BR9808062A - Módulo eletrônico para cartão de microplaqueta - Google Patents

Módulo eletrônico para cartão de microplaqueta

Info

Publication number
BR9808062A
BR9808062A BR9808062-8A BR9808062A BR9808062A BR 9808062 A BR9808062 A BR 9808062A BR 9808062 A BR9808062 A BR 9808062A BR 9808062 A BR9808062 A BR 9808062A
Authority
BR
Brazil
Prior art keywords
chip card
electronic chip
card module
electronic module
electronic
Prior art date
Application number
BR9808062-8A
Other languages
English (en)
Inventor
Michael Zafrany
Philippe Patrice
Original Assignee
Gemplus Card Int
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gemplus Card Int filed Critical Gemplus Card Int
Publication of BR9808062A publication Critical patent/BR9808062A/pt

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    • H01L24/25—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of a plurality of high density interconnect connectors
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73267—Layer and HDI connectors
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    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/76—Apparatus for connecting with build-up interconnects
    • H01L2224/7615—Means for depositing
    • H01L2224/76151—Means for direct writing
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H01L2924/01058—Cerium [Ce]
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01075—Rhenium [Re]
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
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    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Credit Cards Or The Like (AREA)
  • Wire Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

Resumo da Patente de Invenção <B>''MóDULO ELETRôNICO PARA CARTãO DE MICROPLAQUETA''<D>. A invenção diz respeito a um módulo eletrônico, criado especificamente para ser fixado em um dispositivo eletrônico em forma de cartão, que compreende um meio (40) que inclui pelo menos uma superfície
BR9808062-8A 1997-03-27 1998-03-09 Módulo eletrônico para cartão de microplaqueta BR9808062A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR9704094A FR2761498B1 (fr) 1997-03-27 1997-03-27 Module electronique et son procede de fabrication et carte a puce comportant un tel module
PCT/FR1998/000500 WO1998044451A1 (fr) 1997-03-27 1998-03-09 Module electronique pour carte a puce

Publications (1)

Publication Number Publication Date
BR9808062A true BR9808062A (pt) 2000-03-08

Family

ID=9505498

Family Applications (1)

Application Number Title Priority Date Filing Date
BR9808062-8A BR9808062A (pt) 1997-03-27 1998-03-09 Módulo eletrônico para cartão de microplaqueta

Country Status (12)

Country Link
US (2) US6435414B1 (pt)
EP (2) EP0970437A1 (pt)
JP (1) JP3869860B2 (pt)
CN (1) CN1183486C (pt)
AU (1) AU720691B2 (pt)
BR (1) BR9808062A (pt)
CA (1) CA2283692A1 (pt)
DE (1) DE69832104T2 (pt)
FR (1) FR2761498B1 (pt)
HK (1) HK1028833A1 (pt)
RU (1) RU2200975C2 (pt)
WO (1) WO1998044451A1 (pt)

