CN101373932A - 微型表面贴装单相全波桥式整流器及其制造方法 - Google Patents
微型表面贴装单相全波桥式整流器及其制造方法 Download PDFInfo
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- CN101373932A CN101373932A CNA2007100710195A CN200710071019A CN101373932A CN 101373932 A CN101373932 A CN 101373932A CN A2007100710195 A CNA2007100710195 A CN A2007100710195A CN 200710071019 A CN200710071019 A CN 200710071019A CN 101373932 A CN101373932 A CN 101373932A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 238000003466 welding Methods 0.000 claims abstract description 41
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- 238000004806 packaging method and process Methods 0.000 claims abstract description 4
- 210000003205 muscle Anatomy 0.000 claims description 17
- 238000005452 bending Methods 0.000 claims description 4
- 239000005022 packaging material Substances 0.000 claims description 3
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CN2007100710195A CN101373932B (zh) | 2007-08-25 | 2007-08-25 | 微型表面贴装单相全波桥式整流器及其制造方法 |
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CN101373932A true CN101373932A (zh) | 2009-02-25 |
CN101373932B CN101373932B (zh) | 2011-06-29 |
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Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101546714B (zh) * | 2009-04-30 | 2010-08-04 | 强茂电子(无锡)有限公司 | 微型半导体桥式整流器的制作方法 |
CN101937896A (zh) * | 2010-04-22 | 2011-01-05 | 苏州固锝电子股份有限公司 | 一种用于制造整流器的引线框 |
CN102651326A (zh) * | 2012-05-18 | 2012-08-29 | 常州银河世纪微电子有限公司 | 一种半导体整流桥的制备方法 |
CN102931174A (zh) * | 2012-10-30 | 2013-02-13 | 南通康比电子有限公司 | 一种微型表面贴装单相全波桥式整流器及其制造方法 |
CN103401438A (zh) * | 2013-08-13 | 2013-11-20 | 苏州工业园区凯众通微电子技术有限公司 | 新型表面贴装桥式整流器及其制造方法 |
CN103426874A (zh) * | 2013-08-20 | 2013-12-04 | 绍兴旭昌科技企业有限公司 | 一种超薄高压瞬态电压抑制二极管及其应用 |
CN103855421A (zh) * | 2012-11-30 | 2014-06-11 | 纳米新能源(唐山)有限责任公司 | 自充电薄膜锂离子电池 |
CN104124222A (zh) * | 2013-04-24 | 2014-10-29 | 太仓天宇电子有限公司 | 一种微型超薄单向整流桥器件及其加工工艺 |
CN104735872A (zh) * | 2011-01-28 | 2015-06-24 | 首尔半导体株式会社 | Led驱动电路封装 |
CN105185757A (zh) * | 2015-10-08 | 2015-12-23 | 苏州固锝电子股份有限公司 | 散热片结构表面贴装整流桥器件 |
CN106001824A (zh) * | 2016-05-11 | 2016-10-12 | 山东迪电子科技有限公司 | 一种半导体整流桥焊接制备方法 |
WO2017161669A1 (zh) * | 2016-03-25 | 2017-09-28 | 苏州固锝电子股份有限公司 | 散热片结构超薄型表面贴装整流桥器件 |
CN110098128A (zh) * | 2019-05-16 | 2019-08-06 | 强茂电子(无锡)有限公司 | 半导体桥式整流器的制作方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2545706Y (zh) * | 2002-03-29 | 2003-04-16 | 苏州固锝电子有限公司 | 片式微型桥堆 |
CN2901580Y (zh) * | 2006-02-24 | 2007-05-16 | 梁锦荣 | 单列直插全波整流桥堆 |
CN201118457Y (zh) * | 2007-08-25 | 2008-09-17 | 绍兴旭昌科技企业有限公司 | 微型表面贴装单相全波桥式整流器 |
-
2007
- 2007-08-25 CN CN2007100710195A patent/CN101373932B/zh active Active
Cited By (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101546714B (zh) * | 2009-04-30 | 2010-08-04 | 强茂电子(无锡)有限公司 | 微型半导体桥式整流器的制作方法 |
CN101937896A (zh) * | 2010-04-22 | 2011-01-05 | 苏州固锝电子股份有限公司 | 一种用于制造整流器的引线框 |
CN104735872B (zh) * | 2011-01-28 | 2017-05-31 | 首尔半导体株式会社 | Led驱动电路封装 |
