CN102159033A - Method for making flared hole on circuit board - Google Patents
Method for making flared hole on circuit board Download PDFInfo
- Publication number
- CN102159033A CN102159033A CN 201110075449 CN201110075449A CN102159033A CN 102159033 A CN102159033 A CN 102159033A CN 201110075449 CN201110075449 CN 201110075449 CN 201110075449 A CN201110075449 A CN 201110075449A CN 102159033 A CN102159033 A CN 102159033A
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- Prior art keywords
- hole
- circuit board
- flared hole
- flared
- manufacture method
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
The invention discloses a method for making a flared hole on a circuit board. The method comprises the following steps of: cutting, drilling a through hole and drilling a flared hole, wherein the flared hole is drilled by using a computerized numerical control (CNC) drilling machine. The method is simple, low in cost, high in profit and wide in application, can meet requirement of customers on various order quantities, and has broad market prospect. The method can be used for making various flared holes on metallic and nonmetallic circuit boards and belongs to the technical field of board drilling.
Description
Technical field
The present invention relates to a kind of manufacture method of hole, relate in particular to a kind of manufacture method of flared hole, belong to sheet material perforate technical field.
Technical background
The electrical equipment assembly structure of miniaturization at present is tight, the useful space is little, so require the installation hole shape of part substrate to require to be processed into the tubaeform of different angles, different depth, cover concordant plate face to satisfy set screw, the top of thing of screw and so on that usefulness promptly is installed is all below the PBC surface, big aperture coupling part is the inclined-plane, and the angle requirement is arranged.At present, above-mentioned hole is made, wiring board manufacturing factory all finishes by making the high mould of a cover precision prescribed, but cost of manufacture height like this, the mould striker is short, fragile useful life, brought inconvenience for like this manufacturer and user, as flared hole unit price height, and once property order volume great achievement is produced producer's ability order production.How to address the above problem, be that pendulum is in the previous extremely urgent problem of our face.
Summary of the invention
At the problems referred to above, the present invention discloses a kind of use CNC rig and makes the bellmouth orifice method, and this method is tackled the identical dimensional requirement class hole of different aperture angle by selecting the cutter of difformity, different-diameter, angle.
Technical scheme of the present invention is such: the manufacture method of flared hole on a kind of circuit board comprises: open material, drill through the hole, bore bellmouth orifice, wherein, described brill bellmouth orifice adopts the CNC rig to hole.
The manufacture method of flared hole on above-mentioned a kind of circuit board, wherein, described method can be used to bore non-heavy brass bugle shape hole and heavy brass bugle shape hole.
The manufacture method of flared hole on above-mentioned a kind of circuit board, wherein, described heavy brass bugle shape hole opening is selected to piece together nail and is done the location drilling mode.
The manufacture method of flared hole on above-mentioned a kind of circuit board, wherein, described non-heavy brass bugle shape hole opening is selected the finished product list to prop up or is propped up the location location drilling mode that the cover that is combined into is loaded onto by several lists.
The manufacture method of flared hole on above-mentioned a kind of circuit board, wherein, when described CNC rig carried out bellmouth orifice, the different-diameter flared hole selected the brill of different-diameter, different angles to chew.
The manufacture method of flared hole on above-mentioned a kind of circuit board wherein, selects the brill of diameter 5.0mm different angles to chew when described CNC rig carries out bellmouth orifice.
The manufacture method of flared hole on above-mentioned a kind of circuit board, wherein, can be during described brill bellmouth orifice by drilling depth under the control flared hole upper shed diameter adjustment equipment.
The manufacture method of flared hole on above-mentioned a kind of circuit board, wherein, described hole opening diameter tolerance surpasses the concave plane step that then needs to go out according to bellmouth orifice size elder generation gong on the CNC table top to be processed certain depth of the margin of tolerance.
Prior art is compared, and it is simple that the present invention has manufacture method, and cost of manufacture is low, the profit height, and applied range can satisfy client's various quantity on order requirements, and vast market prospect is arranged.
