CN100405534C - 半导体结构的制造方法 - Google Patents
半导体结构的制造方法 Download PDFInfo
- Publication number
- CN100405534C CN100405534C CNB2005100807613A CN200510080761A CN100405534C CN 100405534 C CN100405534 C CN 100405534C CN B2005100807613 A CNB2005100807613 A CN B2005100807613A CN 200510080761 A CN200510080761 A CN 200510080761A CN 100405534 C CN100405534 C CN 100405534C
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- Prior art keywords
- strain
- sige alloy
- silicon substrate
- damage field
- relaxation
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- 229910052710 silicon Inorganic materials 0.000 title claims description 71
- 239000010703 silicon Substances 0.000 title claims description 71
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims description 70
- 229910000577 Silicon-germanium Inorganic materials 0.000 claims abstract description 127
- 239000000758 substrate Substances 0.000 claims abstract description 80
- 239000004065 semiconductor Substances 0.000 claims abstract description 70
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 39
- 239000000956 alloy Substances 0.000 claims abstract description 39
- 238000000137 annealing Methods 0.000 claims abstract description 33
- 238000004519 manufacturing process Methods 0.000 claims abstract description 12
- 238000000034 method Methods 0.000 claims description 87
- 238000000576 coating method Methods 0.000 claims description 47
- 239000011248 coating agent Substances 0.000 claims description 46
- 238000002347 injection Methods 0.000 claims description 22
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- 230000015572 biosynthetic process Effects 0.000 claims description 12
- 230000002950 deficient Effects 0.000 claims description 10
- 239000000203 mixture Substances 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 9
- 230000008859 change Effects 0.000 claims description 8
- 238000005229 chemical vapour deposition Methods 0.000 claims description 8
- 238000002513 implantation Methods 0.000 claims description 7
- 230000006911 nucleation Effects 0.000 claims description 5
- 238000010899 nucleation Methods 0.000 claims description 5
- 230000005669 field effect Effects 0.000 claims description 4
- 229910044991 metal oxide Inorganic materials 0.000 claims description 4
- 150000004706 metal oxides Chemical class 0.000 claims description 4
- 238000001451 molecular beam epitaxy Methods 0.000 claims description 4
- 238000000038 ultrahigh vacuum chemical vapour deposition Methods 0.000 claims description 4
- 229910003811 SiGeC Inorganic materials 0.000 claims description 3
- 229910052796 boron Inorganic materials 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 238000004871 chemical beam epitaxy Methods 0.000 claims description 2
- 229910052805 deuterium Inorganic materials 0.000 claims description 2
- 229910052739 hydrogen Inorganic materials 0.000 claims description 2
- 230000001939 inductive effect Effects 0.000 claims description 2
- 238000000869 ion-assisted deposition Methods 0.000 claims description 2
- 238000001289 rapid thermal chemical vapour deposition Methods 0.000 claims 2
- 238000005253 cladding Methods 0.000 claims 1
- 238000012423 maintenance Methods 0.000 claims 1
- 230000007547 defect Effects 0.000 abstract description 4
- 235000012431 wafers Nutrition 0.000 abstract 2
- 150000002500 ions Chemical class 0.000 description 15
- 238000005468 ion implantation Methods 0.000 description 8
- 229910052734 helium Inorganic materials 0.000 description 7
- 238000005275 alloying Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000001307 helium Substances 0.000 description 4
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 4
- 239000012212 insulator Substances 0.000 description 4
- 238000003723 Smelting Methods 0.000 description 3
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
