CN100583443C - 一种薄膜晶体管结构及其制备方法 - Google Patents
一种薄膜晶体管结构及其制备方法 Download PDFInfo
- Publication number
- CN100583443C CN100583443C CN200710100342A CN200710100342A CN100583443C CN 100583443 C CN100583443 C CN 100583443C CN 200710100342 A CN200710100342 A CN 200710100342A CN 200710100342 A CN200710100342 A CN 200710100342A CN 100583443 C CN100583443 C CN 100583443C
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- 239000010409 thin film Substances 0.000 title claims description 19
- 238000002360 preparation method Methods 0.000 title claims description 16
- 239000004065 semiconductor Substances 0.000 claims abstract description 43
- 229910020286 SiOxNy Inorganic materials 0.000 claims abstract description 33
- 229910004205 SiNX Inorganic materials 0.000 claims abstract description 30
- 238000004519 manufacturing process Methods 0.000 claims abstract description 18
- 229910000838 Al alloy Inorganic materials 0.000 claims abstract description 16
- 238000009413 insulation Methods 0.000 claims abstract description 15
- 238000002161 passivation Methods 0.000 claims abstract description 14
- 239000010410 layer Substances 0.000 claims description 137
- 238000000034 method Methods 0.000 claims description 63
- 239000000758 substrate Substances 0.000 claims description 39
- 238000005530 etching Methods 0.000 claims description 38
- 238000001259 photo etching Methods 0.000 claims description 35
- 229910052751 metal Inorganic materials 0.000 claims description 34
- 239000002184 metal Substances 0.000 claims description 34
- 238000005229 chemical vapour deposition Methods 0.000 claims description 27
- 238000000151 deposition Methods 0.000 claims description 24
- 230000008021 deposition Effects 0.000 claims description 24
- 238000001755 magnetron sputter deposition Methods 0.000 claims description 23
- 239000010408 film Substances 0.000 claims description 21
- 238000005516 engineering process Methods 0.000 claims description 14
- 239000011241 protective layer Substances 0.000 claims description 11
- 230000015572 biosynthetic process Effects 0.000 claims description 9
- 238000001312 dry etching Methods 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 7
- 238000005275 alloying Methods 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- 230000005611 electricity Effects 0.000 claims 1
- 230000007547 defect Effects 0.000 abstract description 2
- 239000012528 membrane Substances 0.000 abstract 2
- 229910021417 amorphous silicon Inorganic materials 0.000 description 6
- 239000011521 glass Substances 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000004062 sedimentation Methods 0.000 description 2
- 229910016048 MoW Inorganic materials 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007323 disproportionation reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000003870 refractory metal Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/45—Ohmic electrodes
- H01L29/456—Ohmic electrodes on silicon
- H01L29/458—Ohmic electrodes on silicon for thin film silicon, e.g. source or drain electrode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78606—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device
- H01L29/78618—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device characterised by the drain or the source properties, e.g. the doping structure, the composition, the sectional shape or the contact structure
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Optics & Photonics (AREA)
- Thin Film Transistor (AREA)
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
Description
Claims (6)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200710100342A CN100583443C (zh) | 2007-06-08 | 2007-06-08 | 一种薄膜晶体管结构及其制备方法 |
KR1020080029767A KR100931875B1 (ko) | 2007-06-08 | 2008-03-31 | 박막 트랜지스터 및 이의 제조 방법 |
US12/061,425 US8030654B2 (en) | 2007-06-08 | 2008-04-02 | Thin film transistor and method of manufacturing the same |
JP2008097547A JP2008306167A (ja) | 2007-06-08 | 2008-04-03 | 薄膜トランジスタ及びその製造方法 |
JP2012204276A JP5685565B2 (ja) | 2007-06-08 | 2012-09-18 | 薄膜トランジスタ及びその製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200710100342A CN100583443C (zh) | 2007-06-08 | 2007-06-08 | 一种薄膜晶体管结构及其制备方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101320737A CN101320737A (zh) | 2008-12-10 |
CN100583443C true CN100583443C (zh) | 2010-01-20 |
Family
ID=40095018
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200710100342A Active CN100583443C (zh) | 2007-06-08 | 2007-06-08 | 一种薄膜晶体管结构及其制备方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8030654B2 (zh) |
JP (2) | JP2008306167A (zh) |
KR (1) | KR100931875B1 (zh) |
CN (1) | CN100583443C (zh) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100917654B1 (ko) * | 2006-11-10 | 2009-09-17 | 베이징 보에 옵토일렉트로닉스 테크놀로지 컴퍼니 리미티드 | 박막트랜지스터 액정 디스플레이 화소 구조 및 그 제조방법 |
