 2008-02-29 | ||
| JP2008-050383 | 2008-02-29 | ||
| PCT/JP2008/068422 WO2009051067A1 (en) | 2007-10-18 | 2008-10-10 | Adhesive composition, circuit connecting material using the adhesive composition, method for connecting circuit member, and circuit connecting body |
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| CN200880111995A Pending CN101828434A (en) | 2007-10-18 | 2008-10-10 | Adhesive composition, circuit connecting material using the adhesive composition, method for connecting circuit member, and circuit connecting body |
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| JP (1) | JP4930598B2 (en) |
| KR (2) | KR101130377B1 (en) |
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| JP5247968B2 (en) * | 2003-12-02 | 2013-07-24 | 日立化成株式会社 | Circuit connection material and circuit member connection structure using the same |
| US20060182949A1 (en) * | 2005-02-17 | 2006-08-17 | 3M Innovative Properties Company | Surfacing and/or joining method |
| JP2006028521A (en) * | 2005-08-19 | 2006-02-02 | Hitachi Chem Co Ltd | Addhesive for circuit connection |
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| JP4877230B2 (en) * | 2005-11-18 | 2012-02-15 | 日立化成工業株式会社 | Adhesive composition, circuit connection material, connection structure, and circuit member connection method |
| JP5082296B2 (en) * | 2005-12-19 | 2012-11-28 | 日立化成工業株式会社 | Adhesive with wiring and circuit connection structure |
| JP4967482B2 (en) * | 2006-02-27 | 2012-07-04 | 日立化成工業株式会社 | Conductive particles, adhesive composition and circuit connecting material |
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| CN103262172A (en) * | 2010-11-03 | 2013-08-21 | 弗赖斯金属有限公司 | Sintering materials and attachment methods using same |
| CN102709257A (en) * | 2012-05-10 | 2012-10-03 | 三星半导体(中国)研究开发有限公司 | Semiconductor plastic package material and manufacturing method thereof as well as semiconductor plastic package piece |
| CN107148809A (en) * | 2014-10-17 | 2017-09-08 | 太阳油墨制造株式会社 | Dry film and flexible printed circuit board |
| CN107148809B (en) * | 2014-10-17 | 2020-08-11 | 太阳油墨制造株式会社 | Dry film and flexible printed circuit board |
| CN112863732A (en) * | 2014-10-29 | 2021-05-28 | 迪睿合株式会社 | Method for manufacturing connection structure, and conductive material |
| CN112863732B (en) * | 2014-10-29 | 2023-01-17 | 迪睿合株式会社 | Method for manufacturing connection structure, and conductive material |
| CN110050036A (en) * | 2016-12-09 | 2019-07-23 | 日立化成株式会社 | The manufacturing method of composition, bonding agent, sintered body, conjugant and conjugant |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2009051067A1 (en) | 2009-04-23 |
| CN104893655A (en) | 2015-09-09 |
| TW200932861A (en) | 2009-08-01 |
| KR101183317B1 (en) | 2012-09-14 |
| JP4930598B2 (en) | 2012-05-16 |
| CN104893655B (en) | 2020-06-16 |
| TWI402321B (en) | 2013-07-21 |
| KR20100009545A (en) | 2010-01-27 |
| KR20110099793A (en) | 2011-09-08 |
| KR101130377B1 (en) | 2012-03-27 |
| JPWO2009051067A1 (en) | 2011-03-03 |
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