CN100460798C - 一种均温回路热管装置 - Google Patents

一种均温回路热管装置 Download PDF

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CN100460798C
CN100460798C CNB2007100280445A CN200710028044A CN100460798C CN 100460798 C CN100460798 C CN 100460798C CN B2007100280445 A CNB2007100280445 A CN B2007100280445A CN 200710028044 A CN200710028044 A CN 200710028044A CN 100460798 C CN100460798 C CN 100460798C
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temperature
heat pipe
pipe device
evenness
loop heat
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吕树申
金积德
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Sun Yat Sen University
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Priority to PCT/CN2008/000898 priority patent/WO2008138216A1/zh
Priority to AU2008250879A priority patent/AU2008250879B2/en
Priority to CA2687005A priority patent/CA2687005C/en
Priority to EP08748456A priority patent/EP2154461A1/en
Priority to US12/599,786 priority patent/US20100300656A1/en
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/043—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure forming loops, e.g. capillary pumped loops
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/06—Control arrangements therefor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/124—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and being formed of pins
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/14—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally
    • F28F1/20—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally the means being attachable to the element
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/30—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means being attachable to the element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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Abstract

本发明公开了一种均温回路热管装置，它包括设有蒸发器和冷凝器的回路热管装置及均温器，均温器设置在回路热管装置蒸发器的蒸发端上，均温器内表面覆盖有金属网，金属网内包覆着留有通气孔的金属板，金属板上下表面均设有支撑柱，均温器内均填充有液体。本发明吸收了现有回路热管良好的传热性能，并增加了均温器，可将电子芯片的高热流密度集中点快速均衡分散，以降低芯片表面温度，使芯片的运用扩展至更高的积集度和更高速度下的运作。在均温器与回路热管装置结合的基础上，变换冷凝方式，温控翅片与冷凝翅片结合使用，提高***对温度控制的灵活性和精确度。

