CN116676551A - 一种镀锡黄铜及其生产方法 - Google Patents
一种镀锡黄铜及其生产方法 Download PDFInfo
- Publication number
- CN116676551A CN116676551A CN202310742305.9A CN202310742305A CN116676551A CN 116676551 A CN116676551 A CN 116676551A CN 202310742305 A CN202310742305 A CN 202310742305A CN 116676551 A CN116676551 A CN 116676551A
- Authority
- CN
- China
- Prior art keywords
- tin
- copper
- layer
- production method
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910001369 Brass Inorganic materials 0.000 title claims abstract description 35
- 239000010951 brass Substances 0.000 title claims abstract description 35
- 238000004519 manufacturing process Methods 0.000 title claims description 31
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 117
- 239000010949 copper Substances 0.000 claims abstract description 77
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 75
- 229910052802 copper Inorganic materials 0.000 claims abstract description 74
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 46
- 239000000956 alloy Substances 0.000 claims abstract description 46
- 238000007747 plating Methods 0.000 claims abstract description 35
- 239000007788 liquid Substances 0.000 claims abstract description 26
- 238000005507 spraying Methods 0.000 claims abstract description 26
- 238000000034 method Methods 0.000 claims description 22
- 238000001816 cooling Methods 0.000 claims description 21
- 239000007921 spray Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 abstract description 26
- 230000035882 stress Effects 0.000 abstract description 7
- 230000032683 aging Effects 0.000 abstract description 5
- 238000005275 alloying Methods 0.000 abstract description 4
- 239000011135 tin Substances 0.000 description 99
- 229910052718 tin Inorganic materials 0.000 description 97
- 238000005096 rolling process Methods 0.000 description 31
- 238000005266 casting Methods 0.000 description 15
- 229910000570 Cupronickel Inorganic materials 0.000 description 13
- 238000004140 cleaning Methods 0.000 description 13
- 238000000137 annealing Methods 0.000 description 10
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 10
- 238000010438 heat treatment Methods 0.000 description 10
- 229910000906 Bronze Inorganic materials 0.000 description 9
- 239000010974 bronze Substances 0.000 description 9
- 238000005498 polishing Methods 0.000 description 8
- 238000003466 welding Methods 0.000 description 8
