TWD190983S - 固態硬碟儲存裝置 - Google Patents

固態硬碟儲存裝置

Info

Publication number
TWD190983S
TWD190983S TW106304668F TW106304668F TWD190983S TW D190983 S TWD190983 S TW D190983S TW 106304668 F TW106304668 F TW 106304668F TW 106304668 F TW106304668 F TW 106304668F TW D190983 S TWD190983 S TW D190983S
Authority
TW
Taiwan
Prior art keywords
storage device
design
ssd storage
item
ssd
Prior art date
Application number
TW106304668F
Other languages
English (en)
Inventor
任洸萬
尹恩振
兪赫濬
Original Assignee
三星電子股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三星電子股份有限公司 filed Critical 三星電子股份有限公司
Publication of TWD190983S publication Critical patent/TWD190983S/zh

Links

Abstract

【物品用途】;本設計物品是一種固態硬碟(Solid State Drive,簡稱SSD)儲存裝置,其經由使用半導體來儲存資料於其內。;【設計說明】;圖式所揭露之虛線部分,為本案不主張設計之部分。

Description

固態硬碟儲存裝置
本設計物品是一種固態硬碟(Solid State Drive,簡稱SSD)儲存裝置,其經由使用半導體來儲存資料於其內。
圖式所揭露之虛線部分,為本案不主張設計之部分。
TW106304668F 2017-02-17 2017-08-16 固態硬碟儲存裝置 TWD190983S (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20170007652 2017-02-17
??30-2017-0007652 2017-02-17

Publications (1)

Publication Number Publication Date
TWD190983S true TWD190983S (zh) 2018-06-11

Family

ID=63111784

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106304668F TWD190983S (zh) 2017-02-17 2017-08-16 固態硬碟儲存裝置

Country Status (3)

Country Link
US (1) USD848432S1 (zh)
JP (1) JP1611022S (zh)
TW (1) TWD190983S (zh)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD869470S1 (en) * 2018-04-09 2019-12-10 Samsung Electronics Co., Ltd. SSD storage device
USD869469S1 (en) * 2018-04-09 2019-12-10 Samsung Electronics Co., Ltd. SSD storage device
USD951937S1 (en) * 2018-12-06 2022-05-17 Samsung Electronics Co., Ltd. Solid state drive storage device
US11251507B2 (en) 2019-04-26 2022-02-15 The Noco Company Battery
USD944219S1 (en) * 2019-09-09 2022-02-22 The Noco Company Circuit board
USD949117S1 (en) * 2019-09-09 2022-04-19 The Noco Company Circuit board
USD1032499S1 (en) 2019-09-09 2024-06-25 The Noco Company Battery
USD1009777S1 (en) 2019-09-09 2024-01-02 The Noco Company Battery
USD938374S1 (en) * 2019-09-09 2021-12-14 The Noco Company Circuit board
USD958762S1 (en) * 2019-09-09 2022-07-26 The Noco Company Circuit board
USD956707S1 (en) * 2019-09-26 2022-07-05 Lapis Semiconductor Co., Ltd. Circuit board
USD1010591S1 (en) * 2021-01-22 2024-01-09 The Noco Company Circuit board
USD1012872S1 (en) * 2021-01-22 2024-01-30 The Noco Company Circuit board
USD1009815S1 (en) * 2021-01-22 2024-01-02 The Noco Company Circuit board

