CN110493972A - A kind of reinforcement for COF - Google Patents
A kind of reinforcement for COF Download PDFInfo
- Publication number
- CN110493972A CN110493972A CN201910782332.2A CN201910782332A CN110493972A CN 110493972 A CN110493972 A CN 110493972A CN 201910782332 A CN201910782332 A CN 201910782332A CN 110493972 A CN110493972 A CN 110493972A
- Authority
- CN
- China
- Prior art keywords
- cof
- reinforcement
- product
- thickness
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
- H05K1/0281—Reinforcement details thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a kind of reinforcements for COF, in RTR production process, adhesive is uniformly coated on the reinforcing film of winding shape and carries out stamp, furthermore equally by way of RTR the adhesive face paste for the reinforcing film for being attached to adhesive in the flexible base board face or metallic conductor face of COF substrate, and be laminated.Compared to the reinforcement processing method of traditional FPC, this method can be more efficient, more accurately attaches reinforcement.On the basis of original production technology, simple stiffener lamination process is increased, and can realize multiple or multilayer reinforcement to the thickness requirement of different zones according to product.This makes it possible to the architectural differences met to COF product different zones, and the mechanism differentiation requirement of single product is realized by this method, meets the highly integrated requirement of high-speed high frequency of final products.
Description
Technical field
The present invention relates to reinforcements, and in particular to a kind of reinforcement for COF.
Background technique
With high density, lightening technical requirements are increasingly improved, and the functions expanding inclusiveness of COF product is higher, it is desirable that
COF product realizes structuring mechanism on the basis of having electric function.To meet the architectural difference to COF product different zones,
The mechanism differentiation requirement that single product is realized by this method, meets the highly integrated requirement of high-speed high frequency of final products.
A kind of PI reinforcement of existing FPC product is as shown in the figure, the specific steps are as follows:
1, the other processes before being bonded by reinforcement obtain FPC product；
2, the specified region on above-mentioned FPC product, by the equipment of automatic reinforcing in the way of punching press or manually into
The fitting of row PI reinforcement；
3, the PI reinforcement on above-mentioned FPC product is pressed；
4, baking-curing is carried out to the PI reinforcement after above-mentioned pressing.
The steel disc reinforcement of existing another kind FPC product is as shown in the figure, the specific steps are as follows:
1, the other processes before being bonded by reinforcement obtain FPC product；
2, the specified region on above-mentioned FPC product, by the equipment of automatic reinforcing in the way of absorption or manually into
The fitting of row steel disc reinforcement；
3, the steel disc reinforcement on above-mentioned FPC product is pressed；
4, baking-curing is carried out to the steel disc reinforcement after above-mentioned pressing.
Nowadays, flexible circuit board (FPC) is widely used in electronic product, flexible circuit board be with polyimides or
Polyester film is a kind of flexible printed circuit with height reliability made of substrate, has Distribution density height, quality
Gently, the feature that thickness is thin and bending is good.But since the mechanical strength of FPC is small, be easily cracked, therefore need lamination reinforcement material with
Reinforce the intensity of FPC.
Existing FPC product has reinforcing in process of production, but is only limitted to single mode group and attaches either single product
It attaches, and mode precision is low, speed is slow for putting of manually attaching；Although and what machine attached is able to achieve batch production, punching
The mode efficiency for overlaying conjunction is relatively low, and the mode for adsorbing fitting can only cope with single product.
It is also not no reinforcing in actual production in addition, current COF product substrate is free from reinforcement,
Therefore under the overall background of fining route, traditional COF production technology is unable to satisfy the architectural difference of single product different zones.
Summary of the invention
The present invention provides a kind of reinforcement for COF, and this method realizes easily fabricated, yield height by RTR mode,
It can be used for the COF reinforcing structure produced in batches.
The present invention is realized by following technical scheme:
A kind of reinforcement for COF carries out the processing of reinforcement, specific side to COF product by roll-to-roll production method
Case is as follows: step 1: the coated with adhesive on winding reinforcing film, and carries out stamp, goes out required shape；
Step 2: the processing of figure route is carried out to COF product；
Step 3: the specified region of the COF product in the reinforcing film and step 2 in step 1 is subjected to roll-to-roll pressing；
Step 4: baking-curing is carried out to the product after pressing in step 3.