- 230000007797 corrosion Effects 0.000 description 7
- 238000005260 corrosion Methods 0.000 description 7
- 229910001432 tin ion Inorganic materials 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 230000001276 controlling effect Effects 0.000 description 6
- 238000010008 shearing Methods 0.000 description 6
- 229910052725 zinc Inorganic materials 0.000 description 6
- 239000011701 zinc Substances 0.000 description 6
- 239000002253 acid Substances 0.000 description 5
- 239000002585 base Substances 0.000 description 5
- 238000005452 bending Methods 0.000 description 5
- 238000003801 milling Methods 0.000 description 5
- 238000005406 washing Methods 0.000 description 5
- 229910000881 Cu alloy Inorganic materials 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 230000000996 additive effect Effects 0.000 description 4
- 239000003513 alkali Substances 0.000 description 4
- 239000012298 atmosphere Substances 0.000 description 4
- 238000009713 electroplating Methods 0.000 description 4
- 150000002500 ions Chemical class 0.000 description 4
- 239000011133 lead Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 238000009749 continuous casting Methods 0.000 description 3
- 238000005238 degreasing Methods 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 3
- 238000005098 hot rolling Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 239000003921 oil Substances 0.000 description 3
- 238000002161 passivation Methods 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 229910000776 Common brass Inorganic materials 0.000 description 2
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 238000003723 Smelting Methods 0.000 description 2
- SBYXRAKIOMOBFF-UHFFFAOYSA-N copper tungsten Chemical compound [Cu].[W] SBYXRAKIOMOBFF-UHFFFAOYSA-N 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 229910052748 manganese Inorganic materials 0.000 description 2
- 239000011572 manganese Substances 0.000 description 2
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000010079 rubber tapping Methods 0.000 description 2
- 238000005070 sampling Methods 0.000 description 2
- 239000002893 slag Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229910001006 Constantan Inorganic materials 0.000 description 1
- 229910017482 Cu 6 Sn 5 Inorganic materials 0.000 description 1
- 241000784732 Lycaena phlaeas Species 0.000 description 1
- 241000227425 Pieris rapae crucivora Species 0.000 description 1
