CN101399245B - 具有桥式互连平板的半导体封装结构 - Google Patents
具有桥式互连平板的半导体封装结构 Download PDFInfo
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- CN101399245B CN101399245B CN2008101609859A CN200810160985A CN101399245B CN 101399245 B CN101399245 B CN 101399245B CN 2008101609859 A CN2008101609859 A CN 2008101609859A CN 200810160985 A CN200810160985 A CN 200810160985A CN 101399245 B CN101399245 B CN 101399245B
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- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Wire Bonding (AREA)
Abstract
Description
Claims (23)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/906,136 US7622796B2 (en) | 2005-09-13 | 2007-09-28 | Semiconductor package having a bridged plate interconnection |
US11/906,136 | 2007-09-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101399245A CN101399245A (zh) | 2009-04-01 |
CN101399245B true CN101399245B (zh) | 2011-01-12 |
Family
ID=40524795
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN2008101609859A Active CN101399245B (zh) | 2007-09-28 | 2008-09-17 | 具有桥式互连平板的半导体封装结构 |
Country Status (4)
Country | Link |
---|---|
US (2) | US7622796B2 (zh) |
CN (1) | CN101399245B (zh) |
TW (1) | TWI364829B (zh) |
WO (1) | WO2009045342A1 (zh) |
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US8193618B2 (en) * | 2008-12-12 | 2012-06-05 | Fairchild Semiconductor Corporation | Semiconductor die package with clip interconnection |
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US10361151B2 (en) * | 2014-03-07 | 2019-07-23 | Bridge Semiconductor Corporation | Wiring board having isolator and bridging element and method of making wiring board |
US10535587B2 (en) | 2015-02-04 | 2020-01-14 | Stmicroelectronics S.R.L. | Integrated electronic device having a dissipative package, in particular dual side cooling package |
US9640465B2 (en) | 2015-06-03 | 2017-05-02 | Infineon Technologies Ag | Semiconductor device including a clip |
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US10825757B2 (en) | 2016-12-19 | 2020-11-03 | Nexperia B.V. | Semiconductor device and method with clip arrangement in IC package |
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WO2019082345A1 (ja) * | 2017-10-26 | 2019-05-02 | 新電元工業株式会社 | 半導体装置、及び、半導体装置の製造方法 |
US11088046B2 (en) * | 2018-06-25 | 2021-08-10 | Semiconductor Components Industries, Llc | Semiconductor device package with clip interconnect and dual side cooling |
US10978380B2 (en) * | 2019-05-03 | 2021-04-13 | Infineon Technologies Ag | Semiconductor package with multi-level conductive clip for top side cooling |
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CN114730741A (zh) * | 2019-11-28 | 2022-07-08 | 京瓷株式会社 | 布线基体、半导体元件容纳用封装件及半导体装置 |
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-
2007
- 2007-09-28 US US11/906,136 patent/US7622796B2/en not_active Expired - Fee Related
-
2008
- 2008-09-16 TW TW097135475A patent/TWI364829B/zh active
- 2008-09-17 CN CN2008101609859A patent/CN101399245B/zh active Active
- 2008-09-26 WO PCT/US2008/011202 patent/WO2009045342A1/en active Application Filing
-
2009
- 2009-05-28 US US12/474,107 patent/US7884469B2/en active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
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US6249041B1 (en) * | 1998-06-02 | 2001-06-19 | Siliconix Incorporated | IC chip package with directly connected leads |
Also Published As
Publication number | Publication date |
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TWI364829B (en) | 2012-05-21 |
WO2009045342A1 (en) | 2009-04-09 |
TW200915512A (en) | 2009-04-01 |
US7884469B2 (en) | 2011-02-08 |
US7622796B2 (en) | 2009-11-24 |
US20080087992A1 (en) | 2008-04-17 |
CN101399245A (zh) | 2009-04-01 |
US20090236708A1 (en) | 2009-09-24 |
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Effective date of registration: 20170628 Address after: Chongqing city Beibei district and high tech Industrial Park the road No. 5 of 407 Patentee after: Chongqing Wanguo Semiconductor Technology Co.,Ltd. Address before: Bermuda Hamilton No. 22 Vitoria street Canon hospital Patentee before: ALPHA & OMEGA SEMICONDUCTOR, Ltd. |
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Denomination of invention: Semiconductor package having dimpled plate interconnections Effective date of registration: 20191210 Granted publication date: 20110112 Pledgee: Chongqing Branch of China Development Bank Pledgor: Chongqing Wanguo Semiconductor Technology Co.,Ltd. Registration number: Y2019500000007 |
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