A kind of reinforcement for COF carries out the processing of reinforcement, tool to COF product by roll-to-roll production method
Body scheme is as follows: step 1: the coated with adhesive on winding reinforcing film, and carries out stamp, goes out required shape；
Step 2: the flexible base board face in adhesive face and COF in step 1 is combined, and is rolled simultaneously；
Step 3: baking-curing is carried out to the product reinforcing after step 2 pressing；
Step 4: the processing of figure route is carried out to the product in step 3.
The invention has the advantages that:
Compared to the reinforcement processing method of traditional FPC, this method can be more efficient, more accurately attaches reinforcement.In original life
On the basis of production. art, simple stiffener lamination process is increased, and can be according to product to the thickness requirement of different zones
To realize multiple or multilayer reinforcement.This makes it possible to the architectural differences met to COF product different zones, are realized by this method
The mechanism differentiation requirement of single product, meets the highly integrated requirement of high-speed high frequency of final products.
Therefore, the invention has the following advantages that
1) otherness of thickness on COF product structure, is realized；
2), it is able to satisfy the requirement that product tells high frequency highly integrated；
3) efficient reinforcing, is realized；
4), method is simple.
Detailed description of the invention
The drawings described herein are used to provide a further understanding of the present invention, constitutes part of this application, this hair
Bright illustrative embodiments and their description are used to explain the present invention, and are not constituted improper limitations of the present invention.Below with reference to attached
The present invention is described in detail for figure and embodiment.
Fig. 1 is an a kind of preferred embodiment of reinforcement for COF of the invention；
Fig. 2 is a kind of another preferred embodiment of reinforcement for COF of the invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, is clearly and completely retouched to the technical solution in embodiment
It states.Obviously, described embodiment is only a part of the embodiments of the present invention, instead of all the embodiments.Based on this hair
Bright embodiment, every other implementation obtained by those of ordinary skill in the art without making creative efforts
Example, shall fall within the protection scope of the present invention.
A kind of PI reinforcement of existing FPC product is as shown in the figure, the specific steps are as follows:
5, the other processes before being bonded by reinforcement obtain FPC product；
6, the specified region on above-mentioned FPC product, by the equipment of automatic reinforcing in the way of punching press or manually into
The fitting of row PI reinforcement；
7, the PI reinforcement on above-mentioned FPC product is pressed；
8, baking-curing is carried out to the PI reinforcement after above-mentioned pressing.
The steel disc reinforcement of existing another kind FPC product is as shown in the figure, the specific steps are as follows:
5, the other processes before being bonded by reinforcement obtain FPC product；
6, the specified region on above-mentioned FPC product, by the equipment of automatic reinforcing in the way of absorption or manually into
The fitting of row steel disc reinforcement；
7, the steel disc reinforcement on above-mentioned FPC product is pressed；
8, baking-curing is carried out to the steel disc reinforcement after above-mentioned pressing.
Nowadays, flexible circuit board (FPC) is widely used in electronic product, flexible circuit board be with polyimides or
Polyester film is a kind of flexible printed circuit with height reliability made of substrate, has Distribution density height, quality
Gently, the feature that thickness is thin and bending is good.But since the mechanical strength of FPC is small, be easily cracked, therefore need lamination reinforcement material with
Reinforce the intensity of FPC.
Existing FPC product has reinforcing in process of production, but is only limitted to single mode group and attaches either single product
It attaches, and mode precision is low, speed is slow for putting of manually attaching；Although and what machine attached is able to achieve batch production, punching
The mode efficiency for overlaying conjunction is relatively low, and the mode for adsorbing fitting can only cope with single product.
It is also not no reinforcing in actual production in addition, current COF product substrate is free from reinforcement,
Therefore under the overall background of fining route, traditional COF production technology is unable to satisfy the architectural difference of single product different zones.
Therefore, the present invention provides a kind of reinforcement for COF, this method realized by RTR mode it is easily fabricated, it is good
Rate is high, can be used for the COF reinforcing structure produced in batches.Concrete scheme is as follows:
As shown in Figure 1, a kind of reinforcement for COF carries out reinforcement to COF product by roll-to-roll production method
Processing, concrete scheme are as follows: step 1: the coated with adhesive on winding reinforcing film, and carry out stamp, go out required shape
Shape；
Step 2: the processing of figure route is carried out to COF product；
Step 3: the specified region of the COF product in the reinforcing film and step 2 in step 1 is subjected to roll-to-roll pressing；
Step 4: baking-curing is carried out to the product after pressing in step 3.
It should be noted that product structure includes its expansion structure, a kind of thickness of single side, single side multi-thickness, single side is more
Layer rank, a kind of two-sided thickness, two-sided multi-thickness, double-sided multi-layer rank.
