CN101243734A - Printed wiring board manufacturing process - Google Patents
Printed wiring board manufacturing process Download PDFInfo
- Publication number
- CN101243734A CN101243734A CNA2006800296714A CN200680029671A CN101243734A CN 101243734 A CN101243734 A CN 101243734A CN A2006800296714 A CNA2006800296714 A CN A2006800296714A CN 200680029671 A CN200680029671 A CN 200680029671A CN 101243734 A CN101243734 A CN 101243734A
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- Prior art keywords
- sheet
- basement membrane
- circuit board
- printed circuit
- enhancing sheet
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49833—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the chip support structure consisting of a plurality of insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/4985—Flexible insulating substrates
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Abstract
Provided is a process for providing a printed wiring board equipped with a reinforcing sheet that has simple processing steps, a small number of steps and therefore can be carried out easily, simply and in a short period of time, while also allowing en bloc, large-volume production instead of batch production.
Description
Technical field
The present invention relates to a kind of printed circuit board manufacturing process, more particularly, relate to manufacturing by basement membrane with insert the manufacturing process of the flexible printed circuit board that the wiring figure layer in its lip-deep circuit region constitutes, and this flexible printed circuit board provides the enhancing sheet at the nonoverlapping position of wiring figure layer with this circuit region.
Background technology
As everyone knows, in electronic device, obtain great progress, occurred various types of electronic devices of performance that provides higher and the size that reduces in recent years.Therefore, also update in the printed circuit board (PCB) that uses widely in electronic device, the typical problem of facing these printed circuit board (PCB)s comprises the packing density that reduces size, reduces setting height(from bottom), flexibility and Geng Gao.Because flexible printed circuit board is particularly not only for the size that reduces electronic device and weight and to increase packing density effective, and the linking number between can adaptive element and the increase of installation elements number, therefore for the increase in demand of these plates.In addition, for the shortcoming that compensates the flexibility that is attributable to them (as the bonding strength that reduces between the element and the fracture in the element installation process), flexible printed circuit board usually is provided with the enhancing sheet that is made of metal material or plastic material, utilizes adhesive to adhere to this enhancing sheet.
Strengthen sheet and be bonded to flexible printed circuit board by the whole bag of tricks usually.For example, patent documentation 1 has been described a kind of manufacturing process of using the stacked flexible printed circuit board of thermosetting resin adhesive and strengthening sheet, wherein in each blade unit, push at warm-up mill and will be equipped with in the step after the flexible printed circuit board that strengthens sheet is pressed together, in each blade unit, in the single slice hot pressing step, this flexible printed circuit board heat is pushed, be equipped with the flexible printed circuit board that strengthens sheet with manufacturing.That is, this patent documentation proposes a kind of by flexible circuit board with strengthen sheet and push step, use warm-up mill pushes push step, use the heat-press step of single slice hot pressing machine and cure the manufacturing process that the back step constitutes temporarily.But because this manufacturing process comprises a large amount of treatment steps, not only this technology is complicated, and manufacturing needs considerable time and cost.In addition, because each sheet is handled in batches, it is not suitable for a large amount of productions, also has the shortcoming of low rate of finished products simultaneously.
On the other hand, patent documentation 2 has been described a kind of being used for and will have been strengthened the enhancing sheet bonding process that sheet is bonded to flexible printed circuit board, in this flexible printed circuit board, form conductor wiring on basement membrane, this technology comprises: wherein strengthen the stacked step that sheet and flexible printed circuit board are arranged opposite to each other and use thermosetting adhesive layer to fold; And the step of pushing that wherein applies pressure to the lamination that strengthens sheet and flexible printed circuit board from both sides; Wherein, push in the step,, apply pressure at least one that strengthens sheet side and flexible printed circuit board side by have the flexible parts of distortion at arbitrary region above-mentioned.That is, this patent documentation proposes a kind of improved hot-pressing system, and what wherein heat conductive rubber and buffering material were fixed to hot press pushes the surface up and down, applies to eliminate the inhomogeneous of pressure by this hot press.But, when this system of use, can not avoid wherein evenly applying pressure to the adverse effect of problem flexible printed circuit board has to(for) the circuit region (zone that promptly comprises the conductor wiring figure that has been out of shape) of flexible printed circuit board.This be because, because the surface of pushing of hot press has regular length and width, if the length of the circuit region on the flexible printed circuit board and change width, part that in circuit region, may take place not to be pressed according to particular case or twice the part of being pressed so.
Description of drawings
Fig. 1 shows the vertical view that is equipped with the preference pattern of the printed circuit board (PCB) that strengthens sheet according to the embodiment of the invention.
Fig. 2 shows the flow chart that is equipped with the manufacturing process of the printed circuit board (PCB) that strengthens sheet according to the embodiment of the invention according to process sequence.
Fig. 3 shows the schematic cross sectional view that is equipped with the enhancing sheet preparation process that comprises in the manufacturing process of the printed circuit board (PCB) that strengthens sheet according to the embodiment of the invention.
Fig. 4 shows the schematic cross sectional view that is equipped with the interim installation steps of enhancing sheet that comprise in the manufacturing process of the printed circuit board (PCB) that strengthens sheet according to the embodiment of the invention.
Fig. 5 shows the schematic cross sectional view that is equipped with the final adhesion step of enhancing sheet that comprises in the manufacturing process of the printed circuit board (PCB) that strengthens sheet according to the embodiment of the invention.
Fig. 6 shows the schematic cross sectional view of the mechanism of the pressure that is used for controlling warm-up mill in the final adhesion step of enhancing sheet shown in Figure 5.