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- 238000005516 engineering process Methods 0.000 description 3
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- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
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- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- YZCKVEUIGOORGS-OUBTZVSYSA-N Deuterium Chemical compound [2H] YZCKVEUIGOORGS-OUBTZVSYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 206010050031 Muscle strain Diseases 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
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- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
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- 239000001257 hydrogen Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 229920000554 ionomer Polymers 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 238000005224 laser annealing Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 229910003465 moissanite Inorganic materials 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000004151 rapid thermal annealing Methods 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
- H01L21/26506—Bombardment with radiation with high-energy radiation producing ion implantation in group IV semiconductors
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02373—Group 14 semiconducting materials
- H01L21/02378—Silicon carbide
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02373—Group 14 semiconducting materials
- H01L21/02381—Silicon, silicon germanium, germanium
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
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- H01L21/02532—Silicon, silicon germanium, germanium
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02664—Aftertreatments
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/8238—Complementary field-effect transistors, e.g. CMOS
- H01L21/823807—Complementary field-effect transistors, e.g. CMOS with a particular manufacturing method of the channel structures, e.g. channel implants, halo or pocket implants, or channel materials
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- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/10—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/1025—Channel region of field-effect devices
- H01L29/1029—Channel region of field-effect devices of field-effect transistors
- H01L29/1033—Channel region of field-effect devices of field-effect transistors with insulated gate, e.g. characterised by the length, the width, the geometric contour or the doping structure
- H01L29/1054—Channel region of field-effect devices of field-effect transistors with insulated gate, e.g. characterised by the length, the width, the geometric contour or the doping structure with a variation of the composition, e.g. channel with strained layer for increasing the mobility
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- H—ELECTRICITY
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- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7842—Field effect transistors with field effect produced by an insulated gate means for exerting mechanical stress on the crystal lattice of the channel region, e.g. using a flexible substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
- H01L21/26506—Bombardment with radiation with high-energy radiation producing ion implantation in group IV semiconductors
- H01L21/26513—Bombardment with radiation with high-energy radiation producing ion implantation in group IV semiconductors of electrically active species
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/938—Lattice strain control or utilization
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- High Energy & Nuclear Physics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Recrystallisation Techniques (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Abstract
Description
