CN100386872C - 液冷*** - Google Patents
液冷*** Download PDFInfo
- Publication number
- CN100386872C CN100386872C CNB2004100077654A CN200410007765A CN100386872C CN 100386872 C CN100386872 C CN 100386872C CN B2004100077654 A CNB2004100077654 A CN B2004100077654A CN 200410007765 A CN200410007765 A CN 200410007765A CN 100386872 C CN100386872 C CN 100386872C
- Authority
- CN
- China
- Prior art keywords
- laminated sheet
- liquid
- heated components
- liquid cooling
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000007788 liquid Substances 0.000 claims abstract description 82
- 238000001816 cooling Methods 0.000 claims abstract description 49
- 238000003475 lamination Methods 0.000 claims abstract description 26
- 238000000034 method Methods 0.000 claims abstract description 16
- 239000002184 metal Substances 0.000 claims description 15
- 229910052751 metal Inorganic materials 0.000 claims description 15
- 238000010438 heat treatment Methods 0.000 claims description 5
- 238000004891 communication Methods 0.000 claims description 4
- 238000004080 punching Methods 0.000 abstract description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000010030 laminating Methods 0.000 abstract 2
- 239000000110 cooling liquid Substances 0.000 abstract 1
- 239000000498 cooling water Substances 0.000 description 39
- 239000012809 cooling fluid Substances 0.000 description 17
- 238000003825 pressing Methods 0.000 description 10
- 239000004065 semiconductor Substances 0.000 description 6
- 238000005476 soldering Methods 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000001125 extrusion Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 3
- 238000005266 casting Methods 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000010839 body fluid Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000004069 differentiation Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000002516 radical scavenger Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
-
- E—FIXED CONSTRUCTIONS
- E02—HYDRAULIC ENGINEERING; FOUNDATIONS; SOIL SHIFTING
- E02D—FOUNDATIONS; EXCAVATIONS; EMBANKMENTS; UNDERGROUND OR UNDERWATER STRUCTURES
- E02D29/00—Independent underground or underwater structures; Retaining walls
- E02D29/02—Retaining or protecting walls
- E02D29/0225—Retaining or protecting walls comprising retention means in the backfill
- E02D29/0241—Retaining or protecting walls comprising retention means in the backfill the retention means being reinforced earth elements
-
- E—FIXED CONSTRUCTIONS
- E02—HYDRAULIC ENGINEERING; FOUNDATIONS; SOIL SHIFTING
- E02D—FOUNDATIONS; EXCAVATIONS; EMBANKMENTS; UNDERGROUND OR UNDERWATER STRUCTURES
- E02D29/00—Independent underground or underwater structures; Retaining walls
- E02D29/02—Retaining or protecting walls
- E02D29/025—Retaining or protecting walls made up of similar modular elements stacked without mortar
-
- E—FIXED CONSTRUCTIONS
- E02—HYDRAULIC ENGINEERING; FOUNDATIONS; SOIL SHIFTING
- E02D—FOUNDATIONS; EXCAVATIONS; EMBANKMENTS; UNDERGROUND OR UNDERWATER STRUCTURES
- E02D29/00—Independent underground or underwater structures; Retaining walls
- E02D29/02—Retaining or protecting walls
- E02D29/0258—Retaining or protecting walls characterised by constructional features
- E02D29/0266—Retaining or protecting walls characterised by constructional features made up of preformed elements
