CN101303968A - 基板处理装置 - Google Patents
基板处理装置 Download PDFInfo
- Publication number
- CN101303968A CN101303968A CNA200810091639XA CN200810091639A CN101303968A CN 101303968 A CN101303968 A CN 101303968A CN A200810091639X A CNA200810091639X A CN A200810091639XA CN 200810091639 A CN200810091639 A CN 200810091639A CN 101303968 A CN101303968 A CN 101303968A
- Authority
- CN
- China
- Prior art keywords
- substrate
- mentioned
- air
- mentioned gas
- injection apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Weting (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
Claims (5)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007122257A JP4850775B2 (ja) | 2007-05-07 | 2007-05-07 | 基板処理装置 |
JP2007-122257 | 2007-05-07 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101303968A true CN101303968A (zh) | 2008-11-12 |
CN101303968B CN101303968B (zh) | 2010-08-25 |
Family
ID=40055265
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200810091639XA Expired - Fee Related CN101303968B (zh) | 2007-05-07 | 2008-04-11 | 基板处理装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4850775B2 (zh) |
KR (1) | KR100934329B1 (zh) |
CN (1) | CN101303968B (zh) |
TW (1) | TWI467643B (zh) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103871853A (zh) * | 2014-03-24 | 2014-06-18 | 上海华力微电子有限公司 | 改善薄膜均匀性的装置及方法 |
CN104362118A (zh) * | 2014-11-24 | 2015-02-18 | 合肥鑫晟光电科技有限公司 | 一种液刀清洗装置 |
CN104475387A (zh) * | 2014-12-16 | 2015-04-01 | 大庆圣赫环保设备有限公司 | 喷射冲洗装置 |
CN108109946A (zh) * | 2018-01-16 | 2018-06-01 | 昆山成功环保科技有限公司 | 一种刻蚀设备 |
CN109212793A (zh) * | 2018-09-30 | 2019-01-15 | 惠科股份有限公司 | 一种用于显示面板的制造设备和清洗方法 |
CN110109271A (zh) * | 2019-04-16 | 2019-08-09 | 深圳市华星光电技术有限公司 | 液刀 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04300672A (ja) * | 1991-03-28 | 1992-10-23 | Toppan Printing Co Ltd | 回転塗布方法およびその装置 |
JP2001188211A (ja) * | 1999-12-28 | 2001-07-10 | Optrex Corp | 液晶表示素子用電極基板の現像装置 |
JP2002110619A (ja) * | 2000-09-26 | 2002-04-12 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JP4020584B2 (ja) * | 2000-12-26 | 2007-12-12 | クボタ松下電工外装株式会社 | スプレー塗装装置のノズル洗浄方法 |
JP2004273984A (ja) * | 2003-03-12 | 2004-09-30 | Dainippon Screen Mfg Co Ltd | 基板処理方法および基板処理装置 |
JP4509613B2 (ja) * | 2004-03-19 | 2010-07-21 | 大日本スクリーン製造株式会社 | 基板処理装置 |
JP2005340402A (ja) * | 2004-05-26 | 2005-12-08 | Sony Corp | 洗浄装置および洗浄方法 |
JP4514140B2 (ja) * | 2005-02-28 | 2010-07-28 | 大日本スクリーン製造株式会社 | 基板処理装置及び基板処理方法 |
JP2006278606A (ja) * | 2005-03-29 | 2006-10-12 | Dainippon Screen Mfg Co Ltd | 基板処理装置および基板処理方法 |
-
2007
- 2007-05-07 JP JP2007122257A patent/JP4850775B2/ja not_active Expired - Fee Related
-
2008
- 2008-03-06 TW TW97107925A patent/TWI467643B/zh not_active IP Right Cessation
- 2008-04-11 CN CN200810091639XA patent/CN101303968B/zh not_active Expired - Fee Related
- 2008-04-17 KR KR1020080035529A patent/KR100934329B1/ko not_active IP Right Cessation
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103871853A (zh) * | 2014-03-24 | 2014-06-18 | 上海华力微电子有限公司 | 改善薄膜均匀性的装置及方法 |
EP3226283A4 (en) * | 2014-11-24 | 2018-04-11 | Boe Technology Group Co. Ltd. | Liquid cutter cleaning device |
WO2016082419A1 (zh) * | 2014-11-24 | 2016-06-02 | 京东方科技集团股份有限公司 | 液刀清洗装置 |
CN104362118B (zh) * | 2014-11-24 | 2017-02-01 | 合肥鑫晟光电科技有限公司 | 一种液刀清洗装置 |
CN104362118A (zh) * | 2014-11-24 | 2015-02-18 | 合肥鑫晟光电科技有限公司 | 一种液刀清洗装置 |
US10157754B2 (en) | 2014-11-24 | 2018-12-18 | Boe Technology Group Co., Ltd. | Liquid knife cleaning device |
CN104475387A (zh) * | 2014-12-16 | 2015-04-01 | 大庆圣赫环保设备有限公司 | 喷射冲洗装置 |
CN104475387B (zh) * | 2014-12-16 | 2016-10-12 | 大庆圣赫环保设备有限公司 | 喷射冲洗装置 |
CN108109946A (zh) * | 2018-01-16 | 2018-06-01 | 昆山成功环保科技有限公司 | 一种刻蚀设备 |
CN109212793A (zh) * | 2018-09-30 | 2019-01-15 | 惠科股份有限公司 | 一种用于显示面板的制造设备和清洗方法 |
WO2020062365A1 (zh) * | 2018-09-30 | 2020-04-02 | 惠科股份有限公司 | 一种用于显示面板的制造设备和清洗方法 |
US11513378B2 (en) | 2018-09-30 | 2022-11-29 | HKC Corporation | Display panel manufacturing device and cleaning method |
CN110109271A (zh) * | 2019-04-16 | 2019-08-09 | 深圳市华星光电技术有限公司 | 液刀 |
CN110109271B (zh) * | 2019-04-16 | 2022-02-22 | Tcl华星光电技术有限公司 | 液刀 |
Also Published As
Publication number | Publication date |
---|---|
CN101303968B (zh) | 2010-08-25 |
KR100934329B1 (ko) | 2009-12-29 |
JP2008277682A (ja) | 2008-11-13 |
TWI467643B (zh) | 2015-01-01 |
KR20080099138A (ko) | 2008-11-12 |
TW200901303A (en) | 2009-01-01 |
JP4850775B2 (ja) | 2012-01-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: DAINIPPON SCREEN MFG. CO., LTD. Free format text: FORMER NAME: DAINIPPON MESH PLATE MFR. CO., LTD. Owner name: SCREEN GROUP CO., LTD. Free format text: FORMER NAME: DAINIPPON SCREEN MFG. CO., LTD. |
|
CP01 | Change in the name or title of a patent holder |
Address after: Kyoto City, Kyoto, Japan Patentee after: Skilling Group Address before: Kyoto City, Kyoto, Japan Patentee before: DAINIPPON SCREEN MFG Co.,Ltd. Address after: Kyoto City, Kyoto, Japan Patentee after: DAINIPPON SCREEN MFG Co.,Ltd. Address before: Kyoto City, Kyoto, Japan Patentee before: Dainippon Screen Mfg. Co.,Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100825 Termination date: 20170411 |