- 229910001297 Zn alloy Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229910052790 beryllium Inorganic materials 0.000 description 1
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 description 1
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 1
- 229910002056 binary alloy Inorganic materials 0.000 description 1
- 229910021538 borax Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000003245 coal Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- HPDFFVBPXCTEDN-UHFFFAOYSA-N copper manganese Chemical compound [Mn].[Cu] HPDFFVBPXCTEDN-UHFFFAOYSA-N 0.000 description 1
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 description 1
- TVZPLCNGKSPOJA-UHFFFAOYSA-N copper zinc Chemical compound [Cu].[Zn] TVZPLCNGKSPOJA-UHFFFAOYSA-N 0.000 description 1
- NWFNSTOSIVLCJA-UHFFFAOYSA-L copper;diacetate;hydrate Chemical compound O.[Cu+2].CC([O-])=O.CC([O-])=O NWFNSTOSIVLCJA-UHFFFAOYSA-L 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- ALKZAGKDWUSJED-UHFFFAOYSA-N dinuclear copper ion Chemical compound [Cu].[Cu] ALKZAGKDWUSJED-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000009036 growth inhibition Effects 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000001050 lubricating effect Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 238000004663 powder metallurgy Methods 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 239000013535 sea water Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000004328 sodium tetraborate Substances 0.000 description 1
- 235000010339 sodium tetraborate Nutrition 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- -1 tinned copper wire Chemical compound 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/04—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the coating material
- C23C4/06—Metallic material
- C23C4/08—Metallic material containing only metal elements
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C10/00—Solid state diffusion of only metal elements or silicon into metallic material surfaces
- C23C10/18—Solid state diffusion of only metal elements or silicon into metallic material surfaces using liquids, e.g. salt baths, liquid suspensions
- C23C10/20—Solid state diffusion of only metal elements or silicon into metallic material surfaces using liquids, e.g. salt baths, liquid suspensions only one element being diffused
- C23C10/22—Metal melt containing the element to be diffused
