CN1937856B - Rare earth basic-metal resistance size for metal base board based rare earth thick film circuit and its preparing process - Google Patents
Rare earth basic-metal resistance size for metal base board based rare earth thick film circuit and its preparing process Download PDFInfo
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- CN1937856B CN1937856B CN2006100367158A CN200610036715A CN1937856B CN 1937856 B CN1937856 B CN 1937856B CN 2006100367158 A CN2006100367158 A CN 2006100367158A CN 200610036715 A CN200610036715 A CN 200610036715A CN 1937856 B CN1937856 B CN 1937856B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/14—Conductive material dispersed in non-conductive inorganic material
- H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
- H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
- H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component
- H01C17/06553—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component composed of a combination of metals and oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
- H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
- H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component
- H01C17/06533—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component composed of oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
- H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
- H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component
- H01C17/06533—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component composed of oxides
- H01C17/06546—Oxides of zinc or cadmium
Abstract
The invention discloses rare earth thick film circuit base metals rare earth resistor paste material based on metal substrate , whose characteristic is that the paste material is composed of the functional phase and the organic carriers, the ratio is: (0.65~0.85) : (35~15). The functional phase is composed of Cu-Zn-Yt composite powder and crystallite glass power, the ratio is: (75-55): (25 ~ 45).The weight ratio of the Cu-Zn-Yt composite powder is: (62~40): (35-45): (3-15). The preparation technics of the base metals rare earth resistor paste material: Preparation of crystallite glass power-Preparation of Cu-Zn-Yt composite powder- preparation of organic solvent carries -rare earth paste material integrated modulation. The invention has low square resistance, big resistance temperature coefficient which is controllable, the compatibility is good with humidity of the medium paste material and the conductive paste material, the rare earth thick film circuit base metals rare earth resistor paste material and its preparation technologies is applicable to the series of ferrite stainless steel substrate.
Description
Technical field
The present invention relates to thick film circuit rare earth resistance slurry and technology of preparing thereof based on metal substrate, be particularly related to based on the ferritic stainless steel series substrate, for example: GB trade mark 1Cr15,1Cr17,00Cr12 etc., large power thick film circuit rare earth resistance slurry and preparation technologies thereof such as external trade mark 429#, 430#, 410L#.
Background technology
At present, in field of electric heating, novel heating element wants that cube is little, power wants big, thermal inertia is little, surface thermal load wants big, power consumption is low, the heat efficiency wants high, warm start is fast, power stability, temperature field evenly, good manufacturability, body be from temperature control, safe and reliable to operation, life-span is long, wide accommodation.As earlier 2000s, du pont company has been used it for the stainless steel heat-generating disc of coffee pot and has been pushed Chinese market to, domestic research institutions also released the thick film circuit electric slurry that is used for stainless steel substrate in 2003 successively, but all use with a kind of substrate, same electron-like slurry, comprise dielectric paste, resistance slurry (silver-colored palladium), electrocondution slurry, technical costs, quality cost, product quality, range of application all is restricted, especially the dielectric paste preparation efficiency is low, electrical property, wettability is poor, resistance slurry stability is not good enough, cost can be in any more, the easy oxidation of electrode slurry, silver ion easily moves under the high temperature, and adhesive force is not firm etc.Till the present, the domestic rare earth thick film circuit that does not also have based on 1Cr15,1Cr17,00Cr12 (the external trade mark is 430#, 429#, 410L#) series stainless steel substrate, the relevant report of the document of rare earth metal electric slurry and technology of preparing thereof, patent and achievement.
Summary of the invention
It is little that purpose of the present invention is exactly a kind of side's resistance that provides for the deficiency that solves prior art, big temperature coefficient of resistance and controlled, with low cost, reliable in quality, good electrical properties and dielectric paste, the rare earth thick film circuit rare earth base metal resistor slurry that electrocondution slurry wettability compatibility is good based on metal substrate.
