CN101044806B - Multilayer printed wiring board and method for producing same - Google Patents
Multilayer printed wiring board and method for producing same Download PDFInfo
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- CN101044806B CN101044806B CN2006800006675A CN200680000667A CN101044806B CN 101044806 B CN101044806 B CN 101044806B CN 2006800006675 A CN2006800006675 A CN 2006800006675A CN 200680000667 A CN200680000667 A CN 200680000667A CN 101044806 B CN101044806 B CN 101044806B
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Abstract
The invention provides a multilayer printing patchboard, of which parts can be mounted in high density on two surfaces, and a method of manufacturing the multilayer printing patchboard with simple process. The multilayer printing patchboard is characterized in that a stacking body is arranged, which has two patchboard basis materials consisting of an insulation foundation plate of a wiring layer formed of electric conducting materials on at least a surface. An access hole passing from an opening of the other surface to the wiring layer is disposed in the insulation foundation plate; A cementing agent layer has a penetration hole connected to the opening part of the access hole in the mode of enclosing the opening part of the access hole at both sides; an electric conducting part between the wiring layers is composed of a electroconductive resin combination B filled in the access hole and the penetration hole.
Description
Technical field
The present invention relates to multi-layer printed circuit board and manufacturing approach thereof that many printed wiring layers of lamination form.
Background technology
As everyone knows, multi-layer printed circuit board can the high-density installation parts, can (meaning be for conducting with connecting with beeline between parts.Be designated hereinafter simply as " connection ").
For example; Open in the 2004-95963 communique (patent documentation 1) the spy; Record has the manufacturing approach of multi-layer printed circuit board; It is formed with to the distributing board base material of said conductive layer to the outstanding projection in another surface on the insulating substrate (single face substrate) that is provided with the conductive layer (conductor wirings layer) into wiring graph on the single face many, so that the mode that projection contacts with the conductive layer of another distributing board base material and clamping binding agent and lamination between the distributing board base material.But in this method since with the single face substrate in order at a direction lamination, lamination together, be positioned at outermost single face substrate, the face of insulating substrate is in the outside, therefore, can not be at two surperficial upper mounting components.
For can be to two surface mounting assemblies, consider to have be positioned at place Copper Foil lamination, lamination on the surface of outermost insulating substrate after, this Copper Foil is carried out etching and processing to form the method for distribution.Perhaps; According to use the insulating substrate (double-sided substrate) that is provided with metallic wiring layer on two surfaces in central authorities; In the method for the foregoing single face substrate of this two outsides lamination, also can make to two surface mounting assemblies becomes possible (patent documentation 2: the spy opens the 2001-15920 communique).
But, need carry out etching and processing after the lamination in the former method together, in the latter's method, just need be used for the etching and processing that metal wiring forms owing to carry out the lamination of single face substrate at every turn, therefore on operation, see, very numerous and diverse.In addition, in the former method, owing to behind the lamination that produces change in size, carry out etching and processing, the position with distribution when etching and processing also is easy to generate the problem that departs from; In the latter's method, likewise,, has the problem that is easy to generate position deviation owing in the lamination of the single face substrate that each generation surface size changes, need carry out etching and processing.
Patent documentation 1: (Japan) spy opens the 2004-95963 communique
Patent documentation 2: (Japan) spy opens the 2001-15920 communique
Summary of the invention
The present invention be provided at its two the surface on to high-density the multi-layer printed circuit board of installing component be problem.The present invention also with provide can with on its two surface to high-density the multi-layer printed circuit board of installing component with low-cost and be problem with the manufacturing approach of the multi-layer printed circuit board of simple procedures manufacturing.
Inventor's of the present invention result of study; Found to solve the multi-layer wiring board of above-mentioned problem; It comprises laminate, and said laminate utilizes binding agent with two insulated substrates that on a surface, have the wiring layer that is formed by electric conducting material at least; So that said wiring layer is bonded in the mode in its two outside at least, and be connected between wiring layer through in the insulated substrate and the conductive part that constitutes by conductive resin composition that forms in the adhesive layer and both sides.
Inventor of the present invention has found can be with the method for lamination; With said multi-layer printed circuit board with the simple procedures manufacturing; Said method is: use by constituting, have the conductive part that in this insulated substrate, is formed by conductive resin composition at the insulated substrate that has the wiring layer that is formed by electric conducting material on the surface at least; And the distributing board base material of the projection that forms by conductive resin composition on this conductive part so that through this projection with ways of connecting between the conductive part of distributing board base material with distributing board base material lamination.The present invention is found to be the basis with these and accomplishes.
In first aspect of the present invention, a kind of multi-layer printed circuit board is provided, it is characterized in that comprise laminate, this laminate has:
Two distributing board base materials, it is made up of the insulated substrate that at least one surface, is provided with the wiring layer that is formed by electric conducting material, in this insulated substrate, has the access opening at another surperficial upper shed to a wiring layer;
Adhesive layer, it has: the through hole that openings at two ends portion is connected with this peristome with the mode of the peristome that comprises said access opening respectively;
And conductive part between wiring layer, it is made up of filled conductive resin combination B in said access opening and said through hole.
The present invention provides a kind of multi-layer printed circuit board, and said electric conducting material is a metal forming, it is characterized in that, comprises laminate, and this laminate has:
Two distributing board base materials, it is made up of the insulated substrate that at least one surface, is provided with the wiring layer that is formed by electric conducting material, in this insulated substrate, has the access opening at another surperficial upper shed to a wiring layer;
Adhesive layer, it has: the through hole that openings at two ends portion is connected with this peristome with the mode of the peristome that comprises said access opening respectively;
And conductive part between wiring layer, it is made up of filled conductive resin combination B in said access opening and said through hole.(second aspect).
The present invention provides a kind of multi-layer printed circuit board, and said electric conducting material is conductive resin composition A, it is characterized in that, comprises laminate, and this laminate has:
Two distributing board base materials, it is made up of the insulated substrate that at least one surface, is provided with the wiring layer that is formed by electric conducting material, in this insulated substrate, has the access opening at another surperficial upper shed to a wiring layer;
Adhesive layer, it has: the through hole that openings at two ends portion is connected with this peristome with the mode of the peristome that comprises said access opening respectively;
And conductive part between wiring layer, it is made up of filled conductive resin combination B in said access opening and said through hole.(third aspect).
Can use insulating resin film at this as insulated substrate, be the resin molding of main material with PET or polyimides for example.Wherein, The resin molding that with the polyimides is main material is a heat-resistant film; Can the corresponding high heat-resistingization requirement of adopting Pb-free solder; And compare with the resin that adds pottery, glass fabric, when high-frequency transmit loss little and can realize the thinning and the high strength of insulated substrate, thereby be preferably (the 6th aspect).