Family Cites Families (118)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4936785A (en) * 1988-12-19 1990-06-26 Krug Eric M Interchangeable adapter module for electronic devices
US5224023A (en) * 1992-02-10 1993-06-29 Smith Gary W Foldable electronic assembly module
US6036098A (en) * 1992-05-15 2000-03-14 Symbol Technologies, Inc. Miniature scan element operably connected to a personal computer interface card
US5347428A (en) * 1992-12-03 1994-09-13 Irvine Sensors Corporation Module comprising IC memory stack dedicated to and structurally combined with an IC microprocessor chip
US5303121A (en) * 1992-12-28 1994-04-12 Ncr Corporation Multi-chip module board
USD370464S (en) * 1994-11-30 1996-06-04 Metropage, Inc. Heat seal connector for a pager
US5933623A (en) * 1995-10-26 1999-08-03 Hitachi, Ltd. Synchronous data transfer system
US6021048A (en) * 1998-02-17 2000-02-01 Smith; Gary W. High speed memory module
US6008994A (en) * 1998-08-04 1999-12-28 Itt Manufacturing Enterprises, Inc. PC card grounding clip
US6025992A (en) * 1999-02-11 2000-02-15 International Business Machines Corp. Integrated heat exchanger for memory module
US6381140B1 (en) * 1999-08-30 2002-04-30 Witek Enterprise Co., Ltd. Memory module
USD432096S (en) * 1999-11-24 2000-10-17 Samsung Electronics Co., Ltd. Semiconductor module
JP4569913B2 (ja) * 2000-03-10 2010-10-27 エルピーダメモリ株式会社 メモリモジュール
US6757751B1 (en) * 2000-08-11 2004-06-29 Harrison Gene High-speed, multiple-bank, stacked, and PCB-mounted memory module
US6576972B1 (en) * 2000-08-24 2003-06-10 Heetronix High temperature circuit structures with expansion matched SiC, AlN and/or AlxGa1-xN(x>0.69) circuit device
US7103694B2 (en) * 2000-09-08 2006-09-05 Hewlett-Packard Development Company, L.P. Method and apparatus implementing a tuned stub SCSI topology
KR100340285B1 (ko) * 2000-10-24 2002-06-15 윤종용 복수의 인쇄회로기판이 상호 직렬 접속된 메모리 모듈
US6535387B2 (en) * 2001-06-28 2003-03-18 Intel Corporation Heat transfer apparatus
US6956284B2 (en) * 2001-10-26 2005-10-18 Staktek Group L.P. Integrated circuit stacking system and method
US20030097506A1 (en) * 2001-11-20 2003-05-22 Aaeon Technology Inc. Structure of the bus card of the mini image port
WO2003049518A1 (fr) * 2001-12-04 2003-06-12 Tokyo R & D Co., Ltd. Alimentation de courant
DE10160041A1 (de) * 2001-12-06 2003-09-25 Marconi Comm Gmbh Elektronisches Schaltungsmodul und Verfahren zu dessen Montage
US6590282B1 (en) * 2002-04-12 2003-07-08 Industrial Technology Research Institute Stacked semiconductor package formed on a substrate and method for fabrication
US6762942B1 (en) * 2002-09-05 2004-07-13 Gary W. Smith Break away, high speed, folded, jumperless electronic assembly
JP4221238B2 (ja) * 2002-09-26 2009-02-12 エルピーダメモリ株式会社 メモリモジュール
US6812555B2 (en) * 2003-03-10 2004-11-02 Everstone Industry Corp. Memory card substrate with alternating contacts
JP2005123503A (ja) * 2003-10-20 2005-05-12 Renesas Technology Corp 半導体装置および半導体モジュール
TW200515843A (en) * 2003-10-27 2005-05-01 Benq Corp Electronic apparatus with module-locking device
JP2005191147A (ja) * 2003-12-24 2005-07-14 Sanyo Electric Co Ltd 混成集積回路装置の製造方法
JP2005191148A (ja) * 2003-12-24 2005-07-14 Sanyo Electric Co Ltd 混成集積回路装置およびその製造方法
DE102004009055B4 (de) * 2004-02-23 2006-01-26 Infineon Technologies Ag Kühlanordnung für Geräte mit Leistungshalbleitern und Verfahren zum Kühlen derartiger Geräte
US7532537B2 (en) * 2004-03-05 2009-05-12 Netlist, Inc. Memory module with a circuit providing load isolation and memory domain translation
US7516281B2 (en) * 2004-05-25 2009-04-07 Micron Technology, Inc. On-die termination snooping for 2T applications in a memory system implementing non-self-terminating ODT schemes
US7423885B2 (en) * 2004-09-03 2008-09-09 Entorian Technologies, Lp Die module system
US7468893B2 (en) * 2004-09-03 2008-12-23 Entorian Technologies, Lp Thin module system and method
US20060050492A1 (en) * 2004-09-03 2006-03-09 Staktek Group, L.P. Thin module system and method