Embodiment
The purpose of this invention is to provide a kind of manufacturing process that is equipped with the flexible printed circuit board that strengthens sheet, this manufacturing process is improved the method for available technology adopting, to strengthen sheet by simple process steps and be bonded to flexible printed circuit board, has few steps, also can carry out this processing step easily, simply and in a short time even therefore be unfamiliar with the personnel of this process, and allow overall, a large amount of manufacturing to replace producing in batches.
In addition, another object of the present invention provides a kind of manufacturing process that is equipped with the flexible printed circuit board that strengthens sheet, even the length of the circuit region on this manufacturing process flexible printed circuit board and width change, not pushing with excessive problem of pushing in the time of also preventing to push on strengthening sheet in the circuit region takes place.
Can easily understand these purposes of the present invention and other purposes from following detailed description.
As for addressing the above problem the result who carries out broad research, the present inventor finds that by long material manufacturing flexible printed circuit board and flexible board be effective, especially preferably guide those to begin material to manufacturing process from twining attitude, and divide two stages that constitute by interim installation steps (interim adhesion step) and its final adhesion step subsequently to strengthen the sheet adhesion step, finish the present invention thus.
That is, the present invention is a technology of making flexible printed circuit board, and this flexible printed circuit board comprises basement membrane at least and insert wiring figure layer in its lip-deep circuit region, and the position beyond the position of the wiring figure in dividing circuit district provides the enhancing sheet; This technology comprises:
Wherein make the step of the long basement membrane that limits by at least one circuit region corresponding to printed circuit board (PCB);
In each circuit region, form the step of wiring figure layer;
Step: in each circuit region, form before the wiring figure layer, during or afterwards, with moving this basement membrane continuously, during its moving process, will be bonded to the precalculated position of basement membrane at enhancing sheet local or that make in the another position by tack coat; And
With this basement membrane with strengthen the lamination cutting of sheet and be divided into the step of each printed circuit board (PCB), each printed circuit board (PCB) has the wiring figure layer and strengthens sheet; Wherein
Divide two stages that constitute by enhancing interim installation steps of sheet and the final adhesion step of enhancing sheet subsequently thereof to strengthen the sheet adhesion step.
Can easily understand by following detailed description, according to the present invention, to strengthen under the situation that sheet is bonded to flexible printed circuit board, because processing and adhesion step are simple, only need a spot of processing step, can carry out this technology easily, simply and in a short time even be unfamiliar with the personnel of this process, and this technology do not rely on and is produced in batches yet, therefore can be totally and make the flexible printed circuit board that be equipped with the enhancing sheet in large quantities.Launch printed circuit board (PCB) and the flexible printed circuit board that strengthens sheet that is equipped with that will finally obtain rewinds to system on this spool by adopting wherein, can more advantageously embody these effects from spool.
In addition, according to the present invention,, do not occur in not pushing and excessive problem of pushing in the circuit region when pushing on the enhancing sheet even the length of the circuit region on the flexible printed circuit board and width change yet.
According to the present invention, together with realizing the effect that flexible printed circuit board is intrinsic such as the size that reduces and the weight and the high packing density of electronic device naturally, the also increase of linking number between the adaptive element and installation elements number easily, and the result of this enhancing sheet of conduct bonding, can also realize such as the bonding strength and the additional effect that prevents the fracture in the element installation process that improve between the element.
Manufacturing process according to flexible printed circuit board of the present invention can advantageously be carried out with various forms.Although provide the explanation of the preferred embodiments of the present invention below with reference to accompanying drawing, self-evident, the present invention is not limited to these embodiment.
Printed circuit board (PCB) of the present invention is made of basement membrane and wiring figure layer at least, this basement membrane itself is flexible, and can be deformed into arbitrary shape, this wiring figure layer is placed into the lip-deep circuit region of basement membrane, and is provided with the enhancing sheet at the position except that the position of the wiring figure floor in foregoing circuit district.But this enhancing sheet is applied to the rear surface of basement membrane usually, and if desired, it can be applied to the upper surface of basement membrane.The printed circuit board (PCB) that is equipped with the enhancing sheet of the present invention is usually with the form manufacturing of long film, and this long film provides and is equipped with a plurality of printed circuit board (PCB)s that strengthen sheet, and it can be divided into single printed circuit board by cutting then.That is, printed circuit board (PCB) of the present invention in its precursor forms, is made of a plurality of printed circuit board (PCB)s that form continuously with mutual predetermined space on this long film.Fig. 1 shows the vertical view of the preferred form of the long band that is equipped with the printed circuit board (PCB) that strengthens sheet.
The length of printed circuit board (PCB) shown in Figure 1 constitutes with 10 flexible base film 1 by the TAB band forms that is equipped with the location hole (sprocket hole) 12 that is used for its transmission.Basement membrane 1 can be treated to single printed circuit board 10-1,10-2 etc. by along line of cut c cutting.Although each printed circuit board (PCB) can be formed the various sizes corresponding to its structure, application etc., in the accompanying drawings shown under the situation of example, bandwidth w is 70mm, length l is 38mm, and the spacing p of location hole 12 is 4.75mm.Each printed circuit board (PCB) with the form of its marking area therein the heart have circuit region 2.Circuit region 2 is rectangle normally.In addition, although not shown in the accompanying drawings, circuit region 2 is provided with the mounting portion of installing device and near wiring figure layer thereof, wherein forms the figure of any desired.In addition, for the printed circuit board (PCB) typical case at large, the wiring figure layer is made of wiring, lead, outer lead etc.In addition,, strengthen the rear surface that sheet 3 further is bonded to the circuit region 2 of printed circuit board (PCB) according to technology of the present invention, that is, and with the wiring figure layer-bearing-surface facing surfaces of basement membrane 1, as shown in the figure.Enhancing sheet 3 partly extends to the perimeter of circuit region 2.
