CN101142080A - 金属基板-碳基金属复合材料结构体以及该结构体的制造方法 - Google Patents
金属基板-碳基金属复合材料结构体以及该结构体的制造方法 Download PDFInfo
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- CN101142080A CN101142080A CNA2005800491981A CN200580049198A CN101142080A CN 101142080 A CN101142080 A CN 101142080A CN A2005800491981 A CNA2005800491981 A CN A2005800491981A CN 200580049198 A CN200580049198 A CN 200580049198A CN 101142080 A CN101142080 A CN 101142080A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/15—Ceramic or glass substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3732—Diamonds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12007—Component of composite having metal continuous phase interengaged with nonmetal continuous phase
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12014—All metal or with adjacent metals having metal particles
- Y10T428/12028—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
- Y10T428/12063—Nonparticulate metal component
- Y10T428/12069—Plural nonparticulate metal components
- Y10T428/12076—Next to each other
- Y10T428/12083—Nonmetal in particulate component
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Manufacture Of Alloys Or Alloy Compounds (AREA)
- Ceramic Products (AREA)
Abstract
Description
A | B | C | 接合层 | 温度℃ | 压力(MPa) | 翘曲(mm) | |
实施例1245比较例12345 | Cu0.02Cu0.02-Al2O30.6-Al2O30.6Al2O30.6Cu0.02- | C-Cu0.5C-Cu1.0C-Al1.0C-Al0.5C-Al0.5-C-Al0.5C-Cu0.5C-Al1.0 | Cu2.0Cu1.0Al3.0Al3.0Al3.0Al0.3Al3.0Cu2.0Al3.0 | Sn0.01+Cu0.02Sn0.01+Cu0.02Al0.3Al0.3Al0.3Al0.3Al0.3Sn0.01+Cu0.02Al0.3 | 800800600595595595620800600 | 202015150.039215500.040 | 0.030.120.030.150.2>0.3(不能计量)基板变形>0.15>0.2 |
Claims (13)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2005/005270 WO2006100769A1 (ja) | 2005-03-23 | 2005-03-23 | 金属基板−炭素基金属複合材料構造体および該構造体の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101142080A true CN101142080A (zh) | 2008-03-12 |
CN101142080B CN101142080B (zh) | 2012-01-11 |
Family
ID=37023466
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2005800491981A Active CN101142080B (zh) | 2005-03-23 | 2005-03-23 | 金属基板-碳基金属复合材料结构体以及该结构体的制造方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US9390999B2 (zh) |
EP (1) | EP1862298A4 (zh) |
KR (1) | KR101153107B1 (zh) |
CN (1) | CN101142080B (zh) |
HK (1) | HK1116449A1 (zh) |
WO (1) | WO2006100769A1 (zh) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101973144A (zh) * | 2010-09-15 | 2011-02-16 | 中国人民解放军国防科学技术大学 | 可激光焊接的层状铝硅-铝碳化硅复合材料及其制备方法 |
CN102470639A (zh) * | 2009-06-30 | 2012-05-23 | 住友电气工业株式会社 | 金属层压构件和制造所述金属层压构件的方法 |
CN102958273A (zh) * | 2012-10-23 | 2013-03-06 | 陈伟杰 | Pcb板 |
CN103354219A (zh) * | 2013-06-17 | 2013-10-16 | 苏州晶品光电科技有限公司 | 用于光学和电子器件的图案化功能结构基板 |
US8993121B2 (en) | 2010-02-19 | 2015-03-31 | Sumitomo Electric Industries, Ltd. | Metal laminated structure and method for producing the same |
CN105081333A (zh) * | 2014-05-20 | 2015-11-25 | 中国科学院宁波材料技术与工程研究所 | 石墨-金属导热复合材料及其制备方法 |
CN111557126A (zh) * | 2018-01-30 | 2020-08-18 | 三菱综合材料株式会社 | 金属基底基板 |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
