CN101420841B - 一种散热机构 - Google Patents

一种散热机构 Download PDF

Info

Publication number
CN101420841B
CN101420841B CN200810218662.0A CN200810218662A CN101420841B CN 101420841 B CN101420841 B CN 101420841B CN 200810218662 A CN200810218662 A CN 200810218662A CN 101420841 B CN101420841 B CN 101420841B
Authority
CN
China
Prior art keywords
cooling mechanism
circuit board
pin
pins
radiating mechanism
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN200810218662.0A
Other languages
English (en)
Other versions
CN101420841A (zh
Inventor
李永洲
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lite On Electronics Guangzhou Co Ltd
Lite On Technology Changzhou Co Ltd
Lite On Technology Corp
Original Assignee
Silitek Electronic Guangzhou Co Ltd
Lite On Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Silitek Electronic Guangzhou Co Ltd, Lite On Technology Corp filed Critical Silitek Electronic Guangzhou Co Ltd
Priority to CN200810218662.0A priority Critical patent/CN101420841B/zh
Publication of CN101420841A publication Critical patent/CN101420841A/zh
Priority to US12/485,929 priority patent/US7974097B2/en
Application granted granted Critical
Publication of CN101420841B publication Critical patent/CN101420841B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4031—Packaged discrete devices, e.g. to-3 housings, diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

本发明一种散热机构，用于对安装于其上的电子元件进行散热，所述散热机构设有相互连接的散热主体和连接部，所述连接部具有复数个插脚，散热机构通过所述插脚可固定于印刷电路板上，所述插脚相互间隔，两两相邻插脚之间形成有填充孔，用于填充导电材料。本发明散热机构采用多孔式连接部与印刷电路板电连接，由于连接部具有复数个插脚，通过较多插脚与印刷电路板的对应插孔插接，使得散热机构与印刷电路板之间的结合更为紧密稳固；另一方面，由于所形成的填充孔越多，使得所填充的导电材料更多，从而提高了导电截面积，减小了散热机构与印刷电路板之间的电阻，有效提高了导电和导热效率。

