CN100556248C - 柔性电路板激光加工承载装置 - Google Patents
柔性电路板激光加工承载装置 Download PDFInfo
- Publication number
- CN100556248C CN100556248C CNB2007100742340A CN200710074234A CN100556248C CN 100556248 C CN100556248 C CN 100556248C CN B2007100742340 A CNB2007100742340 A CN B2007100742340A CN 200710074234 A CN200710074234 A CN 200710074234A CN 100556248 C CN100556248 C CN 100556248C
- Authority
- CN
- China
- Prior art keywords
- groove
- laser processing
- circuit board
- bearing device
- flexible circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0173—Template for holding a PCB having mounted components thereon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/085—Using vacuum or low pressure
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laser Beam Processing (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
Claims (8)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2007100742340A CN100556248C (zh) | 2007-04-27 | 2007-04-27 | 柔性电路板激光加工承载装置 |
US11/847,300 US8009432B2 (en) | 2007-04-27 | 2007-08-29 | Retaining apparatus for a flexible printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2007100742340A CN100556248C (zh) | 2007-04-27 | 2007-04-27 | 柔性电路板激光加工承载装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101296581A CN101296581A (zh) | 2008-10-29 |
CN100556248C true CN100556248C (zh) | 2009-10-28 |
Family
ID=39886702
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2007100742340A Expired - Fee Related CN100556248C (zh) | 2007-04-27 | 2007-04-27 | 柔性电路板激光加工承载装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US8009432B2 (zh) |
CN (1) | CN100556248C (zh) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5353614B2 (ja) * | 2008-10-06 | 2013-11-27 | 日立化成株式会社 | 基板挿入用コネクタ及びその製造方法 |
CN101742823B (zh) * | 2008-11-21 | 2011-12-28 | 华通电脑股份有限公司 | 电路板承载装置及其应用方法 |
CN101742821B (zh) * | 2008-11-24 | 2011-10-26 | 华通电脑股份有限公司 | 电路板承载装置的应用方法 |
EP2309829A1 (en) * | 2009-09-24 | 2011-04-13 | Harman Becker Automotive Systems GmbH | Multilayer circuit board |
CN102480839A (zh) * | 2010-11-24 | 2012-05-30 | 富葵精密组件(深圳)有限公司 | 固持装置 |
CN102593028A (zh) * | 2012-03-19 | 2012-07-18 | 南通富士通微电子股份有限公司 | 双面贴装器件的基板的固定装置 |
US9647997B2 (en) | 2013-03-13 | 2017-05-09 | Nagrastar, Llc | USB interface for performing transport I/O |
USD729808S1 (en) | 2013-03-13 | 2015-05-19 | Nagrastar Llc | Smart card interface |
USD758372S1 (en) * | 2013-03-13 | 2016-06-07 | Nagrastar Llc | Smart card interface |
US9888283B2 (en) | 2013-03-13 | 2018-02-06 | Nagrastar Llc | Systems and methods for performing transport I/O |
USD759022S1 (en) | 2013-03-13 | 2016-06-14 | Nagrastar Llc | Smart card interface |
CN104254189B (zh) * | 2013-06-25 | 2018-03-30 | 珠海格力电器股份有限公司 | Pcb板的固定板及其加工方法 |
CN104661507B (zh) * | 2013-11-20 | 2018-11-30 | 韩华泰科株式会社 | 组件贴装机的电路板结构 |
US9474154B2 (en) * | 2014-07-18 | 2016-10-18 | Starkey Laboratories, Inc. | Reflow solderable flexible circuit board — to — flexible circuit board connector reinforcement |
USD780763S1 (en) | 2015-03-20 | 2017-03-07 | Nagrastar Llc | Smart card interface |
CN104822250B (zh) * | 2015-04-01 | 2017-08-11 | 太原风华信息装备股份有限公司 | 一种柔性线路板邦定定位机构 |
USD864968S1 (en) | 2015-04-30 | 2019-10-29 | Echostar Technologies L.L.C. | Smart card interface |
CN111601464A (zh) * | 2020-05-27 | 2020-08-28 | 西安金百泽电路科技有限公司 | 一种带元器件字符小pcs后处理方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4892321A (en) * | 1988-06-16 | 1990-01-09 | Colgate Samuel O | Ultra-high vacuum device gasket with means of insertion and removal |