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* Cited by examiner, † Cited by third party
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FR2761498B1 (fr) * 1997-03-27 1999-06-18 Gemplus Card Int Module electronique et son procede de fabrication et carte a puce comportant un tel module
FR2785072B1 (fr) * 1998-10-23 2001-01-19 St Microelectronics Sa Circuit electronique autocollant
FR2797075B1 (fr) * 1999-07-26 2001-10-12 Gemplus Card Int Procede de fabrication de dispositif portable a circuits integres, de type carte a puce de format reduit par rapport au format standard
FR2797996B1 (fr) * 1999-08-25 2003-10-03 Gemplus Card Int Procede de protection de puces de circuit integre par depot de couche mince isolante
FR2797995B1 (fr) * 1999-08-25 2002-03-22 Gemplus Card Int Procede de protection de puces de circuit integre par depot de couche mince isolante
FR2799306B1 (fr) * 1999-10-04 2003-09-19 Gemplus Card Int Procede d'isolation de puce de circuit integre par depot de matiere sur la face active
FR2800198B1 (fr) * 1999-10-26 2002-03-29 Gemplus Card Int Procede de protection de puces de circuit integre par aspiration sous vide
FR2808920B1 (fr) * 2000-05-10 2003-10-03 Gemplus Card Int Procede de protection de puces de circuit integre
FR2818801B1 (fr) * 2000-12-21 2003-04-04 Gemplus Card Int Interconnexion par organe d'isolation decoupe et cordon de conduction
FR2818800B1 (fr) * 2000-12-21 2003-04-04 Gemplus Card Int Interconnexion par organe deformable pour dispositif electronique
FR2823011B1 (fr) * 2001-03-30 2004-11-19 Gemplus Card Int Connexion par depot de cordon conductrice sur zone de raccordement delimitee par masque isolant
FR2845805B1 (fr) * 2002-10-10 2005-06-03 Gemplus Card Int Adhesif d'encartage formant navette
FR2847365B1 (fr) * 2002-11-15 2005-03-11 Gemplus Card Int Connexion/raccordement simultane par un percage d'adhesif d'encartage
US7243421B2 (en) * 2003-10-29 2007-07-17 Conductive Inkjet Technology Limited Electrical connection of components
WO2007042071A1 (de) * 2005-10-10 2007-04-19 Alphasem Ag Baugruppe mit wenigstens zwei in elektrisch leitender wirkverbindung stehenden komponenten und verfahren zum herstellen der baugruppe
DE102006056361B4 (de) * 2006-11-29 2012-08-16 Infineon Technologies Ag Modul mit polymerhaltigem elektrischen Verbindungselement und Verfahren
DE102008019571A1 (de) * 2008-04-18 2009-10-22 Giesecke & Devrient Gmbh Chipkarte und Verfahren zu deren Herstellung
TWM425346U (en) * 2011-05-20 2012-03-21 Mxtran Inc Integrated circuit film for smart card and mobile communication device
US8991711B2 (en) * 2012-07-19 2015-03-31 Infineon Technologies Ag Chip card module
MY184608A (en) * 2013-12-10 2021-04-07 Carsem M Sdn Bhd Pre-molded integrated circuit packages
DE102014105861B4 (de) * 2014-04-25 2015-11-05 Infineon Technologies Ag Sensorvorrichtung und Verfahren zum Herstellen einer Sensorvorrichtung

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US4999136A (en) * 1988-08-23 1991-03-12 Westinghouse Electric Corp. Ultraviolet curable conductive resin
US5255430A (en) * 1992-10-08 1993-10-26 Atmel Corporation Method of assembling a module for a smart card
DE4325458A1 (de) * 1993-07-29 1995-02-09 Orga Bond Technik Gmbh Trägerelement für einen IC-Baustein
US5689136A (en) * 1993-08-04 1997-11-18 Hitachi, Ltd. Semiconductor device and fabrication method
DE9315652U1 (de) * 1993-10-15 1993-12-23 Nordson Corp., Westlake, Ohio Auftragskopf zum Aufbringen von Klebstoff auf ein Substrat, insbesondere für eine Verklebung eines Chips mit einer Karte
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Also Published As

Publication number Publication date
JP2002511188A (ja) 2002-04-09
FR2761498B1 (fr) 1999-06-18
EP0970437A1 (fr) 2000-01-12
HK1028833A1 (en) 2001-03-02
WO1998044451A1 (fr) 1998-10-08
AU6922598A (en) 1998-10-22
EP1168240A3 (fr) 2002-01-30
US6435414B1 (en) 2002-08-20
US6769619B2 (en) 2004-08-03
EP1168240A2 (fr) 2002-01-02
EP1168240B1 (fr) 2005-10-26
CA2283692A1 (fr) 1998-10-08
CN1257599A (zh) 2000-06-21
RU2200975C2 (ru) 2003-03-20
FR2761498A1 (fr) 1998-10-02
US20020125329A1 (en) 2002-09-12
AU720691B2 (en) 2000-06-08
DE69832104T2 (de) 2006-11-23
CN1183486C (zh) 2005-01-05
DE69832104D1 (de) 2005-12-01
JP3869860B2 (ja) 2007-01-17

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