On the insulated substrate that constitutes the distributing board base material, at least one surface, be provided with the wiring layer that constitutes by electric conducting material.This wiring layer can be located at a surface of insulated substrate, also can be located at two surfaces.In addition, forming by conductive resin composition under the situation of this wiring layer, with this conductive resin composition as conductive resin composition A.
On the insulated substrate that constitutes the distributing board base material, be provided with at least one surface under the situation of the wiring layer that constitutes by metal forming, the metal forming wiring layer can form through the metal formings such as Copper Foil of pasting on the insulated substrate are for example carried out etching and processing.For example, on metal forming, behind the wiring layer figure of formation resist layer, impregnated in the corrosive agent of corroding metal paper tinsel, remove the part beyond the wiring layer figure, the chemical etching (wet etching) of removing resist layer thereafter.Corrosive agent in this case can be enumerated the iron chloride series corrosive agent that iron chloride is main component, or copper chloride series corrosive agent, alkaline corrosion agent etc.In addition, as metal forming on a surface or the insulated substrates pasted of two surfaces, illustration have a polyimide base material (CCL) of Copper Foil.
As the material that forms said metal forming wiring layer, with copper be main material material from its conductivity, durability and easily viewpoint such as acquisitions see, be preferably (the 5th aspect).
Copper is that the material of main material for example has: copper or be the alloy of main component with copper.As the material of conductive layer wiring layer,, can also use silver, aluminium, nickel etc. except copper.
Forming by conductive resin composition under the situation of wiring layer, using conductive resin composition A as conductive resin composition.As conductive resin composition A; But illustration is with conducting particles; For example metal microparticle, metallic stuffing, carbon element particulate etc. are mixed in the resin of easy plastic deformation, specifically, the paste of silver paste, silver coating copper gasket, copper gasket or carbon mix etc. are for example arranged.
Forming by conductive resin composition under the situation of wiring layer, can this conductive resin composition A formed through coating on insulated substrate with methods such as silk screen printings.
In said insulated substrate, be formed on the access opening (hole that the end is arranged) of another surface opening to one wiring layer.At this, " to a wiring layer " is meant the meaning of a wiring layer as the end of access opening.Be provided with under the situation of wiring layer on two surfaces of insulated substrate, access opening is the end, the wiring layer that connects insulated substrate and opposite side with the wiring layer of a side, on the wiring layer of opposite side, forms peristome.
Access opening can have in the hope of this insulated substrate on the position of interlayer connection, forms through using laser, brill, mould etc. to carry out opening processing.Forming by conductive resin composition under the situation of wiring layer, can many overlapping processing etc., do not need the stain of the Copper Foil part of access opening part to remove operation.
Multi-layer printed circuit board of the present invention is characterized in that, comprises at least on its part (middle body of thickness direction), contains the laminate of said two distributing board base materials through the binding agent bonding.Adhesive layer has through hole.Two distributing board base materials and binding agent, on two outsides (surface) of resulting laminate, having the mode of wiring layer, and make the through hole openings at two ends portion of binding agent comprise respectively two distributing board base materials the access opening peristome mode and dispose.At this, " peristome of through hole comprise the peristome of access opening and dispose " refers to the most of of the peristome of access opening or whole modes in the peristome of through hole, both contacted meanings.
The spring rate of adhesive layer is under the situation below the 1GPa, and the stress during owing to the backflow when the multi-layer printed circuit board upper mounting component reduces, and anti-backflow property and reliability are high, are preferred therefore.On the other hand, spring rate is when discontented 0.001GPa, owing to have deflection (elongation) the excessive and unworkable situation that becomes sometimes, so preferably more than 0.001GPa (aspect the of the present invention the 7th).
But under the situation of the complex that constitutes more than by two parts; When containing spring rate and be the parts of 0.001～1GPa, even whole spring rate surpasses 1GPa, in this part; Because the stress when refluxing reduces; Can improve anti-backflow property and reliability, therefore, be similarly preferably (eight aspect) with the situation of the third aspect.
Binding agent as by the complex that constitutes more than two parts for example has: binding agent is contained be dipped in the sheet that forms in the porous material of high rigidity, the sheet that the high rigid insulation rete of clamping forms between two-layer adhesive layer etc.
Binding agent as forming bonding agent tablet for example has: thermoplastic polyimide resin, be the thermosetting resins such as resin, epoxy resin or acid imide resin that the part of main material has the hot curing function with the TPI.Wherein, be that the part of main material has the resinoid situation of resin, thermosetting epoxy resin and thermosetting imide of hot curing function with the TPI, owing to after being heating and curing, can guarantee enough cohesive forces, be preferred therefore.In addition, the formation method of through hole is not particularly limited, and can adopt the perforate of using laser to process, use is bored etc. carried out the method for mechanical type perforate etc.
As previously mentioned, owing to comprise the peristome of the access opening of two distributing board base materials respectively,, on the wiring layer that is positioned at laminate two outsides, be formed up to the hole at its two ends in the openings at two ends portion of the through hole of binding agent through this through hole and two access openings.On the multi-layer printed circuit board of the present invention, in this hole, be filled with conductive resin composition, be connected between wiring layer laminate two outsides.(with this conductive resin composition as conductive resin composition B.Below, the hole of filled conductive resin combination B simply is called " conductive part ").
As conductive resin composition B; A is identical with conductive resin composition; Be with conducting particles; For example: metal particle, metallic stuffing, carbon element particulate etc. are mixed in the resin of easy plastic deformation, and specifically, for example: silver paste, silver coat the paste of copper gasket, copper gasket or carbon mix etc.Resin as easy plastic deformation for example has: epoxy resin, mylar, polyimide resin, polyamide, liquid crystal polymer etc.
Conductive resin composition A can be the conductive resin composition of different cooperations compositions with conductive resin composition B, but from simplified working procedures, reaches the current value on both interfaces, aspects such as the variation consideration of resistance value, preferably uses identical composition.
Multi-layer printed circuit board of the present invention comprises said laminate, promptly on two surfaces, has the laminate of the wiring layer that is formed by electric conducting material, but usually, and in the more lateral of the wiring layer on its two surfaces, other distributing board base material is lamination through the binding agent bonding.As other distributing board base material, have the insulating properties substrate and be located at the conductor layer on the surface thereof at least, through reaching the conductive part that is provided with in the binding agent in this insulated substrate, the wiring layer in the outside of laminate is connected with the conductor layer of other distributing board base material.Conductive part can through in the access opening that in insulated substrate for example, is provided with, and in binding agent, be provided with, in its peristome and the through hole that the peristome of access opening links to each other, filled conductive resin combination and obtaining.
