EP0970437A1 - Module electronique pour carte a puce - Google Patents
Module electronique pour carte a puceInfo
- Publication number
- EP0970437A1 EP0970437A1 EP98914903A EP98914903A EP0970437A1 EP 0970437 A1 EP0970437 A1 EP 0970437A1 EP 98914903 A EP98914903 A EP 98914903A EP 98914903 A EP98914903 A EP 98914903A EP 0970437 A1 EP0970437 A1 EP 0970437A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- electronic module
- support
- contact
- module according
- card
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
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- H—ELECTRICITY
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07743—External electrical contacts
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/76—Apparatus for connecting with build-up interconnects
- H01L2224/7615—Means for depositing
- H01L2224/76151—Means for direct writing
- H01L2224/76152—Syringe
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01058—Cerium [Ce]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01075—Rhenium [Re]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Definitions
- the present invention relates to electronic modules, in particular intended to be mounted in an electronic device in the form of a card, comprising a support comprising at least one face provided with contact tracks and a microcircuit which is fixed on said support and which comprises contact pads. output each connected to a contact track of the support.
- Such card-shaped devices include, in particular, integrated circuit cards, also called smart cards, but also supports for electronic elements for television, video recorders, etc.
- a smart card consists of a card body and a module comprising the chip and integrated into the card body.
- a smart card module consists of a support, generally made of epoxy glass, which is metallized on one side so as to present contact tracks and a chip which is glued on the other side of the support and which comprises output pads on its outer face. Connection wells are arranged through the support for the passage of connection wires connecting an output pad to a contact track.
- the connection wires made of stainless metal such as gold or aluminum, are welded using different technologies, such as ultrasonic or thermocompression welding, which require subsequent coating (“glob top”) of the wires. connection by means of a resin to protect them. It is sometimes necessary to fix a resin retaining barrier, such as a metal or silicon ring, on the support beforehand.
- the mass of resin is deposited in an uncontrollable manner and, when it is polymerized, it forms a drop of great thickness which exceeds in height the specifications of the smart cards. It is therefore necessary to perform a milling operation to reduce the thickness of the module to the required value. This milling operation can damage the module, which is the main cause of manufacturing waste.
- the body of the smart card there is a cavity which is intended to receive the module and which must be relatively deep to receive a module of significant height.
- the thickness of the card body at the level of the cavity is small, which causes, when the smart card undergoes bending, a significant deformation of the card body which limits the reliability and the lifetime. from the menu.
- the polymerization of this drop of resin causes the module to bulge.
- This bulging can lead to deterioration of smart card readers.
- the problem underlying the invention is to provide an electronic module of reduced height so as to eliminate the aforementioned drawbacks.
- the electronic module according to the invention is notably remarkable in that the connections between the output pads and the contact tracks consist of a bead of adhesive conductive substance conforming to the relief of the support.
- connections do not require a protective coating, which makes it possible to significantly reduce the height of the module.
- the manufacturing is simplified and, in particular, the milling operation is eliminated, which greatly reduces the rate of manufacturing scrap.
- the conductive substance is an isotropic conductive adhesive.
- connection wells these are filled with the conductive substance.
- the support may have two faces provided with contact tracks and the connections are made directly on two faces without using connection wells.
- one of the faces of the support is covered by an activatable adhesive film.
- the output pads of the microcircuit may have connection bumps so as to reduce the contact resistance
- the invention also relates to a method of manufacturing an electronic module, characterized in that the cord is produced by depositing a viscous conductive substance
- FIG. 1 is a diagram which represents, in cross section, an electronic module of known type
- FIG. 2 represents an electronic module in accordance with the present invention
- FIG. 3 is a top view of an embodiment of a module, the support of which has two faces provided with contact tracks,
- FIG. 1 represents an electronic module of known type II comprises a support 10, for example made of epoxy glass
- One of its faces 12 has contact tracks 14 produced by metallization
- the other face 16 has a layer of adhesive 18 used to fix the lower face of a microcircuit 20 which has output pads 22 on its free upper face
- the connections between the output pads 22 and the contact tracks 14 are produced by welding of metal wires 24 which each pass through a connection well 26 made in the support 10 After the welding operation of the wires 24, these are coated of a polymerizable resin which forms a drop 28 which is retained by a peripheral ring 30 of silicone
- This drop 28 is applied in an uncontrolled manner and it has a significant thickness which increases considerably the height of the module so that it is necessary to level off its upper part by a machining operation, such as milling, as shown schematically by the dotted line 32. As indicated above, the presence of this drop 28 can reduce the mechanical resistance of the smart card at the level of the cavity receiving the module so that the mechanical resistance of the card at this level is insufficient and that, in addition, the card can have a bulge at this level.