Reinforcing film uses PET, any material in PI, LCP.
Adhesive uses epoxide resin type, polyimide type, any material in polyurethane-type.
As shown in Fig. 2, a kind of reinforcement for COF mends COF product by roll-to-roll production method
Strong processing, concrete scheme are as follows: step 1: the coated with adhesive on winding reinforcing film, and carry out stamp, required for going out
Shape；
Step 2: the flexible base board face in adhesive face and COF in step 1 is combined, and is rolled simultaneously；
Step 3: baking-curing is carried out to the product reinforcing after step 2 pressing；
Step 4: the processing of figure route is carried out to the product in step 3.
It should be noted that product structure includes its expansion structure, a kind of thickness of single side, single side multi-thickness, single side is more
Layer rank, a kind of two-sided thickness, two-sided multi-thickness, double-sided multi-layer rank.
Reinforcing film uses PET, any material in PI, LCP.
Adhesive uses epoxide resin type, polyimide type, any material in polyurethane-type.
To sum up, compared to the reinforcement processing method of traditional FPC, this method can be more efficient, more accurately attaches reinforcement.In
On the basis of original production technology, simple stiffener lamination process is increased, and can be according to product to different zones
Thickness requirement come realize repeatedly or multilayer reinforcement.This makes it possible to the architectural differences met to COF product different zones, by this
Method realizes the mechanism differentiation requirement of single product, meets the highly integrated requirement of high-speed high frequency of final products.
It should be noted that referred to as being explained to above-mentioned some letters:
COF(chip on film or chip on flex): flip chip；
RTR(roll to roll): roll-to-roll production；
FPC:Flexible Printed Circuit flexible circuit board；
PET:Polyethylene terephthalate poly terephthalic acid class plastics；
PI:Polyimide polyimides, a kind of high-molecular organic material of good combination property；
LCP:Liquid Crystal Polymer polymeric liquid crystal copolymer, a kind of engineering plastics of novel high-performance.
Finally it should be noted that: the above embodiments are merely illustrative of the technical scheme of the present invention and are not intended to be limiting thereof;To the greatest extent
The present invention is described in detail with reference to preferred embodiments for pipe, it should be understood by those ordinary skilled in the art that: still
It can modify to a specific embodiment of the invention or some technical features can be equivalently replaced;Without departing from this hair
The spirit of bright technical solution should all cover within the scope of the technical scheme claimed by the invention.
Claims (8)
1. a kind of reinforcement for COF, it is characterised in that: by roll-to-roll production method, mended to COF product
Strong processing, concrete scheme are as follows: step 1: the coated with adhesive on winding reinforcing film, and carry out stamp, required for going out
Shape；
Step 2: the processing of figure route is carried out to COF product；
Step 3: the specified region of the COF product in the reinforcing film and step 2 in step 1 is subjected to roll-to-roll pressing；
Step 4: baking-curing is carried out to the product after pressing in step 3.
2. a kind of reinforcement for COF according to claim 1, it is characterised in that: product structure includes its extension
Structure, a kind of thickness of single side, single side multi-thickness, single-side multi-layer rank, a kind of two-sided thickness, two-sided multi-thickness, double-sided multi-layer
Rank.
3. a kind of reinforcement for COF according to claim 1, it is characterised in that: reinforcing film uses PET, PI,
Any material in LCP.
4. a kind of reinforcement for COF according to claim 1, it is characterised in that: adhesive uses epoxy resin
Type, polyimide type, any material in polyurethane-type.
5. a kind of reinforcement for COF, it is characterised in that: by roll-to-roll production method, mended to COF product
Strong processing, concrete scheme are as follows: step 1: the coated with adhesive on winding reinforcing film, and carry out stamp, required for going out
Shape；
Step 2: the flexible base board face in adhesive face and COF in step 1 is combined, and is rolled simultaneously；
Step 3: baking-curing is carried out to the product reinforcing after step 2 pressing；
Step 4: the processing of figure route is carried out to the product in step 3.
6. a kind of reinforcement for COF according to claim 5, it is characterised in that: product structure includes its extension
Structure, a kind of thickness of single side, single side multi-thickness, single-side multi-layer rank, a kind of two-sided thickness, two-sided multi-thickness, double-sided multi-layer
Rank.
7. a kind of reinforcement for COF according to claim 5, it is characterised in that: reinforcing film uses PET, PI,
Any material in LCP.