RU2011130872A (ru) * | 2008-12-23 | 2013-01-27 | Зилтектра Гмбх | Способ получения тонких отдельных слоев твердотельных материалов со структурированными поверхностями |
DE102009034082A1 (de) * | 2009-07-21 | 2011-01-27 | Osram Gesellschaft mit beschränkter Haftung | Optoelektronische Baueinheit und Verfahren zur Herstellung einer solchen Baueinheit |
US9556501B2 (en) * | 2010-04-02 | 2017-01-31 | Sumitomo Electric Industries, Ltd. | Magnesium-based composite member, heat radiation member, and semiconductor device |
RU2466204C1 (ru) * | 2011-05-31 | 2012-11-10 | Государственное образовательное учреждение высшего профессионального образования Волгоградский государственный технический университет (ВолгГТУ) | Композиционный материал для электротехнических изделий |
JP5719740B2 (ja) * | 2011-09-30 | 2015-05-20 | 株式会社日立製作所 | 配線材料および、それを用いた半導体モジュール |
CN103373017A (zh) * | 2012-04-25 | 2013-10-30 | 華廣光電股份有限公司 | 软性陶瓷基板 |
KR101429429B1 (ko) * | 2013-02-28 | 2014-08-11 | 주식회사 티앤머티리얼스 | 가압함침형 다층방열기판 및 그 제조방법 |
KR101468920B1 (ko) * | 2013-08-01 | 2014-12-08 | 주식회사 티앤머티리얼스 | 세라믹판과 금속기지 복합재료 방열판이 접합된 가압합침 일체형 다층방열기판 및 그 제조방법 |
JP5897062B2 (ja) * | 2014-05-08 | 2016-03-30 | 三菱電機株式会社 | 圧縮機用電動機及び圧縮機及び冷凍サイクル装置及び圧縮機用電動機の製造方法 |
RU2571296C1 (ru) * | 2014-07-22 | 2015-12-20 | Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Волгоградский государственный технический университет" (ВолгГТУ) | Композиционный материал, содержащий углеграфитовый каркас, пропитанный матричным сплавом на основе меди |
RU2571248C1 (ru) * | 2014-07-22 | 2015-12-20 | Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Волгоградский государственный технический университет" (ВолгГТУ) | Матричный сплав на основе меди для получения композиционных материалов пропиткой углеграфитового каркаса |
US9909197B2 (en) * | 2014-12-22 | 2018-03-06 | Semes Co., Ltd. | Supporting unit and substrate treating apparatus including the same |
TWI654074B (zh) * | 2015-02-12 | 2019-03-21 | 台灣奈米碳素股份有限公司 | Method for producing composite material containing carbon material by using high energy thrust |
WO2016210335A1 (en) * | 2015-06-25 | 2016-12-29 | Kyocera America, Inc. | Optical module and optical module package incorporating a high-thermal-expansion ceramic substrate |
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JPH0829302B2 (ja) | 1987-08-31 | 1996-03-27 | 積水化学工業株式会社 | ポリフッ化ビニリデン樹脂組成物を用いた金属体の被履方法 |
JP3062278B2 (ja) | 1991-03-29 | 2000-07-10 | 株式会社神戸製鋼所 | 線膨張係数が小さい材料と銅との接合方法 |
JPH0693449A (ja) | 1992-09-14 | 1994-04-05 | Tokai Carbon Co Ltd | 金属基材へのカーボン被覆法 |
JPH06321649A (ja) | 1993-05-17 | 1994-11-22 | Hitachi Ltd | 金属化炭素部材及びその製造方法ならびに金属化炭素部材を用いた半導体装置 |
JPH09321190A (ja) | 1996-05-29 | 1997-12-12 | Tonen Corp | 放熱板 |
JPH10107190A (ja) | 1996-10-01 | 1998-04-24 | Tonen Corp | 半導体パッケージ |
TW450861B (en) | 1998-05-13 | 2001-08-21 | Toyo Kohan Co Ltd | Manufacturing method of a combination material of metal foil and ceramic, and metal foil laminated ceramic substrate |
