CN100499942C - Rare earth thick film circuit rare earth resistance pastes based on metal substrate and its preparation process - Google Patents
Rare earth thick film circuit rare earth resistance pastes based on metal substrate and its preparation process Download PDFInfo
- Publication number
- CN100499942C CN100499942C CNB2006100367162A CN200610036716A CN100499942C CN 100499942 C CN100499942 C CN 100499942C CN B2006100367162 A CNB2006100367162 A CN B2006100367162A CN 200610036716 A CN200610036716 A CN 200610036716A CN 100499942 C CN100499942 C CN 100499942C
- Authority
- CN
- China
- Prior art keywords
- powder
- rare earth
- silver
- palladium
- organic carrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
- H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
- H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component
- H01C17/06533—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component composed of oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
- H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
- H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component
- H01C17/06553—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component composed of a combination of metals and oxides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/013—Heaters using resistive films or coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/017—Manufacturing methods or apparatus for heaters
Abstract
This invention discloses one rare earth thick film circuit resistance plasma and its process method based on metal baseboard, wherein, the plasma is composed of function phase and organic load with proportion as 65-85:35- 15; the function phase is composed of palladium-silver-yttrium compound power and micro crystal power with proportion as 75-55:25- 45; palladium-silver-yttrium weight as proportion as 75-59:15-40.5:10-0.5. The rare earth resistance plasma process comprises the following steps: a, micro crystal glass powder processing; b, palladium-silver-yttrium compound processing; c, matching organic solvent load; d, processing rare earth plasma.
Description
Technical field:
The present invention relates to thick film circuit rare earth resistance slurry and technology of preparing thereof based on metal substrate, be particularly related to based on the ferritic stainless steel series substrate, for example: GB trade mark 1Cr15,1Cr17,00Cr12 etc., large power thick film circuit rare earth resistance slurry and preparation technologies thereof such as external trade mark 429#, 430#, 410L#.
Background technology:
In the strategy of sustainable development that China establishes, two aspects that relate to are environmental protection and raising capacity usage ratio, improve energy-structure.In field of electric heating, novel heating element wants that cube is little, power wants big, thermal inertia is little, surface thermal load wants big, power consumption is low, the heat efficiency wants high, warm start is fast, power stability, temperature field evenly, good manufacturability, body be from temperature control, safe and reliable to operation, life-span is long, wide accommodation.At present, to have only the new electrically heating of employing element be the rare earth thick film circuit electric heating element to the heating element that can satisfy above-mentioned requirements.
Earlier 2000s, du pont company has been used it for the stainless steel heat-generating disc of coffee pot and has been pushed Chinese market to, domestic research institutions also released the thick film circuit electric slurry that is used for stainless steel substrate in 2003 successively, but all use with a kind of substrate, same electron-like slurry comprises dielectric paste, resistance slurry (silver-colored palladium), electrocondution slurry.Technical costs, quality cost, product quality, range of application all are restricted.By its be that the dielectric paste preparation efficiency is low, electrical property, wettability be poor, resistance slurry stability is not good enough, cost can be in any more, silver ion easily moves under the easy oxidation of electrode slurry, the high temperature, adhesive force is not firm etc.Cause this technology popularization application development slow.
It is investigated card, till the present, also there is not rare earth thick film circuit both at home and abroad, the relevant report of the document of rare earth metal electric slurry and technology of preparing thereof, patent and achievement based on 1Cr15,1Cr17,00Cr12 (external trade mark 430#, 429#, 410L#) series stainless steel substrate.
Summary of the invention
The objective of the invention is to overcome the deficiency of above-mentioned technology and provide technical problem to be solved to provide a kind of low square resistance, big temperature coefficient of resistance and controlled, with low cost, reliable in quality, good electrical properties and dielectric paste, the rare earth thick film circuit rare earth resistance pastes that electrocondution slurry wettability compatibility is good based on metal substrate.
Another object of the present invention also is to provide a kind of preparation method of above-mentioned rare earth resistance slurry.
The present invention adopts following technical scheme to achieve the above object:
The present invention is based on the rare earth thick film circuit rare earth resistance pastes of metal substrate, be made up of function phase component silver palladium yttrium composite powder+microcrystalline glass powder and organic carrier, the weight ratio of function phase component and organic carrier is 65～85: 35～15.