In printed circuit board (PCB) of the present invention, although this flexible base film can be formed by the various materials that can give the basement membrane flexibility, it is normally favourable to be molded as film shape by method of moulding arbitrarily by plastic material.The example that is preferred for the plastic material of basement membrane comprises polyimide resin, acrylic resin, mylar, polyurethane resin and Corvic.In addition, the example that is used for the method for moulding of these plastic materials comprises various types of coating processs and calendering (calendar) method.Although can use this basement membrane with all thickness corresponding to the structure of printed circuit board (PCB), application etc., this thickness is about 300 μ m or following usually, preferably in the scope of about 50 to 200 μ m, more preferably in the scope of about 50 to 150 μ m.If this basement membrane is too thin, machinability reduces and the susceptibility that ruptures is raise so.On the contrary, if basement membrane is too thick, it has the opposite effect with respect to reducing weight so, simultaneously also is difficult to be wrapped on the spool etc.In addition, this basement membrane forms long band usually, preferably by being wrapped in storage and transmission on the spool, and then uses by launching if desired in the manufacture process of printed circuit board (PCB).
As discussed previously, be set at wishing in the figure arbitrarily in the circuit region of printed circuit board (PCB) such as the circuit element that comprises the wiring figure layer that device mounting part and wiring are installed.These elements can be to be similar to the figure that typically adopts in the printed circuit board (PCB) and to use similar techniques to form.For example, the wiring of wiring figure layer and other elements can be by using such as the conducting metal of copper, nickel or gold or its alloy such as electroplating or the technology of vapour deposition and forming.In addition, also can form this wiring figure layer by then it being carried out selective etch at the whole surface of basement membrane bonding conductor thin film.If desired, this wiring figure layer also can use the technology such as welding to form.Although can use the wiring figure layer with all thickness corresponding to the structure of the structure of printed circuit board (PCB) and wiring figure layer, this thickness is about 50 μ m or following usually, preferably in the scope of about 5 to 40 μ m, more preferably in the scope of about 10 to 30 μ m.
Enhancing sheet and wiring figure layer are bonded to the rear surface of basement membrane relatively.Come bonding this enhancing sheet by the space that utilizes wiring figure layer and other function elements not to be placed in the circuit region.Therefore, it can be arranged with arbitrary graphic continuous or that be interrupted.The exemplary of this enhancing sheet figure comprises rectangle, L-shape and circle.Irrelevant with the graph style of using, can use ordinary skill easily to form the enhancing sheet, preferably be stamped to form by strengthening sheet by sheet.The example of the position of layout enhancing sheet comprises the position of connector.
As carrying out usually in art of printed circuit boards, this enhancing sheet can be formed by the form with metal level, plastic layer or its combination such as the metal material that performance of printed circuit board (PCB) etc. is not had adverse effect or plastic material.The example of the metal material that is fit to comprises stainless steel and titanium.In addition, the example of the plastic material of Shi Heing comprises polyimide resin, mylar and glass epoxy resin.In addition, the example of this combination combination that comprises the combination of combination, the plastic layer of metal level, constitute by stacked metal level and plastic layer.For example, the combination of plastic layer comprises the lamination with the bonding polyimide layer of adhesive, and comprises stainless steel layer and the lamination that utilizes the bonding polyimide layer of adhesive by the combination layer that stacked metal level and plastic layer constitute.This strengthens sheet typically with the form of film use, although its thickness can change, is about 300 μ m or following usually in wide region, preferably in the scope of 25 to 200 μ m.If it is too thin, can not realize the reinforced effects of level of hope so.In addition, although the ratio of the surface area that is occupied by the enhancing sheet in the circuit region can not be defined usually, because it depends on the factor of area that goes up the zone of formation wiring figure layer such as the area of circuit region and its, in this case, for example, the width of printed circuit board (PCB) is 70mm, and length is 38mm, therefore by the ratio that strengthens the zone that sheet occupies typically in 20 to 70% scope.
This enhancing sheet is by means of the tack coat bonding and be fixed to basement membrane.Although adhesive used herein can be thermoplastic adhesive as required, resinoid is useful typically.The example of the resinoid that is fit to comprises acryloid cement and epoxy adhesive.In addition, in the present invention, in a stage, do not finish and strengthen sheet to the fixing of basement membrane, but, as below describing in detail, divide at least two stages to carry out.That is, after the enhancing sheet was placed in epilamellar precalculated position, in the phase I, the part that strengthens sheet was bonded to basement membrane (being also referred to as " interim bonding " in the present invention) provisionally, after this strengthens the final bonding of sheet in second stage.That is, printed circuit board (PCB) of the present invention is about being adhered to the interim part that bonds of enhancing sheet combination and the final part that bonds of its basement membrane.
Be pressed into partly on the basement membrane by for example using heating pin or heating rod will strengthen sheet that to strengthen the interim installation steps of sheet on the basement membrane be favourable so that it is attached to.According to the present invention, can advantageously carry out and to strengthen these interim installation steps that the sheet part is installed to basement membrane provisionally by using four axis mechanical robot.In addition, can use the warm-up mill that for example constitutes advantageously to strengthen the final adhesion step of sheet by multistage (stage).