The wiring layer of the conductor layer of other distributing board base material for constituting by metal forming or conductive resin composition.As previously mentioned, multilayer wired layer is connected through conductive part, form multi-layer printed circuit board.In addition, in the more lateral of other distributing board base material of this lamination, also can with identical distributing board base material lamination one or more layers, form the multi-layer printed circuit board that constitutes by more wiring layer.
But the wiring layer that is made up of conductive resin composition because poorer than the metal forming wiring layer aspect high-temperature heat-resistance property, therefore, in the backflow when outermost wiring layer upper mounting component, is compared with the situation of metal forming wiring layer, and problems such as conduction is bad take place easily.Therefore, outermost wiring layer preferable alloy paper tinsel wiring layer.Fourth aspect of the present invention is equivalent to this preferable case.In addition, the manufacturing approach of metal forming wiring layer is identical with situation noted earlier with material.
The present invention further provides the manufacturing approach of said multi-layer printed circuit board.
Be in the 9th aspect of the present invention; A kind of manufacturing approach of multi-layer printed circuit board is provided; It is characterized in that, with the multilayer wired plate substrate that includes distributing board base material a and these two distributing board base materials of distributing board base material b at least, so that the contacted mode of projection of the electroconductive resin portion of distributing board base material a and distributing board base material b and clamping binding agent and lamination between the distributing board base material; They are carried out lamination together; Wherein, said distributing board base material a is made up of the insulated substrate that at least one surface, is provided with the wiring layer that is formed by electric conducting material; In this insulated substrate, has filled conductive resin combination B in the access opening of another surperficial upper shed to a wiring layer and the electroconductive resin portion that constitutes; Said distributing board base material b; Insulated substrate by at least one surface, being provided with the wiring layer that is formed by electric conducting material constitutes; In this insulated substrate, have filled conductive resin combination B in the access opening of another surperficial upper shed to a wiring layer and the electroconductive resin portion that constitutes, and; In said electroconductive resin portion, also has the projection that forms by conductive resin composition B.
Insulated substrate, wiring layer and the access opening of distributing board base material a and distributing board base material b is identical with insulated substrate, wiring layer and the access opening described in the above stated specification of multi-layer printed circuit board of the present invention.
Distributing board base material a is characterised in that to have the electroconductive resin portion that forms at its access opening filled conductive resin combination.Because this electroconductive resin portion forms conductive part between said wiring layer, therefore, the conductive resin composition that forms this electroconductive resin portion is described conductive resin composition B.The fill method of conductive resin composition B is not done special qualification, and the method through fillings such as silk screen printings is for example arranged.
Distributing board base material b is the structure that in the electroconductive resin portion of distributing board base material a, further forms the conducting objects projection.The conducting objects projection is the protrusion of conducting objects.Because the projection of this conducting objects also forms conductive part between said wiring layer, the conductive resin composition that therefore forms it also is said conductive resin composition B.
The formation method of conducting objects projection does not limit especially; Its method for example can be: on insulated substrate, form the somatotype layer by formations such as PETGs (PET); Form the access opening that connects this insulated substrate and somatotype layer; In this access opening, behind the filled conductive resin combination B, peel off the somatotype layer, and form protuberance.As other method that forms the conducting objects projection, for example: in access opening, behind the filled conductive resin combination B, further above that conductive resin composition B is coated with through silk screen printing.
In the manufacturing approach of the multi-layer printed circuit board aspect the said the 9th, this two-layer multilayer wired plate substrate tegillum that comprises distributing board base material a and distributing board base material b at least is long-pending.Lamination so that the contacted mode of projection of the electroconductive resin portion of distributing board base material a and distributing board base material b carry out.
Lamination clamping binding agent and carrying out between distributing board base material a and distributing board base material b.Under the situation of the further lamination of distributing board base material with other, also clamping binding agent between this other distributing board base material carries out lamination together with them.Through this lamination; Bowing, between the distributing board base material, form conductive part; Because this conductive part covers the surface element of the electroconductive resin portion of distributing board base material a; Therefore, between the wiring layer of the wiring layer of distributing board base material a and distributing board base material b, the conductive part that electroconductive resin portion and the bowing through the distributing board base material forms connects.
Aspect the of the present invention the tenth; A kind of manufacturing approach of multi-layer printed circuit board is provided, has it is characterized in that, with the multilayer wired plate substrate that includes two distributing board base material b at least so that the mode that the projection of two distributing board base material b is in contact with one another and clamping binding agent and lamination between the distributing board base material; Carry out lamination; Said distributing board base material b is made up of the insulated substrate that at least one surface, is provided with the wiring layer that is formed by electric conducting material, in this insulated substrate; The electroconductive resin portion that has filled conductive resin combination B in the access opening of another surperficial upper shed to a wiring layer and constitute; And, in said electroconductive resin portion, also have the projection that forms by conductive resin composition B.
The situation of tenth aspect present invention is characterized by, and will have two distributing board base material b of projection, so that the mode that their projection is in contact with one another is carried out lamination, other point is identical with the situation of the 9th aspect.Through lamination, both projections all are out of shape and are integrated, between the distributing board base material, form conductive part.Each projection is owing to be connected with the electroconductive resin portion of distributing board base material respectively, and therefore integrated through this, quilt is connected between the wiring layer of two distributing board base material b.
In addition, under any situation, lamination can carry out through heating, pressurizeing through solidifying pressurization (キ ュ ア プ レ ス) etc.
The manufacturing approach of multi-layer printed circuit board of the present invention is characterized in that, usually, outside said distributing board base material a and/or distributing board base material b, also adds the distributing board base material and lamination.This distributing board base material is made up of the insulated substrate that on a surface, is provided with conductor layer; In this insulated substrate; The electroconductive resin portion that has filled conductive resin combination B in the access opening of another surperficial upper shed to a conductor layer and constitute; And in said electroconductive resin portion, the projection that is formed by conductive resin composition B is so that the contacted mode of wiring layer of this projection and other distributing board base material (bag expands distributing board base material a or distributing board base material b) and lamination (the tenth on the one hand).Through this method, can access the multi-layer printed circuit board more than three layers.For example be meant at this conductor layer: the wiring layer that constitutes by metal forming wiring layer or conductive resin composition.
In the manufacturing approach of multi-layer printed circuit board of the present invention, use metal forming or resin combination A as said electric conducting material.See that from viewpoints such as the conductivity of metal forming, durability for preferably, conductive resin composition A can be with methods such as silk screen printings, form etc. processing (the 12 aspect) easily through coating on insulated substrate.