CN104735872A (zh) * | 2011-01-28 | 2015-06-24 | 首尔半导体株式会社 | Led驱动电路封装 |
CN102651326A (zh) * | 2012-05-18 | 2012-08-29 | 常州银河世纪微电子有限公司 | 一种半导体整流桥的制备方法 |
CN102931174A (zh) * | 2012-10-30 | 2013-02-13 | 南通康比电子有限公司 | 一种微型表面贴装单相全波桥式整流器及其制造方法 |
CN102931174B (zh) * | 2012-10-30 | 2015-03-25 | 南通康比电子有限公司 | 一种微型表面贴装单相全波桥式整流器及其制造方法 |
CN103855421B (zh) * | 2012-11-30 | 2016-07-13 | 纳米新能源(唐山)有限责任公司 | 自充电薄膜锂离子电池 |
CN103855421A (zh) * | 2012-11-30 | 2014-06-11 | 纳米新能源(唐山)有限责任公司 | 自充电薄膜锂离子电池 |
CN104124222B (zh) * | 2013-04-24 | 2017-04-05 | 太仓天宇电子有限公司 | 一种微型超薄单向整流桥器件及其加工工艺 |
CN104124222A (zh) * | 2013-04-24 | 2014-10-29 | 太仓天宇电子有限公司 | 一种微型超薄单向整流桥器件及其加工工艺 |
CN103401438B (zh) * | 2013-08-13 | 2015-11-11 | 苏州工业园区凯众通微电子技术有限公司 | 表面贴装桥式整流器及其制造方法 |
CN103401438A (zh) * | 2013-08-13 | 2013-11-20 | 苏州工业园区凯众通微电子技术有限公司 | 新型表面贴装桥式整流器及其制造方法 |
CN103426874A (zh) * | 2013-08-20 | 2013-12-04 | 绍兴旭昌科技企业有限公司 | 一种超薄高压瞬态电压抑制二极管及其应用 |
CN105185757A (zh) * | 2015-10-08 | 2015-12-23 | 苏州固锝电子股份有限公司 | 散热片结构表面贴装整流桥器件 |
CN105185757B (zh) * | 2015-10-08 | 2018-06-29 | 苏州固锝电子股份有限公司 | 散热片结构表面贴装整流桥器件 |
CN108878410A (zh) * | 2015-10-08 | 2018-11-23 | 苏州固锝电子股份有限公司 | 贴装式整流半导体器件 |
CN108878410B (zh) * | 2015-10-08 | 2020-05-22 | 苏州固锝电子股份有限公司 | 贴装式整流半导体器件 |
WO2017161669A1 (zh) * | 2016-03-25 | 2017-09-28 | 苏州固锝电子股份有限公司 | 散热片结构超薄型表面贴装整流桥器件 |
CN106001824A (zh) * | 2016-05-11 | 2016-10-12 | 山东迪电子科技有限公司 | 一种半导体整流桥焊接制备方法 |
CN110098128A (zh) * | 2019-05-16 | 2019-08-06 | 强茂电子(无锡)有限公司 | 半导体桥式整流器的制作方法 |
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CN101373932B (zh) | 2011-06-29 |
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Assignee: ZHEJIANG CHUANGSHIDA MICROELECTRONICS Co.,Ltd. Assignor: Shaoxing Xuchang Technology Co.,Ltd. Contract record no.: 2011330001160 Denomination of invention: Miniature type surface mounting single-phase full-wave bridge rectifier and manufacturing method of rectifier Granted publication date: 20110629 License type: Common License Open date: 20090225 Record date: 20110916 |
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Application publication date: 20090225 Assignee: HENAN TAIGUAN ELECTRONICS TECHNOLOGY CO.,LTD. Assignor: ZHEJIANG MINGDE MICROELECTRONICS CO.,LTD. Contract record no.: 2018330000031 Denomination of invention: Miniature type surface mounting single-phase full-wave bridge rectifier and manufacturing method of rectifier Granted publication date: 20110629 License type: Common License Record date: 20180330 |
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Application publication date: 20090225 Assignee: Zhejiang Haiyou Semiconductor Co.,Ltd. Assignor: ZHEJIANG MINGDE MICROELECTRONICS Co.,Ltd. Contract record no.: X2020330000075 Denomination of invention: Miniature surface mount single phase full wave bridge rectifier and its manufacturing method Granted publication date: 20110629 License type: Common License Record date: 20201014 |
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