Description

一种散热机构
技术领域
本发明涉及一种散热机构，尤指一种用于对电子元件进行散热的散热机构。 
背景技术
在电器工作过程中，其中的部分电子元件会产生高热，若长时间无法散热，则处于高温环境下的电子元件往往难于正常工作，进而影响电器的运行。为了及时地对电子元件进行散热，人们采用了各种散热手段，如通过风扇加快内外空气流通，以降低内部的整体工作温度。对于部分容易产生高热的电子元件，为了有效快速地对其进行散热，还可将其固定于散热机构上，通过导热性能良好的散热机构辅助电子元件的散热，然而，传统的散热机构上用于容纳导电材料的填充孔很少，一般仅为1个，仅依靠1-2个长条形的插脚与印刷电路板结合，一旦任一焊点松动，则易导致整个散热机构发生脱落，结合不稳固。另一方面，由于填充孔太少，因而可填充的导电材料少，导电导热截面积有较小，则散热和导电效率将受到限制。 
因此，提供一种导电导热效率高的散热机构以解决上述问题实为必要。 
发明内容
本发明的目的在于提供一种散热机构，其以多孔状的连接部与印刷电路板电连接，通过连接部填充孔中的大量导电材料提高散热机构与印刷电路板之间的导电导热效率，从而提高安装于散热机构上的电子元件的导电导热效率。 
本发明提供了一种散热机构，用于对安装于其上的电子元件进行散热，所述散热机构设有相互连接的散热主体和连接部，所述连接部具有复数个插脚，散热机构通过所述插脚可固定于印刷电路板上，所述插脚相互间隔，两两相邻插脚之间形成有填充孔，用于填充导电材料，所述散热主体上具有端臂，所述连接部由端臂的末端延伸。 
在本发明中还可进一步包括以下附加技术特征： 
其中，所述复数个插脚呈锯齿状或波浪状排布，优先锯齿状排布，插脚个数至少大于2。 
所述散热机构呈拱形，所述端臂的个数为≥2个。 
所述散热机构上开设有至少一个固定孔，其可收纳用于固定电子元件的固定件，所述电子元件可通过铆合、胶粘或焊接等方式固定于散热机构上。 
与现有技术相比，本发明散热机构采用多孔式连接部与印刷电路板电连接，由于连接部具有复数个插脚，通过较多插脚与印刷电路板的对应插孔插接，使得散热机构与印刷电路板之间的结合更为紧密稳固；另一方面，由于所形成的填充孔越多，使得所填充的导电材料更多，从而提高了导电截面积，减小了散热机构与印刷电路板之间的电阻，有效提高了导电和导热效率。 
为使本发明更加容易理解，下面将结合附图进一步阐述本发明不同的具体实施例。 
附图说明
图1为本发明散热机构的立体图； 
图2为本发明散热机构安装在印刷电路板上的组装图； 
图3为本发明散热机构与电子元件的组装拆解图。 
具体实施方式
参照图1和图2所示，本发明提供了一种散热机构1，可固定于印刷电路板4上，用于对装载于其上的电子元件进行导电和散热，所述散热机构1包括散热主体12以及由其延伸出的连接部10，其中，所述连接部10具有复数个相互间隔的插脚100，散热机构1通过所述插脚100与印刷电路板4电连接。 
参照图1所示，在本发明的一个实施例中，所述散热机构1呈拱形，散热主体12具有两根相互平行的端臂12a和12b，所述连接部10由所述端臂12a的末端延伸，连接部10包括复数个相互间隔的插脚100，用于与印刷电路板4电连接，插脚100的厚度与端臂12a的厚度相当，插脚100的个数越多，则散热机构1与印刷电路板4之间的结合更为紧密，可防止散热机构1从印刷电路板4上脱落，提高稳固性。相邻两两插脚100之间设有填充孔102，所述填充孔102用于容纳导电材料，形成导电层，如熔融状的锡、铜等金属。填充孔102的个数越多，可填充的导电材料越多，随着导电材料的增多，一方面，相应地减小了散热机构1与电子元件之间的电阻，则可有效地提高与散热机构1电连接的电子元件的导电效率，提高通入电子元件的电流；另一方面，金属的导电材料同时具有良好的导热性能，亦可以有效地提高电子元件的散热效率，以为电子元件提供良好的工作环境。 
在本发明中，所述散热主体12上的端臂个数不受限制，优选≧2。可根据安装电子元件  的个数或所固定的印刷电路板的形状等要求进行设置，端臂的个数越多，其侧面所能承载的电子元件个数亦越多，同样，端臂的个数越多，可由其延伸出的插脚个数亦越多，随之可加强散热机构与印刷电路板之间的连接固定，并通过所填充的导电材料的增加来提高各电子元件的导电导热效率。 
在本发明中，所述连接部10中的各插脚100呈锯齿状或波浪状排布，成型一直线，优选锯齿状的排布方式，这样，既可以使得插脚100与印刷电路板4上相应的插孔之间结合得更为稳固，又可增加填充孔102的收容空间，以增加可填充的导电材料的容量，提高导电和散热效率。各填充孔102的间距相等，则填充于各填充孔102中的导电材料的容量相等，在通电状态下，经由连接部10的电流更为平均，避免了因导电材料分布不均而导致局部电阻过大，从而降低导电效率的问题。 
参照图3所示，在本发明的又一个实施例中，所述散热机构1上还开设有至少一个第一固定孔120，其可收纳用于固定电子元件2的固定件3，其中，电子元件2上亦开设有第二固定孔20，通过所述固定件3依次贯通地穿设第二固定孔20和第一固定孔120，从而将若干个电子元件2固定于散热机构1上。在本发明中，所述固定件3可为螺钉。可以理解，电子元件2除了可通过铆接的方式固定于散热机构，还可通过胶粘、焊接等方式固定于散热机构1上。 
在本发明中，所述散热机构1的形状、插脚100的个数和位置均不受限制，插脚个数>2，插脚100的个数越多，一方面使得散热机构1与印刷电路板4之间的插接更为紧密稳固，另一方面，由于所形成的填充孔102越多，使得所填充的导电材料更多，从而提高了导电截面积，减小了两者之间的电阻，有效提高了导电和导热效率。可以理解，本发明散热机构除了可安装于印刷电路板4上，还可通过特有的多孔连接部与各种电子元件电连接，对电子元件进行散热。 
惟以上所述者，仅为本发明的较佳实施例而已，当不能以此限定本发明实施的范围，即大凡依本发明权利要求及发明说明书所记载的内容所作出简单的等效变化与修饰，皆仍属本发明权利要求所涵盖范围之内。

Claims (7)

1.一种散热机构，用于对安装于其上的电子元件进行散热，其特征在于：所述散热机构设有相互连接的散热主体和连接部，所述连接部具有复数个插脚，散热机构通过所述插脚可固定于印刷电路板上，所述插脚相互间隔，两两相邻插脚之间形成有填充孔，用于填充导电材料；所述复数个插脚呈锯齿状或波浪状排布，所述散热主体上具有端臂，所述连接部由端臂的末端延伸。
2.根据权利要求1所述的散热机构，其特征在于：所述导电材料包括锡或铜。
3.根据权利要求1所述的散热机构，其特征在于：所述端臂的个数为≥2个。
4.根据权利要求1所述的散热机构，其特征在于：所述散热机构呈拱形。
5.根据权利要求1所述的散热机构，其特征在于：所述若干个填充孔间距相等。
6.根据权利要求1所述的散热机构，其特征在于：所述插脚个数为＞2个。
7.根据权利要求1所述的散热机构，其特征在于：所述散热机构上开设有至少一个固定孔，其可收纳用于固定电子元件的固定件。
CN200810218662.0A 2008-10-23 2008-10-23 一种散热机构 Active CN101420841B (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN200810218662.0A CN101420841B (zh) 2008-10-23 2008-10-23 一种散热机构
US12/485,929 US7974097B2 (en) 2008-10-23 2009-06-17 Printed circuit board and heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN200810218662.0A CN101420841B (zh) 2008-10-23 2008-10-23 一种散热机构

