CA1145423A - Chip capacitor for compliance soldering - Google Patents

Chip capacitor for compliance soldering

Info

Publication number
CA1145423A
CA1145423A CA000338300A CA338300A CA1145423A CA 1145423 A CA1145423 A CA 1145423A CA 000338300 A CA000338300 A CA 000338300A CA 338300 A CA338300 A CA 338300A CA 1145423 A CA1145423 A CA 1145423A
Authority
CA
Canada
Prior art keywords
electrodes
capacitor
portions
ceramic
support means
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA000338300A
Other languages
English (en)
French (fr)
Inventor
John L. Galvagni
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Avx Components Corp
Original Assignee
AVX Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AVX Corp filed Critical AVX Corp
Application granted granted Critical
Publication of CA1145423A publication Critical patent/CA1145423A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02Mountings
    • H01G2/06Mountings specially adapted for mounting on a printed-circuit support
    • H01G2/065Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3431Leadless components
    • H05K3/3442Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431Details of mounted components
    • H05K2201/10568Integral adaptations of a component or an auxiliary PCB for mounting, e.g. integral spacer element
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621Components characterised by their electrical contacts
    • H05K2201/10636Leadless chip, e.g. chip capacitor or resistor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621Components characterised by their electrical contacts
    • H05K2201/10727Leadless chip carrier [LCC], e.g. chip-modules for cards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
CA000338300A 1978-11-16 1979-10-24 Chip capacitor for compliance soldering Expired CA1145423A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US96124778A 1978-11-16 1978-11-16
US961,247 1978-11-16

Publications (1)

Publication Number Publication Date
CA1145423A true CA1145423A (en) 1983-04-26

Family

ID=25504239

Family Applications (1)

Application Number Title Priority Date Filing Date
CA000338300A Expired CA1145423A (en) 1978-11-16 1979-10-24 Chip capacitor for compliance soldering

Country Status (5)

Country Link
JP (1) JPS5571018A (de)
CA (1) CA1145423A (de)
DE (1) DE2942704A1 (de)
FR (1) FR2441912A1 (de)
GB (1) GB2034521B (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58196007A (ja) * 1982-05-12 1983-11-15 日本電気株式会社 微小電子部品
US4618911A (en) * 1984-11-19 1986-10-21 Sfe Technologies End termination for chip capacitor
JP2915716B2 (ja) * 1992-08-26 1999-07-05 ティーディーケイ株式会社 電子部品
JP3747940B2 (ja) * 2004-06-03 2006-02-22 株式会社村田製作所 積層コンデンサおよびその製造方法
JP4803451B2 (ja) * 2006-12-26 2011-10-26 Tdk株式会社 電子部品及びその実装構造
CN114241905B (zh) * 2021-12-04 2024-01-23 昆山国显光电有限公司 显示模组及显示装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1826276U (de) * 1959-06-23 1961-02-09 Messwandler Bau Gmbh Elektrischer flachwickelkondensator, insbesondere fuer hochspannungs- und hochstrom-stosspruefanlagen.
GB1117437A (en) * 1965-10-05 1968-06-19 Gen Electric Improvements in molded electronic component
FR1495139A (fr) * 1966-09-23 1967-09-15 Gen Electric Eléments moulés pour circuits électriques ou électroniques
US3590348A (en) * 1969-12-29 1971-06-29 Erie Technological Prod Inc Radial lead ceramic capacitor with integral standoff feet
JPS54105774A (en) * 1978-02-08 1979-08-20 Hitachi Ltd Method of forming pattern on thin film hybrid integrated circuit

Also Published As

Publication number Publication date
GB2034521B (en) 1983-07-27
FR2441912A1 (fr) 1980-06-13
FR2441912B1 (de) 1984-04-20
JPS5571018A (en) 1980-05-28
DE2942704A1 (de) 1980-05-29
JPS6133246B2 (de) 1986-08-01
GB2034521A (en) 1980-06-04

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Legal Events

Date Code Title Description
MKEX Expiry