Embodiment
Embodiment 1
One embodiment of the present invention are: the boring opening diameter is that the heavy copper class flared hole manufacture method of 6.0mm comprises on a kind of metallic circuit: opening the material back is the 3.6mm through hole at the mode drill diameter of perforated plate face employing machine drilling, utilize again to bore and chew 90 ° of angles, the CNC rig of diameter 6.5mm bores flared hole, adopt and piece together the nail location drilling, the hole opening diameter margin of tolerance should be controlled at ± 0.10mm, adopt the chemical medicinal liquid thin copper that heavy last layer is used to conduct electricity on hole wall then, arrange outer-layer circuit at last, electroplate figure, circuit etching, welding resistance makes that each position becomes one in the circuit board again, mark required character again, carry out surface treatment then, the finishing touch external form, but electrical measurement each several part circuit errorless after just shipment.
Embodiment 2
Another embodiment of the invention is: the boring opening diameter is that the non-heavy copper class flared hole manufacture method of 5.5mm comprises on a kind of metallic circuit: opening the material back is the 3.0mm through hole at the mode drill diameter of perforated plate face employing machine drilling, utilize again to bore and chew 90 ° of angles, the CNC rig of diameter 6.0mm bores flared hole, the finished product list props up or props up the cover that is combined into by several lists and load onto location drilling, the hole opening diameter margin of tolerance should be controlled at ± 0.12mm, adopt the chemical medicinal liquid thin copper that heavy last layer is used to conduct electricity on hole wall then, arrange outer-layer circuit at last, electroplate figure, circuit etching, welding resistance makes that each position becomes one in the circuit board again, mark required character again, carry out surface treatment then, the finishing touch external form, but finished product detection qualified after just shipment.
Embodiment 3
Another embodiment of the invention is: the boring opening diameter is that the heavy copper class flared hole manufacture method of 6.5mm comprises on a kind of nonmetal circuit board: opening the material back is the 4.5mm through hole at the mode drill diameter of perforated plate face employing machine drilling, adopt pin rumble Plate grinder to grind off plate face foreign matter again, adopt the chemical medicinal liquid thin copper that heavy last layer is used to conduct electricity on hole wall then, thicken copper 11um again, re-plating copper layer behind the outer graphics, the tin layer, the etching outer-layer circuit, welding resistance makes that each position becomes one in the circuit board again, mark required character again, carry out then repairing external form after the surface treatment, utilize at last to utilize again to bore and chew 90 ° of angles, the CNC rig of diameter 7.0mm bores flared hole, piece together the nail location drilling, the hole opening diameter margin of tolerance should be controlled at ± 0.12mm, the need that surpass the margin of tolerance for the hole opening diameter according to bellmouth orifice size to be processed earlier on the CNC table top gong go out the concave plane step of certain depth, but finished product detection qualified after just shipment.
Embodiment 4
Another embodiment of the invention is: the boring opening diameter is that the non-heavy copper class flared hole manufacture method of 5.8mm comprises on a kind of nonmetal circuit board: opening the material back is the 3.5mm through hole at the mode drill diameter of perforated plate face employing machine drilling, adopt pin rumble Plate grinder to grind off plate face foreign matter again, adopt the chemical medicinal liquid thin copper that heavy last layer is used to conduct electricity on hole wall then, thicken copper 8um again, re-plating copper layer behind the outer graphics, the tin layer, the etching outer-layer circuit, welding resistance makes that each position becomes one in the circuit board again, mark required character again, carry out then repairing external form after the surface treatment, utilize at last to utilize again to bore and chew 90 ° of angles, the CNC rig of diameter 6.5mm bores flared hole finished product list and props up or prop up the cover that is combined into by several lists and load onto location drilling, the hole opening diameter margin of tolerance should be controlled at ± 0.11mm, the need that surpass the margin of tolerance for the hole opening diameter according to bellmouth orifice size to be processed earlier on the CNC table top gong go out the concave plane step of certain depth, but finished product detection qualified after just shipment.
Claims (8)
1. the manufacture method of flared hole on the circuit board, comprising: open material, drill through the hole, bore bellmouth orifice, it is characterized in that, described brill bellmouth orifice adopts the CNC rig to hole.
2. the manufacture method of flared hole on the described a kind of circuit board of claim 1 is characterized in that, described flared hole is non-heavy copper class flared hole or heavy copper class flared hole.
3. the manufacture method of flared hole is characterized in that on a kind of circuit board according to claim 2, and described heavy brass bugle shape hole opening selects to piece together nail location drilling mode.