Another object of the present invention provides a kind of preparation method of above-mentioned rare earth resistance slurry.
The present invention adopts following technical scheme to realize above-mentioned purpose: the rare earth thick film circuit rare earth resistance pastes that the present invention is based on metal substrate, be made up of function phase component copper zinc yttrium composite powder and microcrystalline glass powder and organic solvent carrier, the weight ratio of function phase component and organic solvent carrier is: (65～85): (35～15).
Described function phase component copper zinc yttrium composite powder and microcrystalline glass powder are formed the solid phase composition, and the weight ratio of copper zinc yttrium composite powder and devitrified glass is in the solid phase composition: (75～55): (25～45).
The weight ratio of copper, zinc, yttrium is in the described copper zinc yttrium composite powder: (62～40): (35～45):
(3～15), the particle diameter of copper zinc yttrium composite powder is all less than 3 μ m; Copper zinc yttrium composite powder is the base metal slurry.
Described microcrystalline glass powder is CaO SiO
2-Al
2O
3-B
2O
3-Bi
2O
3-La
2O
3Microcrystalline glass in series.Each oxide weight ratio is: SiO
220～60%, Al
2O
35～35%, CaO10～35%, Bi
2O
310～30%, B
2O
31～10%, La
2O
30.3 TiO～12%,
21～8%, ZrO
21～10%.
The weight ratio of described each component of organic solvent carrier: terpinol 68～78%, tributyl citrate 2～18%, ethyl cellulose 0.4～9%, NC Nitroncellulose 0.4～9%, hydrogenation castor oil 0.1～6%, lecithin 0.1～6%.
The present invention is based on the preparation technology of the rare earth thick film circuit resistance slurry of metal substrate, it is characterized in that, it comprises following processing step:
At first prepare microcrystalline glass powder, copper zinc yttrium composite powder, dispose organic solvent carrier; Stand-by;
Carrying out the rare earth resistance slurry then comprehensively modulates: the function phase constituent is made up of copper zinc yttrium composite powder and microcrystalline glass powder, is in proportion: (75～55): (25～45); And by function mutually and organic solvent carrier composition, ratio is: (65～85): (35～15), and solid phase powder, the organic solvent carrier three-high mill of packing into is rolling; With viscosimeter testing size viscosity, viscosity number is 150～200PaS/RPM.
Wherein, the microcrystalline glass powder preparation is with following proportion raw material (weight % ratio) SiO
220～60%, Al
2O
35～35%, CaO10～35%, Bi
2O
310～30%, B
2O
31～10%, La
2O
30.3 TiO～12%,
21～8%, ZrO
21～10%, the crucible of packing into after in the three-dimensional blender machine, mixing, place the high-temperature smelting pot melting, smelting temperature is 1100～1450 ℃, be incubated after 1～3 hour, fast glass melts immersed shrend in the cold water, obtain little slag, with the little slag of the glass agate ball bucket of packing into, obtain particle diameter with star-like ball mill ball milling and constitute less than 3 microns glass micro mist.
Described copper zinc yttrium composite powder preparation technology is (62～40) with the weight ratio of following proportion raw material copper, zinc, yttrium powder: (35～45): (3～15); The particle diameter of copper zinc yttrium composite powder is all less than 3 μ m; The three-dimensional blender machine of packing into mixes and obtains composite powder, and it is stand-by to bottle.
The configuration of described organic solvent carrier: main solvent, thickener, surfactant, thixotropic agent, gelling agent etc. in the organic solvent carrier are dissolved a few hours by a certain percentage in 80～100 ℃ water.Various raw material weight proportionings are: terpinol 68～78%, tributyl citrate 2～18%, ethyl cellulose 0.4～9%, NC Nitroncellulose 0.4～9%, hydrogenation castor oil 0.1～6%, lecithin 0.1～6%.Adjust amount of thickener, the viscosity of organic solvent carrier is adjusted in the scope of 150～280mPas.
