CN101635285B - Ceramic substrate structure with radiating function and manufacturing method thereof - Google Patents
Ceramic substrate structure with radiating function and manufacturing method thereof Download PDFInfo
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- CN101635285B CN101635285B CN2008101343520A CN200810134352A CN101635285B CN 101635285 B CN101635285 B CN 101635285B CN 2008101343520 A CN2008101343520 A CN 2008101343520A CN 200810134352 A CN200810134352 A CN 200810134352A CN 101635285 B CN101635285 B CN 101635285B
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Abstract
The invention discloses a ceramic substrate structure with radiating function and a manufacturing method thereof. The ceramic substrate structure comprises a ceramic substrate, multiple thermal via, a weldable metal layer and a solder layer, wherein the ceramic substrate is provided with a first surface and a second surface which are opposite; the first surface is provided with a concave part; the multiple thermal via is arranged on the bottom surface of the concave part and penetrates the second surface; the weldable metal layer is formed on the bottom surface of the concave part and is connected with the thermal via; and the solder layer is filled in the concave part on the weldable metal layer. Therefore, the ceramic substrate structure with the radiating function has the characteristics of simple manufacture, low operating cost and the like.
Description
Technical field
The present invention relates to a kind of ceramic substrate structure and manufacturing approach thereof, and particularly relates to a kind of ceramic substrate structure and manufacturing approach thereof with heat sinking function.
Background technology
In recent years; Because the fast development of consumer electronics and radio communication product, the numerous and confused trend of electronic product possesses the development of demand such as multi-functional, that external form is compact, therefore; Various integrated technology begin to come into one's own, LTCC (Low-Temperature Cofired Ceramics; LTCC) be that electronic product is towards one of compact Development Technology.LTCC Technology is passive component to be imbedded sintering forms integrated ceramic component in the multilayer ceramic substrate, with the space of effective minimizing element, makes the element heights aggregation, reaches the purpose of element/module downsizing, miniaturization of electronic products
The integrated element of LTCC, be with ceramic material as substrate, passive component imbedded sintering forms integrated ceramic component in the multilayer ceramic substrate, with the space of effective minimizing element, make the element heights aggregation, reach save the space just.
General heat dissipating method common in the LTCC technology; For having the ceramic substrate structure 1 of the passage of heat (thermalvia) that runs through; Like Fig. 1; Ceramic substrate 11 has a plurality of passages of heat (thermal via) 12 and sees through soldering-tin layer 15 is connected to each other ceramic substrate 11 and printed circuit board (PCB) 16, and sees through the design of these passages of heat 12, can assist the substrate heat radiation.
Yet, utilize the heat sinking function of the passage of heat (thermal via) that runs through ceramic substrate to have certain effect, for high-power product and inapplicable; So; General to high-power product, the method that can adopt metal patch is strengthening its heat radiation power, however the mode of this metal patch; Need extra processing step and material, and improve the complexity and the expense of product technology.
Summary of the invention
In view of this, the problem of institute of the present invention desire solution is to provide a kind of ceramic substrate structure and manufacturing approach thereof with heat sinking function.
For addressing the above problem, technological means proposed by the invention is that the present invention provides a kind of ceramic substrate structure with heat sinking function, and this ceramic substrate structure comprises ceramic substrate, has opposite first and second surface, and first surface has recess; A plurality of passages of heat (thermal via) are located at the recess bottom surface and are connected to second surface; Bondable metal layer is formed at the recess bottom surface and above-mentioned passage of heat connects; And solder layer, be filled in the recess of bondable metal layer top.
Among the foregoing invention embodiment, passage of heat is a metal column, and solderable metal can be Ag-Pt, Ag-Pd, Ag or copper; Also capable solderable metal Sn of one-tenth of usable surface electric plating method or method for non-electric plating form solderable metal Ni, Pd or Au; Ceramic base material can be arranged at printed circuit board (PCB) (Printed Circuit Board; PCB) on; And can be connected to each other through the soldering-tin layer of printed circuit board (PCB), and ceramic base material can be applicable to the LED of high power or high brightness.
