CN101431147A - 有机el显示装置及其制造方法 - Google Patents
有机el显示装置及其制造方法 Download PDFInfo
- Publication number
- CN101431147A CN101431147A CNA2008101728595A CN200810172859A CN101431147A CN 101431147 A CN101431147 A CN 101431147A CN A2008101728595 A CNA2008101728595 A CN A2008101728595A CN 200810172859 A CN200810172859 A CN 200810172859A CN 101431147 A CN101431147 A CN 101431147A
- Authority
- CN
- China
- Prior art keywords
- organic
- film
- electrode
- display
- magnesium oxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 14
- 238000005401 electroluminescence Methods 0.000 title 1
- 238000010521 absorption reaction Methods 0.000 claims abstract description 110
- 229910004286 SiNxOy Inorganic materials 0.000 claims abstract description 83
- 229910007991 Si-N Inorganic materials 0.000 claims abstract description 19
- 229910006294 Si—N Inorganic materials 0.000 claims abstract description 19
- 239000011241 protective layer Substances 0.000 claims abstract description 19
- 229910002808 Si–O–Si Inorganic materials 0.000 claims abstract description 16
- 239000000395 magnesium oxide Substances 0.000 claims description 57
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 57
- 239000000758 substrate Substances 0.000 claims description 53
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 51
- 239000010410 layer Substances 0.000 claims description 37
- 239000011347 resin Substances 0.000 claims description 24
- 229920005989 resin Polymers 0.000 claims description 24
- 239000012044 organic layer Substances 0.000 claims description 23
- 239000007789 gas Substances 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 15
- 238000001228 spectrum Methods 0.000 claims description 10
- 238000002835 absorbance Methods 0.000 claims description 8
- 239000011261 inert gas Substances 0.000 claims description 8
- 238000010884 ion-beam technique Methods 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 7
- 229910052739 hydrogen Inorganic materials 0.000 claims description 6
- 150000004767 nitrides Chemical class 0.000 claims description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 4
- 239000011777 magnesium Substances 0.000 claims description 4
- 238000002441 X-ray diffraction Methods 0.000 claims description 3
- 238000010894 electron beam technology Methods 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 abstract description 21
- 230000001681 protective effect Effects 0.000 abstract description 3
- 239000010408 film Substances 0.000 description 163
- 230000014509 gene expression Effects 0.000 description 67
- 239000011521 glass Substances 0.000 description 29
- 238000007789 sealing Methods 0.000 description 15
- 239000000565 sealant Substances 0.000 description 14
- 230000000694 effects Effects 0.000 description 12
- 229910052760 oxygen Inorganic materials 0.000 description 9
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Inorganic materials [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 7
- 229910018557 Si O Inorganic materials 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 6
- 239000001301 oxygen Substances 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 230000008020 evaporation Effects 0.000 description 5