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- E—FIXED CONSTRUCTIONS
- E02—HYDRAULIC ENGINEERING; FOUNDATIONS; SOIL SHIFTING
- E02D—FOUNDATIONS; EXCAVATIONS; EMBANKMENTS; UNDERGROUND OR UNDERWATER STRUCTURES
- E02D2600/00—Miscellaneous
- E02D2600/20—Miscellaneous comprising details of connection between elements
-
- E—FIXED CONSTRUCTIONS
- E02—HYDRAULIC ENGINEERING; FOUNDATIONS; SOIL SHIFTING
- E02D—FOUNDATIONS; EXCAVATIONS; EMBANKMENTS; UNDERGROUND OR UNDERWATER STRUCTURES
- E02D2600/00—Miscellaneous
- E02D2600/40—Miscellaneous comprising stabilising elements
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Civil Engineering (AREA)
- Structural Engineering (AREA)
- Environmental & Geological Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Life Sciences & Earth Sciences (AREA)
- Mining & Mineral Resources (AREA)
- Paleontology (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- Human Computer Interaction (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims (5)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP402369/2003 | 2003-12-02 | ||
JP2003402369A JP2005166855A (ja) | 2003-12-02 | 2003-12-02 | 電子機器 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1624407A CN1624407A (zh) | 2005-06-08 |
CN100386872C true CN100386872C (zh) | 2008-05-07 |
Family
ID=34463949
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004100077654A Expired - Fee Related CN100386872C (zh) | 2003-12-02 | 2004-03-05 | 液冷*** |
Country Status (7)
Country | Link |
---|---|
US (1) | US7044198B2 (zh) |
EP (1) | EP1538884B1 (zh) |
JP (1) | JP2005166855A (zh) |
KR (1) | KR100612810B1 (zh) |
CN (1) | CN100386872C (zh) |
DE (1) | DE602004027341D1 (zh) |
TW (1) | TWI255025B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106711110A (zh) * | 2017-03-19 | 2017-05-24 | 北京工业大学 | 一种用于大功率串联igbt的风冷水冷混合散热模组 |
Families Citing this family (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2880107B1 (fr) * | 2004-12-27 | 2007-05-11 | Technologies De L Echange Ther | Perfectionnements aux refroidisseurs a eau pour microprocesseurs |
US20070184320A1 (en) * | 2004-06-24 | 2007-08-09 | Jean-Paul Domen | Cooling devices for various applications |
US7327571B2 (en) * | 2005-09-06 | 2008-02-05 | Hewlett-Packard Development Company, L.P. | Thermal load balancing systems and methods |
JP4682775B2 (ja) * | 2005-09-27 | 2011-05-11 | セイコーエプソン株式会社 | マイクロチャンネル構造体、熱交換システム及び電子機器 |
JP2007127398A (ja) | 2005-10-05 | 2007-05-24 | Seiko Epson Corp | 熱交換器、熱交換器の製造方法、液冷システム、光源装置、プロジェクタ、電子デバイスユニット、電子機器 |
JP4449894B2 (ja) | 2005-12-16 | 2010-04-14 | セイコーエプソン株式会社 | 熱交換器、光源装置、プロジェクタおよび電子機器 |
JP4645472B2 (ja) * | 2006-02-21 | 2011-03-09 | セイコーエプソン株式会社 | 流体冷却装置、および電子機器 |
US7537047B2 (en) | 2006-03-23 | 2009-05-26 | Foxconn Technology Co., Ltd. | Liquid-cooling heat sink |
CN100584169C (zh) * | 2006-04-21 | 2010-01-20 | 富准精密工业(深圳)有限公司 | 液冷散热装置 |
JP2008027370A (ja) | 2006-07-25 | 2008-02-07 | Fujitsu Ltd | 電子機器 |
JP4842040B2 (ja) | 2006-07-25 | 2011-12-21 | 富士通株式会社 | 電子機器 |
JP5148079B2 (ja) * | 2006-07-25 | 2013-02-20 | 富士通株式会社 | 液冷ユニット用熱交換器および液冷ユニット並びに電子機器 |
JP2008027374A (ja) * | 2006-07-25 | 2008-02-07 | Fujitsu Ltd | 液冷ユニット用受熱器および液冷ユニット並びに電子機器 |
JP5133531B2 (ja) * | 2006-07-25 | 2013-01-30 | 富士通株式会社 | 液冷ユニット用熱交換器および液冷ユニット並びに電子機器 |
JP4781929B2 (ja) | 2006-07-25 | 2011-09-28 | 富士通株式会社 | 電子機器 |