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C10/00—Solid state diffusion of only metal elements or silicon into metallic material surfaces
- C23C10/60—After-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/12—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the method of spraying
- C23C4/123—Spraying molten metal
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/12—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the method of spraying
- C23C4/14—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the method of spraying for coating elongate material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/18—After-treatment
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Coating With Molten Metal (AREA)
Abstract
本发明提供了一种镀锡黄铜及其生产方法,与现有技术相比,本发明通过将锡液喷洒在铜带表面,控制锡液的成分、喷洒温度等,使镀锡带难以因应力改变而生长出锡须,能够抑制锡须生长。且,通过本申请锡液的成分、与温度、风机速度协同控制,减少锡层与铜材合金化时间,降低游离合金层的产生率,将镀锡合金层的厚度控制在镀锡层厚度的1/5~2/5,获得最佳合金层厚度,提高产品抗老化性能。
Description
技术领域
本发明属于铜带生产领域,具体涉及一种镀锡黄铜及其生产方法。
背景技术
目前市场上铜合金应用最为普遍的主要是黄铜、百铜、青铜。不同的种类合金成分不同,用途不同。
其中,黄铜:以锌作主要添加元素的铜合金,具有美观的黄色,统称黄铜。铜锌二元合金称普通黄铜或称简单黄铜,三元以上的黄铜称特殊黄铜或称复杂黄铜。含锌低于36%的黄铜合金具有良好的冷加工性能,如含锌30%的黄铜常用来制作弹壳;最常用的是含锌40%的黄铜。为了改善普通黄铜的性能,常添加其他元素,如铝、镍、锰、锡、硅、铅等。铝能提高黄铜的强度、硬度和耐蚀性,但使塑性降低,适合作海轮冷凝管及其他耐蚀零件。锡能提高黄铜的强度和对海水的耐腐性,用作船舶热工设备和螺旋桨等。铅能改善黄铜的切削性能,这种易切削黄铜常用作钟表零件。黄铜铸件常用来制作阀门和管道配件等,船舶常用的消防栓防爆月牙扳手,就是黄铜加铝铸造而成。
白铜:以镍为主要添加元素的铜合金,铜镍二元合金称普通白铜;加有锰、铁、锌、铝等元素的白铜合金称复杂白铜。工业用白铜分为结构白铜和电工白铜两大类。结构白铜的特点是机械性能和耐蚀性好,色泽美观。这种白铜广泛用於制造精密机械、化工机械和船舶构件。电工白铜一般有良好的热电性能。锰铜、康铜、考铜是含锰量不同的锰白铜,是制造精密电工仪器、变阻器、精密电阻、应变片、热电偶等用的材料。
青铜:原指铜锡合金,后除黄铜、白铜以外的铜合金均称青铜,并常在青铜名字前冠以第一主要添加元素的名。锡青铜的铸造性能、减摩性能好和机械性能好,适合于制造轴承、蜗轮、齿轮等。铅青铜是现代发动机和磨床广泛使用的轴承材料。铝青铜强度高,耐磨性和耐蚀性好,用于铸造高载荷的齿轮、轴套、船用螺旋桨等。磷青铜的弹性极限高,导电性好,适於制造精密弹簧和电接触元件。铍青铜还用来制造煤矿、油库等使用的无火花工具。铍铜是机械性能、物理性能、化学性能及抗蚀性能良好。粉末冶金制作针对钨铜,高碳铜、耐高温超硬合金制作的模具需电蚀时,因普通电极损耗大,速度慢,钨铜是比较理想材料,抗弯强度≥667Mpa。
为了防止铜材暴露在空气中而被氧化,镀锡铜出现了。其在表面镀有一薄层金属锡的铜,如镀锡铜线,在线缆加工制造过程中有一定的应用。镀锡能防止铜暴露在空气中而被氧化形成一层膜——铜绿。而铜绿的导电性很差会增加电阻。盛装食物的器皿产生铜绿后可能对人体有害。因而镀锡主要就是为了防止铜被氧化。主要特点有:1)焊带可焊性能好,独特优良的焊料添加剂保证了焊料的流动性;2)优质的铜基材,电阻率低,保证了焊带电阻值低,不会引起组件功率损耗;3)稳定的化学性能,焊料良好的流动和低温性能,保证外观花纹好看,表面光洁光亮,无锡渣,无针孔,无露铜;4)先进的热处理工艺,保证铜基材的物理性能,并保证铜基材的硬度适当,可以根据不同的电池片调整焊带的物理性能,保证焊接过程中电池片的破碎率较低;5)自动化的焊锡工艺保证焊带产品的质量稳定性和一致性;6)强大的实验及检测设备和手段,从材料到成品的每一个环节得以保证。
目前生产镀锡铜采用的主要是电镀和热浸镀,其中电镀锡的应用最为广泛。与其他镀锡方法相比,电镀锡的主要优点是镀层金属厚度均匀,并可随意控制,但其生产工艺较热浸镀锡繁琐,操作要求严格,电镀设备价格高,且电镀液成分复杂,配方成本较高,排放与环境污染较为严重。相比之下,热浸镀锡的优点是可焊接性好、镀层致密牢固、污染较轻、生产简单、流程简单、交货期短,因而被国外许多镀锡厂家采用。