- 238000001704 evaporation Methods 0.000 description 5
- 238000007654 immersion Methods 0.000 description 5
- 239000012528 membrane Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 239000010409 thin film Substances 0.000 description 5
- 229910004205 SiNX Inorganic materials 0.000 description 4
- 238000000151 deposition Methods 0.000 description 4
- 238000007598 dipping method Methods 0.000 description 4
- 230000009467 reduction Effects 0.000 description 4
- 229920000178 Acrylic resin Polymers 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 3
- 230000015556 catabolic process Effects 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 230000002950 deficient Effects 0.000 description 3
- 238000006731 degradation reaction Methods 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 239000012467 final product Substances 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 230000008676 import Effects 0.000 description 2
- 238000007733 ion plating Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 208000034189 Sclerosis Diseases 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 230000035508 accumulation Effects 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 239000002912 waste gas Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
- H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/22—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
- H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/302—Details of OLEDs of OLED structures
- H10K2102/3023—Direction of light emission
- H10K2102/3026—Top emission
Landscapes
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
Description
Claims (18)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007288956 | 2007-11-06 | ||
JP2007288956A JP5185598B2 (ja) | 2007-11-06 | 2007-11-06 | 有機el表示装置およびその製造方法 |
JP2007-288956 | 2007-11-06 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101431147A true CN101431147A (zh) | 2009-05-13 |
CN101431147B CN101431147B (zh) | 2011-03-09 |
Family
ID=40587402
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2008101728595A Active CN101431147B (zh) | 2007-11-06 | 2008-11-05 | 有机el显示装置及其制造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8680766B2 (zh) |
JP (1) | JP5185598B2 (zh) |
KR (2) | KR101076568B1 (zh) |
CN (1) | CN101431147B (zh) |
TW (1) | TWI399999B (zh) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014040276A1 (zh) * | 2012-09-13 | 2014-03-20 | 深圳市华星光电技术有限公司 | 有机显示装置 |
CN103682143A (zh) * | 2012-09-04 | 2014-03-26 | 三星显示有限公司 | 有机发光显示装置及其制造方法 |
CN103843457A (zh) * | 2011-10-07 | 2014-06-04 | 松下电器产业株式会社 | 发光元件和发光元件的制造方法 |
WO2016086650A1 (en) * | 2014-12-03 | 2016-06-09 | Boe Technology Group Co., Ltd. | Display panel and packaging method thereof, and display apparatus |
CN107887419A (zh) * | 2017-10-25 | 2018-04-06 | 广东欧珀移动通信有限公司 | 显示组件和具有其的显示装置、终端 |
CN110444112A (zh) * | 2018-05-02 | 2019-11-12 | 三星显示有限公司 | 显示装置 |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011016086A1 (ja) * | 2009-08-05 | 2011-02-10 | 株式会社 東芝 | 有機電界発光素子およびその製造方法 |
JP2014132522A (ja) | 2013-01-04 | 2014-07-17 | Japan Display Inc | 有機el表示装置 |
KR102103421B1 (ko) * | 2013-02-07 | 2020-04-23 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 그 제조 방법 |