US7324352B2 (en) * 2004-09-03 2008-01-29 Staktek Group L.P. High capacity thin module system and method
US7579687B2 (en) * 2004-09-03 2009-08-25 Entorian Technologies, Lp Circuit module turbulence enhancement systems and methods
US20060261449A1 (en) * 2005-05-18 2006-11-23 Staktek Group L.P. Memory module system and method
US7542297B2 (en) * 2004-09-03 2009-06-02 Entorian Technologies, Lp Optimized mounting area circuit module system and method
US7606050B2 (en) * 2004-09-03 2009-10-20 Entorian Technologies, Lp Compact module system and method
US7606049B2 (en) * 2004-09-03 2009-10-20 Entorian Technologies, Lp Module thermal management system and method
US20060049513A1 (en) * 2004-09-03 2006-03-09 Staktek Group L.P. Thin module system and method with thermal management
US7215551B2 (en) * 2004-09-29 2007-05-08 Super Talent Electronics, Inc. Memory module assembly including heat sink attached to integrated circuits by adhesive
US7299313B2 (en) * 2004-10-29 2007-11-20 International Business Machines Corporation System, method and storage medium for a memory subsystem command interface
US7869218B2 (en) * 2004-11-16 2011-01-11 Super Talent Electronics, Inc. Light-weight solid state drive with rivet sets
US7269025B2 (en) * 2004-12-30 2007-09-11 Intel Corporation Ballout for buffer
DE102005005064B4 (de) * 2005-02-03 2006-12-21 Infineon Technologies Ag Halbleiterspeichermodul mit Busarchitektur
US7519894B2 (en) * 2005-06-14 2009-04-14 Infineon Technologies Ag Memory device with error correction code module
US8796830B1 (en) * 2006-09-01 2014-08-05 Google Inc. Stackable low-profile lead frame package
US8081474B1 (en) * 2007-12-18 2011-12-20 Google Inc. Embossed heat spreader
DE102005033710B3 (de) * 2005-07-19 2007-01-25 Infineon Technologies Ag Halbleiterspeichermodul mit Fehlerkorrektur
US7442050B1 (en) * 2005-08-29 2008-10-28 Netlist, Inc. Circuit card with flexible connection for memory module with heat spreader
US7365990B2 (en) * 2005-12-19 2008-04-29 Infineon Technologies Ag Circuit board arrangement including heat dissipater
US7511969B2 (en) * 2006-02-02 2009-03-31 Entorian Technologies, Lp Composite core circuit module system and method
US7619893B1 (en) * 2006-02-17 2009-11-17 Netlist, Inc. Heat spreader for electronic modules
US7429788B2 (en) * 2006-03-08 2008-09-30 Microelectronics Assembly Technologies, Inc. Thin multichip flex-module
US7393226B2 (en) * 2006-03-08 2008-07-01 Microelectronics Assembly Technologies, Inc. Thin multichip flex-module
US7520781B2 (en) * 2006-03-08 2009-04-21 Microelectronics Assembly Technologies Thin multichip flex-module
US7394149B2 (en) * 2006-03-08 2008-07-01 Microelectronics Assembly Technologies, Inc. Thin multichip flex-module
CN101043789B (zh) * 2006-03-25 2010-05-12 富准精密工业(深圳)有限公司 散热装置
CN101083362A (zh) * 2006-05-31 2007-12-05 富士康(昆山)电脑接插件有限公司 扣持装置及具有该装置的卡缘连接器
KR100818621B1 (ko) * 2006-08-11 2008-04-01 삼성전자주식회사 메모리 모듈, 메모리 모듈용 소켓 및 그를 구비한 메인보드
US7590899B2 (en) * 2006-09-15 2009-09-15 International Business Machines Corporation Processor memory array having memory macros for relocatable store protect keys
US7477522B2 (en) * 2006-10-23 2009-01-13 International Business Machines Corporation High density high reliability memory module with a fault tolerant address and command bus
US7612446B2 (en) * 2006-11-22 2009-11-03 International Business Machines Corporation Structures to enhance cooling of computer memory modules
US7474529B2 (en) * 2006-11-29 2009-01-06 International Business Machines Corporation Folded-sheet-metal heatsinks for closely packaged heat-producing devices
JP4389228B2 (ja) * 2006-11-29 2009-12-24 エルピーダメモリ株式会社 メモリモジュール
TW200825931A (en) * 2006-12-11 2008-06-16 Kreton Corp Memory packaging element and insert card module using the memory packaging element
CN101206603A (zh) * 2006-12-22 2008-06-25 鸿富锦精密工业(深圳)有限公司 基于pci的ad信号接口卡
DE102007019117B4 (de) * 2007-04-23 2009-01-22 Qimonda Ag Speichermodul
US7839712B2 (en) * 2007-08-03 2010-11-23 Qimonda Ag Semiconductor memory arrangement