And then in aspect the of the present invention the 13; A kind of manufacturing approach of multi-layer printed circuit board is provided; Manufacturing approach for said multi-layer printed circuit board more than three layers is characterized in that, will on a surface, be provided with the distributing board base material of the insulated substrate formation of metal forming wiring layer; Become outermost mode and dispose with said metal forming, and lamination.Through outermost layer is the metal forming wiring layer, and can access can the multi-layer printed circuit board more than three layers abundant anti-backflow, that have high anti-backflow property and reliability when installing component.
In the manufacturing approach of multi-layer printed circuit board of the present invention, distributing board base material a and/or distributing board base material b and said other distributing board base material, clamping binding agent in the middle of their and overlapping carries out lamination together with them.That is,, can produce multi-layer printed circuit board of the present invention, obtain high productivity owing to pass through lamination together.
As the method for clamping binding agent, can enumerate the method for using bonding agent tablet sheet, this sheet sheet of clamping.For example: use the bonding agent tablet sheet that on position, has through hole, so that projection is inserted the mode in the through hole, with distributing board base material b and the overlapping method of bonding agent tablet sheet corresponding to projection.The corresponding situation of using this bonding agent tablet sheet of the tenth cubic face.
The diameter of through hole is preferably about 0.5～5 times of diameter (maximum gauge) of said projection.Be more than 0.5 times the time, through hole aligns with the position of projection easily.In this case, before lamination, though gapped between bonding agent tablet sheet and the projection; But the diameter of through hole is when to be about 5 times of diameter of projection following, through lamination, and the expansion of bonding agent tablet sheet; And projection is plastic deformation also, and the conducting objects of projection contacts with binding agent, eliminates this gap easily.
In addition, when bonding agent tablet and distributing board base material are overlapping, in order to prevent to reach in the lamination departing from the lamination that the preferred bonding temporarily that bonds easily promptly bonds and compares than the bonding of prior art, under quite gentle condition, carries out temporarily.
As the melt viscosity of said bonding agent tablet, said bonding agent tablet preferably in the time of 100～250 ℃ minimum melt viscosity be 500～50000PaS.If melt viscosity is higher than the upper limit of this scope, when lamination, have the situation that the gap between projection and bonding agent tablet is difficult to eliminate.On the other hand, in limited time flow into binding agent at the interface easily between projection or between electroconductive resin portion and projection down, be easy to generate the situation of loose contact when what be lower than this scope.The 15 aspect is to should preferable case.
But be under the situation of the complex that constitutes more than two parts at bonding agent tablet; When containing 100～250 ℃, having the parts of the melt viscosity of minimum melt viscosity in 500～50000PaS scope; Can eliminate the gap between projection and bonding agent tablet thus; Therefore identical with the 14 aspect, be preferred.The 16 aspect is corresponding to this preferable case.
Bonding agent tablet as by the complex that constitutes more than two parts for example has: make binder-impregnated in porous material and the bonding agent tablet that constitutes, the bonding agent tablet that the clamping insulating film layer forms between two-layer adhesive layer.
Multi-layer printed circuit board of the present invention, because in that the position deviation between installing component and distributing board is few to high-density on its two surface, so reliability is high, can be applicable in the manufacturing of various electronic equipments.And,, can make this good multi-layer printed circuit board with simple operation according to the manufacturing approach of multi-layer printed circuit board of the present invention.
Description of drawings
Fig. 1 is the schematic section of an example of expression multi-layer printed circuit board of the present invention;
Fig. 2 is the schematic section of an operation of expression multi-layer printed circuit board manufacturing of the present invention;
Fig. 3 is the schematic section of an example of expression multi-layer printed circuit board of the present invention;
Fig. 4 is the schematic section of an example of expression multi-layer printed circuit board of the present invention.
Reference numeral
11、12、13、14、15、16、111、112、113、121、122、123、124
The wiring layer that forms by electric conducting material
21,22,23,24,25,26,211,221,212,222 polyimide films
215,225 access openings
31 ' distributing board base material b
32 ' distributing board base material a
31,32,33,33 ', 34,34 ', 35,35 ', 36,36 ', 311 single face base materials
312,321,322 two-sided base materials
41,42,43,44,45,46,47 adhesive layers
412,422,432,442,452 through holes
51,52,53 laminates
61,62,63,64,65 conductive parts
811,821,831,841,851,861 electroconductive resin portions
812,832,842,852,862 projections
411,421,431,441,451 bonding agent tablets
Embodiment
Below, preferred forms of the present invention is described according to accompanying drawing.Scope of the present invention be not limited to this execution mode and after the embodiment that states, so long as do not break away from purport of the present invention, can be to other execution mode change.
The said laminate that multi-layer printed circuit board of the present invention comprises is made up of two distributing board base materials, and these two distributing board base materials are provided with the wiring layer that is formed by electric conducting material respectively on its at least one surface.That is,, can consider: two combinations that on a surface, are provided with the single face base material of the wiring layer that forms by electric conducting material as the combination of two distributing board base materials; At the single face base material that is provided with the wiring layer that forms by electric conducting material on the surface with on two surfaces, be provided with the combination of the two-sided base material of the wiring layer that forms by electric conducting material; Two combinations that on two surfaces, are provided with the two-sided base material of the wiring layer that forms by electric conducting material.
Fig. 1 is under the situation of two single face substrate combination for the said laminate of expression, the schematic section of multi-layer printed circuit board of the present invention.In Fig. 1; In the laminate 51; The wiring layer 11 that forms by polyimide film 21 and electric conducting material (below abbreviate wiring layer 11 as) and the single face base material 31 that constitutes and the wiring layer 12 that forms by polyimide film 22 and electric conducting material (below abbreviate wiring layer 12 as) and the single face base material 32 of formation; Via spring rate is the adhesive layer 41 of 0.001～1GPa, in polyimide film 21 and 22 bondings of polyimide film.
In the laminate 51, from wiring layer 11 to wiring layer 12, form the hole that connects polyimide film 21, polyimide film 22 and adhesive layer 41, filled conductive resin combination B in this hole forms conductive part 61.As a result, wiring layer 11 is connected with wiring layer 12.The hole that forms conductive part 61 for the access opening 215 that on polyimide film 21 and polyimide film 22, forms respectively and 225 with adhesive layer 41 in the through hole 412 of formation be connected; As shown in Figure 1; Through hole 412 openings at two ends portions are bigger than the peristome of access opening 215 and 225, and respectively it comprised.