WO2015037463A1 (ja) * | 2013-09-12 | 2015-03-19 | コニカミノルタ株式会社 | 有機エレクトロルミネッセンス素子及びその製造方法 |
US20150152543A1 (en) * | 2013-10-30 | 2015-06-04 | Skyworks Solutions, Inc. | Systems, devices and methods related to reactive evaporation of refractory materials |
US9728741B2 (en) | 2013-11-26 | 2017-08-08 | Joled Inc. | Organic EL panel, method for producing same, and color filter substrate |
KR102244722B1 (ko) * | 2013-12-24 | 2021-04-26 | 엘지디스플레이 주식회사 | 점등 패드부 및 이를 포함하는 유기발광표시장치 |
JP2015128033A (ja) * | 2013-12-27 | 2015-07-09 | 株式会社ジャパンディスプレイ | 表示装置 |
CN103996696A (zh) * | 2014-05-09 | 2014-08-20 | 京东方科技集团股份有限公司 | 一种oled显示面板及其制备方法、显示装置 |
KR20160122895A (ko) * | 2015-04-14 | 2016-10-25 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 |
JP6557601B2 (ja) * | 2015-12-29 | 2019-08-07 | 株式会社ジャパンディスプレイ | 表示装置、表示装置の製造方法 |
CN107068905B (zh) * | 2017-04-19 | 2019-01-01 | 京东方科技集团股份有限公司 | Oled封装结构、oled封装方法及显示面板 |
US10297779B1 (en) * | 2017-10-30 | 2019-05-21 | Wuhan China Star Optoelectronics Technology Co., Ltd. | OLED display device and process for manufacturing the same |
Family Cites Families (33)
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JPH0253242A (ja) * | 1988-08-16 | 1990-02-22 | Nissin Electric Co Ltd | 光滋気ディスク用保護膜の製造法 |
JP3577117B2 (ja) | 1994-10-07 | 2004-10-13 | Tdk株式会社 | 有機エレクトロルミネセンス素子の製法 |
TW327694B (en) * | 1997-01-30 | 1998-03-01 | Nat Science Council | The method for depositing oxynitride film on substrate by LPD |
JPH11144864A (ja) | 1997-11-13 | 1999-05-28 | Mitsubishi Chemical Corp | 有機電界発光素子及びその製造方法 |
JP2000011888A (ja) * | 1998-06-19 | 2000-01-14 | Hitachi Ltd | プラズマディスプレイパネルおよびその製造方法 |
JP3817081B2 (ja) | 1999-01-29 | 2006-08-30 | パイオニア株式会社 | 有機el素子の製造方法 |
JP2001057287A (ja) | 1999-08-20 | 2001-02-27 | Tdk Corp | 有機el素子 |
JP3409762B2 (ja) | 1999-12-16 | 2003-05-26 | 日本電気株式会社 | 有機エレクトロルミネッセンス素子 |
EP1276129A4 (en) | 2000-03-31 | 2008-08-27 | Matsushita Electric Ind Co Ltd | METHOD OF MANUFACTURING A PLASMA DISPLAY PANEL |
JP4255643B2 (ja) * | 2001-02-21 | 2009-04-15 | 株式会社半導体エネルギー研究所 | 発光装置及びその作製方法 |
TWI258317B (en) * | 2002-01-25 | 2006-07-11 | Semiconductor Energy Lab | A display device and method for manufacturing thereof |
WO2003084290A1 (fr) | 2002-03-29 | 2003-10-09 | Pioneer Corporation | Ecran d'affichage organique electroluminescent |
JP2004050821A (ja) * | 2002-05-30 | 2004-02-19 | Sumitomo Heavy Ind Ltd | 水蒸気透過防止膜およびその製造方法 |
JP4419012B2 (ja) | 2002-09-27 | 2010-02-24 | 株式会社スリーボンド | 有機el素子用封止材及び有機el素子の封止方法 |
JP4261902B2 (ja) * | 2002-12-26 | 2009-05-13 | 大日本印刷株式会社 | バリアフィルムとこれを用いた積層材、包装用容器、画像表示媒体およびバリアフィルムの製造方法 |
JP3650101B2 (ja) * | 2003-02-04 | 2005-05-18 | 三洋電機株式会社 | 有機エレクトロルミネッセンス装置およびその製造方法 |
JP4303011B2 (ja) * | 2003-03-14 | 2009-07-29 | オプトレックス株式会社 | 上面発光型有機エレクトロルミネセンス表示素子およびその製造方法 |
WO2005004550A1 (ja) * | 2003-07-07 | 2005-01-13 | Pioneer Corporation | 有機エレクトロルミネッセンス表示パネル及びその製造方法 |
JP3881973B2 (ja) | 2003-08-29 | 2007-02-14 | 三菱重工業株式会社 | 窒化シリコン膜の成膜方法 |
US20050238816A1 (en) * | 2004-04-23 | 2005-10-27 | Li Hou | Method and apparatus of depositing low temperature inorganic films on plastic substrates |
WO2005112516A1 (ja) * | 2004-05-17 | 2005-11-24 | Ulvac, Inc. | 有機el装置 |