WO2000027776A1 (en) | 1998-11-11 | 2000-05-18 | Advanced Materials International Company, Ltd. | Carbon-based metal composite material, method for preparation thereof and use thereof |
JP3351778B2 (ja) | 1999-06-11 | 2002-12-03 | 日本政策投資銀行 | 炭素基金属複合材料板状成形体および製造方法 |
JP4336016B2 (ja) | 2000-02-29 | 2009-09-30 | 京セラ株式会社 | 半導体素子収納用パッケージ |
JP4272329B2 (ja) | 2000-03-15 | 2009-06-03 | 京セラ株式会社 | 半導体素子収納用パッケージ |
JP2002043482A (ja) | 2000-05-17 | 2002-02-08 | Ngk Insulators Ltd | 電子回路用部材及びその製造方法並びに電子部品 |
JP3659336B2 (ja) | 2001-05-24 | 2005-06-15 | 京セラ株式会社 | 半導体素子収納用パッケージ |
JP3554304B2 (ja) | 2001-10-24 | 2004-08-18 | 京セラ株式会社 | 半導体素子収納用パッケージおよび半導体装置 |
CN1451505A (zh) * | 2002-04-16 | 2003-10-29 | 西北有色金属研究院 | 一种碳基复合材料与钛合金的钎焊方法 |
JP2004356625A (ja) | 2003-05-06 | 2004-12-16 | Fuji Electric Device Technology Co Ltd | 半導体装置及びその製造方法 |
KR100705868B1 (ko) | 2003-05-06 | 2007-04-10 | 후지 덴키 디바이스 테크놀로지 가부시키가이샤 | 반도체 장치 및 그 제조 방법 |
JP2005005400A (ja) | 2003-06-10 | 2005-01-06 | Honda Motor Co Ltd | 半導体装置 |
JP2005095944A (ja) | 2003-09-25 | 2005-04-14 | Sentan Zairyo:Kk | 金属基板−炭素基金属複合材料構造体および該構造体の製造方法。 |
-
2005
- 2005-03-21 US US11/909,349 patent/US9390999B2/en active Active
- 2005-03-23 KR KR1020077019829A patent/KR101153107B1/ko active IP Right Grant
- 2005-03-23 WO PCT/JP2005/005270 patent/WO2006100769A1/ja active Application Filing
- 2005-03-23 CN CN2005800491981A patent/CN101142080B/zh active Active
- 2005-03-23 EP EP05721320A patent/EP1862298A4/en not_active Withdrawn
-
2008
- 2008-06-17 HK HK08106633.2A patent/HK1116449A1/xx unknown
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102470639A (zh) * | 2009-06-30 | 2012-05-23 | 住友电气工业株式会社 | 金属层压构件和制造所述金属层压构件的方法 |
US9199433B2 (en) | 2009-06-30 | 2015-12-01 | Sumitomo Electric Industries, Ltd. | Metal laminated structure and method for producing the metal laminated structure |
US8993121B2 (en) | 2010-02-19 | 2015-03-31 | Sumitomo Electric Industries, Ltd. | Metal laminated structure and method for producing the same |
CN101973144A (zh) * | 2010-09-15 | 2011-02-16 | 中国人民解放军国防科学技术大学 | 可激光焊接的层状铝硅-铝碳化硅复合材料及其制备方法 |
CN101973144B (zh) * | 2010-09-15 | 2012-10-10 | 中国人民解放军国防科学技术大学 | 可激光焊接的层状铝硅-铝碳化硅复合材料及其制备方法 |
CN102958273A (zh) * | 2012-10-23 | 2013-03-06 | 陈伟杰 | Pcb板 |
CN102958273B (zh) * | 2012-10-23 | 2015-10-28 | 陈伟杰 | Pcb板 |
CN103354219A (zh) * | 2013-06-17 | 2013-10-16 | 苏州晶品光电科技有限公司 | 用于光学和电子器件的图案化功能结构基板 |
CN103354219B (zh) * | 2013-06-17 | 2016-01-13 | 苏州晶品光电科技有限公司 | 用于光学和电子器件的图案化功能结构基板 |
CN105081333A (zh) * | 2014-05-20 | 2015-11-25 | 中国科学院宁波材料技术与工程研究所 | 石墨-金属导热复合材料及其制备方法 |
CN111557126A (zh) * | 2018-01-30 | 2020-08-18 | 三菱综合材料株式会社 | 金属基底基板 |
CN111557126B (zh) * | 2018-01-30 | 2023-11-03 | 三菱综合材料株式会社 | 金属基底基板 |
Also Published As
Publication number | Publication date |
---|---|
HK1116449A1 (en) | 2008-12-24 |
US20120164468A1 (en) | 2012-06-28 |
EP1862298A1 (en) | 2007-12-05 |
KR20070114353A (ko) | 2007-12-03 |
US9390999B2 (en) | 2016-07-12 |
KR101153107B1 (ko) | 2012-06-04 |
CN101142080B (zh) | 2012-01-11 |
WO2006100769A1 (ja) | 2006-09-28 |
EP1862298A4 (en) | 2010-08-18 |
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