The weight ratio of silver-colored palladium yttrium composite powder and devitrified glass is 75～55: 25～45 in the described solid phase composition.
As a further improvement on the present invention, the weight ratio of described silver, palladium, yttrium powder is: 75～59:15～40.5: 10～0.5, the particle diameter of silver-colored palladium yttrium composite powder are all less than 3 μ m.Silver palladium yttrium composite powder is the noble metal slurry.
Described microcrystalline glass powder is CaO-SiO
2-Al
2O
3-B
2O
3-Bi
2O
3-La
2O
3Microcrystalline glass in series; Each oxide weight ratio: SiO
220～60%, Ai
2O
35～35%, CaO10～35%, Bi
2O
310～30%, B
2O
31～10%, La
2O
30.3 TiO～8%,
21～8%, ZrO
21～10%;
The weight ratio of described each component of organic carrier: terpinol 68～78%, tributyl citrate 2～18%, ethyl cellulose 0.4～9%, NC Nitroncellulose 0.4～9%, hydrogenation castor oil 0.1～6%, lecithin 0.1～6%.
The present invention is based on the preparation technology of the rare earth thick film circuit resistance slurry of metal substrate, it is characterized in that: it comprises following processing step
At first prepare microcrystalline glass powder, palladium-silver yttrium composite powder, configuration organic carrier solvent, stand-by;
Carrying out the rare earth resistance slurry then comprehensively modulates: the function phase constituent is made up of silver-colored palladium yttrium composite powder and microcrystalline glass powder, is in proportion: (75～55): (25～45); And mutually and the organic carrier proportion of composing: (65～85) by function: (35～15), solid phase powder, the organic carrier solvent three-high mill of packing into is rolling, usefulness viscosimeter testing size viscosity, viscosity number is: 150～200PaS/RPM.
Wherein, described microcrystalline glass powder preparation is with following proportion raw material (weight % ratio) SiO
220～60%, Ai
2O
35～35%, CaO10～35%, Bi
2O
310～30%, B
2O
31～10%, La
2O
30.3 TiO～12%,
21～8%, ZrO
21～10%, the platinum crucible of packing into after in the three-dimensional blender machine, mixing, place the high-temperature smelting pot melting, smelting temperature is: 1100～1450 ℃, be incubated after 1～3 hour, fast glass melts invaded shrend in the cold water, obtain little slag, with the little slag of the glass agate ball bucket of packing into, obtain particle diameter with star-like ball mill ball milling and constitute less than 3 microns glass micro mist.
Described palladium-silver yttrium composite powder preparation technology is that the weight ratio with following proportion raw material (weight % than) Ag-Pd-Yt powder is: 75～59: 15～40.5: 10～0.5.The particle diameter of silver powder, palladium powder, yttrium powder is less than 3 μ m in the silver palladium yttrium composite powder; The three-dimensional blender machine of packing into mixes and obtains composite powder.
The configuration of described organic carrier solvent is that main solvent, thickener, surfactant, thixotropic agent, gelling agent etc. in the organic carrier solvent are dissolved in 80～100 ℃ water a few hours by a certain percentage, various raw material weight proportionings are: terpinol 68～78%, tributyl citrate 2～18%, ethyl cellulose 0.4～9%, NC Nitroncellulose 0.4～9%, hydrogenation castor oil 0.1～6%, lecithin 0.1～6%, adjust amount of thickener, the viscosity of organic carrier is adjusted in the scope of 150～280mPas and gets final product.
The features and advantages of the present invention are:
1. by domestic and international thick film circuit is researched and analysed with electric slurry physics, chemical property and processing performance, Rare Earth Lanthanum (La) and yttrium (Y) are mixed in decision in electric slurry, experimental results show that the function phase, bonding mutually in because the adding of Rare Earth Lanthanum and yttrium, the electrical property of slurry, wettability, intermiscibility, intermolecular linkage bond strength and manufacturability all improve a lot.By to SiO
2-Al
2O
3-CaO-Bi
2O
3-B
2O
3-La
2O
3Rare earth microcrystalline glass formula and preparation technology are determined in the dynamic analysis that microcrystalline glass in series coefficient of dilatation, vitrification point, glass transition temperature and forming core are grown up.Make it the coefficient of expansion and the metal substrate coupling of the resistor track layer that constitutes with the noble metal composite powder, and in conjunction with firm.Effectively reduce cost.