8. a kind of reinforcement for COF according to claim 5, it is characterised in that: adhesive uses epoxy resin
Type, polyimide type, any material in polyurethane-type.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910782332.2A CN110493972A (en) | 2019-08-23 | 2019-08-23 | A kind of reinforcement for COF |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910782332.2A CN110493972A (en) | 2019-08-23 | 2019-08-23 | A kind of reinforcement for COF |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110493972A true CN110493972A (en) | 2019-11-22 |
Family
ID=68553096
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910782332.2A Pending CN110493972A (en) | 2019-08-23 | 2019-08-23 | A kind of reinforcement for COF |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110493972A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111278222A (en) * | 2020-02-22 | 2020-06-12 | 瑞声科技(沭阳)有限公司 | Reinforcement manufacturing and laminating method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1578584A (en) * | 2003-07-01 | 2005-02-09 | 夏普株式会社 | Method for bonding reinforcing plate |
| CN101243734A (en) * | 2005-06-24 | 2008-08-13 | 3M创新有限公司 | Printed wiring board manufacturing process |
| US20080217047A1 (en) * | 2007-03-07 | 2008-09-11 | Phoenix Precision Technology Corporation | Circuit board surface structure |
| CN105517355A (en) * | 2015-12-11 | 2016-04-20 | 苏州米达思精密电子有限公司 | Production device for hot attachment of flexible reinforcing sheet |
-
2019
- 2019-08-23 CN CN201910782332.2A patent/CN110493972A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1578584A (en) * | 2003-07-01 | 2005-02-09 | 夏普株式会社 | Method for bonding reinforcing plate |
| CN101243734A (en) * | 2005-06-24 | 2008-08-13 | 3M创新有限公司 | Printed wiring board manufacturing process |
| US20080217047A1 (en) * | 2007-03-07 | 2008-09-11 | Phoenix Precision Technology Corporation | Circuit board surface structure |
| CN105517355A (en) * | 2015-12-11 | 2016-04-20 | 苏州米达思精密电子有限公司 | Production device for hot attachment of flexible reinforcing sheet |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111278222A (en) * | 2020-02-22 | 2020-06-12 | 瑞声科技(沭阳)有限公司 | Reinforcement manufacturing and laminating method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4159578B2 (en) | Apparatus and method for producing copper-clad laminate with improved adhesive strength | |
| CN206840863U (en) | Combined type LCP high-frequency high-speed Double-sided copper clad laminates | |
| KR100302652B1 (en) | Method for manufacturing flexible printed circuit board and flexible printed circuit board manufactured by the same | |
| CN206932462U (en) | Combined type LCP high-frequency high-speed FRCC base materials | |
| CN103379751A (en) | Manufacturing method of combined printed-circuit board, printed-circuit board and manufacturing method thereof | |
| CN101296561B (en) | Flexible printing patchboard and sliding lid type mobile phone terminal using the same | |
| KR100991756B1 (en) | Manufacturing method of double-sided flexible printed circuit board | |
| CN110493972A (en) | A kind of reinforcement for COF | |
| KR101606492B1 (en) | The product method of fpcb | |
| CN110785021A (en) | Manufacturing method for COF ink reinforcement | |
| CN208128629U (en) | FPC based on high frequency FRCC Yu FCCL single sided board | |
| CN109401654B (en) | Packaging carrier tape base material, double-interface carrier tape and manufacturing method thereof | |
| CN108594549B (en) | Panel driving framework, chip-on-film flexible film and chip-on-film flexible film reinforcing method | |
| CN110996559A (en) | Blind hole plate lamination positioning method | |
| CN202435714U (en) | Glue-free single-sided copper foil coated substrate with bonding function | |
| CN101746098A (en) | Adhesive block film for flexible printed circuit board fast compression technology | |
| CN113223750A (en) | 5G base station cable hard copper bar and processing technology thereof | |
| KR20150043118A (en) | Method for forming metal patterns of printedcircuit board | |
| CN2902689Y (en) | Flexible composite board | |
| CN208128661U (en) | FPC multi-layer board based on high frequency FRCC Yu high frequency dual platen | |
| CN107535045A (en) | Flexure type rigid substrates and utilize its dimensional antenna manufacture method | |
| CN110149757A (en) | A kind of high frequency circuit board and preparation method thereof | |
| KR102454430B1 (en) | Method for fabricating metal interconnects using electroforming process and metal paste composition for use in the same | |
| CN105163522A (en) | Dielectric layer stitching production technology utilizing different materials between soft boards of combined soft and hard boards | |
| US9674955B2 (en) | Tape carrier package, method of manufacturing the same and chip package |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20191122 |