According to the present invention, the printed circuit board (PCB) that is equipped with aforesaid enhancing sheet can be made by sequentially saying capable following steps:
The step of the long basement membrane that manufacturing is limited by at least one circuit region corresponding to printed circuit board (PCB);
In each circuit region, form the step of wiring figure layer;
In each circuit region, form before the wiring figure layer, during or afterwards, in its moving process, will be bonded to the step in the precalculated position of basement membrane at enhancing sheet local or that make in the another position with mobile basement membrane continuously by tack coat; And
Cut the lamination of this basement membrane and enhancing sheet and it is divided into the step of single printed circuit board, each printed circuit board (PCB) has the wiring figure layer and strengthens sheet.In addition, under the situation of technology of the present invention, divide two stages that constitute by the interim installation steps of enhancing sheet and its final adhesion step of enhancing sheet subsequently to carry out and to strengthen the step that sheet is bonded to basement membrane.In addition, in this manufacturing process of flexible printed circuit board, the structure of printed circuit board (PCB) does not provide detailed description below like previous description.
This technology of the present invention can advantageously be carried out with various patterns.Fig. 2 illustrates the flow chart that is equipped with the manufacturing process of the printed circuit board (PCB) that strengthens sheet according to the present invention according to process sequence.
According to technology of the present invention, at first make printed circuit board (PCB).This printed circuit board (PCB) can be made by following steps: the step of making the long basement membrane that is limited by at least one circuit region corresponding to printed circuit board (PCB); With the step that forms the wiring figure layer corresponding to each circuit region.Particularly, this basement membrane preferably has a plurality of circuit regions.In addition, although considering to be convenient to process preferably forms identical circuitous pattern usually in each circuit region, examine also and can form different circuitous patterns as required.In addition, preferably make long basement membrane in advance, and store, then as required by launching to use from this spool by being wrapped on the spool etc.In addition, form in the step,, can form lead, outer lead and outside other members that are connected pin that need such as printed circuit board (PCB) synchronously or in the different time with the formation of wiring etc. after spool etc. launches basement membrane at subsequently wiring figure.
This enhancing sheet separates manufacturing with the manufacturing of basement membrane.Although can make this enhancing sheet by the whole bag of tricks, but it is usually preferably with long form manufacturing of being with, in this long band, a plurality of enhancing sheets are inserted continuously, so that can be cut into single enhancing sheet as required, store by being wrapped on spool etc., use by launching as required then.Rectangle strengthens sheet and is preferably formed the shape of being with into long especially, and uses by being wrapped on the spool, and it considers that punch steps is cut open a width (be slit to a width).In addition, utilized metal pattern processing moulding to be in the enhancing sheet that twines attitude simultaneously and be optimized for enhancing sheet with special shape.In addition, because this enhancings sheet has and is used for its bonding and is fixed to the tack coat of basement membrane, it is preferably protected up to horse back and will bond with release back boxing (packing paper).Corresponding enhancing sheet problem adhered to one another etc. when in addition, the existence that discharges back boxing also makes it to avoid in being wound into spool.
Next, after the band that strengthens sheet cuts out single enhancing sheet and peels off this release back boxing, this enhancing sheet is glued to epilamellar precalculated position.In addition, can be before each circuit region formation wiring figure of basement membrane, in the process that forms the wiring figure layer, or after forming the wiring figure layer, will strengthen sheet and be bonded to basement membrane, and under any circumstance, in the end the stage, form the wiring figure layer in the pre-position of basement membrane.
Basement membrane launches continuously from spool etc. usually, and be moved to strengthen the interim installation position of sheet after, will be by means of tack coat local or be bonded to the precalculated position of basement membrane at the enhancing sheet of diverse location manufacturing.In addition, in the present invention, the enhancing sheet adhesion step of carrying out here is meant and strengthens the interim installation steps of sheet, wherein by partly being bonded to basement membrane this enhancing sheet is installed temporarily.In addition, in technology of the present invention, the translational speed by the coupling basement membrane guides this enhancing sheet continuously, and preferably should strengthen sheet by means of the tack coat that is connected with basement membrane is installed to basement membrane provisionally.In addition, preferably, be installed on the basement membrane provisionally thereby should strengthen sheet by heating at least in part with the end of heating pin or heating rod to allow heat to act on the tack coat.In addition, for the heater of interim installation steps, as required, can use tabular heater or other to install the heater that has pointed tip electrode in the mode that replaces having with heater bar.In addition, these interim installation steps can advantageously be carried out by using four axis mechanical robot.The four shaft mechanical robots that use among the present invention preferably can be demonstrated simultaneously: transmission is equipped with the function of the enhancing sheet that is cut into the tack coat of wishing size on four direction of principal axis, guiding strengthens the function of sheet above flexible printed circuit board, the location strengthens sheet and by means of stacked its function of tack coat on printed circuit board (PCB), apply pressure to and strengthen sheet pushing its function to the printed circuit board (PCB), and the interim installation function that is bonded to printed circuit board (PCB) by the part that the heater that use provides will strengthen sheet.That is, preferably utilize measuring system of picture to measure the width and the marginal position of reinforcement plate, also measure the position of printed circuit board (PCB), and this positional information is sent to four axis mechanical robot and is used for controlling its position.Therefore, four axis mechanical robot are picked up the enhancing sheet of cutting, keep it, move it then with it by on the precalculated position that is pressed in printed circuit board (PCB).Simultaneously, the heater that provides is pressed against on this enhancing sheet so that it is partially mounted (temporarily mount) it to printed circuit board (PCB).In addition, can obtain such four axis mechanical robot from Yamaha MotorCo.Ltd (Yamaha Engine Ltd.) with the form of " PCX4O " (trade name).
