CN101420841A - 一种散热机构 - Google Patents
一种散热机构 Download PDFInfo
- Publication number
- CN101420841A CN101420841A CN200810218662.0A CN200810218662A CN101420841A CN 101420841 A CN101420841 A CN 101420841A CN 200810218662 A CN200810218662 A CN 200810218662A CN 101420841 A CN101420841 A CN 101420841A
- Authority
- CN
- China
- Prior art keywords
- cooling mechanism
- circuit board
- pin
- mechanism according
- pins
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
- H01L2023/4031—Packaged discrete devices, e.g. to-3 housings, diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims (9)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200810218662.0A CN101420841B (zh) | 2008-10-23 | 2008-10-23 | 一种散热机构 |
US12/485,929 US7974097B2 (en) | 2008-10-23 | 2009-06-17 | Printed circuit board and heat sink |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200810218662.0A CN101420841B (zh) | 2008-10-23 | 2008-10-23 | 一种散热机构 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101420841A true CN101420841A (zh) | 2009-04-29 |
CN101420841B CN101420841B (zh) | 2012-06-27 |
Family
ID=40631352
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200810218662.0A Active CN101420841B (zh) | 2008-10-23 | 2008-10-23 | 一种散热机构 |
Country Status (2)
Country | Link |
---|---|
US (1) | US7974097B2 (zh) |
CN (1) | CN101420841B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102910163A (zh) * | 2011-08-05 | 2013-02-06 | 日立汽车***株式会社 | 电子控制装置 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11039550B1 (en) * | 2020-04-08 | 2021-06-15 | Google Llc | Heat sink with turbulent structures |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4254447A (en) * | 1979-04-10 | 1981-03-03 | Rca Corporation | Integrated circuit heat dissipator |
US4344106A (en) * | 1980-11-26 | 1982-08-10 | Rca Corporation | Transistor heat sink assembly |
CA2096983C (en) * | 1992-05-29 | 1996-08-13 | Naoya Taki | Radiator assembly for substrate |
US5311395A (en) * | 1992-10-29 | 1994-05-10 | Ncr Corporation | Surface mount heat sink |
JP2002171086A (ja) * | 2000-11-29 | 2002-06-14 | Pioneer Electronic Corp | 部 品 |
FR2909254B1 (fr) * | 2006-11-23 | 2009-01-09 | Siemens Vdo Automotive Sas | Bus de conduction thermique, notamment pour unite de calcul a microprocesseur. |
-
2008
- 2008-10-23 CN CN200810218662.0A patent/CN101420841B/zh active Active
-
2009
- 2009-06-17 US US12/485,929 patent/US7974097B2/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102910163A (zh) * | 2011-08-05 | 2013-02-06 | 日立汽车***株式会社 | 电子控制装置 |
Also Published As
Publication number | Publication date |
---|---|
US20100103625A1 (en) | 2010-04-29 |
US7974097B2 (en) | 2011-07-05 |
CN101420841B (zh) | 2012-06-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN201230438Y (zh) | 散热装置组合 | |
CN102238847A (zh) | 散热装置 | |
CN101420841B (zh) | 一种散热机构 | |
CN106027724B (zh) | 移动终端及手机 | |
US20070279871A1 (en) | Electrical connection box | |
US20110013366A1 (en) | Electronic circuit board with a thermal capacitor | |
CN201706440U (zh) | 一种led灯具 | |
CN209767915U (zh) | 一种散热快速的pcb板 | |
JP5920634B2 (ja) | プリント基板 | |
JP4863164B2 (ja) | バスバー | |
CN204834602U (zh) | 大功率半导体和散热器的组装结构 | |
CN201174855Y (zh) | 散热器组合 | |
CN201066957Y (zh) | 一种印刷电路板和表贴焊盘 | |
JP6098705B1 (ja) | インバータ | |
CN202475945U (zh) | 散热组件 | |
CN210272335U (zh) | 一种芯片散热结构 | |
CN111465258B (zh) | 用于电子单元的导热***元件 | |
CN211792701U (zh) | 具有散热功能的emc屏蔽结构 | |
CN209435534U (zh) | 一种集成式高压镇流电子板 | |
CN207382663U (zh) | 新型抗干扰散热型电路板 | |
CN207283902U (zh) | 一种散热pcb板 | |
CN105679715B (zh) | 具有脚架的平躺热敏电阻 | |
CN108430158A (zh) | 一种手机用带有固定装置的柔性线路板 | |
CN101365292A (zh) | 具有散热效能的印刷电路板结构 | |
CN210202174U (zh) | 一种具有散热件的电路板 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: GUANGBAO ELECTRIC UANGZHOU) CO., LTD. Free format text: FORMER NAME: SILITEK ELECTRONIC (GUANGZHOU) CO., LTD. |
|
CP01 | Change in the name or title of a patent holder |
Address after: 510663 Guangzhou science and Technology Development Zone, Guangzhou City, Guangdong Province Science City West Road, No. 25 Patentee after: Lite-On Electronic (Guangzhou) Co., Ltd. Patentee after: Lite-On Technology Corporation Address before: 510663 Guangzhou science and Technology Development Zone, Guangzhou City, Guangdong Province Science City West Road, No. 25 Patentee before: Xuli Electronics (Guangzhou) Co., Ltd. Patentee before: Lite-On Technology Corporation |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20170228 Address after: Wujin, Changzhou province high tech Industrial Development Zone, 88 Yang Lake Road, No. Patentee after: Lite on Technology (Changzhou) Co., Ltd. Patentee after: Lite-On Electronic (Guangzhou) Co., Ltd. Patentee after: Lite-On Technology Corporation Address before: 510663 Guangzhou science and Technology Development Zone, Guangzhou City, Guangdong Province Science City West Road, No. 25 Patentee before: Lite-On Electronic (Guangzhou) Co., Ltd. Patentee before: Lite-On Technology Corporation |