2. adopt rare-earth oxidation yttrium (Y
2O
3) and lanthanum (La) additive package, can reduce sintering temperature, acceleration of sintering improves technology, raises the efficiency, and saves the energy.Yttrium can strengthen stainless non-oxidizability and ductility, improves bond strength.In the Al-Zr alloy pulp, add a small amount of yttrium-rich RE, improve conductance.
3. Rare Earth Lanthanum (La) is mixed and can greatly be changed sintering character, microstructure, density, phase composition and the physical and mechanical property of microcrystal glass material and function phase.Thereby improve the strong bond strength of wettability, compatibility and molecule of dielectric strength, electric property, processing performance and the electric slurry of rare earth thick film circuit electric heating element.Improve technology, significantly improve the product fine rate.
4. rare earth thick film circuit rare earth resistance pastes printing performance of the present invention, sintering character are good.With dielectric paste, conductor paste good wettability and intermiscibility are arranged.
5. based on heightened awareness to each organic solvent mechanism in the rare earth slurry, with the main solvent of different boiling and evaporation rate in proportion preparation rationally make slurry evenly volatilization and discharging in processes such as printing, oven dry, sintering, avoid solvent to concentrate volatilization to form defectives such as cracking, pin hole.Effectively improve product qualified rate.
6. in the organic solvent prescription, select for use fine solvent such as hydrogenation castor oil to make thixotropic agent, make slurry have good thixotropy and anti-heavy effect to form good colloform texture.
In sum, the present invention joins rare earth function resistance slurry and can not only prepare on metal substrate, can also prepare on devitrified glass, pottery and other metal and nonmetal substrate.Can not only prepare in the plane, can also prepare on curved surface.The purposes scope is quite extensive.
The technology of the present invention material does not need dependence on import, and 100% production domesticization reduces noble metal dosage, and with low cost, material consumption is few, and is energy-conservation.Meet the requirement of the new road toward industrialization (high in technological content, good in economic efficiency, low in resources consumption, low in the pollution of the environment) of the recycling economy that China advocates, and very strong foreign exchange earning prospect is arranged.
So simultaneously, the present invention is by adjusting function phase constituent, content and sintering process, and this resistance slurry can be compatible with multiple metal substrate dielectric paste.For example: aluminum oxide substrate (Al
2O
3), aluminium nitride substrate (AIN), crystallite glass substrate, metal alloy aluminium, titanium alloy substrate etc.Rare earth thick film circuit is applicable to ferrite series stainless steel substrate with noble metal rare earth resistance slurry and technology of preparing thereof under the present invention.For example: GB trade mark 1Cr15,1Cr17,00Cr12 etc.External trade mark 429#, 430#, 410L# etc.
Each function is filled a prescription mutually and is all contained rare earth element yttrium (Y) and lanthanum (La).Owing to added rare earth metal yttrium and lanthanum, the compatibility of slurry, wettability, electrical property, manufacturability, adaptability have remarkable improvement to improve, and rare earth thick film circuit rare earth resistance pastes is gained the name thus.Application and Development based on the rare earth thick film circuit electric slurry success of metal substrate has ground-breaking innovative significance
Adjust function phase constituent of the present invention, content and sintering process, this resistance slurry can be compatible with multiple metal substrate dielectric paste.For example: aluminum oxide substrate (Al
2O
3), aluminium nitride (AIN) substrate, crystallite glass substrate, metal alloy aluminium, titanium alloy substrate etc.Rare earth thick film circuit of the present invention is applicable to ferrite series stainless steel substrate with rare earth resistance slurry and technology of preparing thereof.For example: GB trade mark 1Cr15,1Cr17,00Cr12 etc.External trade mark 429#, 430#, 410L# etc.