JP5283836B2 (ja) | 2006-07-25 | 2013-09-04 | 富士通株式会社 | 液冷ユニット用受熱器および液冷ユニット並びに電子機器 |
JP5005314B2 (ja) * | 2006-10-17 | 2012-08-22 | 株式会社ティラド | 水冷ヒートシンクおよびその製造方法 |
US9496200B2 (en) | 2011-07-27 | 2016-11-15 | Coolit Systems, Inc. | Modular heat-transfer systems |
US9943014B2 (en) | 2013-03-15 | 2018-04-10 | Coolit Systems, Inc. | Manifolded heat exchangers and related systems |
CN101610664B (zh) * | 2008-06-20 | 2014-05-14 | 萨帕铝型材(上海)有限公司 | 液体冷却器及其制造方法 |
JP2011017516A (ja) * | 2009-07-10 | 2011-01-27 | Mitsubishi Electric Corp | プレート積層型冷却装置及びその製造方法 |
JP5259559B2 (ja) * | 2009-11-30 | 2013-08-07 | 株式会社ティラド | ヒートシンク |
KR101572787B1 (ko) | 2010-04-28 | 2015-11-27 | 가부시키가이샤 도요다 지도숏키 | 방열 장치 및 반도체 장치 |
CN102934528B (zh) * | 2010-06-09 | 2015-07-01 | 京瓷株式会社 | 流路构件、使用该流路构件的热交换器、以及电子部件装置 |
CN102647884B (zh) * | 2011-02-17 | 2015-03-18 | 北汽福田汽车股份有限公司 | 散热器及其散热水道***结构 |
JP6005930B2 (ja) * | 2011-07-28 | 2016-10-12 | 京セラ株式会社 | 流路部材、これを用いた熱交換器および電子部品装置ならびに半導体製造装置 |
US10365667B2 (en) | 2011-08-11 | 2019-07-30 | Coolit Systems, Inc. | Flow-path controllers and related systems |
WO2014141162A1 (en) | 2013-03-15 | 2014-09-18 | Coolit Systems, Inc. | Sensors, multiplexed communication techniques, and related systems |
US20130058043A1 (en) * | 2011-09-03 | 2013-03-07 | Weiss-Aug Co. Inc | Heat sink with a stack of metal layers having channels therein |
US9275931B2 (en) * | 2012-01-12 | 2016-03-01 | Huang-Han Chen | Heat dissipating module |
JP5901343B2 (ja) | 2012-02-24 | 2016-04-06 | 三菱電機株式会社 | 冷却器及び冷却装置 |
KR101524939B1 (ko) * | 2013-11-06 | 2015-06-02 | 주식회사 동양매직 | 발열체 냉각을 위한 수냉식 워터재킷 및 이를 포함하는 냉각탱크 |
WO2017098640A1 (ja) * | 2015-12-10 | 2017-06-15 | 株式会社日立製作所 | 造形物および電子機器ならびに造形方法 |
US10251306B2 (en) * | 2016-09-26 | 2019-04-02 | Asia Vital Components Co., Ltd. | Water cooling heat dissipation structure |
US11662037B2 (en) | 2019-01-18 | 2023-05-30 | Coolit Systems, Inc. | Fluid flow control valve for fluid flow systems, and methods |
US11473860B2 (en) | 2019-04-25 | 2022-10-18 | Coolit Systems, Inc. | Cooling module with leak detector and related systems |
EP4150216A4 (en) | 2020-05-11 | 2023-11-01 | Coolit Systems, Inc. | LIQUID PUMPING UNITS, AND ASSOCIATED SYSTEMS AND METHODS |
KR102449766B1 (ko) * | 2022-03-18 | 2022-10-04 | 덕양산업 주식회사 | 배터리모듈용 냉각플레이트 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09102568A (ja) * | 1995-10-05 | 1997-04-15 | Mitsubishi Electric Corp | プレート型ヒートシンク |
US20010004370A1 (en) * | 1998-08-18 | 2001-06-21 | Hamamatsu Photonics K.K. | Heat sink and semiconductor laser apparatus and semiconductor laser stack apparatus using the same |
US20020135979A1 (en) * | 2001-03-20 | 2002-09-26 | Motorola, Inc | Two-phase cooling module and method of making the same |
CN1375868A (zh) * | 2001-03-20 | 2002-10-23 | 摩托罗拉公司 | 压模成型的两相冷却组件及其制作方法 |
JP2003007944A (ja) * | 2001-06-18 | 2003-01-10 | Showa Denko Kk | 発熱部品用冷却装置 |
CN2577220Y (zh) * | 2002-09-27 | 2003-10-01 | 天津市吉鑫达金属制品有限公司 | 带装饰边的异管散热器 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4468717A (en) * | 1982-06-09 | 1984-08-28 | Sperry Corporation | Apparatus for cooling integrated circuit chips |
CA1227886A (en) * | 1984-01-26 | 1987-10-06 | Haruhiko Yamamoto | Liquid-cooling module system for electronic circuit components |
US4561040A (en) * | 1984-07-12 | 1985-12-24 | Ibm Corporation | Cooling system for VLSI circuit chips |