The features and advantages of the present invention are:
1, by domestic and international thick film circuit is researched and analysed with electric slurry physics, chemical property and processing performance, Rare Earth Lanthanum (La) and yttrium (Y) are mixed in decision in electric slurry, experimental results show that the function phase, bonding mutually in because the adding of Rare Earth Lanthanum and yttrium, the electrical property of slurry, wettability, intermiscibility, intermolecular linkage bond strength and manufacturability all improve a lot.By to SiO
2-Al
2O
3-CaO-Bi
2O
3-B
2O
3-La
2O
3Rare earth microcrystalline glass formula and preparation technology are determined in the dynamic analysis that the microcrystalline glass in series coefficient of expansion, vitrification point, glass transition temperature and forming core are grown up.Make it the coefficient of expansion and the metal substrate coupling of the resistor track layer that constitutes with the base metal composite powder, and, effectively reduce cost in conjunction with firm.
2, adopt rare-earth oxidation yttrium (Y
2O
3) and lanthanum (La) additive package, can reduce sintering temperature, acceleration of sintering improves technology, raises the efficiency, and saves the energy, and yttrium can strengthen stainless non-oxidizability and ductility, improves bond strength; In the Al-Zr alloy pulp, add a small amount of yttrium-rich RE, improve the alloy conductive rate; In copper base metal kirsite slurry, add yttrium, improve conductivity and mechanical strength, satisfy the requirement of thick film circuit low square resistance.
3, Rare Earth Lanthanum (La) is mixed and can greatly be changed sintering character, microstructure, density, phase composition and the physical and mechanical property of microcrystal glass material and function phase, thereby improve the strong bond strength of wettability, compatibility and molecule of dielectric strength, electric property, processing performance and the electric slurry of rare earth thick film circuit electric heating element, improve technology, significantly improve the product fine rate.
4, rare earth thick film circuit rare earth resistance pastes printing performance of the present invention, sintering character are good.With dielectric paste, conductor paste good wettability and intermiscibility are arranged.
5, based on heightened awareness to each organic solvent mechanism in the rare earth slurry, with the main solvent of different boiling and evaporation rate in proportion preparation rationally make slurry evenly volatilization and discharging in processes such as printing, oven dry, sintering, avoid solvent to concentrate volatilization to form defectives such as cracking, pin hole, effectively improve product qualified rate.
6, in the organic solvent prescription, select for use fine solvent such as hydrogenation castor oil to make thixotropic agent, make slurry have good thixotropy and anti-heavy effect to form good colloform texture.
The present invention joins rare earth function electric slurry and can not only prepare preparing on the metal substrate on devitrified glass, pottery and other metal and nonmetal substrate, can not only prepare in the plane, can also prepare on curved surface, and the purposes scope is quite extensive.
The technology of the present invention material does not need dependence on import, and 100% production domesticization reduces noble metal dosage, and with low cost, material consumption is few, and is energy-conservation.Meet the requirement of the new road toward industrialization (high in technological content, good in economic efficiency, low in resources consumption, low in the pollution of the environment) of the recycling economy that China advocates, and very strong foreign exchange earning prospect is arranged.
The present invention is by adjusting base metal slurry function phase constituent, content and sintering process, this rare earth resistance slurry can be compatible with dielectric paste with multiple metal substrate, and rare earth thick film circuit of the present invention is applicable to ferrite series stainless steel substrate with base metal rare earth resistance slurry and technology of preparing thereof.For example: GB trade mark 1Cr15,1Cr17,00Cr12 etc.External trade mark 429#, 430#, 410L# etc.
