CN100365090C - 具有ptc特性的各向异性导电粘合剂 - Google Patents
具有ptc特性的各向异性导电粘合剂 Download PDFInfo
- Publication number
- CN100365090C CN100365090C CNB2005100691674A CN200510069167A CN100365090C CN 100365090 C CN100365090 C CN 100365090C CN B2005100691674 A CNB2005100691674 A CN B2005100691674A CN 200510069167 A CN200510069167 A CN 200510069167A CN 100365090 C CN100365090 C CN 100365090C
- Authority
- CN
- China
- Prior art keywords
- anisotropic
- electroconductive adhesive
- adhesive according
- crystalline polymer
- binder component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0141—Liquid crystal polymer [LCP]
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Dispersion Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Thermistors And Varistors (AREA)
Abstract
Description
性质 | 室温下电阻<sup>*</sup>(mΩ) | 高温下电阻<sup>**</sup>(kΩ) | PTC强度(Rmax/Rmin) | 最大电压(Vmax) | 最大操作电流(mA) | 粘合力(gf/cm) |
实施例1 | 41 | 697 | 1.7×10<sup>8</sup> | 83 | 2178 | 947 |
实施例2 | 45 | 2251 | 3.4×10<sup>8</sup> | 120 | 2383 | 1083 |
实施例3 | 57 | 431.7 | 4.2×10<sup>8</sup> | 73 | 2318 | 1024 |
实施例4 | 46 | 364.3 | 5.8×10<sup>8</sup> | 70 | 2535 | 1184 |
比较例1 | 52 | - | - | 113 | 3283 | 1273 |
Claims (13)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020040102831 | 2004-12-08 | ||
KR1020040102831A KR100622598B1 (ko) | 2004-12-08 | 2004-12-08 | 피티씨 특성을 갖는 이방 도전성 접착제 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1786096A CN1786096A (zh) | 2006-06-14 |
CN100365090C true CN100365090C (zh) | 2008-01-30 |
Family
ID=36573168
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2005100691674A Expired - Fee Related CN100365090C (zh) | 2004-12-08 | 2005-05-11 | 具有ptc特性的各向异性导电粘合剂 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7438834B2 (zh) |
JP (1) | JP4482676B2 (zh) |
KR (1) | KR100622598B1 (zh) |
CN (1) | CN100365090C (zh) |
TW (1) | TWI298739B (zh) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8518304B1 (en) | 2003-03-31 | 2013-08-27 | The Research Foundation Of State University Of New York | Nano-structure enhancements for anisotropic conductive material and thermal interposers |
JP5349316B2 (ja) * | 2007-09-19 | 2013-11-20 | 日立化成株式会社 | 接着剤組成物及び接合体 |
KR20100073848A (ko) * | 2008-12-23 | 2010-07-01 | 제일모직주식회사 | 전기전자용 접착필름 조성물 및 이를 이용한 전기전자용 접착필름 |
KR100973910B1 (ko) | 2010-02-18 | 2010-08-03 | (주)주원 | 엘이디조명 구동장치 |
KR101397690B1 (ko) * | 2010-12-31 | 2014-05-22 | 제일모직주식회사 | 이방 전도성 필름 |
EP2578624A1 (en) | 2011-10-06 | 2013-04-10 | Henkel Italia S.p.A. | Polymeric PTC thermistors |
KR101391697B1 (ko) * | 2011-12-14 | 2014-05-07 | 제일모직주식회사 | 이방성 도전 필름용 조성물 및 이를 이용한 이방성 도전 필름 |
CN102634286B (zh) * | 2012-05-17 | 2013-08-14 | 深圳市飞世尔实业有限公司 | 一种光热双重固化型异方性导电膜的制备方法 |
KR101365107B1 (ko) * | 2012-09-21 | 2014-02-20 | 제일모직주식회사 | 이방성 도전 필름 및 이를 포함하는 반도체 장치 |
JP2014102943A (ja) * | 2012-11-19 | 2014-06-05 | Dexerials Corp | 異方性導電フィルム、接続方法、及び接合体 |