Wherein 1Cr15 (429#) 00Cr12 (410L#) is that 1Cr17 (430#) improves steel grade, and its manufacturability, (welding, bending) corrosion resistance, high-temperature oxidation, stability all are significantly increased than 1Cr17 (430#).
Adopted that heating element of the present invention meets that volume is little, power is big, thermal inertia is little, surface thermal load is big, power consumption is low, the heat efficiency is high, warm start is fast, power stability, temperature field evenly, good manufacturability, body be from temperature control, safe and reliable to operation, life-span is long, the requirement of wide accommodation.
Embodiment:
Embodiment one:
The rare earth thick film circuit noble metal rare earth resistance slurry that is used for 1Cr15 (429#) series stainless steel substrate
1. microcrystalline glass formula: SiO
232%, Ai
2O
318%, CaO15%, Bi
2O
316%, B
2O
38%, La
2O
35, TiO
24%, ZrO
22%:
2. devitrified glass preparation technology: 1250 ℃ of insulations 135 minutes.
3. preparation granulation: vibrator ball milling → star-like agitating ball mill → powder granularity ≮ 3 μ m
4. the noble metal composition is filled a prescription: the weight ratio of silver, palladium, yttrium composite powder is: 69: 28: 3.Composite powder particle diameter ≮ 2 μ m.
5. organic solvent prescription dissolution process: terpinol 69%, tributyl citrate 12%, ethyl cellulose 5%, NC Nitroncellulose 5%, hydrogenation castor oil 5%, lecithin 4%.Each component is mixed back water-bath 150 minutes in 80～90 ℃ of water temperatures by proportioning.
6. comprehensive size mixing technology: this slurry is made up of function phase and organic carrier, and ratio is: 75: 25.Carry out three-roll rolling after placing three-dimensional blender machine dispersed with stirring.
7. noble metal rare earth resistance slurry performance parameter of the present invention:
1. electrical property:
| Side's resistance | Resolution | TCR/ppm/℃ | Aging intensity |
| 100±2mΩ/□ | 0.1mm | 1500±150ppm×10 -6/℃ | >10(N/mm 2) |
2. physical property
| Rheological behavior | Resistive layer thickness | Slurry viscosity | The unit consumption |
| The suitable wire mark of thixotroping | 12±2μm | 160±20Pas/10RPM | 88cm 2/ gram |
Embodiment two:
The rare earth thick film circuit noble metal rare earth resistance slurry that is used for 1Cr17 (430#) series stainless steel substrate
1, microcrystalline glass formula: SiO
231%, Ai
2O
319%, CaO 14%, Bi
2O
315%, B
2O
39%, La
2O
35, TiO
25%, ZrO
22%:
2, devitrified glass preparation technology: 1250 ℃ are incubated 135 minutes.
3, preparation granulation: vibrator ball milling → star-like agitating ball mill → powder granularity ≮ 3 μ m
4. the noble metal composition is filled a prescription: the weight ratio of silver, palladium, yttrium composite powder is: 70: 27: 3.Composite powder particle diameter ≮ 2 μ m.
5. organic solvent prescription dissolution process: terpinol 69%, tributyl citrate 12%, ethyl cellulose 5%, NC Nitroncellulose 5%, hydrogenation castor oil 5%, lecithin 4%.Each component is mixed back water-bath 150 minutes in 86 ℃ of water temperatures by proportioning.
6. comprehensive size mixing technology: this slurry is made up of function phase and organic carrier, and ratio is: 76: 24.Carry out three-roll rolling after placing three-dimensional blender machine dispersed with stirring.