Description

一种均温回路热管装置
技术领域
本发明涉及传热和电子器件冷却领域，具体地说，涉及一种均温回路热管装置。
背景技术
回路热管是一种新型的两相的高效传热装置，它利用蒸发器内的毛细芯产生的毛细力驱动回路运行，利用工质的蒸发和冷凝来传递热量，因此能够在小温差、长距离的情况下传递大量的热量。
回路热管的蒸发器与热源相接触，蒸发器内部装有高性能的毛细芯(称为第一吸液芯)。补偿室与蒸发器相连，两者内部通过另外一个毛细芯(称为第二吸液芯)相连。冷凝段与冷源直接接触。蒸发管道将蒸发器与冷凝段相连，回流管道将冷凝段和补偿室相连。当蒸发器受热时，其内部的第一吸液芯表面的液体将吸收潜热产生蒸汽，蒸汽通过蒸汽管道到达冷凝段，放出潜热，变成液体，并通过液体回流管回到补偿室。补偿室的液体再回到蒸发器，从而构成一个循环。
一般的回路热管存在当工质在蒸发器的蒸发速率大于其液体回流管的回流速率，而第二吸液芯难以将工质从补偿室吸到蒸发器时，将出现干涸现象。另外由于吸液芯的热传导过大使补偿室温度过高，常常使整个回路热管的运行温度过高，这常常被称为热泄漏问题。
名称为“高效平板式回路热管装置”，申请号为200510035406.4的中国发明专利公开了一种平板式回路热管。其包括两个液芯，第一吸液芯主要起到使工质蒸发的作用，第二吸液芯起到增大***毛细吸引力的作用，其多孔的结构形式可使工质容易到达第一吸液芯；第一吸液芯中包含了横向槽道和纵向槽道，由于采用了纵横交错的蒸汽槽道，更利于蒸汽的蒸发，蒸汽可以根据局部阻力选择阻力最小、压降最小的槽道进行流动，使回路热管的整体压降大大降低，且不会因为局部蒸汽存在而使蒸发器局部温度过高，增强了回路热管的传热能力，从而减小***的热泄漏问题。
但是，现有的回路热管装置在对高热流密度电子芯片进行散热时，其效果不尽理想。
发明内容
本发明的目的在于克服现有回路热管存在的不足，提供一种适合于高热流密度电子芯片散热的均温回路热管装置。
为了实现上述目的，本发明采用如下技术方案：
一种均温回路热管装置，包括设有蒸发器和冷凝器的回路热管装置及均温器，均温器设置在回路热管装置蒸发器的蒸发端上，均温器内表面覆盖有金属网，金属网内包覆着留有通气孔的金属板，金属板上下表面均设有支撑柱，均温器内均填充有液体。所述留有通气孔的金属板可用金属网代替。
在上述均温回路热管装置中，为了控制***的温度，可在均温回路热管装置上设置温控翅片。
在上述均温回路热管装置中，为了提高冷却效果，可将冷凝器设计为由冷凝夹套与冷凝翅片组成，冷凝翅片设置在冷凝夹套的外表面上。
在上述均温回路热管装置中，为了提高冷却效果，可将冷凝器设计为由冷凝夹板与冷凝翅片组成，冷凝夹板为双面或单面夹板，冷凝翅片设置在冷凝夹板的外表面上。
在上述均温回路热管装置中，为了提高***对温度控制的灵活性和精确度，可将冷凝夹板扩展至整个均温回路热管装置，冷凝夹板的另一侧再设置温控翅片与冷凝翅片，使得温控翅片与冷凝翅片成一体结构。
与现有技术相比，本发明具有如下有益效果：
(1)***传热能力及效果明显。本发明吸收了现有回路热管良好的传热性能，并增加了均温器，可将电子芯片的高热流密度集中点快速均衡分散，以降低芯片表面温度，使芯片的运用扩展至更高的积集度和更高速度下的运作。
(2)***对温度控制的灵活性和精确度明显提升。在均温器与回路热管装置结合的基础上，变换冷凝方式，温控翅片与冷凝翅片结合使用，提高***对温度控制的灵活性和精确度。
附图说明
图1为均温回路热管装置的结构示意图；
图2为卡套式冷凝器的结构示意图；
图3为夹板式冷凝器结构示意图；
图4为冷凝翅片与温控翅片一体化结构示意图。
具体实施方式
实施例1
如图1所示，一种均温回路热管装置，包括蒸发器1、补偿器2和均温器3，蒸发器1和补偿器2置于同一容器7中；蒸发器1的冷凝端11与补偿器2相连，蒸发器1的蒸发端12与均温器3的冷凝端35相连，蒸发器1内装有吸液芯4，吸液芯4底部的槽道与蒸发器1之间形成蒸汽槽道41，蒸汽槽道41与蒸汽管道5相通，蒸汽管道5外表面设有冷凝器6，蒸汽管道5的回流管与补偿器2连通；均温器3内表面覆盖有金属网31，金属网31内包覆着留有通气孔的金属板32，其上下表面均设有支撑柱34；补偿器2和均温器3内均填充有水。容器7外表面设有数量众多的温控翅片8。吸液芯4底部的槽道是纵横交错的槽道。金属网31为100网目以上的金属网。冷凝器6采用卡套式冷凝器，由冷凝夹套61与数量众多的冷凝翅片62组成，冷凝翅片62设置在冷凝夹套61的外表面上，如图2所示。
工作时，均温器3的蒸发端36与热负荷端Q(电子芯片)接触，电子芯片产生高温时，均温器3内部的水因吸热而气化，饱和蒸气自金属板32上的通气孔往上升，将热传递至冷凝端35，凝结成小水珠附着在金属网31上，并经由金属网31内部的毛细结构将凝结的小水珠引流回到底部的均温器3的蒸发端36；此时气化流体会因压力差迅速分布至整个较低温的区域，进而使此均温器3能更平均的吸收热量，确保水由冷凝端35回流至蒸发端36顺畅快速，以将电子芯片的高热流密度集中点快速均衡分散，降低芯片表面温度。
对于蒸发器1而言，其蒸发端12与均温器3的冷凝端35相连，吸液芯4位于蒸发器1内部。当蒸发器1接收来自均温器3的均热时，内部吸液芯4的水将吸收潜热而产生蒸汽，蒸汽通过蒸汽槽道41流进蒸汽管道5，经冷凝器6冷却成液体，回到补偿器2，直到将电子芯片的热量带走。
实施例2 弹性及多样化的散热模块***
图3为夹板式冷凝器结构示意图。夹板式冷凝器6由冷凝夹板63与数量众多的冷凝翅片62组成，冷凝夹板63为双面或单面夹板，冷凝翅片62设置在冷凝夹板63的外表面上。
图4为冷凝翅片与温控翅片一体化结构示意图。为了提高***对温度控制的灵活性和精确度，达到最大***传热能力之要求。可将冷凝夹板63扩展至整个均温回路热管装置，冷凝夹板63的另一侧再设置温控翅片8与冷凝翅片62，使得温控翅片8与冷凝翅片62成一体结构。