- FIG. 2 represents an electronic module in accordance with the present invention.
- the support 40 has connection wells 42.
- the lower face 44 of the support 40 is metallized and has contact tracks 46, 48 and 50.
- the upper face 52 of the support 40 carries a layer 54 of glue used for fixing a chip 56 which comprises, on its upper face 58, output pads 60 and 62 which may be provided with contact bumps (bumps) not shown.
- a coating 64 of insulating adhesive is applied to the periphery of the chip 56, on the face 52 of the support in the vicinity of the chip and in the connection wells 42.
- connections 66 and 68 between the output pads 60 and 62 and the contact tracks 46 and 50 are constituted by a bead of adhesive conductive substance which marries the relief of the support, more particularly which is in contact with the adhesive coating 64 and the ends of which are in contact with the output pad and the associated contact track. This substance is applied in a viscous state.
- this substance for example an isotropic conductive adhesive
- a deposition technique called "dispensing" according to which a liquid or low viscosity substance is applied by means of a syringe or the like with controlled flow and opening.
- This exemption operation is carried out for example by means of an installation marketed under the name CAM / ALOT by the American company Camelot Systems Inc. and used for the online production of electronic circuits.
- the movement and opening of the syringe are controlled by a computer program.
- connections can also be made using a metal deposited by screen printing.
- the output pads may include contact bosses and the ends of the beads of conductive substance are in contact with them.
- the invention also applies to the case where the support comprises two metallized faces comprising contact tracks.
- FIG. 3 is a partial top view of the module where we see a chip 70 with its output pads 72, 74, 76, 78 and 80.
- the pads 72, 74 and 76 are connected to a contact track on the underside of the support and the pads 78 and 80 are connected to a track 82, respectively 84, disposed on the upper face of the support, also by a bead of adhesive conductive substance 86, respectively 88.
- the electronic module according to the invention can be covered with an activatable adhesive film, for example by heating or ultraviolet radiation, in order, on the one hand, to increase the protection of the chip and, on the other hand, to simplify the fixing operation of the module in the cavity of the card body.
- an activatable adhesive film for example by heating or ultraviolet radiation
- the invention makes it possible to eliminate the coating of the connections and, consequently, to reduce the thickness of the modules.
- the resins used as conductive substance are very flexible, which increases the reliability of the module.
- the operations related to the coating of the connections namely the installation of a retaining barrier such as a silicone ring, the deposition of the coating resin and the machining of the drop of resin, are eliminated. .
- the invention makes it possible to have a greater thickness of the card body at the level of the module and, consequently, to increase the mechanical resistance of the card.
- the dimensions of the modules can be reduced in the plane of the microcircuit, which makes it possible to manufacture the modules in a chain with two adjacent lines of modules.
- the invention makes it possible to eliminate the bulging phenomenon and, consequently, to avoid deterioration of the readers.
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Credit Cards Or The Like (AREA)
- Wire Bonding (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP01117497A EP1168240B1 (fr) | 1997-03-27 | 1998-03-09 | Connexion par dépôt de substance visqueuse épousant le relief |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9704094A FR2761498B1 (fr) | 1997-03-27 | 1997-03-27 | Module electronique et son procede de fabrication et carte a puce comportant un tel module |
FR9704094 | 1997-03-27 | ||
PCT/FR1998/000500 WO1998044451A1 (fr) | 1997-03-27 | 1998-03-09 | Module electronique pour carte a puce |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP01117497A Division EP1168240B1 (fr) | 1997-03-27 | 1998-03-09 | Connexion par dépôt de substance visqueuse épousant le relief |
Publications (1)
Publication Number | Publication Date |
---|---|
EP0970437A1 true EP0970437A1 (fr) | 2000-01-12 |
Family
ID=9505498
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP98914903A Ceased EP0970437A1 (fr) | 1997-03-27 | 1998-03-09 | Module electronique pour carte a puce |
EP01117497A Expired - Lifetime EP1168240B1 (fr) | 1997-03-27 | 1998-03-09 | Connexion par dépôt de substance visqueuse épousant le relief |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP01117497A Expired - Lifetime EP1168240B1 (fr) | 1997-03-27 | 1998-03-09 | Connexion par dépôt de substance visqueuse épousant le relief |
Country Status (12)
Country | Link |
---|---|
US (2) | US6435414B1 (fr) |
EP (2) | EP0970437A1 (fr) |
JP (1) | JP3869860B2 (fr) |
CN (1) | CN1183486C (fr) |
AU (1) | AU720691B2 (fr) |
BR (1) | BR9808062A (fr) |
CA (1) | CA2283692A1 (fr) |
DE (1) | DE69832104T2 (fr) |
FR (1) | FR2761498B1 (fr) |
HK (1) | HK1028833A1 (fr) |
RU (1) | RU2200975C2 (fr) |
WO (1) | WO1998044451A1 (fr) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2761498B1 (fr) * | 1997-03-27 | 1999-06-18 | Gemplus Card Int | Module electronique et son procede de fabrication et carte a puce comportant un tel module |
FR2785072B1 (fr) * | 1998-10-23 | 2001-01-19 | St Microelectronics Sa | Circuit electronique autocollant |
FR2797075B1 (fr) * | 1999-07-26 | 2001-10-12 | Gemplus Card Int | Procede de fabrication de dispositif portable a circuits integres, de type carte a puce de format reduit par rapport au format standard |
FR2797995B1 (fr) * | 1999-08-25 | 2002-03-22 | Gemplus Card Int | Procede de protection de puces de circuit integre par depot de couche mince isolante |
FR2797996B1 (fr) * | 1999-08-25 | 2003-10-03 | Gemplus Card Int | Procede de protection de puces de circuit integre par depot de couche mince isolante |
FR2799306B1 (fr) * | 1999-10-04 | 2003-09-19 | Gemplus Card Int | Procede d'isolation de puce de circuit integre par depot de matiere sur la face active |
FR2800198B1 (fr) * | 1999-10-26 | 2002-03-29 | Gemplus Card Int | Procede de protection de puces de circuit integre par aspiration sous vide |
FR2808920B1 (fr) * | 2000-05-10 | 2003-10-03 | Gemplus Card Int | Procede de protection de puces de circuit integre |
FR2818800B1 (fr) * | 2000-12-21 | 2003-04-04 | Gemplus Card Int | Interconnexion par organe deformable pour dispositif electronique |
FR2818801B1 (fr) * | 2000-12-21 | 2003-04-04 | Gemplus Card Int | Interconnexion par organe d'isolation decoupe et cordon de conduction |
FR2823011B1 (fr) * | 2001-03-30 | 2004-11-19 | Gemplus Card Int | Connexion par depot de cordon conductrice sur zone de raccordement delimitee par masque isolant |
FR2845805B1 (fr) * | 2002-10-10 | 2005-06-03 | Gemplus Card Int | Adhesif d'encartage formant navette |
FR2847365B1 (fr) * | 2002-11-15 | 2005-03-11 | Gemplus Card Int | Connexion/raccordement simultane par un percage d'adhesif d'encartage |
US7243421B2 (en) * | 2003-10-29 | 2007-07-17 | Conductive Inkjet Technology Limited | Electrical connection of components |
WO2007042071A1 (fr) * | 2005-10-10 | 2007-04-19 | Alphasem Ag | Bloc de composants comprenant au moins deux elements cooperant de maniere electroconductrice et procede permettant de produire ledit bloc de composants |
DE102006056361B4 (de) * | 2006-11-29 | 2012-08-16 | Infineon Technologies Ag | Modul mit polymerhaltigem elektrischen Verbindungselement und Verfahren |
DE102008019571A1 (de) * | 2008-04-18 | 2009-10-22 | Giesecke & Devrient Gmbh | Chipkarte und Verfahren zu deren Herstellung |
TWM425346U (en) * | 2011-05-20 | 2012-03-21 | Mxtran Inc | Integrated circuit film for smart card and mobile communication device |
US8991711B2 (en) * | 2012-07-19 | 2015-03-31 | Infineon Technologies Ag | Chip card module |
MY184608A (en) * | 2013-12-10 | 2021-04-07 | Carsem M Sdn Bhd | Pre-molded integrated circuit packages |
DE102014105861B4 (de) * | 2014-04-25 | 2015-11-05 | Infineon Technologies Ag | Sensorvorrichtung und Verfahren zum Herstellen einer Sensorvorrichtung |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3338597A1 (de) * | 1983-10-24 | 1985-05-02 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben |
US4999136A (en) * | 1988-08-23 | 1991-03-12 | Westinghouse Electric Corp. | Ultraviolet curable conductive resin |
US5255430A (en) * | 1992-10-08 | 1993-10-26 | Atmel Corporation | Method of assembling a module for a smart card |
DE4325458A1 (de) * | 1993-07-29 | 1995-02-09 | Orga Bond Technik Gmbh | Trägerelement für einen IC-Baustein |
US5689136A (en) * | 1993-08-04 | 1997-11-18 | Hitachi, Ltd. | Semiconductor device and fabrication method |
DE9315652U1 (de) * | 1993-10-15 | 1993-12-23 | Nordson Corp., Westlake, Ohio | Auftragskopf zum Aufbringen von Klebstoff auf ein Substrat, insbesondere für eine Verklebung eines Chips mit einer Karte |
US5423889A (en) * | 1994-06-24 | 1995-06-13 | Harris Corporation | Process for manufacturing a multi-port adhesive dispensing tool |
JPH0839974A (ja) * | 1994-07-27 | 1996-02-13 | Dainippon Printing Co Ltd | Icカード用icモジュールとその製造方法、及びicカード |
DE4441052A1 (de) * | 1994-11-18 | 1996-05-23 | Orga Kartensysteme Gmbh | Trägerelement für einen IC-Baustein zum Einsatz in Chipkarten |
DE69635397T2 (de) * | 1995-03-24 | 2006-05-24 | Shinko Electric Industries Co., Ltd. | Halbleitervorrichtung mit Chipabmessungen und Herstellungsverfahren |
JPH08310172A (ja) * | 1995-05-23 | 1996-11-26 | Hitachi Ltd | 半導体装置 |
FR2761498B1 (fr) * | 1997-03-27 | 1999-06-18 | Gemplus Card Int | Module electronique et son procede de fabrication et carte a puce comportant un tel module |
US6107109A (en) * | 1997-12-18 | 2000-08-22 | Micron Technology, Inc. | Method for fabricating a semiconductor interconnect with laser machined electrical paths through substrate |
-
1997
- 1997-03-27 FR FR9704094A patent/FR2761498B1/fr not_active Expired - Fee Related
-
1998
- 1998-03-09 EP EP98914903A patent/EP0970437A1/fr not_active Ceased
- 1998-03-09 RU RU99122604/09A patent/RU2200975C2/ru not_active IP Right Cessation
- 1998-03-09 CA CA002283692A patent/CA2283692A1/fr not_active Abandoned
- 1998-03-09 EP EP01117497A patent/EP1168240B1/fr not_active Expired - Lifetime
- 1998-03-09 US US09/402,008 patent/US6435414B1/en not_active Expired - Fee Related
- 1998-03-09 JP JP54121098A patent/JP3869860B2/ja not_active Expired - Fee Related
- 1998-03-09 DE DE69832104T patent/DE69832104T2/de not_active Expired - Lifetime
- 1998-03-09 CN CNB988054485A patent/CN1183486C/zh not_active Expired - Fee Related
- 1998-03-09 BR BR9808062-8A patent/BR9808062A/pt not_active Application Discontinuation
- 1998-03-09 WO PCT/FR1998/000500 patent/WO1998044451A1/fr not_active Application Discontinuation
- 1998-03-09 AU AU69225/98A patent/AU720691B2/en not_active Ceased
-
2000
- 2000-12-19 HK HK00108190A patent/HK1028833A1/xx not_active IP Right Cessation
-
2002
- 2002-05-09 US US10/141,180 patent/US6769619B2/en not_active Expired - Fee Related
Non-Patent Citations (1)
Title |
---|
See references of WO9844451A1 * |
Also Published As
Publication number | Publication date |
---|---|
EP1168240A2 (fr) | 2002-01-02 |
WO1998044451A1 (fr) | 1998-10-08 |
CN1183486C (zh) | 2005-01-05 |
DE69832104T2 (de) | 2006-11-23 |
DE69832104D1 (de) | 2005-12-01 |
BR9808062A (pt) | 2000-03-08 |
FR2761498A1 (fr) | 1998-10-02 |
AU720691B2 (en) | 2000-06-08 |
HK1028833A1 (en) | 2001-03-02 |
CN1257599A (zh) | 2000-06-21 |
RU2200975C2 (ru) | 2003-03-20 |
EP1168240A3 (fr) | 2002-01-30 |
US20020125329A1 (en) | 2002-09-12 |
AU6922598A (en) | 1998-10-22 |
EP1168240B1 (fr) | 2005-10-26 |
FR2761498B1 (fr) | 1999-06-18 |
JP2002511188A (ja) | 2002-04-09 |
US6435414B1 (en) | 2002-08-20 |
JP3869860B2 (ja) | 2007-01-17 |
US6769619B2 (en) | 2004-08-03 |
CA2283692A1 (fr) | 1998-10-08 |
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Effective date: 19991027 |
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