7. the noble metal rare earth resistance slurry performance parameter of the embodiment of the invention:
1. electrical property:
| Resistance | Resolution | TCR/ppm/℃ | Aging intensity |
| 85±2mΩ/□ | 0.1mm | 1500±150ppm× 10 -6/℃ | >10 (N/mm 2) |
2. physical property
| Rheological behavior | Resistive layer thickness | Slurry viscosity | The unit consumption |
| The suitable wire mark of thixotroping | 12±2μm | 168 ± 20Pas/10RPM | 88cm 2/ gram |
Claims (2)
1. the rare earth thick film circuit rare earth resistance pastes based on metal substrate is characterized in that, it is made up of function phase component silver palladium yttrium composite powder and microcrystalline glass powder and organic carrier, and the weight ratio of function phase component and organic carrier is 65～85: 35～15;
Described silver-colored palladium yttrium composite powder and microcrystalline glass powder are formed the solid phase composition, and the weight ratio of silver-colored palladium yttrium composite powder and devitrified glass is 75～55: 25～45 in the solid phase composition;
The weight ratio of the silver in the described silver-colored palladium yttrium composite powder, palladium, yttrium powder is: 75～59: 15～40.5: 10～0.5, and the particle diameter of silver-colored palladium yttrium composite powder is all less than 3 μ m;
Described microcrystalline glass powder is CaO-SiO
2-Al
2O
3-B
2O
3-Bi
2O
3-La
2O
3Microcrystalline glass in series; Each oxide weight ratio: SiO
220～60%, Ai
2O
35～35%, CaO 10～35%, Bi
2O
310～30%, B
2O
31～10%, La
2O
30.3 TiO～8%,
21～8%, ZrO
21～10%;
The weight ratio of described each component of organic carrier: terpinol 68～78%, tributyl citrate 2～18%, ethyl cellulose 0.4～9%, NC Nitroncellulose 0.4～9%, hydrogenation castor oil 0.1～6%, lecithin 0.1～6%.
2. based on the preparation technology of the rare earth thick film circuit resistance slurry of metal substrate, it is characterized in that: it comprises following processing step:
At first prepare microcrystalline glass powder, palladium-silver yttrium composite powder, configuration organic carrier solvent, stand-by;
Carrying out the rare earth resistance slurry then comprehensively modulates: the function phase constituent is made up of silver-colored palladium yttrium composite powder and microcrystalline glass powder, is by weight proportion: 75～55: 25～45; And by function mutually and organic carrier form part by weight: 65～85: 35～15, solid phase powder, the organic carrier solvent three-high mill of packing into is rolling, usefulness viscosimeter testing size viscosity, viscosity number is: 150～200PaS/RPM;
Described microcrystalline glass powder preparation is the percentage by weight SiO with following proportion raw material
220～60%, Ai
2O
35～35%, CaO 10～35%, Bi
2O
310～30%, B
2O
31～10%, La
2O
30.3 TiO～12%,
21～8%, ZrO
21～10%, the platinum crucible of packing into after in the three-dimensional blender machine, mixing, place the high-temperature smelting pot melting, smelting temperature is: 1100～1450 ℃, be incubated after 1～3 hour, fast glass melts invaded shrend in the cold water, obtain little slag, with the little slag of the glass agate ball bucket of packing into, obtain particle diameter with star-like ball mill ball milling and constitute less than 3 microns glass micro mist;
Described palladium-silver yttrium composite powder preparation technology is: the proportion raw material Ag-Pd-Yt powder is pressed the column weight amount than ratio proportioning: (75～59): (15～40.5): (10～0.5); The particle diameter of silver powder, palladium powder, yttrium powder is less than 3 μ m in the silver palladium yttrium composite powder; The three-dimensional blender machine of packing into mixes and obtains composite powder;
The configuration of described organic carrier solvent is that main solvent, thickener, surfactant, thixotropic agent, gelling agent in the organic carrier solvent are dissolved a few hours by a certain percentage in 80～100 ℃ water, various raw material weight proportionings are: terpinol 68～78%, tributyl citrate 2～18%, ethyl cellulose 0.4～9%, NC Nitroncellulose 0.4～9%, hydrogenation castor oil 0.1～6%, lecithin 0.1～6%, adjust amount of thickener, the viscosity of organic carrier solvent is adjusted in the scope of 150～280mPas and gets final product.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100367162A CN100499942C (en) | 2006-07-28 | 2006-07-28 | Rare earth thick film circuit rare earth resistance pastes based on metal substrate and its preparation process |