US5227338A (en) * | 1990-04-30 | 1993-07-13 | International Business Machines Corporation | Three-dimensional memory card structure with internal direct chip attachment |
US5278724A (en) * | 1992-07-06 | 1994-01-11 | International Business Machines Corporation | Electronic package and method of making same |
JP3258120B2 (ja) | 1993-03-25 | 2002-02-18 | セイコーインスツルメンツ株式会社 | プローブ顕微鏡 |
US5363276A (en) * | 1993-09-01 | 1994-11-08 | Ncr Corporation | Apparatus for containing and supporting electronic components |
US6219258B1 (en) * | 1999-01-29 | 2001-04-17 | Ericsson Inc. | Electronic enclosure with improved environmental protection |
US6462955B1 (en) * | 1999-09-13 | 2002-10-08 | Miraco, Inc. | Component alignment casing system |
US6897753B2 (en) * | 2002-09-03 | 2005-05-24 | Artesyn Technologies, Inc. | Housing for a transformer |
US6819562B2 (en) * | 2003-01-31 | 2004-11-16 | Hewlett-Packard Development Company, L.P. | Cooling apparatus for stacked components |
DE502004008576D1 (de) * | 2003-07-02 | 2009-01-15 | Siemens Home & Office Comm | Abschirmung für emi-gefährdete elektronische bauelemente und/oder schaltungen von elektronischen geräten |
JP4428199B2 (ja) * | 2004-01-14 | 2010-03-10 | 株式会社デンソー | 電子制御装置 |
US7372701B2 (en) * | 2006-07-27 | 2008-05-13 | Deere & Company | Cantilever mounted electronic module with rigid center backbone |
US7751204B2 (en) * | 2007-08-24 | 2010-07-06 | Clint Wilber | Electromagnetic isolation shield |
-
2007
- 2007-04-27 CN CNB2007100742340A patent/CN100556248C/zh not_active Expired - Fee Related
- 2007-08-29 US US11/847,300 patent/US8009432B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US8009432B2 (en) | 2011-08-30 |
US20080266819A1 (en) | 2008-10-30 |
CN101296581A (zh) | 2008-10-29 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN100556248C (zh) | 柔性电路板激光加工承载装置 | |
CN103108485B (zh) | 多层印刷电路板及其制作方法 | |
CN110621122A (zh) | 多层电路板的制作方法、多层电路板和电子设备 | |
CN101938881B (zh) | 集成滤波器的印制电路板及其加工方法 | |
CN210491338U (zh) | 一种柔性线路板分割吸附平台 | |
CN103737184B (zh) | 激光加工通孔装置、治具以及该治具的安装方法 | |
CN102758831B (zh) | 真空吸附装置 | |
CN102189722A (zh) | 覆铜板及其加工方法 | |
EP2496059A3 (en) | Multi-plate board-embedded capacitor and methods for fabricating the same | |
CN201821583U (zh) | 柔性线路板的补强层压治具 | |
CN216183545U (zh) | 一种阻燃高性能基板覆铜箔设备 | |
CN103287016A (zh) | 覆铜箔层压板及其制备方法 | |
JP2001246635A5 (zh) | ||
US10964489B2 (en) | Upper mold for MLCC lamination | |
CN2624584Y (zh) | 电路板承载装置结构 | |
CN204836790U (zh) | 一种线路板防爆结构 | |
CN201860518U (zh) | 一种线路板塞孔装置 | |
CN101448365A (zh) | 一种塑胶架金属线路板的制造方法 | |
CN104275741B (zh) | 石膏板封边装置 | |
JP2011103404A (ja) | 基板分割装置、及び電子部品の製造方法 | |
CN105478585A (zh) | 一种咪头pcb板的冲压下模 | |
CN204471997U (zh) | 环保型耐磨复合板 | |
CN204316876U (zh) | 一种适应各种脆性材料线路板的真空压合机 | |
CN203344478U (zh) | 一种线路板印刷治具 | |
CN104619124B (zh) | 一种适应各种脆性材料线路板的真空压合机 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee | ||
CP01 | Change in the name or title of a patent holder |
Address after: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Co-patentee after: Zhending Technology Co., Ltd. Patentee after: Fuku Precision Components (Shenzhen) Co., Ltd. Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Co-patentee before: Honsentech Co., Ltd. Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. |
|
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20091028 Termination date: 20140427 |