After finishing the interim installation steps of enhancing sheet, carry out the final bonding of this enhancing sheet.Although the final adhesion step of this enhancing sheet can be undertaken by the whole bag of tricks, bond fully and be fixed to basement membrane thereby the enhancing sheet preferably by heating whole interim installation will strengthen sheet with softening this adhesive.In addition, be temporarily fixed basement membrane by interim installation owing to strengthen sheet, thus strengthen sheet be directed into final adhesion step during the problem that this enhancing sheet and basement membrane separate can not take place.In this final adhesion step, be equipped with the basement membrane that strengthens sheet and preferably be directed at least one pair of warm-up mill that it is heated and is pressed together.Especially preferably sequentially carry out final adhesion step by using by for example 2 grades or the more multistage warm-up mill that constitutes.In addition, the temperature and pressure of each warm-up mill can be provided with independently and be controlled.The rotating speed of warm-up mill (base film transport speeds) is identical.The temperature of warm-up mill, pressure and rotating speed can be according to the thickness that strengthens sheet and the physical property and the type that are applied to strengthen the tack coat of sheet suitably determine.
By carrying out in conjunction with multistage warm-up mill under the situation of final adhesion step, remove in the laminated portions of basement membrane and strengthen the air (degasification) that exists between the sheet by first order warm-up mill.Degasification can not only prevent visual defects, and can prevent the varied in thickness of the enhancing sheet that the existence by air causes and peel off, and the existence of air may damage the automatic installation steps of device etc.Therefore, consider these purposes, the temperature and pressure of warm-up mill is set.Next, utilize the second level and warm-up mill subsequently to be used for comprehensive heating of final bonding and push.Therefore, consider this purpose, the temperature and pressure of each warm-up mill is set.
By at the predetermined position fixed length basement membrane of each circuit region of basement membrane with strengthen the above-mentioned series of steps that sheet constitutes, obtain to be equipped with the printed circuit board (PCB) that strengthens sheet (lamination) by experience.Before various types of devices were installed, this lamination can advantageously be stored to be wrapped on the spool etc. simultaneously, perhaps can be transmitted as required maybe and can be provided for user etc.In addition, under situation about lamination being wound on the spool, use winding mechanism with lamination with being wrapped on the spool normally favourable every paper (insertion film).By being divided into the printed circuit board (PCB) that single printed substrate can obtain to have the corresponding wiring line graph layer and strengthen sheet.According to this technology, because printed circuit board (PCB) can be placed in the single basement membrane in a large number, so a large amount of printed circuit board (PCB) can be made on a large scale and separate.
The detailed description of technology
Be described in more detail the manufacturing process that is equipped with the printed circuit board (PCB) that strengthens sheet according to of the present invention below.Fig. 3 shows the schematic cross sectional view that is equipped with the enhancing sheet preparation process that comprises in the manufacturing process of the printed circuit board (PCB) that strengthens sheet according to the present invention.As shown in the figure, strengthen sheet 3 and have tack coat 4 on the side of printed circuit board (PCB) being bonded to, and in order to prevent to twine the bonding in the attitude, the surface of tack coat 4 covers with discharging back boxing 5.By passing a pair of deflector roll 32, these long sheets 3 that strengthen launch from spool 31, so that use in its bonded step.Next, thus peeling off by spool 33 after back boxing 5 exposes tack coat 4, strengthen sheet 3 and be cut into the size that needs by the cutting machine of arranging after the spool 33 34.Then Qie Ge enhancing sheet 3 be guided in four axis mechanical robot 35 below, and under the state of the bottom that is inhaled into robot, be directed into the interim installation steps of follow-up enhancing sheet.Here, four axis mechanical robot 35 are designed to move on four direction of principal axis, and are equipped with at the interim heating rod 36 that strengthens use in the sheet 3 of installing.In addition, in the example shown in, although the long sheet 3 that strengthens is by launching to be treated to single enhancing sheet 3 from spool 31, the enhancing sheet 3 that can be treated to monolithic as required in different position preparations is used for carrying out the present invention then in the accompanying drawings.
Fig. 4 shows the schematic cross sectional view that is equipped with the interim installation steps of enhancing sheet that comprise in the manufacturing process of the printed circuit board (PCB) that strengthens sheet according to of the present invention.Although not shown in the accompanying drawings, basement membrane 1 has the wiring figure layer that is placed in its circuit region, and the precursor that can be described as printed circuit board (PCB) of the present invention.As shown in the figure, provide basement membrane 1 with the long ribbon shape attitude of on spool 11, twining.After spool 11 launches, this long basement membrane 1 is directed into and strengthens the interim erecting bed 15 of sheet, is bonded to its rear surface so that will strengthen sheet 3.Here, because the guiding speed of the enhancing sheet of making in the guiding speed of basement membrane 1 and the previous enhancing sheet preparation process with reference to figure 3 explanations 3 is synchronous, and be directed into and strengthen the interim erecting bed 15 of sheet, therefore can be accurately and will strengthen sheet 3 continuously and adhere to basement membrane 1.The predetermined position that strengthens the basement membrane 1 on the interim erecting bed 15 of sheet is synchronous with arriving, the enhancing sheet of making in strengthening the sheet preparation process 3 also arrives the interim erecting bed 15 of enhancing sheet and is drawn into four axis mechanical robot 35 simultaneously, be pressed on the basement membrane 1 by reducing robot 35, and partly be installed in provisionally on the basement membrane 1 by the heating rod (not shown) that provides in the robot 35.Because being heated the end of rod, tack coat 4 carries out a heating, so enhancing sheet 3 is bonded to basement membrane 1 provisionally and can keeps with being stabilized.Support the basement membrane 1 that strengthens sheet 3 and be directed into the final adhesion step of follow-up enhancing sheet, maintain the original state simultaneously.In addition, although not shown in the accompanying drawings, basement membrane 1 may be directed to help roll (differential level roller (differential level roller)), and removes de-shirred before moving on to the final adhesion step of follow-up enhancing sheet.