但是,镀锡带在生产过程中或者在客户端使用过程中经常会出现锡须生长的现象,主要是原因是在镀锡过程中金属锡和铜形成的合金厚度厚度偏低或者表面不均、锡层厚度偏低、使用过程中对镀锡铜片的应力偏高从而导致残余应力偏高破坏了原来的晶体结构等,此类现象的出现最终都会导致镀锡铜带产生锡须,锡须的不断生长长时间必定会导致电子元器件发生短路、橘皮纹等情况,最终导致产品使用寿命大大降低。
因此,抑制锡须生长是生产镀锡铜过程中亟待解决的问题。
发明内容
本发明的目的在于提供一种镀锡黄铜及其生产方法,在镀锡工艺中,采用含锡离子溶液喷洒,提高了镀锡带锡层的均匀性,提高了锡层表面氧化膜的生长速率,避免了镀锡带由于自身应力改变而生长出锡须现象等现象。且,生产中,通过工艺优化,获得最佳合金层厚度,提高产品抗老化性能。
本发明具体技术方案如下:
一种镀锡黄铜的生产方法,包括镀锡,所述镀锡采用锡液喷洒在铜带表面。
进一步的,锡液喷洒在运行中的铜带表面,铜带运行速度为8米/分钟;
所述喷洒,控制喷洒流量10-15升/分钟,喷洒运行速度4-16米/分钟,喷洒角度垂直向下且固定不变,即喷洒角度垂直于带铜表面,喷洒采用的喷嘴压强设置在250KPa-300KPa,喷嘴直径在4-11mm。
所述锡液,包括以下质量百分比成分:Cu≤1.5%,Zn 0.05-0.20%,余量为Sn;
所述锡液的温度为300~500℃。
锡液喷洒在铜带表面环境温度为80-90℃;锡液加热至温度为300-500℃,然后经过喷嘴喷洒至运行中的铜带表面,在喷洒过程中锡液的热量会传递,在锡液喷洒在铜带表面环境温度为80-90℃。
所述喷洒采用带有喷嘴的雾化器喷洒。
所述生产方法还包括镀锡后冷却,控制冷却风机风速为800±20m/s,冷却至室温。
本发明提供的一种镀锡黄铜,采用以上方法生产得到,为抑制锡须生长的镀锡黄铜;
所述包括抑制锡须生长的镀锡黄铜铜基体,所述铜基体的表面上为镀锡层,所述镀锡层包括合金层和锡层,所述合金层的厚度为镀锡层总厚度的1/5-2/5。
与现有技术相比,本发明通过将锡液喷洒在铜带表面,控制锡液的成分、喷洒温度等,使镀锡带难以因应力改变而生长出锡须,能够抑制锡须生长。且,通过本申请锡液的成分、温度、镀锡后冷却(风机速度)协同控制,减少锡层与铜材合金化时间,降低游离合金层的产生率,将镀锡合金层的厚度控制在镀锡层总厚度的1/5~2/5,获得最佳合金层厚度,提高产品抗老化性能。
附图说明
图1为镀锡铜带断面组成,包括铜基体、合金层和锡层。
图2为200m/s风速下材料合金层;
图3为800m/s风速下材料合金层。
具体实施方式
本发明提供的一种镀锡黄铜的生产方法,其生产方法包括以下工艺流程:熔铸→半连续铸造→锯切→步进炉加热→热轧→双面铣→粗轧→厚剪切边→罩式炉退火→厚带清洗→预精轧→中轧退火→精轧成品轧制→成品清洗→拉弯矫直→成品分条裸材→镀锡→成品分条镀锡材。
所述锡液,包括以下质量百分比成分:Cu≤1.5%,Zn 0.05-0.20%,余量为Sn;
所述锡液的温度为300~500℃。
锡液喷洒在铜带表面环境温度为80-90℃;锡液加热至温度为300-500℃,然后经过喷嘴喷洒至运行中的铜带表面,在喷洒过程中锡液的热量会传递,在锡液喷洒在铜带表面环境温度为80-90℃。
所述喷洒采用带有喷嘴的雾化器喷洒。
所述生产方法还包括镀锡后冷却,冷却风机风速为800±20m/s。
以上方法生产的镀锡黄铜,提高了镀锡带锡层的均匀性,提高了锡层表面氧化膜的生长速率,避免了镀锡带由于自身应力改变而生长出锡须现象等现象。所生产的镀锡黄铜合金层的厚度为合金层和锡层总厚度的1/5-2/5。
传统锡液浇漫式,由于铜带表面接触的锡溶液时间、锡离子浓度等各类因素,都导致铜带表面镀锡层厚度不均。而本发明采用高温喷洒式采用雾化器来进行喷洒,雾化器喷嘴喷出来的含锡离子溶液在铜带表面进行小颗粒浓密分布,锡离子得电子后形成较为均匀的锡层,锡液加热至温度为300-500℃,然后经过喷嘴喷洒至运行中的铜带表面,在喷洒过程中锡液的热量会传递到镀锡的设备和环境,环境温度达到80-90℃,此温度下能加速锡离子的运动速度,在高密度小颗粒的雾液表面锡离子运动速度加快,接电后在铜带表面形成更加均匀,无空隙的锡层,同时铜带表面形成的锡层与空气中的氧气反应生成二氧化锡的速度加速,锡层表面形成更加均匀、无空隙和厚度更大的锡氧化层。最终促使镀锡带难以因应力改变而生长出锡须,避免电器元部件短路现象。
发明人发现,自由锡层中的游离合金在高温老化实验中,自由锡中的游离合金层会增长,使得整个自由锡层硬化,从而降低热浸镀镀锡材料的焊接性能,游离的合金层主要是由于基材的Cu离子还未完全溢出,停留在镀锡层的自由锡层中。本申请通过实验论证,游离的合金层主要由锡液的温度和锡液化学成分有关。不同的锡液成分对应不同的锡液温度,在锡液成分一定时,锡液温度低于该值时,溢出速度过慢,Cu离子还未完全溢出,产品表面不良;锡液的温度过高,导致Cu离子从铜材中溢出数量增加且速度加快,在锡层中游离合金层数量同样增加。因此,本申请控制锡液温度范围为300~500℃。
在热镀锡过程中,在铜基体表面形成镀锡层,镀锡层包括锡层和合金层(如图1所示),所述铜基体表面上依次为合金层和锡层。因为熔化的锡和铜之间反应,在铜基体和镀锡层之间产生硬且均匀的合金层(Cu6Sn5),保证了非常好的附着率,改善了摩擦特性,合金层的厚度对热镀锡层质量极为重要,是调控镀锡工艺的主要参数。合金层太薄,镀锡层附着力较弱,容易剥离脱落;合金层太厚,使镀锡层产生合金硬化,降低材料焊接性能和抗腐蚀性能,材料接触电阻增大。如何获得合适的合金层厚度是保证产品性能的关键。本申请通过锡液成分与温度、控制镀后冷却风机速度协同控制,减少镀层与铜材合金化时间,降低游离合金层的产生率,将合金层的厚度控制在整个镀锡层的厚度的1/5~2/5,获得最佳合金层厚度,提高产品抗老化性能。通过发明人大量探索,发现影响合金层厚度的主要因素是冷却风机风速,加大冷却风机风速缩短熔融锡液凝固时间,从而减少锡层与铜材合金化时间,降低合金层厚度。本申请通过发现,在本申请镀锡方法和镀液成分下,200m/s风速下合金层厚度约占整个镀锡层厚度的1/2;在800m/s风速条件下,合金层厚度达到最佳水平,约占整个镀锡层厚度的1/5-2/5。