The present invention provides a kind of technology with ceramic substrate of heat sinking function in addition.At first, ceramic thin plate is provided, ceramic thin plate has a plurality of passages of heat (thermal via).Then, coating or printing solderable metal are in the passage of heat top, to form bondable metal layer.Afterwards, living embryo sheet is provided, gives birth to the embryo sheet and have at least one hole (cavity), bore hole size is greater than the passage of heat size.Afterwards, pile up living embryo sheet on ceramic thin plate, hole forms recess, and recess exposes outside bondable metal layer.Afterwards, carry out sintered ceramic thin plate, living embryo sheet and bondable metal layer, with common formation ceramic substrate.Afterwards, put into scolder in recess.And carry out the reflow step, make solder solidification in recess.
Wherein, scolder is selected from any tin cream raw material of stanniferous.Solderable metal can be Ag-Pt, Ag-Pd, Ag or copper; Also the usable surface electric plating method is capable becomes solderable metal Sn; Or method for non-electric plating forms solderable metal Ni, Pd or Au after carrying out the reflow step; Also can comprise a step ceramic substrate is connected on the printed circuit board (PCB), and ceramic substrate and printed circuit board (PCB) are connected to each other through soldering-tin layer.Ceramic thin plate is a low-temperature co-fired ceramic substrate, and ceramic substrate can be applicable to the LED of high power or high brightness.
The utilization effect that the present invention obtained is that the present invention sees through known hole technology and on living embryo sheet, forms hole, and collocation has the ceramic thin plate of solderable metal in the passage of heat top; To and insert scolder in hole, thereby carry living heat dissipation metal volume, can form fin thus naturally; Improve the substrate radiating efficiency and improve heat radiation power; Enlarge the range of application that ceramic substrate is applied to high power products, as: the heat radiation of substrates such as high power IC and LED, and the mode of this mode and sheet metal applying is compared down; Can reduce processing step and manufacturing cost; In addition, ceramic substrate structure of the present invention can directly engage through solder layer with substrate, uses and reduce the heat-conducting glue ester.
Description of drawings
Fig. 1 is the section of structure of known ceramics board structure;
Fig. 2 is the section of structure with ceramic substrate structure of heat sinking function of the present invention; And
Fig. 3 A～Fig. 3 F is the making flow chart with ceramic substrate structure of heat sinking function of the present invention.
Description of reference numerals
1 ceramic substrate structure, 11 ceramic substrates
12 passages of heat, 15 soldering-tin layers
16 printed circuit board (PCB)s, 2 ceramic substrate structures
21 ceramic substrates, 211 first surfaces
212 second surfaces, 213 ceramic thin plates
214 give birth to embryo sheet 215 holes
216 recess, 22 passages of heat
23 bondable metal layer, 24 solder layers
241 scolders, 25 soldering-tin layers
26 printed circuit board (PCB)s
Embodiment
Below will the ceramic substrate structure with heat sinking function according to the preferred embodiment of the present invention be described, and be convenient to understand that the similar elements system among the following embodiment explains with identical symbology for making with reference to relevant indicators.
Please refer to Fig. 2, it is the ceramic substrate structure with heat sinking function of the present invention.Among the figure, ceramic substrate structure 2 comprises ceramic substrate 21, a plurality of passage of heat (thermal via) 22, bondable metal layer 23 and solder layer 24.Ceramic substrate 21 has opposite first 211 and second surface 212; And recess 216 is arranged on the first surface 211; A plurality of passages of heat (thermal via) 22 are located at recess 216 bottom surfaces and are connected to second surface 212; Bondable metal layer 23 is formed at recess 216 bottom surfaces and is connected with a little passages of heat 22, and solder layer 24 is filled in the recess 216 of bondable metal layer 23 tops.
Hold above-mentionedly, the passage of heat of present embodiment is a metal column, and the metal column material can be any metal material that contains metal ingredient, and in addition, the material of above-mentioned solderable metal can be Ag-Pt, Ag-Pd, Ag or copper; Also the usable surface electric plating method is capable becomes solderable metal Sn, or method for non-electric plating forms solderable metal Ni, Pd or Au, or other proper metal materials, perhaps also can be the combination in any of above-mentioned metal material.
In the above-described embodiments, the ceramic substrate structure 2 with heat sinking function more can be arranged at printed circuit board (PCB) (Printed Circuit Board PCB) on 26, wherein can see through soldering-tin layer 25 and be connected to each other.
In the above-described embodiments, the ceramic substrate structure 2 with heat sinking function can be applicable to the LED of high power or high brightness, but applicable Related product is not as limit.