Two outsides of laminate 51; To on polyimide film 23, form respectively the wiring layer 13 that forms by electric conducting material (below abbreviate wiring layer 13 as) single face base material 33, and on polyimide film 24, form the single face base material 34 of the wiring layer 14 that forms by electric conducting material (below abbreviate wiring layer 14 as), carry out lamination.Lamination is bonding and carry out with polyimide film 23,24 through adhesive layer 42,43 respectively.
Filled conductive resin combination B in the hole that through hole in access opening in polyimide film 23 and the adhesive layer 42 is connected forms conductive part 62.Likewise, filled conductive resin combination B in the hole that the through hole in access opening in polyimide film 24 and the adhesive layer 43 is connected forms conductive part 63.Through conductive part 62,63, wiring layer 13 and wiring layer 14 respectively with laminate 51 on wiring layer 11 and wiring layer 12 be connected.
Likewise; On wiring layer 13 and wiring layer 14, the single face base material 35 that the wiring layer 15 that is formed by electric conducting material through adhesive layer 44,45 laminations respectively (below abbreviate wiring layer 15 as) forms on polyimide film 25, and the single face base material 36 that on polyimide film 26, forms of the wiring layer 16 that forms by electric conducting material (below abbreviate wiring layer 16 as).And then; The conductive part 64,65 that forms through the through hole filled conductive resin combination B in access opening in polyimide film 25,26 and the adhesive layer 45,46; Wiring layer 15 and wiring layer 16 are connected with wiring layer 13, wiring layer 14 respectively, form multi-layer printed circuit board.
Fig. 2 is the schematic section of a manufacturing process of the said multi-layer printed circuit board of the present invention of expression.In Fig. 2,31 ' and 32 ' be respectively distributing board base material b and distributing board base material a.Distributing board base material b31 ' is made up of polyimide film 21 and the wiring layer 11 that on surface thereof, forms.In the polyimide film 21; Formation is the access opening of the end at another surface opening with wiring layer 11, through with conductive resin composition B silk screen printing, and filled conductive resin combination B in access opening and form electroconductive resin portion 811; And then; In electroconductive resin portion 811,, form projection 812 through conductive resin composition B is carried out silk screen printing.
Distributing board base material a32 ' is made up of polyimide film 22 and the wiring layer 12 that on surface thereof, forms.In the polyimide film 22, forming with wiring layer 12 is the access opening of the end at another surface opening, through with conductive resin composition B silk screen printing, and filled conductive resin combination B in access opening and form electroconductive resin portion 821.
Between distributing board base material a32 ' and distributing board base material b31 '; Configuration is the bonding agent tablet 411 that the binding agent of 0.001～1GPa constitutes by the spring rate after solidifying; So that the relative mode of electroconductive resin portion 821 and projection 812, and dispose distributing board base material a32 ', distributing board base material b31 ' and bonding agent tablet 411 with the mode that projection 812 is inserted into the through hole 412 that on bonding agent tablet 411, forms.
The outside at distributing board base material b31 '; Configuration is the bonding agent tablet 421 that the binding agent of 0.001～1GPa constitutes by the spring rate after solidifying; And then in the outside; Configuration single face base material 33 ', it constitutes by polyimide film 23 with at the wiring layer that forms on the surface thereof 13, the access opening place in polyimide film 23, have electroconductive resin portion 831 and projection 832 that conductive resin composition B is formed through silk screen printing.Distributing board base material b31 ', bonding agent tablet 421 and single face base material 33 ' so that the relative mode of wiring layer 11 and projection 832, and be inserted in the mode at through hole 422 places that form on the bonding agent tablet 421 and dispose with projection 812.
Likewise; Single face base material 33 ' the more lateral; Configuration is the bonding agent tablet 441 that the binding agent of 0.001～1GPa constitutes by the spring rate after solidifying; And then in the outside, configuration single face base material 35 ', it constitutes by polyimide film 25 with at the wiring layer that forms on the surface thereof 15, the access opening place in polyimide film 25, have conductive resin composition B through electroconductive resin portion 851 and projection 852 that silk screen printing forms; Its configuration mode is for making wiring layer 13 relative with projection 852, and makes projection 852 be inserted in through hole 442 places that form on the bonding agent tablet 441.
The outside of distributing board base material a32 ' disposes: bonding agent tablet 431 too in this order; Constitute by polyimide film 24 with at the wiring layer that forms on the surface thereof 14, the access opening place in polyimide film 24, have with conductive resin composition B through the single face base material 34 of electroconductive resin portion 841 that silk screen printing forms and projection 842 '; Bonding agent tablet 451; Constitute by polyimide film 26 with at the wiring layer that forms on the surface thereof 16, the access opening place in polyimide film 26, have with conductive resin composition B through the single face base material 36 of electroconductive resin portion 861 that silk screen printing forms and projection 862 '; Be inserted on bonding agent tablet 431, the bonding agent tablet 451 mode of the through hole 432,452 that forms respectively respectively with projection 842,862, and dispose with wiring layer 12,14 relative modes respectively with projection 842,862.
As stated, behind configuration bonding agent tablet, single face base material, the distributing board base material, they are pressurizeed through solidifying pressurization together.Through pressurization, each projection plastic deformation, the also plastic deformation of each bonding agent tablet, eliminate in the gap between each bonding agent tablet and each projection, forms multi-layer printed circuit board of the present invention shown in Figure 1.And then, utilize each electroconductive resin portion and projection, form conductive part or conductive part between wiring layer.
Said manufacturing approach can use two distributing board base material b to replace distributing board base material b31 ' and distributing board base material a32 ', also can make equally.In this case,, two distributing board base material b clamping bonding agent tablets are disposed with each projection mode respect to one another, aspect in addition, identical with aforementioned manufacturing approach, form multi-layer printed circuit board of the present invention as shown in Figure 1.
Fig. 3 is a schematic section under the situation of single face base material and two-sided substrate combination, that represent multi-layer printed circuit board of the present invention for said laminate.In Fig. 3; Laminate 52 is the two-sided base material 321 that single face base material 311 that will be made up of the wiring layer 111 (hereinafter to be referred as wiring layer 111) that is formed by electric conducting material that polyimide film 211 and surface thereof upward form and the wiring layers 121 (hereinafter to be referred as wiring layer 121) and 122 that formed by electric conducting material that upward formed by polyimide film 221 and two surfaces thereof constitute; Through spring rate is the adhesive layer 46 of 0.001～1GPa, with bonding between polyimide film 211 and the wiring layer 122 (hereinafter to be referred as wiring layer 122) that formed by conductive resin composition A and form.Outside last aspect, with the example identical (just the single face base material quantity of lamination is few) of Fig. 1, can be with the same procedure manufacturing.