US4705102A (en) * | 1985-12-13 | 1987-11-10 | Fuji Electric Company, Ltd. | Boiling refrigerant-type cooling system |
US4910642A (en) * | 1988-12-05 | 1990-03-20 | Sundstrand Corporation | Coolant activated contact compact high intensity cooler |
US5125451A (en) * | 1991-04-02 | 1992-06-30 | Microunity Systems Engineering, Inc. | Heat exchanger for solid-state electronic devices |
FR2701554B1 (fr) * | 1993-02-12 | 1995-05-12 | Transcal | Echangeur de chaleur pour composants électroniques et appareillages électro-techniques. |
FR2746177B1 (fr) * | 1996-03-14 | 2000-04-07 | Dispositif de refroidissement utilisant un refrigerant en ebullition et se condensant | |
US6152213A (en) * | 1997-03-27 | 2000-11-28 | Fujitsu Limited | Cooling system for electronic packages |
US5815370A (en) * | 1997-05-16 | 1998-09-29 | Allied Signal Inc | Fluidic feedback-controlled liquid cooling module |
US6152215A (en) * | 1998-12-23 | 2000-11-28 | Sundstrand Corporation | High intensity cooler |
US6166907A (en) * | 1999-11-26 | 2000-12-26 | Chien; Chuan-Fu | CPU cooling system |
JP4423792B2 (ja) * | 2000-09-14 | 2010-03-03 | 株式会社デンソー | 沸騰冷却装置 |
-
2003
- 2003-12-02 JP JP2003402369A patent/JP2005166855A/ja not_active Withdrawn
-
2004
- 2004-02-23 TW TW093104461A patent/TWI255025B/zh not_active IP Right Cessation
- 2004-03-03 KR KR1020040014159A patent/KR100612810B1/ko active IP Right Grant
- 2004-03-04 DE DE602004027341T patent/DE602004027341D1/de not_active Expired - Lifetime
- 2004-03-04 EP EP04005163A patent/EP1538884B1/en not_active Expired - Fee Related
- 2004-03-05 CN CNB2004100077654A patent/CN100386872C/zh not_active Expired - Fee Related
- 2004-03-05 US US10/792,690 patent/US7044198B2/en not_active Expired - Lifetime
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09102568A (ja) * | 1995-10-05 | 1997-04-15 | Mitsubishi Electric Corp | プレート型ヒートシンク |
US20010004370A1 (en) * | 1998-08-18 | 2001-06-21 | Hamamatsu Photonics K.K. | Heat sink and semiconductor laser apparatus and semiconductor laser stack apparatus using the same |
US20020135979A1 (en) * | 2001-03-20 | 2002-09-26 | Motorola, Inc | Two-phase cooling module and method of making the same |
CN1375868A (zh) * | 2001-03-20 | 2002-10-23 | 摩托罗拉公司 | 压模成型的两相冷却组件及其制作方法 |
JP2003007944A (ja) * | 2001-06-18 | 2003-01-10 | Showa Denko Kk | 発熱部品用冷却装置 |
CN2577220Y (zh) * | 2002-09-27 | 2003-10-01 | 天津市吉鑫达金属制品有限公司 | 带装饰边的异管散热器 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106711110A (zh) * | 2017-03-19 | 2017-05-24 | 北京工业大学 | 一种用于大功率串联igbt的风冷水冷混合散热模组 |
CN106711110B (zh) * | 2017-03-19 | 2019-05-17 | 北京工业大学 | 一种用于大功率串联igbt的风冷水冷混合散热模组 |
Also Published As
Publication number | Publication date |
---|---|
EP1538884A2 (en) | 2005-06-08 |
EP1538884B1 (en) | 2010-05-26 |
TWI255025B (en) | 2006-05-11 |
EP1538884A3 (en) | 2005-10-12 |
KR100612810B1 (ko) | 2006-08-18 |
TW200520187A (en) | 2005-06-16 |
DE602004027341D1 (de) | 2010-07-08 |
US20050126752A1 (en) | 2005-06-16 |
CN1624407A (zh) | 2005-06-08 |
KR20050053298A (ko) | 2005-06-08 |
JP2005166855A (ja) | 2005-06-23 |
US7044198B2 (en) | 2006-05-16 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: HITACHI LTD. Free format text: FORMER OWNER: HITACHI,LTD. Effective date: 20130718 |
|
C41 | Transfer of patent application or patent right or utility model | ||
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