Compared to known technology (please refer to Fig. 1), known technology is only simple to dispel the heat through passage of heat, and this heat radiation function is limited; The present invention in hole, thereby promotes the heat dissipation metal volume with scolder, can form fin naturally thus; Improve the substrate radiating efficiency and improve heat radiation power, enlarge the range of application that ceramic substrate is applied to high power products, as: the heat radiation of substrates such as high power IC and LED; And the mode that this mode and sheet metal are fitted is compared down, can reduce processing step and manufacturing cost, in addition; Ceramic substrate structure of the present invention can directly engage through solder layer with substrate, uses and reduce the heat-conducting glue ester.
Below only introduce the structure of ceramic substrate, and, below will cooperate Fig. 3 A to Fig. 3 F to carry out detailed explanation about the technology of ceramic substrate.
Please consult Fig. 3 A and Fig. 3 B in regular turn, at first, ceramic thin plate 213 is provided, this ceramic thin plate 213 has a plurality of passages of heat 22, and wherein, ceramic thin plate 213 can be LTCC (LowTemperature Co-fired Ceramic, LTCC) substrate.Then, form bondable metal layer 23 on ceramic thin plate 213, wherein bondable metal layer 23 can see through the method for coating or printing solderable metal, is formed at passage of heat 22 tops, and the material of this solderable metal can be Ag-Pt, Ag-Pd, Ag or copper; Also the usable surface electric plating method is capable becomes solderable metal Sn, or method for non-electric plating forms solderable metal Ni, Pd or Au or other metal materials, perhaps also can be the combination in any of above-mentioned metal material.
Then, see also Fig. 3 C and Fig. 3 D, living embryo sheet 214 is provided in addition, this gives birth to embryo sheet 214 and has at least one hole 215, and wherein, hole 215 sizes of giving birth to embryo sheet 214 are at least greater than passage of heat 22 sizes.The mode of formation hole 215 on living embryo sheet 214 can have a variety of, and for instance, methods such as laser or machine boring all can adopt.
Afterwards, pile up living embryo sheet 214 on ceramic thin plate 213, wherein these holes 215 can be seated in bondable metal layer 23 tops that correspond on the passage of heat 22, and promptly these bondable metal layer 23 that are formed on passage of heat 22 tops can be corresponding to these holes 215.
Pile up finish after, this ceramic thin plate that is stacked 213 of sintering, give birth to embryo sheet 214 and bondable metal layer 23, with common formation ceramic substrate 21.After sintering finishes, give birth to 215 recess 216 that form ceramic substrate 21 of original hole on the embryo sheet, and recess 216 exposes outside bondable metal layer 23.
See also Fig. 3 E and Fig. 3 F, then, put into scolder 241 in recess 216; Wherein the material of scolder 241 can be the tin cream raw material of any stanniferous; Carry out the reflow step at last, make scolder 241 solidify in recess 216, and the temperature when carrying out the reflow step is set; Then determine, do not limit at this according to the kind of tin cream raw material.
So, the ceramic substrate 21 with heat sinking function has been accomplished, sees through scolder and plants the mode in hole, and this can form fin naturally, thereby promotes the radiating efficiency of ceramic substrate.
In addition, the method more can comprise ceramic substrate 21 is connected on the printed circuit board (PCB) 26.Wherein, ceramic substrate 21 sees through soldering-tin layer 25 with printed circuit board (PCB) (or other substrate) 26 and is connected to each other, and it is identical with known technology in the method for printed circuit board (PCB) 26 to connect ceramic substrate 21, so no longer repeat to introduce.
So, solder metal heat dissipating method used in the present invention is through the mode of scolder filling; Improve this design of heat radiation volume, can promote the radiating efficiency of ceramic substrate thus, enlarge ceramic substrate in the range of application of high power products; Be on the LED that can be applicable to high power or high brightness of ceramic substrate of the present invention, in addition, see through soldering-tin layer and substrates; Reduce the heat-conducting glue ester and use, also have the effect that reduces cost.
In sum, be only notebook invention for presenting the preferred implementation or the embodiment of the technological means that adopted of dealing with problems, be not the scope that is used for limiting patent working of the present invention.Be that patent claim context all and of the present invention conforms to, or, be all claim of the present invention and contain according to equivalent variations and modification that claim of the present invention is done.
Claims (12)
1. ceramic substrate structure with heat sinking function comprises:
Ceramic substrate, this ceramic substrate has opposite first and second surface, and this first surface has recess;
A plurality of passages of heat are located at this recess bottom surface and perforation to this second surface;
Bondable metal layer is formed at this recess bottom surface and is connected with said passage of heat; And
Solder layer is filled in this recess of this bondable metal layer top.