下面结合几个实际案例对本申请进一步说明。
实施例1
一种镀锡黄铜的生产方法,所述镀锡黄铜以牌号C2600为例,包括以下质量百分比成分:铜69.36%、锡0.03%、磷0.002%、镍0.006%、铅0.004%、铁0.018%、铝0.0014%,锌30.5786%;包括以下工艺流程:熔铸→半连续铸造→锯切→步进炉加热→热轧→双面铣→粗轧→厚剪切边→罩式炉退火→厚带清洗→预精轧→中轧退火→精轧成品轧制→成品清洗→拉弯矫直→成品分条裸材→镀锡→成品分条镀锡材。
1)熔炼:将阴极铜及其他金属按顺序及比例加入熔炼炉中→熔化→升温→静置10-15分钟除气→捞渣→取样分析→调整成分至合格→升温至转炉温度(1080~1100)→转炉→转炉后搅拌均匀,取样分析,并静置不少于15分钟,分析结果必须符合出炉范围,方可出炉铸造。
2)半连续铸造:倾斜保温炉炉膛,使铜液流进结晶器中(拉铸的温度在1070~1110℃),再通过引锭机拉出铜锭,其中初始拉铸速度30mm/min,初始水流量15L/min,进水水压:0.01-2Mpa,正常拉铸速度160mm/min,正常水流量80L/min,铸造时使用的覆盖剂为硼砂。
3)锯切:采用扁锭式锯切机将头尾表面缺陷切除,铸锭确保锯后长度符合5500~7000mm。
4)步进炉加热:炉内温度达到740℃后方可加料,炉内所采取的气氛为微氧化性气氛,步进炉加热温度在870~950℃,步进周期控制在540~720s。
5)热轧:铸坯出炉后,通过二辊可逆式轧机经过9个道次的轧制将厚度轧制15~16mm,轧制力在600~1000KN,轧制速度控制在90~130m/min,轧制后通过冷却段进行卷曲。
6)双面铣:单面铣屑量为0.8~1.0mm,单边铣屑量为2~4mm,设备运行速度控制在4~8m/s。
7)粗轧:采取4辊轧机进行开坯将铜带多道次轧制至1.5mm,轧制时采取乳化液作为润滑液和冷却液,开坯第一道次速度低于60m/min,开坯非第一道次低于180m/min。
8)厚剪切边:黄铜带通过厚纵剪剪切宽度30~40mm,剪切速度控制在60~90m/s。
9)罩式炉退火:将剪切后的铜带放入罩式炉中进行退火,退火温度为420℃,退火时间为6h,退火气氛为75%H2+25%N2。
10)厚带清洗:将铜带通过碱洗脱脂、酸洗去除氧化层等清洗工序,清洗速度为30~35m/min。
11)预精轧:将清洗后的铜带通过20辊精轧机进行多道次加工,轧制厚度为0.42mm,轧辊的粗糙度控制在0.3um,轧制采取全油轧制,轧制速度控制在180m/min以下。
12)中轧退火:将轧制后的铜带通过气垫炉进行退火,退火温度为650℃,退火气氛为空气气氛,退火速度为69m/min,铜带先通过碱洗区进行脱脂,再通过加热区进行退火,加热1、2、3区的风机转速为1200rpm,加热4区的风机转速为1200rpm,再通过冷却区进行冷却,冷却1、2、3区的风机转速为1200rpm,冷却4区的风机转速为500rpm,最后酸洗抛光进行钝化烘干,碱液的浓度控制在2.5~6%。抛光刷使用3000目,抛光电流为2A,酸液的浓度控制在8%~13%,钝化液的浓度控制在0.02%~0.06%,各段带材张力设定比例开卷如下:活套Ⅰ:炉区:后处理:活套Ⅱ:收卷=12:12:1.3:12:12:20。
13)精轧(FRM-2)成品轧制:将退完火的铜带通过六辊精轧机进行多道次加工,轧制厚度为0.3mm,轧辊粗糙度控制在0.12um,轧制采取全油轧制,轧制速度控制在120m/min以下。
14)成品清洗:将轧制后的铜带通过薄带脱脂机进行清洗,清洗前观察挤干辊的使用情况无问题后进行清洗,若使用时间长则需更换挤干辊再进行清洗。先碱洗进行脱脂,碱液的浓度控制在4~5%,工作温度为65~75℃,碱洗后进行酸洗抛光,酸液的浓度控制在6~10%;工作温度为常温,酸洗后进行抛光,抛光刷使用3000目,抛光电流为2.1A,抛光后进行钝化处理,钝化液的浓度控制在0.03~0.09%。
15)拉弯矫直:将清洗后的铜带进行板形矫直,拉矫采取延伸率模式,延伸率控制在3%,并开启表面检测,检查表面质量。
16)成品分条裸材:根据拉弯矫直的质检结果和客户要求的规格进行分条、分条运行速度低于70m/min。
17)镀锡:将锡液喷洒在运行中的铜带表面,铜带运行速度为8米/分钟;采用的锡液,包括以下质量百分比成分:Cu1.4%,Zn 0.06%,余量为Sn;锡液的温度为320~360℃;利用带喷嘴的雾化器喷洒锡液,控制喷洒流量13升/分钟,喷洒运行速度8米/分钟,喷洒角度垂直于带铜表面,喷洒采用的喷嘴压强设置在250KPa-260KPa,喷嘴直径在4-6mm,锡液喷洒在铜带表面环境温度为80-90℃;喷洒结束后,进行冷却,控制冷却风机风速为800m/s,冷却至室温。
18)成品分条镀锡材:根据客户要求的规格进行分条、分条运行速度低于70m/min。
实施例1生产的镀锡黄铜的合金层如图3所示,合金层的厚度为镀锡层总厚度的1/5-2/5。
对比例1
按照实施例1相同的方法,只是锡液喷洒结束后,进行冷却,冷却风机风速为200m/s,冷却至室温。生产的镀锡黄铜的合金层如图2所示,合金层厚度较厚,合金层厚度约占整个镀锡层厚度的1/2。
Claims (9)
1.一种镀锡黄铜的生产方法,其特征在于,所述生产方法包括镀锡,所述镀锡采用锡液喷洒在铜带表面。
2.根据权利要求1所述的生产方法,其特征在于,所述锡液,包括以下质量百分比成分:Cu≤1.5%,Zn 0.05-0.20%,余量为Sn。