Each function is filled a prescription mutually and is all contained rare earth element yttrium (Y) and lanthanum (La).Owing to added rare earth metal yttrium and lanthanum, the compatibility of slurry, wettability, electrical property, manufacturability, adaptability have remarkable improvement to improve, and rare earth thick film circuit rare earth resistance pastes is gained the name thus.Application and Development based on the rare earth thick film circuit electric slurry success of metal substrate has ground-breaking innovative significance.By it is the development space that the Application and Development of copper (Cu) zinc (Zn) yttrium (Y) lanthanum (La) base metal resistor slurry has been expanded the thick film circuit electric heating element greatly.
Adjust function phase constituent, content and sintering process in formula range of the present invention, this resistance slurry can be compatible with multiple metal substrate dielectric paste.For example: aluminum oxide substrate (Al
2O
3), aluminium nitride (AIN) substrate, crystallite glass substrate, metal alloy aluminium, titanium alloy substrate etc.Rare earth thick film circuit of the present invention is applicable to ferrite series stainless steel substrate with rare earth resistance slurry and technology of preparing thereof.For example: GB trade mark 1Cr15,1Cr17,00Cr12 etc.; External trade mark 429#, 430#, 410L# etc.
Wherein metal substrate 1Cr15 (429#) 00Cr12 (410L#) is that 1Cr17 (430#) improves steel grade, and its manufacturability, (welding, bending) corrosion resistance, high-temperature oxidation, stability all are significantly increased than 1Cr17 (430#).
The electrical heating elements that has adopted base metal resistor slurry of the present invention be at present uniquely meet that volume is little, power is big, thermal inertia is little, surface thermal load is big, power consumption is low, the heat efficiency is high, warm start is fast, power stability, temperature field are even, good manufacturability, body be from temperature control, safe and reliable to operation, life-span is long, the electrical heating elements of the requirement of wide accommodation.
Embodiment
Embodiment one:
The present invention is based on the rare earth thick film circuit base metal rare earth resistance slurry and the fabricating technology thereof of metal substrate, the rare earth thick film circuit base metal rare earth resistance slurry that is used for 1Cr15 (429#) series stainless steel substrate, this resistance slurry function phase component copper zinc yttrium composite powder and microcrystalline glass powder and organic solvent carrier are formed, and its concrete Recipe is as follows:
1, microcrystalline glass powder prescription: SiO
226%, Al
2O
318%, CaO19%, Bi
2O
318%, B
2O
38%, La
2O
35%, TiO
24%, ZrO
22%.
2, microcrystalline glass powder preparation process: 1350 ℃ of heating conditions are incubated 150 minutes down.
3, preparation granulation: vibrator ball milling → star-like ball mill → powder granularity ≮ 3 μ m.
4, base metal composition prescription: the weight ratio of copper, zinc, yttrium composite powder is 58: 36: 6, copper, zinc, yttrium composite powder particle diameter ≮ 2 μ m.
5, organic solvent carrier compound dissolution process (weight portion): terpinol 72%, tributyl citrate 9%, ethyl cellulose 6%, NC Nitroncellulose 6%, hydrogenation castor oil 4%, lecithin 3%; Each component is mixed back water-bath 180 minutes in 80～90 ℃ of water temperatures by proportioning.
6, comprehensive size mixing technology: this slurry by function mutually and the organic solvent carrier form, ratio is 70: 30, carries out three-roll rolling after placing three-dimensional blender machine dispersed with stirring.
7, the base metal rare earth resistance slurry performance parameter of the embodiment of the invention:
1. electrical property:
| Side's resistance | Resolution | TCR/ppm/℃ | Aging intensity |
| 100±2mΩ/□ | 0.2mm | 1500±150ppm×10 -6/℃ | ＞10(N/mm 2) |
2. physical property
| Rheological behavior | Resistive layer thickness | Slurry viscosity | The unit consumption |
| The suitable wire mark of thixotroping | 12±2μm | 160±20Pas/10RPM | 88cm 2/ gram |
Embodiment two:
The present invention is based on the rare earth thick film circuit base metal rare earth resistance slurry and the fabricating technology thereof of metal substrate, the rare earth thick film circuit base metal rare earth resistance slurry that is used for 1Cr17 (430#) series stainless steel substrate: this resistance slurry function phase component copper zinc yttrium composite powder and microcrystalline glass powder and organic solvent carrier are formed, and its concrete Recipe is as follows:
1, microcrystalline glass powder prescription: SiO
228%, Al
2O
316%, CaO18%, Bi
2O
318%, B
2O
39%, La
2O
34%, TiO
24%, ZrO
23%.