2. ceramic substrate structure as claimed in claim 1, wherein said passage of heat are metal column.
3. ceramic substrate structure as claimed in claim 1, wherein this solderable metal is Ag-Pt, Ag-Pd, Ag, Cu, Sn, Ni, Pd or Au.
4. ceramic substrate structure as claimed in claim 1, wherein this ceramic substrate is arranged on the printed circuit board (PCB), and is connected to each other through the soldering-tin layer of this printed circuit board (PCB).
5. ceramic substrate structure as claimed in claim 1, wherein this ceramic substrate is applied to the LED of high power or high brightness.
6. the manufacturing approach with ceramic substrate of heat sinking function comprises the following steps:
Ceramic thin plate is provided, and this ceramic thin plate has a plurality of passages of heat;
Coating or printing solderable metal are in said passage of heat top, to form bondable metal layer;
Living embryo sheet is provided, and this life embryo sheet has at least one hole, and this bore hole size is greater than said passage of heat size;
Pile up this life embryo sheet on this ceramic thin plate, this hole forms recess, and this recess exposes outside this bondable metal layer;
Carry out this ceramic thin plate of sintering, this life embryo sheet and this bondable metal layer, with this ceramic substrate of common formation;
Put into scolder in this recess; And
Carry out the reflow step, make this solder solidification in this recess.
7. manufacturing approach as claimed in claim 6, wherein this scolder is selected from any tin cream raw material of stanniferous.
8. manufacturing approach as claimed in claim 6, wherein this solderable metal is Ag-Pt, Ag-Pd, Ag, Cu, Sn, Ni, Pd or Au.
9. manufacturing approach as claimed in claim 6, wherein this carries out also comprising after the reflow step: connect this ceramic substrate on printed circuit board (PCB).
10. manufacturing approach as claimed in claim 9, wherein this ceramic substrate and this printed circuit board (PCB) are to see through soldering-tin layer to be connected to each other.
11. manufacturing approach as claimed in claim 6, wherein this ceramic thin plate is a low-temperature co-fired ceramic substrate.
12. manufacturing approach as claimed in claim 6, wherein this ceramic substrate is applied to the LED of high power or high brightness.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN2008101343520A CN101635285B (en) | 2008-07-24 | 2008-07-24 | Ceramic substrate structure with radiating function and manufacturing method thereof |
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| CN2008101343520A CN101635285B (en) | 2008-07-24 | 2008-07-24 | Ceramic substrate structure with radiating function and manufacturing method thereof |
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| CN101635285A CN101635285A (en) | 2010-01-27 |
| CN101635285B true CN101635285B (en) | 2012-06-13 |
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| CN2008101343520A Expired - Fee Related CN101635285B (en) | 2008-07-24 | 2008-07-24 | Ceramic substrate structure with radiating function and manufacturing method thereof |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102176434A (en) * | 2010-12-24 | 2011-09-07 | 苏州达方电子有限公司 | Airtight ceramic layer structure and manufacturing method thereof |
| US9580360B2 (en) * | 2014-04-07 | 2017-02-28 | Lam Research Corporation | Monolithic ceramic component of gas delivery system and method of making and use thereof |
| CN104310973B (en) * | 2014-10-10 | 2016-04-13 | 淄博艾丽嘉陶瓷有限公司 | High heat conduction function ceramics thin plate and preparation method thereof |
| CN112103252B (en) * | 2020-08-07 | 2022-12-09 | 西安电子科技大学 | Refrigeration type LTCC micro-system based on metal micro-channel and preparation method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001085581A (en) * | 1999-09-14 | 2001-03-30 | Sumitomo Metal Electronics Devices Inc | Substrate for semiconductor module and production thereof |
| CN1905223A (en) * | 2006-08-07 | 2007-01-31 | 陈盈君 | LED light source packaging structure for low-temp. coburning ceramic by thermoelectric separating design |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001085581A (en) * | 1999-09-14 | 2001-03-30 | Sumitomo Metal Electronics Devices Inc | Substrate for semiconductor module and production thereof |
| CN1905223A (en) * | 2006-08-07 | 2007-01-31 | 陈盈君 | LED light source packaging structure for low-temp. coburning ceramic by thermoelectric separating design |
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| CN101635285A (en) | 2010-01-27 |
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