| PCT/CN2007/002226 WO2008014680A1 (en) | 2006-07-28 | 2007-07-23 | Rare earth resistance slurry for rare earth thick-film circuit based on metal substrate and producing process thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100367162A CN100499942C (en) | 2006-07-28 | 2006-07-28 | Rare earth thick film circuit rare earth resistance pastes based on metal substrate and its preparation process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1972535A CN1972535A (en) | 2007-05-30 |
| CN100499942C true CN100499942C (en) | 2009-06-10 |
Family
ID=38113056
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006100367162A Active CN100499942C (en) | 2006-07-28 | 2006-07-28 | Rare earth thick film circuit rare earth resistance pastes based on metal substrate and its preparation process |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN100499942C (en) |
| WO (1) | WO2008014680A1 (en) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101106842B (en) * | 2007-07-24 | 2011-12-21 | 王晨 | Thick film circuit heating part based on minicrystal glass base plate and its making technology |
| CN102450944A (en) * | 2011-05-30 | 2012-05-16 | 浙江苏泊尔家电制造有限公司 | Electrothermal cooker |
| CN102685942B (en) * | 2012-05-29 | 2014-05-07 | 王克政 | Intelligent electric-heating element with PTC (Positive Temperature Coefficient) rare-earth thick film circuit and preparation method thereof |
| CN103730189A (en) * | 2014-01-09 | 2014-04-16 | 湖南利德电子浆料有限公司 | Metal substrate based sintering temperature adjustable thick film circuit resistor paste and preparation process thereof |
| CN104320866A (en) * | 2014-09-19 | 2015-01-28 | 王晨 | Composite-material-based thick-film circuit rare earth electrode slurry and preparation process thereof |
| CN106098140A (en) * | 2016-05-23 | 2016-11-09 | 东莞珂洛赫慕电子材料科技有限公司 | A kind of PTC thermistor slurry based on stainless steel substrate and preparation method thereof |
| CN106205773B (en) * | 2016-07-06 | 2018-04-24 | 东莞珂洛赫慕电子材料科技有限公司 | A kind of rare earth thick film circuit electrode slurry based on stainless steel substrate and preparation method thereof |
| CN106131982A (en) * | 2016-07-08 | 2016-11-16 | 东莞珂洛赫慕电子材料科技有限公司 | A kind of high temperature high power rare earth resistance slurry and preparation method thereof |
| CN106409380A (en) * | 2016-09-27 | 2017-02-15 | 东莞珂洛赫慕电子材料科技有限公司 | Medium temperature sintering resistance slurry of aluminum alloy substrate thick film circuit and preparation method thereof |
| CN109090709A (en) * | 2018-08-30 | 2018-12-28 | 湖北中烟工业有限责任公司 | A kind of heat generating ceramic slurry and preparation method thereof |
| CN109448885A (en) * | 2018-11-05 | 2019-03-08 | 浙江亮能机电科技有限公司 | A kind of YH21CT stainless steel thick film circuit resistance slurry and preparation method thereof |
| CN112216422B (en) * | 2020-10-10 | 2022-04-01 | 云南中烟工业有限责任公司 | High-insulation low-thermal expansion coefficient medium slurry and preparation method and application thereof |
| CN113707360B (en) * | 2021-10-22 | 2022-02-25 | 西安宏星电子浆料科技股份有限公司 | Thick film resistor paste suitable for different types of stainless steel substrates |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06186006A (en) * | 1992-12-21 | 1994-07-08 | Hitachi Ltd | Surface accuracy measuring method for substrate surface and original plate for surface accuracy measurement |
| US5277844A (en) * | 1993-03-29 | 1994-01-11 | Rainey Clifford S | Resistor composition |
| JP2002367804A (en) * | 2001-06-11 | 2002-12-20 | K-Tech Devices Corp | Resistor |
| US20040245507A1 (en) * | 2001-09-06 | 2004-12-09 | Atsushi Nagai | Conductor composition and method for production thereof |
| CN1216381C (en) * | 2002-12-30 | 2005-08-24 | 中国人民解放军国防科学技术大学 | Conductive sizing agent and its producing process for high-power thick-film circuit based on stainless steel substrate |
| CN1216380C (en) * | 2002-12-30 | 2005-08-24 | 中国人民解放军国防科学技术大学 | Resistance sizing agent and its producing process for high-power thick-film circuit based on stainless steel substrate |
| CN100386829C (en) * | 2004-07-28 | 2008-05-07 | 王克政 | PTC thick film curc uit controllable electric heating element |
-
2006
- 2006-07-28 CN CNB2006100367162A patent/CN100499942C/en active Active