Fig. 4 is a schematic section under the situation of two two-sided substrate combination, expression multi-layer printed circuit board of the present invention for said laminate.In Fig. 4; Laminate 53 is with polyimide film 212 and at the wiring layer that is formed by electric conducting material 112 and 113 that forms on its two surface (hereinafter to be referred as wiring layer 112 and 113) and the two-sided base material 312 that constitutes and by polyimide film 222 and the wiring layer 123 and 124 (hereinafter to be referred as wiring layer 123 and 124) that is formed by electric conducting material that on its two surface, forms and the two-sided base material 322 of formation; Through spring rate is the adhesive layer 47 more than the 0.001GPa, below the 1GPa, and 113,124 of wiring layers is bonding and form.Outside last aspect, identical with the example of Fig. 1, can be with the same procedure manufacturing.
In addition; It is characterized by the multi-layer printed circuit board (invention of fourth aspect) that outermost layer has the metal forming wiring layer; To replace to the metal forming wiring layer like the outermost wiring layer (for example 15,16 among Fig. 1, Fig. 2) of the laminate of Fig. 1～shown in Figure 4, other part can be used with aforementioned identical method and form.
Embodiment 1
(manufacturing of single face distributing board base material)
On the one side of polyimide film (PI), do not use binding agent and with Copper Foil on the bonding single face copper-surfaced substrate (PI:25 μ m, the thick 18 μ m of copper); Use YGA laser; To be access opening (opening diameter the is 100 μ m) perforate at the end with said Copper Foil, implement to utilize the wet type decontamination of alkali and potassium permanganate.Form and amount to eight access openings.
In the epoxy resin that constitutes by bisphenol A type epoxy resin 70 weight portions (epoxide equivalent 7000～8500) and bisphenol f type epoxy resin 30 weight portions (epoxide equivalent 160～170); Process with the acetate of butyl carbitol is the solution of solvent; Add the potential curing agent of imidazoles therein; And then, so that silver particles accounts for 55% mode of the volume of all solid constituents it is disperseed, make silver paste.
The silver paste of processing like this is filled in each access opening through silk screen printing, implements accurate curing.And then the use composition identical with said silver paste, but change quantity of solvent and the silver paste that improves viscosity with silk screen printing, form that to amount to eight diameters be that 200 μ m, height are the projection (protuberance) of 60 μ m, implement accurate curing.Like this, make the distributing board base material with projection, the single face distributing board base material that is equivalent to 31 among Fig. 2 ', 33 ', 34 ', 35 ', 36 '.
In addition, identical with said method except the silk screen printing that utilizes the silver paste that improves viscosity, make the single face distributing board base material that is equivalent to 32 of Fig. 2 '.
(interlaminar bonding is with the manufacturing of insulating trip)
On the assigned position of the bonding agent tablet that constitutes by the epoxy resin of thick 25 μ m (TLF-Y30: Ba Chuan paper mill system, the minimum melt viscosity in the time of 100～250 ℃ is 4700PaS), use drill bit, form the through hole of diameter 300 μ m.
(lamination)
As shown in Figure 2; Make said single face distributing board base material (among Fig. 2 to use the mode of insertion projection in the insulation through hole at interlaminar bonding; Be equivalent to 31 ', 32 ', 33 ', 34 ', 35 ', 36 ') and interlaminar bonding with insulating trip overlapping after, implement to utilize the joining process of vacuum pressed, afterwards; The interlayer coupling part forms wiring layer with the mode that becomes daisy chain (デ イ ジ-チ エ-Application), makes multi-layer printed circuit board.
Embodiment 2
Replace the single face distributing board base material that does not form projection (the distributing board base material that is equivalent to 32 of Fig. 2 ') that uses among the embodiment 1, and use with embodiment 1 in the identical distributing board base material of single face distributing board base material (the distributing board base material that is equivalent to 31 of Fig. 2 ') of formation projection of use.In addition; Only for interlaminar bonding with 411 the insulating trip that is equivalent to Fig. 2 in the insulating trip, use epoxy resin (TLF-Y30: on the assigned position of the bonding agent tablet that Ba Chuan paper mill system) constitutes, use drill bit to be formed with the structure that diameter is the through hole of 300 μ m by thick 35 μ m.On other aspect, make multi-layer printed circuit board with embodiment 1 identically.
Embodiment 3
For the manufacturing of interlaminar bonding, except the epoxy resin that uses thick 25 μ m (TLF-Y30F: Ba Chuan paper mill system, the minimum melt viscosity in the time of 100～250 ℃ is 21000PaS) in addition, is made multi-layer printed circuit board with embodiment 1 identically with insulating trip.
Embodiment 4
For the manufacturing of interlaminar bonding, except the epoxy resin that uses thick 25 μ m (TLF-Y20: Ba Chuan paper mill system, the minimum melt viscosity in the time of 100～250 ℃ is 700PaS) in addition, is made multi-layer printed circuit board with embodiment 1 identically with insulating trip.
Embodiment 5
For the manufacturing of interlaminar bonding with insulating trip; Except the interlaminar bonding agent (EA541: new Kobe motor that uses impregnating resin in the aramid nonwoven fabric; The minimum melt viscosity of resin is 63PaS in the time of 100～250 ℃) in addition, make multi-layer printed circuit board with embodiment 1 identically.
Evaluation test
In embodiment 1, embodiment 2, embodiment 3, embodiment 4 any all can conducting, even carry out unleaded backflow test three times, its resistance change rate is all below 10%.On the other hand, among the embodiment 5, resistance change rate is 15%.
Embodiment 6
(manufacturing of conductive paste)
In the epoxy resin that constitutes by bisphenol A type epoxy resin 70 weight portions (epoxide equivalent 7000～8500) and bisphenol f type epoxy resin 30 weight portions (epoxide equivalent 160～170); Process with the acetate of butyl carbitol is the solution of solvent; Add the potential curing agent of imidazoles therein; Make silver paste, as conductive paste (conductive resin composition A, B).During coating, carry out the viscosity adjustment with solvent as required.
(manufacturing of single face cream distributing board base material)
, on the single face of the polyimide film (PI) that forms eight through holes (opening diameter 150 μ m) altogether, conductive paste is coated with by silk screen printing by drill bit, wiring layer is set, make substrate (PI:25 μ m, bed thickness: 18 μ m).In addition, when silk screen printing, paste little stickup polyester film etc., prevent that cream from spilling from through hole at the back side of printing surface.