2, microcrystalline glass powder preparation process: 1350 ℃ of heating conditions are incubated 150 minutes down.
3, preparation granulation: vibrator ball milling → star-like ball mill → powder granularity ≮ 3 μ m.
4, base metal composition prescription: the weight ratio of copper, zinc, yttrium composite powder is: 60: 35: 5, and copper, zinc, yttrium composite powder particle diameter ≮ 2 μ m.
5, organic solvent carrier compound dissolution process: terpinol 72%, tributyl citrate 9%, ethyl cellulose 6%, NC Nitroncellulose 6%, hydrogenation castor oil 4%, lecithin 3%, each component is mixed back water-bath 180 minutes in 80～90 ℃ of water temperatures by proportioning.
6, comprehensive size mixing technology: this slurry by function mutually and the organic solvent carrier form, ratio is 72: 28, carries out three-roll rolling after placing three-dimensional blender machine dispersed with stirring, usefulness viscosimeter testing size viscosity, viscosity number is 150～200PaS/RPM.
7, the base metal rare earth resistance slurry performance parameter of the embodiment of the invention:
1. electrical property:
| Side's resistance | Resolution | TCR/ppm/℃ | Aging intensity |
| 150±2mΩ/□ | 0.2mm | 1500±150ppm×10 -6/℃ | ＞10(N/mm 2) |
2. physical property
| Rheological behavior | Resistive layer thickness | Slurry viscosity | The unit consumption |
| The suitable wire mark of thixotroping | 12±2μm | 170±20Pas/10RPM | 88cm 2/ gram |
Claims (8)
- One kind based on the rare earth thick film circuit of metal substrate with rare earth base metal resistor slurry, it is characterized in that: it is made up of function phase component copper zinc yttrium composite powder and microcrystalline glass powder and organic solvent carrier, the weight ratio of function phase component and organic solvent carrier is (65～85): (35～15)The weight ratio of copper zinc yttrium composite powder and microcrystalline glass powder is (75～55) in the described function phase component: (25～45).
- 2. the rare earth base metal resistor slurry of the rare earth thick film circuit based on metal substrate according to claim 1, it is characterized in that: in the described copper zinc yttrium composite powder, the weight ratio of copper, zinc, yttrium is: (62～40): (35～45): (3～15), the particle diameter of copper zinc yttrium composite powder is all less than 3 μ m.
- 3. the rare earth base metal resistor slurry of the rare earth thick film circuit based on metal substrate according to claim 1, it is characterized in that: described microcrystalline glass powder is CaO-SiO 2-Al 2O 3-B 2O 3-Bi 2O 3-La 2O 3Microcrystalline glass in series; Each oxide weight ratio: SiO 220～60%, Al 2O 35～35%, CaO10～35%, Bi 2O 310～30%, B 2O 31～10%, La 2O 30.3 TiO～12%, 21～8%, ZrO 21～10%.
- 4. the rare earth base metal resistor slurry of the rare earth thick film circuit based on metal substrate according to claim 1 is characterized in that: the weight ratio of described each component of organic solvent carrier: terpinol 68～78%, tributyl citrate 2～18%, ethyl cellulose 0.4～9%, NC Nitroncellulose 0.4～9%, hydrogenation castor oil 0.1～6%, lecithin 0.1～6%.