Claims (5)

1.一种均温回路热管装置，包括蒸发器(1)和冷凝器(6)，其特征在于还包括均温器(3)，均温器(3)设置在均温回路热管装置蒸发器(1)的蒸发端(12)上，均温器(3)内表面覆盖有金属网(31)，金属网(31)内包覆着留有通气孔的金属板(32)，金属板(32)上下表面均设有支撑柱(34)，均温器(3)内均填充有液体。
2.如权利要求1所述的均温回路热管装置，其特征在于所述均温回路热管装置上设置有温控翅片(8)。
3.如权利要求1或2所述的均温回路热管装置，其特征在于所述冷凝器(6)由冷凝夹套(61)与冷凝翅片(62)组成，冷凝翅片(62)设置在冷凝夹套(61)的外表面上。
4.如权利要求1或2所述的均温回路热管装置，其特征在于所述冷凝器(6)由冷凝夹板(63)与冷凝翅片(62)组成，冷凝夹板(63)为双面或单面夹板，冷凝翅片(62)设置在冷凝夹板(63)的外表面上。
5.如权利要求4所述的均温回路热管装置，其特征在于所述冷凝夹板(63)扩展至整个均温回路热管装置，蒸发器(1)和冷凝器(6)均设置在冷凝夹板(63)一面上，冷凝夹板(63)的另一面与蒸发器(1)相对应的地方设置温控翅片(8)，冷凝夹板(63)的另一面与冷凝器(6)相对应的地方设置冷凝翅片(62)。
CNB2007100280445A 2007-05-16 2007-05-16 一种均温回路热管装置 Expired - Fee Related CN100460798C (zh)

Priority Applications (7)

Application Number Priority Date Filing Date Title
CNB2007100280445A CN100460798C (zh) 2007-05-16 2007-05-16 一种均温回路热管装置
PCT/CN2008/000898 WO2008138216A1 (en) 2007-05-16 2008-05-05 Uniform temperature loop heat pipe device
AU2008250879A AU2008250879B2 (en) 2007-05-16 2008-05-05 Uniform temperature loop heat pipe device
CA2687005A CA2687005C (en) 2007-05-16 2008-05-05 A heat transfer device combining a flatten loop heat pipe and a vapor chamber
EP08748456A EP2154461A1 (en) 2007-05-16 2008-05-05 Uniform temperature loop heat pipe device
US12/599,786 US20100300656A1 (en) 2007-05-16 2008-05-05 heat transfer device combined a flatten loop heat pipe and a vapor chamber
JP2010507779A JP2010527432A (ja) 2007-05-16 2008-05-05 ループヒートパイプ装置

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WO2008138216A1 (en) 2008-11-20
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