4. the manufacture method of flared hole is characterized in that on a kind of circuit board according to claim 2, and described non-heavy brass bugle shape hole opening is selected circuit board finished product list to prop up or propped up the location drilling mode that the cover that is combined into is loaded onto by several lists.
5. the manufacture method of flared hole is characterized in that on a kind of circuit board according to claim 1, when described CNC rig carries out loudspeaker boring, selects the brill of different-diameter, different angles to chew for the different-diameter flared hole.
6. the manufacture method of flared hole is characterized in that on a kind of circuit board according to claim 5, selects the brill of diameter 5.0mm different angles to chew when described CNC rig carries out bellmouth orifice.
7. according to the manufacture method of flared hole on claim 1 or the 2 any described a kind of circuit boards, it is characterized in that, adjust drilling depth under the CNC rig by control flared hole upper shed diameter during described brill bellmouth orifice.
8. according to the manufacture method of flared hole on the described a kind of circuit board of claim 1, it is characterized in that described flared hole opening diameter tolerance surpasses the concave plane step that then needs to go out according to bellmouth orifice size elder generation gong on the CNC table top to be processed certain depth of the margin of tolerance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110075449 CN102159033A (en) | 2011-03-28 | 2011-03-28 | Method for making flared hole on circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110075449 CN102159033A (en) | 2011-03-28 | 2011-03-28 | Method for making flared hole on circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102159033A true CN102159033A (en) | 2011-08-17 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201110075449 Pending CN102159033A (en) | 2011-03-28 | 2011-03-28 | Method for making flared hole on circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102159033A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102933028A (en) * | 2012-10-25 | 2013-02-13 | 华为技术有限公司 | Printed circuit board and method for manufacturing compression joint holes thereof |
| CN103889166A (en) * | 2012-12-19 | 2014-06-25 | 深南电路有限公司 | Mechanical controlled deep blind hole processing technology |
| CN107900616A (en) * | 2017-11-14 | 2018-04-13 | 珠海市魅族科技有限公司 | The processing method and terminal in terminal horn hole |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58197896A (en) * | 1982-05-14 | 1983-11-17 | 株式会社日立製作所 | Circuit board having through hole and method of producing same |
| CN1816246A (en) * | 2005-02-04 | 2006-08-09 | 光宝科技股份有限公司 | Printed circuit board and formation method |
| CN101287332A (en) * | 2008-05-27 | 2008-10-15 | 艾默生网络能源有限公司 | Circuit board and method of processing the same |
| CN101765296A (en) * | 2009-12-31 | 2010-06-30 | 深圳崇达多层线路板有限公司 | Drilling method of motherboard of circuit board |
| CN101954500A (en) * | 2010-08-13 | 2011-01-26 | 大连太平洋电子有限公司 | Device and method for processing counterbore of circuit board |
-
2011
- 2011-03-28 CN CN 201110075449 patent/CN102159033A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58197896A (en) * | 1982-05-14 | 1983-11-17 | 株式会社日立製作所 | Circuit board having through hole and method of producing same |
| CN1816246A (en) * | 2005-02-04 | 2006-08-09 | 光宝科技股份有限公司 | Printed circuit board and formation method |
| CN101287332A (en) * | 2008-05-27 | 2008-10-15 | 艾默生网络能源有限公司 | Circuit board and method of processing the same |
| CN101765296A (en) * | 2009-12-31 | 2010-06-30 | 深圳崇达多层线路板有限公司 | Drilling method of motherboard of circuit board |
| CN101954500A (en) * | 2010-08-13 | 2011-01-26 | 大连太平洋电子有限公司 | Device and method for processing counterbore of circuit board |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102933028A (en) * | 2012-10-25 | 2013-02-13 | 华为技术有限公司 | Printed circuit board and method for manufacturing compression joint holes thereof |
| CN103889166A (en) * | 2012-12-19 | 2014-06-25 | 深南电路有限公司 | Mechanical controlled deep blind hole processing technology |
| CN107900616A (en) * | 2017-11-14 | 2018-04-13 | 珠海市魅族科技有限公司 | The processing method and terminal in terminal horn hole |
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Application publication date: 20110817 |