- 5. use the preparation technology of rare earth base metal resistor slurry based on the rare earth thick film circuit of metal substrate, it is characterized in that: it comprises following processing step:At first prepare microcrystalline glass powder, copper zinc yttrium composite powder, dispose organic solvent carrier, stand-by;Carrying out the rare earth resistance slurry then comprehensively modulates: the function phase constituent is made up of copper zinc yttrium composite powder and microcrystalline glass powder, is by weight: (75～55): (25～45); And by function mutually and organic solvent carrier composition, weight ratio is: (65～85): (35～15), and solid phase powder, the organic solvent carrier three-high mill of packing into is rolling; With viscosimeter testing size viscosity, viscosity number is 150～200PaS/RPM.
- 6. the rare earth thick film circuit based on metal substrate according to claim 5 is with the preparation technology of rare earth base metal resistor slurry, and it is characterized in that: described microcrystalline glass powder preparation is by following raw material weight percentage proportioning: SiO 220～60%, Al 2O 35～35%, CaO10～35%, Bi 2O 310～30%, B 2O 31～10%, La 2O 30.3 TiO～12%, 21～8%, ZrO 21～10%, the crucible of packing into after in the three-dimensional blender machine, mixing, place the high-temperature smelting pot melting, smelting temperature is 1100～1450 ℃, be incubated after 1～3 hour, fast glass melts immersed shrend in the cold water, obtain little slag, with the little slag of the glass agate ball bucket of packing into, obtain particle diameter with star-like ball mill ball milling and constitute less than 3 microns glass micro mist.
- 7. the rare earth thick film circuit based on metal substrate according to claim 5 is with the preparation technology of rare earth base metal resistor slurry, and it is characterized in that: described copper zinc yttrium composite powder preparation technology is by following raw material proportioning: the weight ratio of copper, zinc, yttrium powder is (62～40): (35～45): (3～15); The particle diameter of copper zinc yttrium composite powder is all less than 3 μ m; The three-dimensional blender machine of packing into mixes and obtains composite powder, and it is stand-by to bottle;The configuration of described organic solvent carrier: main solvent, thickener, surfactant, thixotropic agent, gelling agent in the organic solvent carrier are dissolved a few hours in proportion in 80～100 ℃ water; Adjust amount of thickener, the viscosity of organic solvent carrier is adjusted in the scope of 150～280mPas.
- 8. the rare earth thick film circuit based on metal substrate according to claim 5 is with the preparation technology of rare earth base metal resistor slurry, and it is characterized in that: the configuration of described organic solvent carrier is that main solvent, thickener, surfactant, thixotropic agent, gelling agent in the organic solvent carrier are dissolved a few hours by a certain percentage in 80～100 ℃ water; Various raw material weight proportionings are: terpinol 68～78%, tributyl citrate 2～18%, ethyl cellulose 0.4～9%, NC Nitroncellulose 0.4～9%, hydrogenation castor oil 0.1～6%, lecithin 0.1～6%; Adjust amount of thickener, the viscosity of organic solvent carrier is adjusted in the scope of 150～280mPas.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2006100367158A CN1937856B (en) | 2006-07-28 | 2006-07-28 | Rare earth basic-metal resistance size for metal base board based rare earth thick film circuit and its preparing process |
| PCT/CN2007/002224 WO2008014678A1 (en) | 2006-07-28 | 2007-07-23 | Rare earth base-metal resistance slurry for rare earth thick-film circuit based on metal substrate and producing process thereof |
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|---|---|---|---|
| CN2006100367158A CN1937856B (en) | 2006-07-28 | 2006-07-28 | Rare earth basic-metal resistance size for metal base board based rare earth thick film circuit and its preparing process |