3.根据权利要求1或2所述的生产方法,其特征在于,所述锡液的温度为300~500℃。
4.根据权利要求1或2所述的生产方法,其特征在于,所述喷洒,锡液喷洒在铜带表面环境温度为80-90℃。
5.根据权利要求1或2所述的生产方法,其特征在于,所述喷洒采用带有喷嘴的雾化器喷洒。
6.根据权利要求1所述的生产方法,其特征在于,锡液喷洒在运行中的铜带表面,铜带运行速度为8±0.5米/分钟。
7.根据权利要求1所述的生产方法,其特征在于,所述喷洒,控制喷洒流量10-15升/分钟,喷洒运行速度4-16米/分钟喷洒角度垂直于带铜表面,喷洒采用的喷嘴压强设置在250KPa-300KPa。
8.根据权利要求1所述的生产方法,其特征在于,所述生产方法还包括镀锡后冷却,控制冷却风机风速为800±20m/s,冷却至室温。
9.一种权利要求1-8任一项所述的生产方法生产的镀锡黄铜,其特征在于,所述镀锡黄铜包括铜基体,所述铜基体的表面上为镀锡层,所述镀锡层包括合金层和锡层,所述合金层的厚度为镀锡层总厚度的1/5-2/5。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202310742305.9A CN116676551A (zh) | 2023-06-21 | 2023-06-21 | 一种镀锡黄铜及其生产方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202310742305.9A CN116676551A (zh) | 2023-06-21 | 2023-06-21 | 一种镀锡黄铜及其生产方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN116676551A true CN116676551A (zh) | 2023-09-01 |
Family
ID=87790787
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202310742305.9A Pending CN116676551A (zh) | 2023-06-21 | 2023-06-21 | 一种镀锡黄铜及其生产方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN116676551A (zh) |
-
2023
- 2023-06-21 CN CN202310742305.9A patent/CN116676551A/zh active Pending
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5319101B2 (ja) | 電子部品用Snめっき材 | |
JP5025387B2 (ja) | 接続部品用導電材料及びその製造方法 | |
CN110777319B (zh) | 高耐蚀高成形性热成形钢用镀液、热成形钢板、热浸镀生产工艺、热冲压部件及应用 | |
JP5002407B2 (ja) | すずめっきの耐磨耗性に優れるすずめっき銅又は銅合金条 | |
US20090176125A1 (en) | Sn-Plated Cu-Ni-Si Alloy Strip | |
CN101636514B (zh) | 印刷基板端子 | |
JP2018506644A (ja) | 溶接性及び加工部耐食性に優れた亜鉛合金めっき鋼材及びその製造方法 | |
KR20160078670A (ko) | 내식성이 우수한 용융아연합금 도금강선 및 그 제조방법 | |
JP2006307336A (ja) | Cu−Ni−Si−Zn系合金Snめっき条 | |
JP4489738B2 (ja) | Cu−Ni−Si−Zn系合金すずめっき条 | |
WO2007126010A1 (ja) | ウィスカーが抑制されたCu-Zn合金耐熱Snめっき条 | |
JP4756195B2 (ja) | Cu−Ni−Sn−P系銅合金 | |
EP0036778B1 (en) | Steel member plated with pb-sn alloy and a method of making same | |
JP4987028B2 (ja) | プリント基板端子用銅合金すずめっき材 | |
JP2012007242A (ja) | Cu−Ni−Si合金すずめっき条 | |
WO2018012297A1 (ja) | 銅合金圧延材及びその製造方法並びに電気電子部品 | |
CN110306077B (zh) | 一种电连接器用耐蚀铜合金及其制备方法 | |
CN116676551A (zh) | 一种镀锡黄铜及其生产方法 | |
KR20150049488A (ko) | 내흑변성 및 표면외관이 우수한 용융아연합금 도금강판 및 그 제조방법 | |
KR20160103534A (ko) | 전자 부품용 Sn 도금재 | |
JP6134557B2 (ja) | 銅条または銅合金条および、それを備える放熱部品 | |
JP5226032B2 (ja) | ウィスカーが抑制されたCu−Zn合金耐熱Snめっき条 | |
CN112126879A (zh) | 一种铜线的镀锡方法 | |
JP2010248593A (ja) | 電気・電子部品用銅合金材およびその製造方法 | |
JP7381644B2 (ja) | 銅合金の製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination |