BR9603593A - Cartão com circuito integrado - Google Patents
Cartão com circuito integradoInfo
- Publication number
- BR9603593A BR9603593A BR9603593A BR9603593A BR9603593A BR 9603593 A BR9603593 A BR 9603593A BR 9603593 A BR9603593 A BR 9603593A BR 9603593 A BR9603593 A BR 9603593A BR 9603593 A BR9603593 A BR 9603593A
- Authority
- BR
- Brazil
- Prior art keywords
- card
- integrated circuit
- integrated
- circuit
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
- H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9506840A FR2735256A1 (fr) | 1995-06-09 | 1995-06-09 | Carte a circuit integre |
PCT/FR1996/000033 WO1996042069A1 (fr) | 1995-06-09 | 1996-01-09 | Carte a circuit integre |
Publications (1)
Publication Number | Publication Date |
---|---|
BR9603593A true BR9603593A (pt) | 1999-06-15 |
Family
ID=9479800
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR9603593A BR9603593A (pt) | 1995-06-09 | 1996-01-09 | Cartão com circuito integrado |
Country Status (4)
Country | Link |
---|---|
AU (1) | AU4491796A (pt) |
BR (1) | BR9603593A (pt) |
FR (1) | FR2735256A1 (pt) |
WO (1) | WO1996042069A1 (pt) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0939379A4 (en) * | 1997-07-18 | 2002-01-30 | Dainippon Printing Co Ltd | Chip module, chip card, encapsulating resin for chip module and method of manufacturing a chip module |
FR2778769B1 (fr) * | 1998-05-15 | 2001-11-02 | Gemplus Sca | Carte a circuit integre comportant un bornier d'interface et procede de fabrication d'une telle carte |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2512990B1 (fr) * | 1981-09-11 | 1987-06-19 | Radiotechnique Compelec | Procede pour fabriquer une carte de paiement electronique, et carte realisee selon ce procede |
DE3420051A1 (de) * | 1984-05-29 | 1985-12-05 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Datentraeger mit ic-baustein und verfahren zur herstellung eines derartigen datentraegers |
FR2629236B1 (fr) * | 1988-03-22 | 1991-09-27 | Schlumberger Ind Sa | Procede de realisation d'une carte a memoire electronique et carte telle qu'obtenue par la mise en oeuvre dudit procede |
EP0370114B1 (en) * | 1988-04-20 | 1995-08-02 | Matsushita Electric Industrial Co., Ltd. | Ic card and production method thereof |
DE9110057U1 (de) * | 1991-08-14 | 1992-02-20 | Orga Kartensysteme GmbH, 6072 Dreieich | Datenträgerkarte mit eingeklebtem Schaltkreisträger |
-
1995
- 1995-06-09 FR FR9506840A patent/FR2735256A1/fr active Pending
-
1996
- 1996-01-09 WO PCT/FR1996/000033 patent/WO1996042069A1/fr active Application Filing
- 1996-01-09 AU AU44917/96A patent/AU4491796A/en not_active Abandoned
- 1996-01-09 BR BR9603593A patent/BR9603593A/pt not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
AU4491796A (en) | 1997-01-09 |
WO1996042069A1 (fr) | 1996-12-27 |
FR2735256A1 (fr) | 1996-12-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE69617304D1 (de) | IC Karte | |
DE69123887D1 (de) | Integrierte Schaltungskarte | |
BR9506922A (pt) | Cartão de chip | |
DE69513058D1 (de) | Elektronische Schaltungsanordnung | |
DE59510572D1 (de) | Elektronikmodul | |
BR9507955A (pt) | Circuito magnetômetro | |
BR9603810A (pt) | Cartão eletrónico | |
DE69631384T2 (de) | Verbesserungen an chipkarten | |
DE69507292D1 (de) | Chipkarte | |
BR9603593A (pt) | Cartão com circuito integrado | |
BR9609247A (pt) | Circuito integrado | |
DE59502827D1 (de) | Integrierte schaltung | |
BR9610907A (pt) | Disposição em um circuito elétrico-ótico | |
BR9502076A (pt) | Circuito integrado de atuação e exploração dupla | |
KR970014897U (ko) | 다수의 아이씨 카드를 장착한 재생장치 | |
DE69622172D1 (de) | Integrierte schaltungsanordnung | |
FR2724871B1 (fr) | Carte antistatique | |
DE69502770D1 (de) | Integrierte optoelektronische Schaltung | |
DE59505249D1 (de) | Integrierte Schaltungsanordnung | |
KR960007143U (ko) | 카드겸용 화투 | |
DE59608801D1 (de) | Integrierte schaltung | |
KR960004690U (ko) | 카드케이스 | |
KR960024631U (ko) | 아이씨 카드 | |
DE69739520D1 (de) | Elektonische Kartenanordnung | |
KR970028196U (ko) | 절단 형상면을 지닌 다접 카드 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
FA10 | Dismissal: dismissal - article 33 of industrial property law |