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|---|---|
| CN1937856A CN1937856A (en) | 2007-03-28 |
| CN1937856B true CN1937856B (en) | 2010-12-15 |
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| WO (1) | WO2008014678A1 (en) |
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| CN101868064B (en) * | 2010-06-21 | 2012-01-25 | 陕西科技大学 | Environment-friendly graphite resistance paste and preparation method thereof |
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| CN102685942B (en) * | 2012-05-29 | 2014-05-07 | 王克政 | Intelligent electric-heating element with PTC (Positive Temperature Coefficient) rare-earth thick film circuit and preparation method thereof |
| CN104575670B (en) * | 2013-10-23 | 2017-02-22 | 宁波市万泓电器科技有限公司 | Resistance paste of substrate thick film circuit and preparation method of resistance paste |
| CN104318979A (en) * | 2014-09-19 | 2015-01-28 | 王晨 | Composite-material-based thick-film circuit rare earth electrode slurry and preparation process thereof |
| CN104916345B (en) * | 2015-05-25 | 2017-06-13 | 电子科技大学 | A kind of thick-film resistor paste and preparation method thereof |
| CN105472791A (en) * | 2015-12-23 | 2016-04-06 | 东莞珂洛赫慕电子材料科技有限公司 | Rare earth-doped semiconductor infrared radiation thick-film electronic paste and preparation method therefor |
| CN105810291A (en) * | 2016-04-07 | 2016-07-27 | 东莞珂洛赫慕电子材料科技有限公司 | Rare-earth resistance paste of medium- and low-resistance high-power thick film circuit and preparation method of rare-earth resistance paste |
| CN106131982A (en) * | 2016-07-08 | 2016-11-16 | 东莞珂洛赫慕电子材料科技有限公司 | A kind of high temperature high power rare earth resistance slurry and preparation method thereof |
| CN108314895A (en) * | 2018-02-06 | 2018-07-24 | 合肥东恒锐电子科技有限公司 | It is a kind of to glue weather-proof high steady environment-friendlyresistance resistance paste and preparation method thereof by force |
| CN110519870B (en) * | 2018-05-21 | 2020-06-26 | 中南大学 | Graphene/base metal alloy conductive material, resistance paste, heating element, preparation and application thereof |
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| JPS5928546A (en) * | 1982-08-05 | 1984-02-15 | Furukawa Electric Co Ltd:The | Copper alloy for radiator fin of automobile |
| JPS6017041A (en) * | 1983-07-08 | 1985-01-28 | Sumitomo Electric Ind Ltd | Electrode wire for wire-cut electric spark machining |
| JPS61130475A (en) * | 1984-11-29 | 1986-06-18 | Inoue Japax Res Inc | Manufacture of high tension copper alloy material |
| JP3105392B2 (en) * | 1994-03-18 | 2000-10-30 | 同和鉱業株式会社 | Manufacturing method of copper base alloy for connector |
| JP2002367804A (en) * | 2001-06-11 | 2002-12-20 | K-Tech Devices Corp | Resistor |
| CN1215484C (en) * | 2002-12-30 | 2005-08-17 | 中国人民解放军国防科学技术大学 | Medium sizing agent and its producing process for high-power thick-film circuit based on stainless steel substrate |
| CN1216381C (en) * | 2002-12-30 | 2005-08-24 | 中国人民解放军国防科学技术大学 | Conductive sizing agent and its producing process for high-power thick-film circuit based on stainless steel substrate |
| CN100386829C (en) * | 2004-07-28 | 2008-05-07 | 王克政 | PTC thick film curc uit controllable electric heating element |
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2006
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2007
- 2007-07-23 WO PCT/CN2007/002224 patent/WO2008014678A1/en active Application Filing
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1424727A (en) * | 2002-12-30 | 2003-06-18 | 中国人民解放军国防科学技术大学 | Resistance sizing agent and its producing process for high-power thick-film circuit based on stainless steel substrate |
| CN1490376A (en) * | 2003-09-01 | 2004-04-21 | 王培英 | Semiconductive ceramic thick film heating material |
Also Published As
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| WO2008014678A1 (en) | 2008-02-07 |
| CN1937856A (en) | 2007-03-28 |
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