Have each the access opening place on the part of through hole at each of the back side of printing surface,, implement accurate curing by silk screen printing filled conductive cream.And then the silk screen printing conductive paste forms the projection (protuberance) of eight diameters, 250 μ m, high 60 μ m altogether, implements accurate curing.Like this, make the distributing board base material with projection, the single face cream distributing board base material (having projection) that is equivalent to 31 among Fig. 2 ', 33 ', 34 '.
In addition, identical except not forming the projection with said method, make the single face cream distributing board base material (no projection) that is equivalent to 32 of Fig. 2 '.
(manufacturing of single face Copper Foil distributing board base material)
On the single face of the laminated substrate that posts copper of 25 microns of polyimides, Copper Foil 18 μ m, form wiring layer,, form the access opening of 150 microns of eight diameters by laser from its opposite side.By silk screen printing filled conductive cream, implement accurate curing in the access opening part.And then the silk screen printing conductive paste forms the projection (protuberance) of eight diameters, 250 μ m, high 60 μ m altogether, implements accurate curing, makes single face distributing board base material.
(interlaminar bonding is with the manufacturing of insulating trip)
On the assigned position of the bonding agent tablet that constitutes by the epoxy resin of thick 25 μ m (TLF-Y30: Ba Chuan paper mill system, the minimum melt viscosity in the time of 100～250 ℃ is 4700PaS), use drill bit, form the through hole of diameter 350 μ m.
(lamination)
Dispose the two layers of one-sided Copper Foil distributing board base material of gained as previously mentioned in outermost; Within it side with as the situation of 31 of Fig. 2 ', 32 ', 33 ' and 34 ' same, configuration as previously mentioned and must three layers of single face cream distributing board base material (having projection) and one deck single face cream distributing board base material (no projection), and then between these distributing board base materials; With five layer by layer between bonding use insulating trip; Inserting interlaminar bonding with projection after overlapping, utilizes vacuum pressed to implement joining process, afterwards with the mode of the through hole of insulating trip; 40 interlayer coupling parts form wiring layer with the mode that becomes the daisy chain, make multi-layer printed circuit board.
Embodiment 7
The single face cream distributing board base material (no projection) that uses single face cream distributing board base material (having projection) to replace embodiment 6 to use.In addition; Only for five layer by layer between bonding with the insulating trip of the central portion (position that is equivalent to sheet 411 among Fig. 2) of insulating trip, (TLF-Y30: on the assigned position of the bonding agent tablet that Ba Chuan paper mill system) constitutes, using drill bit formation diameter is the structure of the through hole of 300 μ m to use epoxy resin by thick 35 μ m.On other aspect, make multi-layer printed circuit board with embodiment 6 identically.
Embodiment 8
Except the epoxy resin (TLF-Y30F: Ba Chuan paper mill system that uses thick 25 μ m; Minimum melt viscosity in the time of 100～250 ℃ is 21000PaS) the insulating trip interlaminar bonding that replaces among the embodiment 6 using with beyond the insulating trip, make multi-layer printed circuit board with embodiment 6 identically.
Embodiment 9
The interlaminar bonding that uses the insulating trip of the epoxy resin (TLF-Y20: Ba Chuan paper mill system, the minimum melt viscosity in the time of 100～250 ℃ is 700PaS) of thick 25 μ m to replace using among the embodiment 6 is used insulating trip.
Embodiment 10
The interlaminar bonding that uses the interlaminar bonding agent of having flooded resin in the aramid nonwoven fabric (EA541: new Kobe motor, the minimum melt viscosity of resin is 63PaS in the time of 100～250 ℃) to replace using among the embodiment 6 is used insulating trip.
Evaluation test
In embodiment 6, embodiment 7, embodiment 8, embodiment 9 any all can conducting, even carry out unleaded backflow test three times, its resistance change rate is all below 10%.On the other hand, among the embodiment 10, resistance change rate is 15%.
Industrial applicibility
Multi-layer printed circuit board of the present invention installing component to high-density on its two surface, because the position deviation between distributing board is few, so reliability is high, can be applicable to various electronic equipments.And according to the manufacturing approach of multi-layer printed circuit board of the present invention, this good multi-layer printed circuit board can be with the simple procedures manufacturing.
Claims (15)
1. a multi-layer printed circuit board is characterized in that, comprises laminate, and this laminate has:
Two distributing board base materials, it is made up of the insulated substrate that at least one surface, is provided with the wiring layer that is formed by electric conducting material, in this insulated substrate, has the access opening at another surperficial upper shed to a wiring layer;
Adhesive layer, it has: the through hole that openings at two ends portion is connected with this peristome with the mode of the peristome that comprises said access opening respectively;
Conductive part between wiring layer, it is made up of filled conductive resin combination B in said access opening and said through hole;
Said through hole openings at two ends portion is bigger than the peristome of said access opening.
2. multi-layer printed circuit board as claimed in claim 1 is characterized in that, said electric conducting material is a metal forming.
3. multi-layer printed circuit board as claimed in claim 1 is characterized in that, said electric conducting material is conductive resin composition A.
4. multi-layer printed circuit board as claimed in claim 3 is characterized in that, has the distributing board base material of metal forming wiring layer in the outermost layer configuration.
5. multi-layer printed circuit board as claimed in claim 2 is characterized in that said metal forming is made up of the material that with copper is main body.
6. like each described multi-layer printed circuit board in the claim 2 to 5, it is characterized in that said insulated substrate is for being the resin molding of main body with the polyimides.
7. like each described multi-layer printed circuit board in the claim 2 to 5, it is characterized in that the spring rate of said adhesive layer is in the scope of 0.001～1GPa.
8. like each described multi-layer printed circuit board in the claim 2 to 5, it is characterized in that said adhesive layer is the complex of plural parts, wherein the spring rate of at least one parts is in the scope of 0.001～1GPa.
9. the manufacturing approach of a multi-layer printed circuit board is characterized in that,
With the multilayer wired plate substrate that includes distributing board base material a and these two distributing board base materials of distributing board base material b at least; So that the contacted mode of projection of the electroconductive resin portion of distributing board base material a and distributing board base material b and clamping binding agent and lamination between the distributing board base material; They are carried out lamination together; Wherein
Said distributing board base material a; Insulated substrate by at least one surface, being provided with the wiring layer that is formed by electric conducting material constitutes; In this insulated substrate, has filled conductive resin combination B in the access opening of another surperficial upper shed to a wiring layer and the electroconductive resin portion that constitutes;
Said distributing board base material b; Insulated substrate by at least one surface, being provided with the wiring layer that is formed by electric conducting material constitutes, and in this insulated substrate, has filled conductive resin combination B in the access opening of another surperficial upper shed to a wiring layer and the electroconductive resin portion that constitutes; And; In said electroconductive resin portion, also has the projection that forms by conductive resin composition B
The binding agent of clamping between the said distributing board base material is the bonding agent tablet that on the position corresponding with said projection, has through hole, so that the mode that said projection is inserted in the said through hole disposes bonding agent tablet, carries out lamination.