Claims (33)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/978,715 | 2004-11-01 | ||
US10/978,715 US7273800B2 (en) | 2004-11-01 | 2004-11-01 | Hetero-integrated strained silicon n- and p-MOSFETs |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1770391A CN1770391A (zh) | 2006-05-10 |
CN100405534C true CN100405534C (zh) | 2008-07-23 |
Family
ID=36260770
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2005100807613A Expired - Fee Related CN100405534C (zh) | 2004-11-01 | 2005-06-30 | 半导体结构的制造方法 |
Country Status (4)
Country | Link |
---|---|
US (3) | US7273800B2 (zh) |
JP (1) | JP5039912B2 (zh) |
CN (1) | CN100405534C (zh) |
TW (1) | TW200629352A (zh) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100583450C (zh) * | 2005-03-11 | 2010-01-20 | 富士通微电子株式会社 | 半导体器件及其制造方法 |
US8450193B2 (en) * | 2006-08-15 | 2013-05-28 | Varian Semiconductor Equipment Associates, Inc. | Techniques for temperature-controlled ion implantation |
SG144883A1 (en) * | 2007-01-29 | 2008-08-28 | Silicon Genesis Corp | Method and structure using selected implant angles using a linear accelerator process for manufacture of free standing films of materials |
US20090004458A1 (en) * | 2007-06-29 | 2009-01-01 | Memc Electronic Materials, Inc. | Diffusion Control in Heavily Doped Substrates |
US8138066B2 (en) | 2008-10-01 | 2012-03-20 | International Business Machines Corporation | Dislocation engineering using a scanned laser |
CN102792446A (zh) * | 2011-01-17 | 2012-11-21 | 住友电气工业株式会社 | 用于制造碳化硅半导体器件的方法 |
FR2986369B1 (fr) * | 2012-01-30 | 2016-12-02 | Commissariat Energie Atomique | Procede pour contraindre un motif mince et procede de fabrication de transistor integrant ledit procede |
US8617968B1 (en) | 2012-06-18 | 2013-12-31 | International Business Machines Corporation | Strained silicon and strained silicon germanium on insulator metal oxide semiconductor field effect transistors (MOSFETs) |
US10361097B2 (en) * | 2012-12-31 | 2019-07-23 | Globalwafers Co., Ltd. | Apparatus for stressing semiconductor substrates |
US9269714B2 (en) * | 2013-06-10 | 2016-02-23 | Globalfoundries Inc. | Device including a transistor having a stressed channel region and method for the formation thereof |
US9087716B2 (en) * | 2013-07-15 | 2015-07-21 | Globalfoundries Inc. | Channel semiconductor alloy layer growth adjusted by impurity ion implantation |
US9305781B1 (en) | 2015-04-30 | 2016-04-05 | International Business Machines Corporation | Structure and method to form localized strain relaxed SiGe buffer layer |
US9570300B1 (en) | 2016-02-08 | 2017-02-14 | International Business Machines Corporation | Strain relaxed buffer layers with virtually defect free regions |
CN107845686A (zh) * | 2017-11-30 | 2018-03-27 | 西安科锐盛创新科技有限公司 | 基于SiGe的PMOS器件 |
CN107946181A (zh) * | 2017-11-30 | 2018-04-20 | 西安科锐盛创新科技有限公司 | SiGe材料CMOS器件及其制备方法 |
CN107978529A (zh) * | 2017-11-30 | 2018-05-01 | 西安科锐盛创新科技有限公司 | 基于SiGe的PMOS器件及其制备方法 |
CN107994017A (zh) * | 2017-11-30 | 2018-05-04 | 西安科锐盛创新科技有限公司 | SiGe材料CMOS器件 |
CN108039370A (zh) * | 2017-11-30 | 2018-05-15 | 西安科锐盛创新科技有限公司 | Pmos器件及计算机 |
CN108022979A (zh) * | 2017-11-30 | 2018-05-11 | 西安科锐盛创新科技有限公司 | Nmos器件及其制备方法及计算机 |
CN107863390A (zh) * | 2017-11-30 | 2018-03-30 | 西安科锐盛创新科技有限公司 | Ge材料NMOS器件 |
CN107919288A (zh) * | 2017-11-30 | 2018-04-17 | 西安科锐盛创新科技有限公司 | 基于压应变Ge材料NMOS器件及其制备方法 |
CN108022844A (zh) * | 2017-11-30 | 2018-05-11 | 西安科锐盛创新科技有限公司 | Pmos器件及其制备方法及计算机 |
CN107863389A (zh) * | 2017-11-30 | 2018-03-30 | 西安科锐盛创新科技有限公司 | Nmos器件及计算机 |
CN108039349A (zh) * | 2017-11-30 | 2018-05-15 | 西安科锐盛创新科技有限公司 | 应变GeCMOS器件 |
CN107968043A (zh) * | 2017-11-30 | 2018-04-27 | 西安科锐盛创新科技有限公司 | 应变GeCMOS器件及其制备方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001168342A (ja) * | 1999-12-10 | 2001-06-22 | Fujitsu Ltd | 半導体装置およびその製造方法 |