JP2006049308A (ja) * | 2004-08-04 | 2006-02-16 | Samsung Electronics Co Ltd | 表示装置、その製造方法、及びその製造装置 |
JP2006082241A (ja) * | 2004-09-14 | 2006-03-30 | Fuji Photo Film Co Ltd | 水蒸気バリアフィルム並びにこれを用いた画像表示素子用基板および有機エレクトロルミネッセンス素子 |
US8350466B2 (en) * | 2004-09-17 | 2013-01-08 | Semiconductor Energy Laboratory Co., Ltd. | Display device and manufacturing method thereof |
TWI254082B (en) * | 2004-09-21 | 2006-05-01 | Chunghwa Picture Tubes Ltd | Fabrication method of front substrate of plasma display, evaporation process and evaporation apparatus |
KR100741967B1 (ko) * | 2004-11-08 | 2007-07-23 | 삼성에스디아이 주식회사 | 평판표시장치 |
US7582904B2 (en) * | 2004-11-26 | 2009-09-01 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, display device and method for manufacturing thereof, and television device |
KR20060094685A (ko) * | 2005-02-25 | 2006-08-30 | 삼성전자주식회사 | 표시 장치 및 이의 제조 방법 |
KR100670324B1 (ko) * | 2005-03-23 | 2007-01-16 | 삼성에스디아이 주식회사 | 플라즈마 디스플레이 패널 |
JP4583277B2 (ja) * | 2005-09-21 | 2010-11-17 | 富士フイルム株式会社 | ガスバリアフィルムおよびこれを用いた有機デバイス |
JP4600254B2 (ja) * | 2005-11-22 | 2010-12-15 | セイコーエプソン株式会社 | 発光装置および電子機器 |
KR100670382B1 (ko) | 2005-12-28 | 2007-01-16 | 삼성에스디아이 주식회사 | 유기 전계 발광 디스플레이 장치 및 이의 제조방법 |
JP2009037811A (ja) * | 2007-07-31 | 2009-02-19 | Sumitomo Chemical Co Ltd | 有機el装置の製造方法 |
-
2007
- 2007-11-06 JP JP2007288956A patent/JP5185598B2/ja active Active
-
2008
- 2008-10-30 TW TW097141881A patent/TWI399999B/zh active
- 2008-11-05 KR KR1020080109406A patent/KR101076568B1/ko active IP Right Grant
- 2008-11-05 US US12/264,942 patent/US8680766B2/en active Active
- 2008-11-05 CN CN2008101728595A patent/CN101431147B/zh active Active
-
2011
- 2011-03-31 KR KR1020110029677A patent/KR101169879B1/ko active IP Right Grant
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103843457A (zh) * | 2011-10-07 | 2014-06-04 | 松下电器产业株式会社 | 发光元件和发光元件的制造方法 |
US9490451B2 (en) | 2011-10-07 | 2016-11-08 | Joled Inc. | Light-emitting element and light-emitting element manufacturing method |
CN103682143A (zh) * | 2012-09-04 | 2014-03-26 | 三星显示有限公司 | 有机发光显示装置及其制造方法 |
WO2014040276A1 (zh) * | 2012-09-13 | 2014-03-20 | 深圳市华星光电技术有限公司 | 有机显示装置 |
WO2016086650A1 (en) * | 2014-12-03 | 2016-06-09 | Boe Technology Group Co., Ltd. | Display panel and packaging method thereof, and display apparatus |
US10892439B2 (en) | 2014-12-03 | 2021-01-12 | Boe Technology Group Co., Ltd. | Display panel having filler layer and heat dissipation layer and packaging method thereof, and display apparatus |
CN107887419A (zh) * | 2017-10-25 | 2018-04-06 | 广东欧珀移动通信有限公司 | 显示组件和具有其的显示装置、终端 |
CN110444112A (zh) * | 2018-05-02 | 2019-11-12 | 三星显示有限公司 | 显示装置 |
CN110444112B (zh) * | 2018-05-02 | 2023-01-20 | 三星显示有限公司 | 显示装置 |
Also Published As
Publication number | Publication date |
---|---|
KR101076568B1 (ko) | 2011-10-24 |
US8680766B2 (en) | 2014-03-25 |
TW200934284A (en) | 2009-08-01 |
KR20110052551A (ko) | 2011-05-18 |
US20090115325A1 (en) | 2009-05-07 |
CN101431147B (zh) | 2011-03-09 |
KR20090046733A (ko) | 2009-05-11 |
JP5185598B2 (ja) | 2013-04-17 |
KR101169879B1 (ko) | 2012-07-31 |
JP2009117180A (ja) | 2009-05-28 |
TWI399999B (zh) | 2013-06-21 |
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