CN101826532B (zh) * | 2009-03-06 | 2012-05-30 | 北京京东方光电科技有限公司 | Tft-lcd阵列基板及其制造方法 |
EP2519969A4 (en) * | 2009-12-28 | 2016-07-06 | Semiconductor Energy Lab | SEMICONDUCTOR COMPONENT |
JP6019370B2 (ja) * | 2012-01-11 | 2016-11-02 | 株式会社Joled | 薄膜トランジスタ及びその製造方法、表示装置 |
CN103400822A (zh) * | 2013-08-01 | 2013-11-20 | 京东方科技集团股份有限公司 | 阵列基板及显示装置 |
CN103715266A (zh) | 2013-12-25 | 2014-04-09 | 京东方科技集团股份有限公司 | 氧化物薄膜晶体管、阵列基板的制造方法及显示器件 |
CN105161504B (zh) * | 2015-09-22 | 2019-01-04 | 京东方科技集团股份有限公司 | 阵列基板及其制作方法、显示装置 |
CN105870058B (zh) * | 2016-06-08 | 2018-12-18 | 昆山龙腾光电有限公司 | 薄膜晶体管阵列基板的制作方法 |
CN109935627A (zh) * | 2019-01-21 | 2019-06-25 | 上海易密值半导体技术有限公司 | 薄膜晶体管 |
CN112447762A (zh) * | 2019-09-05 | 2021-03-05 | 咸阳彩虹光电科技有限公司 | 一种显示面板及显示器 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6284563A (ja) * | 1985-10-08 | 1987-04-18 | Nec Corp | 薄膜電界効果トランジスタアレイの製造方法 |
JPS62252973A (ja) * | 1986-04-25 | 1987-11-04 | Nec Corp | 順スタガ−ド型薄膜トランジスタ |
JPS6378572A (ja) * | 1986-09-20 | 1988-04-08 | Fujitsu Ltd | 半導体装置 |
JPH02248079A (ja) * | 1989-03-22 | 1990-10-03 | Sumitomo Metal Ind Ltd | 薄膜半導体装置 |
JPH05315616A (ja) | 1992-05-08 | 1993-11-26 | Hitachi Ltd | 半導体装置及び薄膜トランジスタ |
JPH07326756A (ja) * | 1994-05-30 | 1995-12-12 | Kyocera Corp | 薄膜トランジスタおよびその製造方法 |
JPH11109406A (ja) * | 1997-09-30 | 1999-04-23 | Sanyo Electric Co Ltd | 表示装置とその製造方法 |
JP3288615B2 (ja) * | 1997-10-21 | 2002-06-04 | 株式会社アドバンスト・ディスプレイ | 薄膜トランジスタの製造方法 |
KR100336890B1 (ko) * | 1998-12-15 | 2003-06-19 | 주식회사 현대 디스플레이 테크놀로지 | 박막트랜지스터액정표시소자의제조방법 |
JP2001166332A (ja) * | 1999-12-06 | 2001-06-22 | Hitachi Ltd | 液晶表示装置 |
KR100915231B1 (ko) * | 2002-05-17 | 2009-09-02 | 삼성전자주식회사 | 저유전율 절연막의 증착방법, 이를 이용한 박막트랜지스터및 그 제조방법 |
CN1466017A (zh) | 2002-07-05 | 2004-01-07 | 友达光电股份有限公司 | 于薄膜晶体管液晶显示器制造过程中的蚀刻方法 |
KR100615205B1 (ko) * | 2004-01-27 | 2006-08-25 | 삼성에스디아이 주식회사 | 광투과율을 개선시키는 구조의 유기 전계 발광 디스플레이소자 및 이의 제조 방법 |
JP2006100387A (ja) * | 2004-09-28 | 2006-04-13 | Toshiba Corp | 電界効果トランジスタ及びその製造方法 |
JP4700352B2 (ja) * | 2005-01-12 | 2011-06-15 | 出光興産株式会社 | Tft基板及びその製造方法 |
US7411298B2 (en) * | 2005-08-17 | 2008-08-12 | Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) | Source/drain electrodes, thin-film transistor substrates, manufacture methods thereof, and display devices |
-
2007
- 2007-06-08 CN CN200710100342A patent/CN100583443C/zh active Active
-
2008
- 2008-03-31 KR KR1020080029767A patent/KR100931875B1/ko active IP Right Grant
- 2008-04-02 US US12/061,425 patent/US8030654B2/en active Active
- 2008-04-03 JP JP2008097547A patent/JP2008306167A/ja active Pending
-
2012
- 2012-09-18 JP JP2012204276A patent/JP5685565B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
KR20080107990A (ko) | 2008-12-11 |
JP2008306167A (ja) | 2008-12-18 |
JP2012248896A (ja) | 2012-12-13 |
US8030654B2 (en) | 2011-10-04 |
KR100931875B1 (ko) | 2009-12-15 |
JP5685565B2 (ja) | 2015-03-18 |
CN101320737A (zh) | 2008-12-10 |
US20080303028A1 (en) | 2008-12-11 |
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PB01 | Publication | ||
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SE01 | Entry into force of request for substantive examination | ||
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ASS | Succession or assignment of patent right |
Owner name: BEIJING BOE PHOTOELECTRICITY SCIENCE + TECHNOLOGY Effective date: 20141128 Owner name: JINGDONGFANG SCIENCE AND TECHNOLOGY GROUP CO., LTD Free format text: FORMER OWNER: BEIJING BOE PHOTOELECTRICITY SCIENCE + TECHNOLOGY CO., LTD. Effective date: 20141128 |
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C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 100176 DAXING, BEIJING TO: 100015 CHAOYANG, BEIJING |
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TR01 | Transfer of patent right |
Effective date of registration: 20141128 Address after: 100015 Jiuxianqiao Road, Beijing, No. 10, No. Patentee after: BOE Technology Group Co., Ltd. Patentee after: Beijing BOE Photoelectricity Science & Technology Co., Ltd. Address before: 100176 Beijing economic and Technological Development Zone, West Central Road, No. 8 Patentee before: Beijing BOE Photoelectricity Science & Technology Co., Ltd. |
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Effective date of registration: 20201127 Address after: 215200 No. 1700, Wujiang economic and Technological Development Zone, Suzhou, Jiangsu, Zhongshan North Road Patentee after: Gaochuang (Suzhou) Electronics Co.,Ltd. Patentee after: BOE TECHNOLOGY GROUP Co.,Ltd. Address before: 100015 Jiuxianqiao Road, Beijing, No. 10, No. Patentee before: BOE TECHNOLOGY GROUP Co.,Ltd. Patentee before: BEIJING BOE OPTOELECTRONICS TECHNOLOGY Co.,Ltd. |
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TR01 | Transfer of patent right |