US6593625B2 (en) * | 2001-06-12 | 2003-07-15 | International Business Machines Corporation | Relaxed SiGe layers on Si or silicon-on-insulator substrates by ion implantation and thermal annealing |
JP2004111638A (ja) * | 2002-09-18 | 2004-04-08 | Sharp Corp | 半導体基板の製造方法およびこの方法を用いた半導体装置の製造方法および半導体装置 |
WO2004047150A2 (en) * | 2002-11-19 | 2004-06-03 | International Business Machines Corporation | RELAXED SiGe LAYERS ON Si OR SILICON-ON-INSULATOR SUBSTRATES BY ION IMPLANTATION AND THERMAL ANNEALING |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
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JP4854871B2 (ja) * | 2001-06-20 | 2012-01-18 | 株式会社Sumco | 半導体基板及び電界効果型トランジスタ並びにこれらの製造方法 |
US6703279B2 (en) * | 2002-01-04 | 2004-03-09 | Promos Technologies, Inc. | Semiconductor device having contact of Si-Ge combined with cobalt silicide |
US6746902B2 (en) * | 2002-01-31 | 2004-06-08 | Sharp Laboratories Of America, Inc. | Method to form relaxed sige layer with high ge content |
JP2003234289A (ja) * | 2002-02-12 | 2003-08-22 | Yoshihisa Hirose | 歪み緩和膜の製造方法、および、歪み緩和膜を有する積層体 |
US6562703B1 (en) * | 2002-03-13 | 2003-05-13 | Sharp Laboratories Of America, Inc. | Molecular hydrogen implantation method for forming a relaxed silicon germanium layer with high germanium content |
US6743651B2 (en) * | 2002-04-23 | 2004-06-01 | International Business Machines Corporation | Method of forming a SiGe-on-insulator substrate using separation by implantation of oxygen |
JP2004014856A (ja) * | 2002-06-07 | 2004-01-15 | Sharp Corp | 半導体基板の製造方法及び半導体装置の製造方法 |
US6841457B2 (en) * | 2002-07-16 | 2005-01-11 | International Business Machines Corporation | Use of hydrogen implantation to improve material properties of silicon-germanium-on-insulator material made by thermal diffusion |
JP2004079912A (ja) * | 2002-08-21 | 2004-03-11 | Sharp Corp | 半導体基板改質方法およびこの方法を用いた半導体装置 |
JP4289864B2 (ja) * | 2002-10-22 | 2009-07-01 | シャープ株式会社 | 半導体装置及び半導体装置製造方法 |
US6774015B1 (en) * | 2002-12-19 | 2004-08-10 | International Business Machines Corporation | Strained silicon-on-insulator (SSOI) and method to form the same |
EP1588406B1 (en) * | 2003-01-27 | 2019-07-10 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor structures with structural homogeneity |
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2004
- 2004-11-01 US US10/978,715 patent/US7273800B2/en not_active Expired - Fee Related
-
2005
- 2005-06-30 CN CNB2005100807613A patent/CN100405534C/zh not_active Expired - Fee Related
- 2005-10-25 JP JP2005309279A patent/JP5039912B2/ja not_active Expired - Fee Related
- 2005-10-31 TW TW094138049A patent/TW200629352A/zh unknown
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2007
- 2007-08-16 US US11/840,029 patent/US7396747B2/en not_active Expired - Fee Related
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2008
- 2008-06-17 US US12/140,612 patent/US20080251813A1/en not_active Abandoned
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001168342A (ja) * | 1999-12-10 | 2001-06-22 | Fujitsu Ltd | 半導体装置およびその製造方法 |
US6593625B2 (en) * | 2001-06-12 | 2003-07-15 | International Business Machines Corporation | Relaxed SiGe layers on Si or silicon-on-insulator substrates by ion implantation and thermal annealing |
JP2004111638A (ja) * | 2002-09-18 | 2004-04-08 | Sharp Corp | 半導体基板の製造方法およびこの方法を用いた半導体装置の製造方法および半導体装置 |
WO2004047150A2 (en) * | 2002-11-19 | 2004-06-03 | International Business Machines Corporation | RELAXED SiGe LAYERS ON Si OR SILICON-ON-INSULATOR SUBSTRATES BY ION IMPLANTATION AND THERMAL ANNEALING |
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US7273800B2 (en) | 2007-09-25 |
US20080251813A1 (en) | 2008-10-16 |
US20070278517A1 (en) | 2007-12-06 |
JP5039912B2 (ja) | 2012-10-03 |
US7396747B2 (en) | 2008-07-08 |
CN1770391A (zh) | 2006-05-10 |
US20060091377A1 (en) | 2006-05-04 |
JP2006135319A (ja) | 2006-05-25 |
TW200629352A (en) | 2006-08-16 |
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