Fig. 5 shows the schematic cross sectional view that is equipped with the final adhesion step of enhancing sheet that comprises in the manufacturing process of the printed circuit board (PCB) that strengthens sheet according to the present invention.Installed provisionally in the above after the enhancing sheet 3, basement membrane 1 is directed into and strengthens the final adhesion station of sheet.The final adhesion station of enhancing sheet used herein is made of first warm-up mill 21 and second warm-up mill 22, and their each free a pair of warm-up mills constitute.Although each warm-up mill can be equipped with any firing equipment, adopt the form that wherein in this roller, comprises heater normally favourable.Basement membrane 1 with wherein install to strengthen provisionally thereon sheet 3 and wherein in advance the state of heating and degasification be directed into first warm-up mill 21.The heating-up temperature of first warm-up mill 21 is about 110 to 160 ℃ usually, and the pressure of pressure when being applied in is about 3 usually to 7kg.In addition, when basement membrane 1 was directed into first warm-up mill 21, it preferably extended wherein to apply the state that is fit to tension force, and can preheat by any heater as required, adds heat lag arbitrarily so that proofreaied and correct before being directed into first warm-up mill 21.After through first warm-up mill 21, basement membrane 1 is directed into second warm-up mill 22, is heated fully at second warm-up mill, 22 place's basement membranes 1, and feasible enhancing sheet 3 is bondd fully and is fixed to basement membrane 1.The heating-up temperature of second warm-up mill 22 is about 120 to 180 ℃ usually, and the pressure when exerting pressure is about 5 usually to 10kg.After finishing heating step by step in this way, have the gained printed circuit board (PCB) 10 that strengthens sheet and be wrapped on the product winding roller 25.Usually, speed of wrap in the case is preferably synchronous to the stacked speed of basement membrane 1 with enhancing sheet 3.
But, under the situation of pushing at the final adhesion station of above-mentioned enhancing sheet place by warm-up mill, the downward pressure of preferred control warm-up mill in technology of the present invention.Fig. 6 shows the schematic cross sectional view of the heated roller downward pressure controlling organization in the final adhesion step of enhancing sheet shown in Figure 5.As shown in the figure, in the time of between printed circuit board (PCB) 10 is through a pair of warm- up mill 22a and 22b, with using measuring instrument 23 measurement products positions, shown in arrow P from exert pressure (downward pressure) so that the serpentine bend (snaking) of printed circuit board (PCB) 10 can be controlled at reference pressure ± 10% scope in.Pressure when exerting pressure in addition, is 6kg ± 600g for example.
Be glued in the relevant problem of the surface irregularity of printed circuit board (PCB) eliminating with coming from the enhancing sheet, heated roller downward pressure controlling organization as shown in the figure is effective.This is because the existence of the surface irregularity in the printed circuit board (PCB) may cause taking place the risk of fold and serpentine bend.The use of this mechanism make it can: when utilizing warm-up mill to push, control the lateral balance of the downward pressure of warm-up mill, control tension force simultaneously by the position of accurately measuring printed circuit board (PCB).In addition,, therefore constant pressure can be applied always, and the size on circuit region vertical printed circuit board (PCB) in needn't be worried because this warm-up mill has cylinder form.
Example
Next, with reference to its example the present invention is described.In addition, in this example, respectively shown in Fig. 3 and 4 by launching from spool and stacked this enhancings sheet and basement membrane are made as shown in Figure 1 flexible printed circuit board, installation enhancing sheet provisionally respectively on this basement membrane finally bonds, as shown in Figure 5 then.The explanation of each step is provided below.
1. the management of product
According to specific type, the product length of printed circuit panel products is different with width.The product of this example (before bonding strengthens sheet) has 8 location holes, measures to have the length of 38mm and the width of 70mm.Although only show two products for simplicity in Fig. 1, in fact, large-tonnage product is inserted in the long band continuously, and long band comprises a product at each Width.Therefore, band-type product is wound onto in the spool usually and can controls based on the length of a product and the product number in the product width.
2. product transmission
The product that is wound in the spool is unfolded and is sent to the interim erecting bed of enhancing sheet.With the product length is the transmission that unit carries out product.The unit of product length usually is set based on the number of location hole, and this set point is by in the input operation panel in advance.
3. strengthen the sheet transmission quality
This enhancing sheet also is wrapped on the spool, when in use the size of transmitting and being cut into needs from this spool.This enhancing sheet transmits with the amount of preset length.Transmit in phase with the product transmission.
4. strengthen the bonding of sheet and product
Be bonded to product in order to strengthen sheet, for each product is indicated the design information relevant with bonding position in advance.Proofread and correct this design information based on CAD information (about the information of design size), and the instruction (design information of finishing) that record is proofreaied and correct with actual product in four axis mechanical robot.
In addition, utilize measuring system of picture to measure width and the marginal position that strengthens sheet.The position of this product is also measured, and uses the Position Control function of four axis mechanical robot to discern product space with pinpoint accuracy.Thus, will strengthen sheet accurately by on the precalculated position that is pressed in product.
5. strengthen sheet installs temporarily
With by being pressed on the product synchronously, strengthen the result of the heating pin that is provided with on four axis mechanical robot in the interim erecting bed of sheet as contact, the part heating that strengthens sheet is applied several seconds pressure simultaneously.The temperature of heating pin and time of contact, the performance according to thickness that strengthens sheet and enhancing sheet tack coat decided.For example, at the thickness that strengthens sheet is that the temperature that is provided with of 200 μ m and adhesive is under 140 ℃ the situation, in the short time 3 seconds pressurization time under 300 ℃ the heating pin temperature, or in the short time 2 to 4 seconds pressurization time under 400 ℃ the heating pin temperature, can be installed to each product provisionally with strengthening sheet.
