CN100475000C - 电子电路模块及其组装方法 - Google Patents
电子电路模块及其组装方法 Download PDFInfo
- Publication number
- CN100475000C CN100475000C CN02827909.3A CN02827909A CN100475000C CN 100475000 C CN100475000 C CN 100475000C CN 02827909 A CN02827909 A CN 02827909A CN 100475000 C CN100475000 C CN 100475000C
- Authority
- CN
- China
- Prior art keywords
- substrate
- load plate
- circuit
- circuit module
- accordance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01068—Erbium [Er]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10371—Shields or metal cases
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/049—Wire bonding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1509—Horizontally held PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49016—Antenna or wave energy "plumbing" making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Combinations Of Printed Boards (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Automatic Assembly (AREA)
- Credit Cards Or The Like (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
Description
Claims (26)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10160041A DE10160041A1 (de) | 2001-12-06 | 2001-12-06 | Elektronisches Schaltungsmodul und Verfahren zu dessen Montage |
DE10160041.0 | 2001-12-06 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1618261A CN1618261A (zh) | 2005-05-18 |
CN100475000C true CN100475000C (zh) | 2009-04-01 |
Family
ID=7708313
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN02827909.3A Expired - Fee Related CN100475000C (zh) | 2001-12-06 | 2002-12-06 | 电子电路模块及其组装方法 |
Country Status (7)
Country | Link |
---|---|
US (2) | US20050128692A1 (zh) |
EP (1) | EP1464211B8 (zh) |
CN (1) | CN100475000C (zh) |
AT (1) | ATE321438T1 (zh) |
AU (1) | AU2002365778A1 (zh) |
DE (2) | DE10160041A1 (zh) |
WO (1) | WO2003049513A1 (zh) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10327767A1 (de) * | 2003-06-18 | 2005-01-05 | Marconi Communications Gmbh | Schaltungsbaugruppe und Herstellungsverfahren dafür |
DE102006021569A1 (de) * | 2006-02-09 | 2007-08-16 | Rohde & Schwarz Gmbh & Co. Kg | Prüfsystem für einen Schaltungsträger |
EP2635097B1 (en) * | 2012-02-28 | 2021-07-07 | Electrolux Home Products Corporation N.V. | An electric and/or electronic circuit including a printed circuit board, a separate circuit board and a power connector |
USD745476S1 (en) * | 2012-10-19 | 2015-12-15 | Solumatics CVBA | Print board |
US8872328B2 (en) * | 2012-12-19 | 2014-10-28 | General Electric Company | Integrated power module package |
USD753073S1 (en) * | 2014-12-30 | 2016-04-05 | Altia Systems, Inc. | Printed circuit board |
CN107770956A (zh) * | 2016-08-16 | 2018-03-06 | 光宝电子(广州)有限公司 | 电路板结构 |
USD804437S1 (en) * | 2016-09-30 | 2017-12-05 | Norton (Waterford) Limited | Circuit board |
TWD189065S (zh) * | 2017-02-17 | 2018-03-11 | 三星電子股份有限公司 | 固態硬碟儲存裝置 |
TWD190983S (zh) * | 2017-02-17 | 2018-06-11 | 三星電子股份有限公司 | 固態硬碟儲存裝置 |
TWD189068S (zh) * | 2017-02-17 | 2018-03-11 | 三星電子股份有限公司 | 固態硬碟儲存裝置 |
TWD189070S (zh) * | 2017-02-17 | 2018-03-11 | 三星電子股份有限公司 | 固態硬碟儲存裝置 |
TWD189066S (zh) * | 2017-02-17 | 2018-03-11 | 三星電子股份有限公司 | 固態硬碟儲存裝置 |
TWD189071S (zh) * | 2017-02-17 | 2018-03-11 | 三星電子股份有限公司 | 固態硬碟儲存裝置 |
TWD189069S (zh) * | 2017-02-17 | 2018-03-11 | 三星電子股份有限公司 | 固態硬碟儲存裝置 |
TWD189067S (zh) * | 2017-02-17 | 2018-03-11 | 三星電子股份有限公司 | 固態硬碟儲存裝置 |
USD894018S1 (en) | 2017-05-31 | 2020-08-25 | D6 Inc. | Container |
USD848383S1 (en) * | 2017-07-13 | 2019-05-14 | Fat Shark Technology SEZC | Printed circuit board |
USD869470S1 (en) * | 2018-04-09 | 2019-12-10 | Samsung Electronics Co., Ltd. | SSD storage device |
USD869469S1 (en) * | 2018-04-09 | 2019-12-10 | Samsung Electronics Co., Ltd. | SSD storage device |
