CA1145423A - Chip capacitor for compliance soldering - Google Patents
Chip capacitor for compliance solderingInfo
- Publication number
- CA1145423A CA1145423A CA000338300A CA338300A CA1145423A CA 1145423 A CA1145423 A CA 1145423A CA 000338300 A CA000338300 A CA 000338300A CA 338300 A CA338300 A CA 338300A CA 1145423 A CA1145423 A CA 1145423A
- Authority
- CA
- Canada
- Prior art keywords
- electrodes
- capacitor
- portions
- ceramic
- support means
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 84
- 238000005476 soldering Methods 0.000 title abstract description 7
- 239000000758 substrate Substances 0.000 claims abstract description 32
- 238000000034 method Methods 0.000 claims abstract description 7
- 239000000919 ceramic Substances 0.000 claims description 21
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 238000007373 indentation Methods 0.000 claims 4
- 239000003985 ceramic capacitor Substances 0.000 claims 3
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 239000011800 void material Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 abstract description 14
- 230000035939 shock Effects 0.000 abstract description 4
- 230000006835 compression Effects 0.000 description 5
- 238000007906 compression Methods 0.000 description 5
- 239000011324 bead Substances 0.000 description 4
- 238000009740 moulding (composite fabrication) Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 230000008030 elimination Effects 0.000 description 2
- 238000003379 elimination reaction Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920000136 polysorbate Polymers 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
- H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10568—Integral adaptations of a component or an auxiliary PCB for mounting, e.g. integral spacer element
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US96124778A | 1978-11-16 | 1978-11-16 | |
US961,247 | 1978-11-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
CA1145423A true CA1145423A (en) | 1983-04-26 |
Family
ID=25504239
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA000338300A Expired CA1145423A (en) | 1978-11-16 | 1979-10-24 | Chip capacitor for compliance soldering |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPS5571018A (de) |
CA (1) | CA1145423A (de) |
DE (1) | DE2942704A1 (de) |
FR (1) | FR2441912A1 (de) |
GB (1) | GB2034521B (de) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58196007A (ja) * | 1982-05-12 | 1983-11-15 | 日本電気株式会社 | 微小電子部品 |
US4618911A (en) * | 1984-11-19 | 1986-10-21 | Sfe Technologies | End termination for chip capacitor |
JP2915716B2 (ja) * | 1992-08-26 | 1999-07-05 | ティーディーケイ株式会社 | 電子部品 |
JP3747940B2 (ja) * | 2004-06-03 | 2006-02-22 | 株式会社村田製作所 | 積層コンデンサおよびその製造方法 |
JP4803451B2 (ja) * | 2006-12-26 | 2011-10-26 | Tdk株式会社 | 電子部品及びその実装構造 |
CN114241905B (zh) * | 2021-12-04 | 2024-01-23 | 昆山国显光电有限公司 | 显示模组及显示装置 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1826276U (de) * | 1959-06-23 | 1961-02-09 | Messwandler Bau Gmbh | Elektrischer flachwickelkondensator, insbesondere fuer hochspannungs- und hochstrom-stosspruefanlagen. |
GB1117437A (en) * | 1965-10-05 | 1968-06-19 | Gen Electric | Improvements in molded electronic component |
FR1495139A (fr) * | 1966-09-23 | 1967-09-15 | Gen Electric | Eléments moulés pour circuits électriques ou électroniques |
US3590348A (en) * | 1969-12-29 | 1971-06-29 | Erie Technological Prod Inc | Radial lead ceramic capacitor with integral standoff feet |
JPS54105774A (en) * | 1978-02-08 | 1979-08-20 | Hitachi Ltd | Method of forming pattern on thin film hybrid integrated circuit |
-
1979
- 1979-10-16 GB GB7935834A patent/GB2034521B/en not_active Expired
- 1979-10-23 DE DE19792942704 patent/DE2942704A1/de not_active Ceased
- 1979-10-24 CA CA000338300A patent/CA1145423A/en not_active Expired
- 1979-11-15 JP JP14830879A patent/JPS5571018A/ja active Granted
- 1979-11-16 FR FR7928339A patent/FR2441912A1/fr active Granted
Also Published As
Publication number | Publication date |
---|---|
GB2034521B (en) | 1983-07-27 |
FR2441912A1 (fr) | 1980-06-13 |
FR2441912B1 (de) | 1984-04-20 |
JPS5571018A (en) | 1980-05-28 |
DE2942704A1 (de) | 1980-05-29 |
JPS6133246B2 (de) | 1986-08-01 |
GB2034521A (en) | 1980-06-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MKEX | Expiry |