In addition,,, heating pin strengthens the interim installation that strengthens sheet on the sheet by being pressed into although in the present example, also can be as required, and by heating pin being pressed into the interim installation that strengthens sheet on the product.In addition,, have at Width under the situation of two products, repeatedly carry out the interim installation that strengthens sheet for each product although in the long band in the present example, only a product is placed in this band on Width.
6. strengthening sheet finally bonds
The product that strengthens sheet has been installed provisionally has been sent to the final adhesion station of follow-up enhancing sheet.Because this enhancing sheet partly is bonded to this product, this product is sent to warm-up mill under the condition that does not have to separate at this enhancing sheet.
Strengthening the final adhesion station of sheet is made of two stages of heated rollers.The temperature and pressure of each warm-up mill is provided with independently and can be independently controlled.Although the size of warm-up mill (diameter) can be identical or different, their rotating speed is identical.The temperature of each warm-up mill, pressure and rotating speed can suitably determine according to the physical property and the type of the tack coat on thickness that strengthens sheet and the enhancing sheet.
When the product that this enhancing sheet is installed provisionally passes through the first order of warm-up mill, not only can remove this product in the previous step and strengthen the air of capturing between the sheet, and owing to apply predetermined temperature and pressure, therefore can raise with respect to the adhesion strength of the reinforcement plate of this product from warm-up mill.Next,, be higher than the temperature and pressure that the first order by warm-up mill applies, further increase, make it thus to finish final bonding with respect to the adhesion strength of the enhancing sheet of this product owing to apply when this product during through the second level of warm-up mill.In addition, example as temperature, pressure and the rotating speed of warm-up mill, when the thickness that strengthens sheet is 200 μ m, the temperature that is provided with of adhesive is 140 ℃, and the thickness of tack coat is 40 μ m, then the first order of warm-up mill is set as 140 to 150 ℃ temperature, 5 to 6kg pressure and the rotating speed of 0.75m/min, and the second level of warm-up mill is set as 160 to 170 ℃ temperature, 6 to 7kg pressure and the rotating speed of 0.75m/min.
But, under the situation of this example, strengthening the interim erecting bed of sheet and strengthening the differential level roller that is provided for controlling tension force between the final adhesion station of sheet.Although according to the product tension fluctuation of the width of product, it is controlled in the scope of about 200g to 1kg usually.
In addition, because this product is equipped with the enhancing sheet, owing to strengthen the existence of sheet, their surface has such as the features of terrain of protruding and caving in, and because warm-up mill has small difference what caused by heat in the expansion of Width (perpendicular to the direction that transmits the line of production), therefore in the transport process that causes by this combination, serpentine bend may take place in product.But, under the situation of this example, use these situations of mechanism controls as described below.That is, be arranged in the cylinder pressure on the left side and the right of heat roller by measurement, move to right as fruit product, You Bian cylinder pressure is reduced or the cylinder pressure on the left side is increased so.On the contrary, move to left as fruit product, the cylinder pressure on the left side is reduced or the cylinder pressure on the right is increased so.In this way, can prevent the product serpentine bend, and at that time the scope of pressure is controlled at be provided with pressure ± 10% in.
7. finish the winding of product
That passes through final warm-up mill makes product (being equipped with the product that strengthens sheet) with being wound onto in the spool every paper (insertion film), should be every paper and the enhancing sheet side contacts of making product.The speed of wrap of this spool is synchronous with the Product transport speed that strengthens in the final adhesion station of sheet.
8. surveillance
In the present example, surveillance is installed dividually, visually monitors from strengthening the interim erecting bed of sheet and strengthening the product that the final adhesion station of sheet is come out to utilize ccd video camera.Catch treatment of picture make it to measure move the position that strengthens in the sheet or the existence that strengthens sheet whether, and can make emergency warning lamp luminous or can interrupt the operation of this equipment as required.
Claims (9)
1. the manufacturing process of a flexible printed circuit board, this flexible printed circuit board comprises basement membrane at least and inserts wiring figure layer in its lip-deep circuit region, and provides the enhancing sheet at the position except that the position of the described wiring figure of described circuit region; This manufacturing process comprises:
The step of the long basement membrane that manufacturing is limited by at least one circuit region corresponding to described printed circuit board (PCB);
In each circuit region, form the step of described wiring figure layer;
In each described circuit region, form before the described wiring figure layer, in the process or afterwards, with moving described basement membrane continuously, in the moving process of described basement membrane, will be bonded to the step in the precalculated position of described basement membrane at enhancing sheet local or that make in the another position by tack coat; And
Cut described basement membrane and strengthen the lamination of sheet and be divided into the step of single printed circuit board, each printed circuit board (PCB) has described wiring figure layer and described enhancing sheet; Wherein
In two stages that constitute by enhancing interim installation steps of sheet and the final adhesion step of enhancing sheet subsequently thereof, carry out described enhancing sheet adhesion step.
2. manufacturing process according to claim 1 wherein, guides described enhancing sheet continuously according to the translational speed of described basement membrane, and by means of the adhesive that is connected with described basement membrane described enhancing sheet is bonded to described basement membrane.
3. manufacturing process according to claim 1, wherein, described enhancing sheet has tack coat being bonded on the side of described basement membrane.
4. according to any described manufacturing process of claim 1 to 3, wherein, in the interim installation steps of described enhancing sheet,, described enhancing sheet is bonded to described basement membrane provisionally by heating at least in part.
5. according to any described manufacturing process of claim 1 to 4, wherein, in the final adhesion step of described enhancing sheet, after installing temporarily and hardening described adhesive, by heating whole described enhancing sheet, described enhancing sheet is fully bondd and be fixed to described basement membrane.