USD915310S1 (en) * | 2019-02-12 | 2021-04-06 | Analog Devices, Inc. | Circuit board |
USD918836S1 (en) * | 2019-06-17 | 2021-05-11 | Sang Hoon Shin | Ionizing coil frame locating ribs |
USD909319S1 (en) * | 2020-07-08 | 2021-02-02 | Impact Ip, Llc | Circuit board |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3113031A1 (de) * | 1981-04-01 | 1982-10-21 | Hagenuk GmbH, 2300 Kiel | "handhabungsvorrichtung fuer leiterplatten" |
US4426773A (en) * | 1981-05-15 | 1984-01-24 | General Electric Ceramics, Inc. | Array of electronic packaging substrates |
US5044615A (en) * | 1991-02-08 | 1991-09-03 | International Business Machines Corporation | Dual purpose work board holder |
US5142239A (en) * | 1991-05-20 | 1992-08-25 | Motorola, Inc. | High frequency linear amplifier assembly |
US6219908B1 (en) * | 1991-06-04 | 2001-04-24 | Micron Technology, Inc. | Method and apparatus for manufacturing known good semiconductor die |
US5210941A (en) * | 1991-07-19 | 1993-05-18 | Poly Circuits, Inc. | Method for making circuit board having a metal support |
US5479694A (en) * | 1993-04-13 | 1996-01-02 | Micron Technology, Inc. | Method for mounting integrated circuits onto printed circuit boards and testing |
JP3157362B2 (ja) * | 1993-09-03 | 2001-04-16 | 株式会社東芝 | 半導体装置 |
US5457605A (en) * | 1993-11-23 | 1995-10-10 | Motorola, Inc. | Electronic device having coplanar heatsink and electrical contacts |
JP3225457B2 (ja) * | 1995-02-28 | 2001-11-05 | 株式会社日立製作所 | 半導体装置 |
DE19511486A1 (de) * | 1995-03-29 | 1996-10-02 | Bosch Gmbh Robert | Verfahren zur Herstellung einer Leiterplattenanordnung |
JP2001244279A (ja) * | 2000-02-25 | 2001-09-07 | Nec Niigata Ltd | 基板の供給方法、基板供給装置、チップ供給装置およびチップ実装装置 |
US20030111494A1 (en) * | 2001-10-26 | 2003-06-19 | Sequenom, Inc. | Method and apparatus for high-throughput sample handling process line |
JP2004119637A (ja) * | 2002-09-25 | 2004-04-15 | Fuji Mach Mfg Co Ltd | 電子部品実装方法、電子部品実装装置および電子部品実装プログラム |
-
2001
- 2001-12-06 DE DE10160041A patent/DE10160041A1/de not_active Withdrawn
-
2002
- 2002-12-06 AT AT02790654T patent/ATE321438T1/de not_active IP Right Cessation
- 2002-12-06 AU AU2002365778A patent/AU2002365778A1/en not_active Abandoned
- 2002-12-06 WO PCT/IB2002/005720 patent/WO2003049513A1/en not_active Application Discontinuation
- 2002-12-06 EP EP02790654A patent/EP1464211B8/en not_active Expired - Lifetime
- 2002-12-06 CN CN02827909.3A patent/CN100475000C/zh not_active Expired - Fee Related
- 2002-12-06 US US10/498,280 patent/US20050128692A1/en not_active Abandoned
- 2002-12-06 DE DE60210135T patent/DE60210135T2/de not_active Expired - Lifetime
-
2007
- 2007-09-06 US US11/899,563 patent/US20070294889A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
CN1618261A (zh) | 2005-05-18 |
WO2003049513A1 (en) | 2003-06-12 |
EP1464211B8 (en) | 2006-08-16 |
US20070294889A1 (en) | 2007-12-27 |
EP1464211B1 (en) | 2006-03-22 |
DE60210135D1 (de) | 2006-05-11 |
US20050128692A1 (en) | 2005-06-16 |
DE60210135T2 (de) | 2007-04-12 |
ATE321438T1 (de) | 2006-04-15 |
AU2002365778A1 (en) | 2003-06-17 |
EP1464211A1 (en) | 2004-10-06 |
DE10160041A1 (de) | 2003-09-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: L.M. ERICSSON CO., LTD. Free format text: FORMER OWNER: MARCONI COMMUNICATIONS GMBH Effective date: 20070420 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20070420 Address after: Stockholm Applicant after: Erisson Address before: German buchnan Applicant before: Marconi Communications GmbH |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090401 Termination date: 20161206 |
|
CF01 | Termination of patent right due to non-payment of annual fee |