10. the manufacturing approach of a multi-layer printed circuit board is characterized in that,
With the multilayer wired plate substrate that includes two distributing board base material b at least so that the mode that the projection of two distributing board base material b is in contact with one another and between the distributing board base material clamping binding agent and lamination is carried out lamination,
Said distributing board base material b; Insulated substrate by at least one surface, being provided with the wiring layer that is formed by electric conducting material constitutes, and in this insulated substrate, has filled conductive resin combination B in the access opening of another surperficial upper shed to a wiring layer and the electroconductive resin portion that constitutes; And; In said electroconductive resin portion, also has the projection that forms by conductive resin composition B
The binding agent of clamping between the said distributing board base material is the bonding agent tablet that on the position corresponding with said projection, has through hole, so that the mode that said projection is inserted in the said through hole disposes bonding agent tablet, carries out lamination.
11. the manufacturing approach like claim 9 or 10 described multi-layer printed circuit boards is characterized in that, said multilayer wired plate substrate is except comprising distributing board base material a and/or distributing board base material b; Also has the distributing board base material; It is made up of the insulated substrate that at least one surface, is provided with the wiring layer that is formed by electric conducting material, in this insulated substrate, has filled conductive resin combination B in the access opening of another surperficial upper shed to a wiring layer and the electroconductive resin portion that constitutes; And; In said electroconductive resin portion, also has the projection that forms by conductive resin composition B, so that the contacted mode of wiring layer of this projection and other distributing board base material and lamination.
12. the manufacturing approach like claim 9 or 10 described multi-layer printed circuit boards is characterized in that, said electric conducting material is metal forming or conductive resin composition A.
13. the manufacturing approach like claim 9 or 10 described multi-layer printed circuit boards is characterized in that,
Said electric conducting material is conductive resin composition A,
Said multilayer wired plate substrate also has the distributing board base material except comprising distributing board base material a and/or distributing board base material b, and it is made up of the insulated substrate that at least one surface, is provided with the wiring layer that is formed by electric conducting material; In this insulated substrate; The electroconductive resin portion that has filled conductive resin combination B in the access opening of another surperficial upper shed to a wiring layer and constitute, and, in said electroconductive resin portion; Also has the projection that forms by conductive resin composition B; So that the contacted mode lamination of the wiring layer of this projection and other distributing board base material, and have the distributing board base material of metal forming wiring layer, carry out lamination in the outermost layer configuration.
14. the manufacturing approach like claim 9 or 10 described multi-layer printed circuit boards is characterized in that, in the scope of minimum melt viscosity at 500～50000PaS of said bonding agent tablet in the time of 100～250 ℃.
15. the manufacturing approach like claim 9 or 10 described multi-layer printed circuit boards is characterized in that, said bonding agent tablet is the complex of parts, and said parts have the melt viscosity of minimum melt viscosity in 500～50000PaS scope in the time of 100～250 ℃.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005296088A JP5077800B2 (en) | 2005-10-11 | 2005-10-11 | Manufacturing method of multilayer printed wiring board |
| JP296088/2005 | 2005-10-11 | ||
| JP2005296729A JP5077801B2 (en) | 2005-10-11 | 2005-10-11 | Manufacturing method of multilayer printed wiring board |
| JP296729/2005 | 2005-10-11 | ||
| PCT/JP2006/319976 WO2007043438A1 (en) | 2005-10-11 | 2006-10-05 | Multilayer printed wiring board and method for producing same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101044806A CN101044806A (en) | 2007-09-26 |
| CN101044806B true CN101044806B (en) | 2012-01-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2006800006675A Active CN101044806B (en) | 2005-10-11 | 2006-10-05 | Multilayer printed wiring board and method for producing same |
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| JP (1) | JP5077800B2 (en) |
| CN (1) | CN101044806B (en) |
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| CN102598887B (en) | 2009-11-10 | 2014-12-03 | 株式会社村田制作所 | Multilayer board and manufacturing method thereof |
| JP5821389B2 (en) | 2011-04-20 | 2015-11-24 | 三菱マテリアル株式会社 | Power module substrate manufacturing method and power module substrate |
| TWI481322B (en) * | 2012-02-17 | 2015-04-11 | Htc Corp | Circuit board, structural unit thereof and manufacturing method thereof |
| WO2017199826A1 (en) * | 2016-05-18 | 2017-11-23 | 株式会社村田製作所 | Multilayer substrate and method for manufacturing multilayer substrate |
| CN110769665B (en) * | 2018-07-27 | 2023-12-05 | 广州方邦电子股份有限公司 | Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2743110B2 (en) * | 1990-05-17 | 1998-04-22 | 株式会社日立製作所 | Method for manufacturing multilayer wiring board |
| JP3220907B2 (en) * | 1991-08-12 | 2001-10-22 | アキレス株式会社 | Impregnating agent for thermoforming, thermoforming method and molded body using the impregnating agent |
| JP2002198652A (en) * | 1995-05-15 | 2002-07-12 | Ibiden Co Ltd | Multilayer printed wiring board, method of manufacturing the same and single-sided circuit board therefor |
| JP2003234576A (en) * | 2002-02-12 | 2003-08-22 | Hitachi Chem Co Ltd | Multilayer printed wiring board and method of manufacturing the same |
| JP4121339B2 (en) * | 2002-09-02 | 2008-07-23 | 株式会社フジクラ | Manufacturing method of multilayer wiring board |
| JP4075673B2 (en) * | 2003-04-22 | 2008-04-16 | 松下電工株式会社 | Copper-clad laminate for multilayer printed wiring board, multilayer printed wiring board, and method for manufacturing multilayer printed wiring board |
-
2005
- 2005-10-11 JP JP2005296088A patent/JP5077800B2/en not_active Expired - Fee Related
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2006
- 2006-10-05 CN CN2006800006675A patent/CN101044806B/en active Active
Non-Patent Citations (4)
| Title |
|---|
| JP平4-22189A 1992.01.27 |
| JP昭63-160397A 1988.07.04 |
| JP特开2004-327510A 2004.11.18 |
| JP特开2004-95963A 2004.03.25 |
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| Publication number | Publication date |
|---|---|
| JP5077800B2 (en) | 2012-11-21 |
| JP2007109697A (en) | 2007-04-26 |
| CN101044806A (en) | 2007-09-26 |
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