CN103928077B (zh) | 2013-01-10 | 2017-06-06 | 杜邦公司 | 含有共混弹性体的导电粘合剂 |
CN103923578A (zh) | 2013-01-10 | 2014-07-16 | 杜邦公司 | 包括含氟弹性体的导电粘合剂 |
DE102014018638A1 (de) * | 2014-12-13 | 2016-06-16 | Audi Ag | Elektrische Energiespeicherzelle, elektrischer Energiespeicher und Kraftfahrzeug |
JP6352979B2 (ja) * | 2016-06-29 | 2018-07-04 | デクセリアルズ株式会社 | 異方性導電フィルム、接続方法、接合体、及び接合体の製造方法 |
JP6271048B2 (ja) * | 2017-01-11 | 2018-01-31 | デクセリアルズ株式会社 | 異方性導電フィルム、接続方法、及び接合体 |
JP6542927B2 (ja) * | 2018-02-14 | 2019-07-10 | デクセリアルズ株式会社 | 異方性導電フィルム、並びに、接続方法及び接合体 |
CN108949089A (zh) * | 2018-06-26 | 2018-12-07 | 合肥萃励新材料科技有限公司 | 一种ptc功能的聚氨酯胶粘剂的制备方法 |
CN108865040A (zh) * | 2018-06-26 | 2018-11-23 | 合肥萃励新材料科技有限公司 | 一种过流保护导电压敏胶的合成方法 |
CN109207102A (zh) * | 2018-06-26 | 2019-01-15 | 合肥萃励新材料科技有限公司 | 一种ptc功能水性胶的合成工艺 |
CN109135629A (zh) * | 2018-06-26 | 2019-01-04 | 合肥萃励新材料科技有限公司 | 一种印制线路板用pptc胶粘剂的制备方法 |
CN109054724A (zh) * | 2018-06-26 | 2018-12-21 | 合肥萃励新材料科技有限公司 | 一种ptc功能聚酰亚胺胶粘剂的合成方法 |
CN108841343B (zh) * | 2018-06-26 | 2020-09-15 | 合肥萃励新材料科技有限公司 | 一种ptc功能丙烯酸酯胶粘剂的合成工艺 |
Citations (12)
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JPH03131679A (ja) * | 1989-10-17 | 1991-06-05 | Fujikura Ltd | 導電性接着剤 |
CN1137324A (zh) * | 1993-12-16 | 1996-12-04 | 美国3M公司 | 各向异性的导电粘合剂膜 |
US5837164A (en) * | 1996-10-08 | 1998-11-17 | Therm-O-Disc, Incorporated | High temperature PTC device comprising a conductive polymer composition |
CN1242403A (zh) * | 1998-03-18 | 2000-01-26 | 住友电木株式会社 | 各向异性导电粘合剂、其制法和使用该粘合剂的电子装置 |
US6074576A (en) * | 1998-03-24 | 2000-06-13 | Therm-O-Disc, Incorporated | Conductive polymer materials for high voltage PTC devices |
JP2001210139A (ja) * | 2000-01-25 | 2001-08-03 | Fujikura Ltd | 導電性インキ組成物およびそれを用いた面状発熱体 |
CN1362459A (zh) * | 2000-12-28 | 2002-08-07 | 日立化成工业株式会社 | 各向异性电路连接用胶粘剂、电路板连接方法及连接体 |
CN1369531A (zh) * | 2000-12-15 | 2002-09-18 | 索尼化学株式会社 | 各向异性导电粘合剂 |
US6620343B1 (en) * | 2002-03-19 | 2003-09-16 | Therm-O-Disc Incorporated | PTC conductive composition containing a low molecular weight polyethylene processing aid |
US20040099846A1 (en) * | 2001-03-29 | 2004-05-27 | Yong- In Lee | Ptc composition and ptc device comprising the same |
TW200416268A (en) * | 2002-12-13 | 2004-09-01 | Lg Cable Ltd | Anisotropic-electroconductive adhesive, circuit connection method and structure using the same |
CN1547749A (zh) * | 2001-08-25 | 2004-11-17 | Lg电线有限公司 | 具有正温度系数的导电性聚合物,控制该聚合物的正温度系数性质的方法和使用该聚合物的电子装置 |
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US4120828A (en) * | 1972-05-07 | 1978-10-17 | Dynacon Industries, Inc. | Pressure sensitive resistance and process of making same |
US20010028953A1 (en) * | 1998-11-16 | 2001-10-11 | 3M Innovative Properties Company | Adhesive compositions and methods of use |
JP3257521B2 (ja) * | 1997-10-07 | 2002-02-18 | ソニーケミカル株式会社 | Ptc素子、保護装置および回路基板 |