US20090086448A1 (en) * 2007-09-27 2009-04-02 Hiew Siew S Solid state drive with coverless casing
KR20090051640A (ko) * 2007-11-19 2009-05-22 삼성전자주식회사 반도체 소자용 히트싱크 및 이를 포함하는 반도체 모듈
US7872483B2 (en) * 2007-12-12 2011-01-18 Samsung Electronics Co., Ltd. Circuit board having bypass pad
TWI439843B (zh) * 2008-04-23 2014-06-01 Ibm 基於安置之踏板而自動選擇儲存配置之印刷電路組件
US8018723B1 (en) * 2008-04-30 2011-09-13 Netlist, Inc. Heat dissipation for electronic modules
US20100049914A1 (en) * 2008-08-20 2010-02-25 Goodwin Paul M RAID Enhanced solid state drive
US7682179B1 (en) * 2008-09-09 2010-03-23 Chou Hsien Tsai Electrical connector having elastic card-ejecting member
JP2010079445A (ja) * 2008-09-24 2010-04-08 Toshiba Corp Ssd装置
JP2010282511A (ja) * 2009-06-05 2010-12-16 Elpida Memory Inc メモリモジュール及びこれを備えるメモリシステム
WO2010144097A1 (en) * 2009-06-12 2010-12-16 Hewlett-Packard Development Company, L.P. Hierarchical on-chip memory
US20110019370A1 (en) * 2009-07-27 2011-01-27 Gainteam Holdings Limited Flexible circuit module
US8014144B2 (en) * 2009-08-18 2011-09-06 Inventec Corporation Server device with a storage array module
JP5649293B2 (ja) * 2009-08-27 2015-01-07 ピーエスフォー ルクスコ エスエイアールエルPS4 Luxco S.a.r.l. メモリモジュール
US8463979B2 (en) * 2009-09-08 2013-06-11 Ocz Technology Group Inc. Non-volatile storage devices, methods of addressing, and control logic therefor
JP2011090441A (ja) * 2009-10-21 2011-05-06 Elpida Memory Inc メモリモジュール
JP5686424B2 (ja) * 2010-06-16 2015-03-18 ヒューレット−パッカード デベロップメント カンパニー エル.ピー.Hewlett‐Packard Development Company, L.P. コンピュータラック
USD637192S1 (en) * 2010-10-18 2011-05-03 Apple Inc. Electronic device
USD637193S1 (en) * 2010-11-19 2011-05-03 Apple Inc. Electronic device
US8675355B2 (en) * 2011-03-16 2014-03-18 Lenovo (Singapore) Pte. Ltd. Release mechanism with pre-travel
USD673922S1 (en) * 2011-04-21 2013-01-08 Kabushiki Kaisha Toshiba Portion of a substrate for an electronic circuit
USD673921S1 (en) * 2011-04-21 2013-01-08 Kabushiki Kaisha Toshiba Portion of a substrate for an electronic circuit
JP2013171337A (ja) * 2012-02-17 2013-09-02 Toshiba Corp メモリシステムとその試験方法
USD716310S1 (en) * 2012-06-09 2014-10-28 Apple, Inc. Electronic device
USD709894S1 (en) * 2012-09-22 2014-07-29 Apple Inc. Electronic device
US9904333B2 (en) * 2012-10-18 2018-02-27 Apple Inc. SSD (solid state drive) related features of a portable computer
US20140146462A1 (en) * 2012-11-26 2014-05-29 Giovanni Coglitore High Density Storage Applicance
USD716743S1 (en) * 2014-03-25 2014-11-04 Transcend Information, Inc. Printed circuit board of solid-state memory
JP1520122S (zh) 2014-05-15 2015-03-23
USD769833S1 (en) * 2014-08-29 2016-10-25 Apple Inc. Component for electronic device
US9934825B2 (en) * 2014-12-12 2018-04-03 Toshiba Memory Corporation Semiconductor device and electronic device
USD753073S1 (en) * 2014-12-30 2016-04-05 Altia Systems, Inc. Printed circuit board
JP1528485S (zh) * 2015-01-14 2015-07-13
JP1528484S (zh) 2015-01-14 2015-07-13
JP1528936S (zh) * 2015-01-14 2015-07-13
JP6381480B2 (ja) * 2015-05-12 2018-08-29 東芝メモリ株式会社 半導体装置
JP2017022241A (ja) * 2015-07-09 2017-01-26 株式会社東芝 半導体装置及び電子機器
TWD179882S (zh) * 2016-06-20 2016-12-01 全何科技股份有限公司 固態硬碟
USD798251S1 (en) * 2016-11-07 2017-09-26 Transcend Information, Inc. Printed circuit board of solid-state memory
TWD189070S (zh) 2017-02-17 2018-03-11 三星電子股份有限公司 固態硬碟儲存裝置
TWD189071S (zh) 2017-02-17 2018-03-11 三星電子股份有限公司 固態硬碟儲存裝置
TWD189069S (zh) * 2017-02-17 2018-03-11 三星電子股份有限公司 固態硬碟儲存裝置
TWD189065S (zh) * 2017-02-17 2018-03-11 三星電子股份有限公司 固態硬碟儲存裝置
TWD189067S (zh) * 2017-02-17 2018-03-11 三星電子股份有限公司 固態硬碟儲存裝置
TWD189066S (zh) * 2017-02-17 2018-03-11 三星電子股份有限公司 固態硬碟儲存裝置
TWD189068S (zh) * 2017-02-17 2018-03-11 三星電子股份有限公司 固態硬碟儲存裝置
TWD189064S (zh) 2017-02-17 2018-03-11 三星電子股份有限公司 固態硬碟儲存裝置

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Publication number Publication date
USD848432S1 (en) 2019-05-14
JP1611022S (zh) 2018-08-13

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