Publications (2)

Publication Number Publication Date
CN101420841A CN101420841A (zh) 2009-04-29
CN101420841B true CN101420841B (zh) 2012-06-27

Family

ID=40631352

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200810218662.0A Active CN101420841B (zh) 2008-10-23 2008-10-23 一种散热机构

Country Status (2)

Country Link
US (1) US7974097B2 (zh)
CN (1) CN101420841B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5384580B2 (ja) * 2011-08-05 2014-01-08 日立オートモティブシステムズ株式会社 電子制御装置
US11039550B1 (en) * 2020-04-08 2021-06-15 Google Llc Heat sink with turbulent structures

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4254447A (en) * 1979-04-10 1981-03-03 Rca Corporation Integrated circuit heat dissipator
US4344106A (en) * 1980-11-26 1982-08-10 Rca Corporation Transistor heat sink assembly
CA2096983C (en) * 1992-05-29 1996-08-13 Naoya Taki Radiator assembly for substrate
US5311395A (en) * 1992-10-29 1994-05-10 Ncr Corporation Surface mount heat sink
JP2002171086A (ja) * 2000-11-29 2002-06-14 Pioneer Electronic Corp 部 品
FR2909254B1 (fr) * 2006-11-23 2009-01-09 Siemens Vdo Automotive Sas Bus de conduction thermique, notamment pour unite de calcul a microprocesseur.

Also Published As

Publication number Publication date
US7974097B2 (en) 2011-07-05
CN101420841A (zh) 2009-04-29
US20100103625A1 (en) 2010-04-29

Similar Documents

Publication Publication Date Title
US11619376B2 (en) Illumination assembly including thermal energy management
CN102238847A (zh) 散热装置
CN101420841B (zh) 一种散热机构
CN106027724B (zh) 移动终端及手机
CN201706440U (zh) 一种led灯具
CN209767915U (zh) 一种散热快速的pcb板
JP4863164B2 (ja) バスバー
JP5920634B2 (ja) プリント基板
EP2276329A1 (en) Electronic circuit board with a thermal capacitor
CN204834602U (zh) 大功率半导体和散热器的组装结构
CN201174855Y (zh) 散热器组合
CN207283896U (zh) 一种具有散热结构的多层pcb板
JP6098705B1 (ja) インバータ
CN201066957Y (zh) 一种印刷电路板和表贴焊盘
CN202475945U (zh) 散热组件
CN210272335U (zh) 一种芯片散热结构
CN111465258B (zh) 用于电子单元的导热***元件
CN207382663U (zh) 新型抗干扰散热型电路板
CN207283902U (zh) 一种散热pcb板
CN207541556U (zh) 一种计算机往复筒式pcb板件
CN210202174U (zh) 一种具有散热件的电路板
CN204167284U (zh) 具有脚架的平躺热敏电阻
CN201201562Y (zh) 汽车稳压装置
CN105679715B (zh) 具有脚架的平躺热敏电阻
CN108430158A (zh) 一种手机用带有固定装置的柔性线路板

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C56 Change in the name or address of the patentee

Owner name: GUANGBAO ELECTRIC UANGZHOU) CO., LTD.

Free format text: FORMER NAME: SILITEK ELECTRONIC (GUANGZHOU) CO., LTD.

CP01 Change in the name or title of a patent holder

Address after: 510663 Guangzhou science and Technology Development Zone, Guangzhou City, Guangdong Province Science City West Road, No. 25

Patentee after: Lite-On Electronic (Guangzhou) Co., Ltd.

Patentee after: Lite-On Technology Corporation

Address before: 510663 Guangzhou science and Technology Development Zone, Guangzhou City, Guangdong Province Science City West Road, No. 25

Patentee before: Xuli Electronics (Guangzhou) Co., Ltd.

Patentee before: Lite-On Technology Corporation

C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20170228

Address after: Wujin, Changzhou province high tech Industrial Development Zone, 88 Yang Lake Road, No.

Patentee after: Lite on Technology (Changzhou) Co., Ltd.

Patentee after: Lite-On Electronic (Guangzhou) Co., Ltd.

Patentee after: Lite-On Technology Corporation

Address before: 510663 Guangzhou science and Technology Development Zone, Guangzhou City, Guangdong Province Science City West Road, No. 25

Patentee before: Lite-On Electronic (Guangzhou) Co., Ltd.

Patentee before: Lite-On Technology Corporation