6. manufacturing process according to claim 5, wherein in described final adhesion step, the described basement membrane with described enhancing sheet is directed between at least one pair of warm-up mill.
7. according to any described manufacturing process of claim 1 to 6, the basement membrane that wherein additionally comprises the steps: wherein can to have or not have the wiring figure layer uses with the state that is wrapped on the spool, and launches to be directed into simultaneously subsequently step from described spool.
8. according to any described manufacturing process of claim 1 to 7, comprise the steps: that additionally wherein said enhancing sheet uses with the state that is wrapped on the spool, launches and be cut into preliminary dimension from described spool before being directed into described enhancing sheet adhesion step.
9. according to any described printed circuit board manufacturing process of claim 1 to 8, additionally comprised the steps: wherein before described printed circuit board (PCB) division step, described basement membrane and the lamination that strengthens sheet are wound on the spool.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005185119 | 2005-06-24 | ||
| JP185119/2005 | 2005-06-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101243734A true CN101243734A (en) | 2008-08-13 |
Family
ID=37595820
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2006800296714A Pending CN101243734A (en) | 2005-06-24 | 2006-06-22 | Printed wiring board manufacturing process |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP1894453A2 (en) |
| KR (1) | KR20080015472A (en) |
| CN (1) | CN101243734A (en) |
| TW (1) | TW200731894A (en) |
| WO (1) | WO2007002269A2 (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101790279B (en) * | 2010-02-02 | 2012-02-29 | 浙江龙威电子科技有限公司 | Composite reinforcing film and manufacturing method thereof |
| CN101772271B (en) * | 2010-02-02 | 2012-05-23 | 浙江龙威电子科技有限公司 | Method for single-sided lamination reinforcement of flexible printed circuit board |
| CN101637926B (en) * | 2009-07-28 | 2013-06-19 | 珠海元盛电子科技股份有限公司 | Steel knife die for making bonding course and method for making bonding course |
| CN104619132A (en) * | 2013-11-04 | 2015-05-13 | 深圳崇达多层线路板有限公司 | Method for processing flexible printed circuit board |
| CN105163484A (en) * | 2015-09-18 | 2015-12-16 | 刘炜 | Flexible circuit board with reinforced structure and processing process thereof |
| CN109786269A (en) * | 2017-11-14 | 2019-05-21 | 蔡宜兴 | Reduce the method and semi-finished product structure of package substrate warpage |
| CN110493972A (en) * | 2019-08-23 | 2019-11-22 | 江苏上达电子有限公司 | A kind of reinforcement for COF |
| CN111890786A (en) * | 2020-07-15 | 2020-11-06 | 刘忠卫 | Printing system |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2100730A1 (en) | 2008-03-14 | 2009-09-16 | Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO | Laminating device and laminating method |
| CN103079351B (en) * | 2012-12-28 | 2016-01-13 | 大连吉星电子有限公司 | The linear stick carbon fiber technique of flexible PCB PET film |
| KR101707844B1 (en) * | 2015-03-02 | 2017-02-17 | 김태헌 | Reinforcing method of flexible printed circuit board and reinforcing device of flexible printed circuit board |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003101167A (en) * | 2001-09-21 | 2003-04-04 | Canon Inc | Flexible printed board |
| JP3726961B2 (en) * | 2002-06-26 | 2005-12-14 | 三井金属鉱業株式会社 | COF film carrier tape and manufacturing method thereof |
| JP4139713B2 (en) * | 2003-03-12 | 2008-08-27 | シャープ株式会社 | Reinforcing plate pasting device and pasting method |
-
2006
- 2006-06-22 WO PCT/US2006/024275 patent/WO2007002269A2/en active Application Filing
- 2006-06-22 CN CNA2006800296714A patent/CN101243734A/en active Pending
- 2006-06-22 EP EP06785329A patent/EP1894453A2/en not_active Withdrawn
- 2006-06-22 KR KR1020077030651A patent/KR20080015472A/en not_active Application Discontinuation
- 2006-06-23 TW TW095122806A patent/TW200731894A/en unknown
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101637926B (en) * | 2009-07-28 | 2013-06-19 | 珠海元盛电子科技股份有限公司 | Steel knife die for making bonding course and method for making bonding course |
| CN101790279B (en) * | 2010-02-02 | 2012-02-29 | 浙江龙威电子科技有限公司 | Composite reinforcing film and manufacturing method thereof |
| CN101772271B (en) * | 2010-02-02 | 2012-05-23 | 浙江龙威电子科技有限公司 | Method for single-sided lamination reinforcement of flexible printed circuit board |
| CN104619132A (en) * | 2013-11-04 | 2015-05-13 | 深圳崇达多层线路板有限公司 | Method for processing flexible printed circuit board |
| CN104619132B (en) * | 2013-11-04 | 2017-11-07 | 深圳崇达多层线路板有限公司 | The processing method of flexible print wiring board |
| CN105163484A (en) * | 2015-09-18 | 2015-12-16 | 刘炜 | Flexible circuit board with reinforced structure and processing process thereof |
| CN109786269A (en) * | 2017-11-14 | 2019-05-21 | 蔡宜兴 | Reduce the method and semi-finished product structure of package substrate warpage |
| CN110493972A (en) * | 2019-08-23 | 2019-11-22 | 江苏上达电子有限公司 | A kind of reinforcement for COF |
| CN111890786A (en) * | 2020-07-15 | 2020-11-06 | 刘忠卫 | Printing system |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2007002269A2 (en) | 2007-01-04 |
| EP1894453A2 (en) | 2008-03-05 |
| WO2007002269A3 (en) | 2007-04-26 |
| KR20080015472A (en) | 2008-02-19 |
| TW200731894A (en) | 2007-08-16 |
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Open date: 20080813 |