CN100527375C - Testing wafer and testing method for edge bead removal - Google Patents
Testing wafer and testing method for edge bead removal Download PDFInfo
- Publication number
- CN100527375C CN100527375C CNB2006101179866A CN200610117986A CN100527375C CN 100527375 C CN100527375 C CN 100527375C CN B2006101179866 A CNB2006101179866 A CN B2006101179866A CN 200610117986 A CN200610117986 A CN 200610117986A CN 100527375 C CN100527375 C CN 100527375C
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- China
- Prior art keywords
- edge bead
- test
- wafer
- test wafer
- edge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2006101179866A CN100527375C (en) | 2006-11-03 | 2006-11-03 | Testing wafer and testing method for edge bead removal |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2006101179866A CN100527375C (en) | 2006-11-03 | 2006-11-03 | Testing wafer and testing method for edge bead removal |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101174573A CN101174573A (en) | 2008-05-07 |
CN100527375C true CN100527375C (en) | 2009-08-12 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2006101179866A Expired - Fee Related CN100527375C (en) | 2006-11-03 | 2006-11-03 | Testing wafer and testing method for edge bead removal |
Country Status (1)
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CN (1) | CN100527375C (en) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101750038B (en) * | 2008-12-15 | 2012-06-20 | 中芯国际集成电路制造(上海)有限公司 | Test wafer for edge detection and wafer edge detection method |
CN101546720B (en) * | 2009-04-09 | 2013-10-09 | 上海集成电路研发中心有限公司 | Method for detecting residue of photoresist in orifice and corresponding method for measuring strip width of orifice |
CN102136409B (en) * | 2010-01-27 | 2012-12-05 | 中芯国际集成电路制造(上海)有限公司 | Method for manufacturing locating marker on wafer |
CN102569113B (en) * | 2010-12-09 | 2014-11-05 | 无锡华润上华半导体有限公司 | Edging width detection method |
CN102591158A (en) * | 2012-02-21 | 2012-07-18 | 西安中为光电科技有限公司 | Method for accurately measuring WEE (wafer edge exclusion) width |
CN105448891A (en) * | 2014-08-07 | 2016-03-30 | 无锡华润上华科技有限公司 | Monitoring wafer for edge removing width and manufacturing method thereof |
CN106601647B (en) * | 2016-12-29 | 2020-02-14 | 南通通富微电子有限公司 | Coating machine for semiconductor and center testing and correcting method |
CN108666244A (en) * | 2018-05-15 | 2018-10-16 | 长江存储科技有限责任公司 | Bevel-etching device and wafer lithographic method |
CN109183105B (en) * | 2018-08-31 | 2020-11-06 | 上海华力微电子有限公司 | Method for correcting and monitoring edge washing position in copper electroplating |
CN111123653B (en) * | 2019-12-06 | 2023-09-08 | 武汉新芯集成电路制造有限公司 | Measuring disc and eccentric value measuring method |
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2006
- 2006-11-03 CN CNB2006101179866A patent/CN100527375C/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
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CN101174573A (en) | 2008-05-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20111118 Address after: 201203 No. 18 Zhangjiang Road, Shanghai Co-patentee after: Semiconductor Manufacturing International (Beijing) Corporation Patentee after: Semiconductor Manufacturing International (Shanghai) Corporation Address before: 201203 No. 18 Zhangjiang Road, Shanghai Patentee before: Semiconductor Manufacturing International (Shanghai) Corporation |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090812 Termination date: 20181103 |