KR20000075344A (ko) * | 1999-05-31 | 2000-12-15 | 이용인 | 피.티.시. 저항소자 제조용 수지 조성물 |
US6274852B1 (en) * | 2000-10-11 | 2001-08-14 | Therm-O-Disc, Incorporated | Conductive polymer compositions containing N-N-M-phenylenedimaleimide and devices |
-
2004
- 2004-12-08 KR KR1020040102831A patent/KR100622598B1/ko not_active IP Right Cessation
-
2005
- 2005-04-18 JP JP2005120361A patent/JP4482676B2/ja not_active Expired - Fee Related
- 2005-04-20 US US11/110,312 patent/US7438834B2/en not_active Expired - Fee Related
- 2005-05-11 CN CNB2005100691674A patent/CN100365090C/zh not_active Expired - Fee Related
- 2005-06-17 TW TW094120202A patent/TWI298739B/zh not_active IP Right Cessation
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH03131679A (ja) * | 1989-10-17 | 1991-06-05 | Fujikura Ltd | 導電性接着剤 |
CN1137324A (zh) * | 1993-12-16 | 1996-12-04 | 美国3M公司 | 各向异性的导电粘合剂膜 |
US5837164A (en) * | 1996-10-08 | 1998-11-17 | Therm-O-Disc, Incorporated | High temperature PTC device comprising a conductive polymer composition |
CN1242403A (zh) * | 1998-03-18 | 2000-01-26 | 住友电木株式会社 | 各向异性导电粘合剂、其制法和使用该粘合剂的电子装置 |
US6074576A (en) * | 1998-03-24 | 2000-06-13 | Therm-O-Disc, Incorporated | Conductive polymer materials for high voltage PTC devices |
JP2001210139A (ja) * | 2000-01-25 | 2001-08-03 | Fujikura Ltd | 導電性インキ組成物およびそれを用いた面状発熱体 |
CN1369531A (zh) * | 2000-12-15 | 2002-09-18 | 索尼化学株式会社 | 各向异性导电粘合剂 |
CN1362459A (zh) * | 2000-12-28 | 2002-08-07 | 日立化成工业株式会社 | 各向异性电路连接用胶粘剂、电路板连接方法及连接体 |
US20040099846A1 (en) * | 2001-03-29 | 2004-05-27 | Yong- In Lee | Ptc composition and ptc device comprising the same |
CN1547749A (zh) * | 2001-08-25 | 2004-11-17 | Lg电线有限公司 | 具有正温度系数的导电性聚合物,控制该聚合物的正温度系数性质的方法和使用该聚合物的电子装置 |
US6620343B1 (en) * | 2002-03-19 | 2003-09-16 | Therm-O-Disc Incorporated | PTC conductive composition containing a low molecular weight polyethylene processing aid |
TW200416268A (en) * | 2002-12-13 | 2004-09-01 | Lg Cable Ltd | Anisotropic-electroconductive adhesive, circuit connection method and structure using the same |
Also Published As
Publication number | Publication date |
---|---|
JP2006161016A (ja) | 2006-06-22 |
US7438834B2 (en) | 2008-10-21 |
KR20060064136A (ko) | 2006-06-13 |
KR100622598B1 (ko) | 2006-09-19 |
CN1786096A (zh) | 2006-06-14 |
TWI298739B (en) | 2008-07-11 |
TW200619340A (en) | 2006-06-16 |
US20060118767A1 (en) | 2006-06-08 |
JP4482676B2 (ja) | 2010-06-16 |
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Owner name: LG INNOTEK CO., LTD. Free format text: FORMER NAME: LG WIRE CO., LTD. |
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Address after: Seoul, South Kerean Patentee after: LG Innotek Limited by Share Ltd Address before: Seoul, South Kerean Patentee before: LG Cable & Machinery Ltd. |
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