-
2007
- 2007-07-23 WO PCT/CN2007/002226 patent/WO2008014680A1/en active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| CN1972535A (en) | 2007-05-30 |
| WO2008014680A1 (en) | 2008-02-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN100499942C (en) | Rare earth thick film circuit rare earth resistance pastes based on metal substrate and its preparation process | |
| CN100499940C (en) | Rare earth electrode slurry of rare earth thick film circuit based on metal plate and its preparation technology | |
| CN1937856B (en) | Rare earth basic-metal resistance size for metal base board based rare earth thick film circuit and its preparing process | |
| CN100499941C (en) | Rare earth medium slurry of rare earth thick film circuit based on metal plate and its preparation technology | |
| CN103716924B (en) | The preparation technology of aluminum bronze Cu+ composite base rare earth thick film circuit Intelligent electric-heating chip | |
| CN101106842B (en) | Thick film circuit heating part based on minicrystal glass base plate and its making technology | |
| CN106187141B (en) | A kind of CBS system LTCC material and preparation method thereof | |
| CN101321415B (en) | Rare earth thick film circuit electrical heating element based on aluminum nitride minicrystal ceramic substrates and its preparation technique | |
| CN101377966B (en) | Method for preparing leadless silver electrode slurry for glass substrates | |
| CN102685942B (en) | Intelligent electric-heating element with PTC (Positive Temperature Coefficient) rare-earth thick film circuit and preparation method thereof | |
| CN102158993B (en) | High-temperature aluminum alloy base rare earth thick film circuit electric heating element and preparation technology thereof | |
| CN101692410B (en) | Silver paste of MLCC terminal electrode | |
| CN1216380C (en) | Resistance sizing agent and its producing process for high-power thick-film circuit based on stainless steel substrate | |
| CN105810291A (en) | Rare-earth resistance paste of medium- and low-resistance high-power thick film circuit and preparation method of rare-earth resistance paste | |
| CN101439966A (en) | Preparation of stannic oxide electrode ceramic material | |
| CN101549957A (en) | Bi*O*-B*O* series lead-free glass powder for electronic slurry and preparation method thereof | |
| CN103730189A (en) | Metal substrate based sintering temperature adjustable thick film circuit resistor paste and preparation process thereof | |
| CN1215484C (en) | Medium sizing agent and its producing process for high-power thick-film circuit based on stainless steel substrate | |
| CN1216381C (en) | Conductive sizing agent and its producing process for high-power thick-film circuit based on stainless steel substrate | |
| CN104320866A (en) | Composite-material-based thick-film circuit rare earth electrode slurry and preparation process thereof | |
| CN106601332A (en) | High electric-heating conversion low temperature resistance slurry with electromagnetic purifying function and preparation method thereof | |
| CN105825910A (en) | Large-power low-temperature-coefficient thick-film heating element resistor slurry and preparation method thereof | |
| CN104318975A (en) | Composite-material-based thick-film circuit rare earth electrode slurry and preparation process thereof | |
| CN109448885A (en) | A kind of YH21CT stainless steel thick film circuit resistance slurry and preparation method thereof | |
| CN203632890U (en) | Aluminum bronze Cu+ composite backing rear earth thick film circuit intelligent electrothermal chip |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170930 Address after: 528000 room 3, No. 1, No. 2905, Jihua six road, Chancheng District, Guangdong, Foshan Patentee after: Guangdong Jiang Calvin Electronic Technology Co. Ltd. Address before: 528000 No. 13 Nanhua street, Chancheng District, Guangdong, Foshan Patentee before: Wang Kezheng |
|
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 528000 2 / F, block 4, No.1, South Huabao Road, Chancheng District, Foshan City, Guangdong Province Patentee after: Guangdong Yuchen Electronic Technology Co.,Ltd. Address before: 528000 room 2905, block 1, No.3, Jihua Sixth Road, Chancheng District, Foshan City, Guangdong Province Patentee before: Guangdong Jiang Calvin Electronic Technology Co.,Ltd. |